ARTIK 053/053s Module Datasheet
2
Samsung Semiconductor, Inc. ARTIK 053/053s Module Datasheet
MODULE OVERVIEW
The Samsung ARTIK™ 053/053s Module is a highly integrated module for
secure Internet of Things (IoT) devices that require Wi-Fi® connectivity. It is
based on an ARM® Cortex® R4 core, with on-module RAM and flash
memory, a complete 2.4GHz Wi-Fi subsystem with on-module antenna, an
independent security subsystem, PUF-based module authentication, and a
large complement of standard I/O interfaces.
The ARTIK 053/053s Module provides excellent performance in a variety of
environments, with a feature set tailored specifically for IoT end nodes.
Processor
CPU 32-bit ARM® Cortex® R4 with 32KB I-Cache and 32KB D-Cache @ 320MHz
Memory
RAM 1280KB (General usage)
128KB (Global IPC data)
FLASH 8MB Flash
Security (ARTIK 053s only)
Secure Subsystem AES/DES/TDES, SHA-1/SHA-2, PKA (Public Key Accelerator), PRNG/DTRNG
(Random Number Generators), Secure key storage
PUF Physically Unclonable Function
Radio
Wi-Fi Certified IEEE802.11™ b/g/n Wi-Fi® 2.4GHz radio served by a dedicated 32-bit ARM
Cortex R4 with 32KB I-Cache and 16KB D-Cache @ 480MHz
Regulatory FCC (U.S.), IC (Canada), CE (EU), KC (Korea), SRRC (China)
Power Management
Single Supply Wide voltage input range of 5–12V
Interfaces
I/O UART, I2C, SPI, PWM, ADC, GPIO. I2S
Form Factor
Dimensions 15mm W x 40mm D x 3.9mm H
Operation Enviroment
Temperture –20 to 85 oC Tc
Figure 1. ARTIK 053s Module Top View
Samsung Semiconductor, Inc. ARTIK 053/053s Module Datasheet
TABLE OF CONTENTS
3
Module Overview................................................................................................................................................................2
Version History ................................................................................................................................................................... 7
Block Diagram.....................................................................................................................................................................8
CPU ...............................................................................................................................................................................8
Memory.........................................................................................................................................................................9
Real Time Clock............................................................................................................................................................9
PUF Unit (ARTIK 053s Module Only)............................................................................................................................9
Security Subsystem (ARTIK 053s Module Only) ....................................................................................................... 10
Wi-Fi Subsystem.......................................................................................................................................................... 11
GPIO Interfaces ........................................................................................................................................................... 11
SPI Interfaces............................................................................................................................................................... 11
I2C Interfaces............................................................................................................................................................... 11
PWM Interfaces ........................................................................................................................................................... 11
I2S Interface................................................................................................................................................................ 12
ADC Interfaces ........................................................................................................................................................... 12
UART Interfaces.......................................................................................................................................................... 13
Module Pad Physical Layout............................................................................................................................................. 14
Module Pad Signal Definitions ......................................................................................................................................... 15
Module Pad Signal Definitions by Function..................................................................................................................... 18
GPIO Interface ............................................................................................................................................................ 18
I2C Interface ............................................................................................................................................................... 19
SPI Interface .............................................................................................................................................................. 20
I2S Interface .............................................................................................................................................................. 20
ADC Interface ............................................................................................................................................................ 20
PWM Interface ............................................................................................................................................................ 21
UART Interface ........................................................................................................................................................... 21
Debug Interface ......................................................................................................................................................... 21
INT Interface ............................................................................................................................................................... 22
Reset Interface ........................................................................................................................................................... 22
Power Interface .......................................................................................................................................................... 22
Electrical Specifications ...................................................................................................................................................23
Absolute Maximum Rating.........................................................................................................................................23
Recommended Operating Conditions ......................................................................................................................23
DC Electrical Characteristics .....................................................................................................................................24
Power and Current Consumption..............................................................................................................................25
ESD Ratings ................................................................................................................................................................25
RF Electrical Characteristics ......................................................................................................................................26
Mechanical Specifications ............................................................................................................................................... 27
Module Antenna Placement Requirements ..............................................................................................................28
Certification and Compliance ..........................................................................................................................................29
CE................................................................................................................................................................................29
FCC Regulatory Disclosures ......................................................................................................................................29
Industry Canada Regulatory Disclosures .................................................................................................................. 31
Industry Canada Statement ................................................................................................................................ 31
KC................................................................................................................................................................................ 31
SRRC ........................................................................................................................................................................... 31
EU Regulatory Disclosures .........................................................................................................................................32
Samsung Semiconductor, Inc. ARTIK 053/053s Module Datasheet
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CE Statement ......................................................................................................................................................32
Ordering Information .......................................................................................................................................................33
Samsung Semiconductor, Inc. ARTIK 053/053s Module Datasheet
LIST OF FIGURES
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Figure 1. ARTIK 053s Module Top View .............................................................................................................................2
Figure 2. ARTIK 053/053s Module Block Diagram ............................................................................................................8
Figure 3. ADC LSB behavior ............................................................................................................................................. 12
Figure 4. ARTIK 053/053s Module Edge Pinout (Top View) ........................................................................................... 14
Figure 5. ARTIK 053/053s Module Mechanical Dimensions........................................................................................... 27
Figure 6. Module Placement Restrictions........................................................................................................................28
Samsung Semiconductor, Inc. ARTIK 053/053s Module Datasheet
LIST OF TABLES
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Table 1. ARTIK 053/053s Module Pinout Signal Descriptions ........................................................................................ 15
Table 2. GPIO Interface .................................................................................................................................................... 18
Table 3. I2C Interface ....................................................................................................................................................... 19
Table 4. SPI Interface....................................................................................................................................................... 20
Table 5. I2S Interface....................................................................................................................................................... 20
Table 6. ADC Interface .................................................................................................................................................... 20
Table 7. PWM Interface..................................................................................................................................................... 21
Table 8. UART Interface.................................................................................................................................................... 21
Table 9. Debug Interface.................................................................................................................................................. 21
Table 10. Interrupt Interface............................................................................................................................................. 22
Table 11. Reset Interface ...................................................................................................................................................22
Table 12. Power Interface ................................................................................................................................................. 22
Table 13. Absolute Maximum Ratings ..............................................................................................................................23
Table 14. Recommended Operating Conditions.............................................................................................................23
Table 15. GPIO DC Electrical Characteristics...................................................................................................................24
Table 16. GPIO Signal Drive Strengths.............................................................................................................................24
Table 17. ADC DC Electrical Characteristics ....................................................................................................................25
Table 18. ARTIK 053/053s Module Power Consumption ................................................................................................25
Table 19. ESD Ratings .......................................................................................................................................................25
Table 20. Tx Performance Characteristics ......................................................................................................................26
Table 21. Rx Performance Characteristics ......................................................................................................................26
Samsung Semiconductor, Inc. ARTIK 053/053s Module Datasheet
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VERSION HISTORY
Revision Date Description
V1.0 April 26, 2017 First release
V1.1 November 20, 2017 Updated Figure 4 pinout. Updated Table 2 to show GPIO14 and GPIO17. Updated Module Antenna
Placement Requirements. Updated Recommended Operating Conditions. Updated other tables to
show GPIO alternate functions. Changed temperature specifications in Recommended Operating
Conditions. Added Power and Current Consumption.
Samsung Semiconductor, Inc. ARTIK 053/053s Module Datasheet
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BLOCK DIAGRAM
Figure 2 shows a functional block diagram of the ARTIK 053/053s Module.
Figure 2. ARTIK 053/053s Module Block Diagram
CPU
The ARTIK 053/053s Module CPU has an ARM® Cortex® R4. It has the following features:
• 32KB of Instruction Cache (I-Cache)
• 32KB of Data Cache (D-Cache)
•320MHz execution clock
• R4 core tuned for embedded and real-time applications
60 GPIO
4Std UART
Ports
6PWM
Signals
4I2CPorts
4SPIPorts
1I2SPort
Debug
UART&
JTAG
4ADC
Signals
16
Interrupts
PowerManagement
Wi‐FiSubsystem
SecuritySubsystem
PUF
ProcessorSystem
ARMCortexR4
32KBI‐Cache
32KBD‐Cache
1280KBRAM
8MBFlash
128KBRAM
Global IPCData
RTC
60
Samsung Semiconductor, Inc. ARTIK 053/053s Module Datasheet
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Memory
The ARTIK 053/053s Module on-module memory has the following features:
• CPU and general purpose RAM
–1280KB CPU RAM
– 128KB global Inter-Process Communication (IPC) RAM
•8MB flash
Real Time Clock
The ARTIK 053/053s Module has a Real Time Clock (RTC) for tracking date/time. The RTC has the following features:
• Binary-Coded Decimal (BCD) coded seconds, minutes, hour, day of the week, day, month, and year
• Leap year detection and compensation
• Millisecond tick time interrupt for Real-Time Operating System (RTOS) kernel time tick
PUF Unit (ARTIK 053s Module Only)
The ARTIK 053s Module has a Physically Unclonable Function (PUF) unit. The PUF unit has the following features:
• Generates unique key values, locked to an individual ARTIK 053s Module
• The algorithm construction is unique to each module
• Allows individual ARTIK 053/053s Modules to be “fingerprint-identified”
Samsung Semiconductor, Inc. ARTIK 053/053s Module Datasheet
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Security Subsystem (ARTIK 053s Module Only)
The ARTIK 053s Module has an independent security subsystem to ensure secure end-to-end operation in any IoT
environment. The security subsystem includes the following features:
• Secure IPC Mailbox for inter-subsystem communication
• Encapsulated key support
– Backup encryption key - 256 bits
– Security subsystem root private key - 521 bits
– Storage key - 256 bits
• Symmetric key engines
– Secure AES
– Secure DES/Triple-DES
• Stream cipher engine
–ARC4 engine
•Various Hash engines
– SHA-1, SHA2-256, SHA2-384, SHA2-512, MD5 HMAC
• Asymmetric key engines
– PKA (Public Key Accelerator) engine
• PRNG (Pseudo Random Number Generator)
• DTRNG (Digital True Random Number Generator)
• Secure key storage
Samsung Semiconductor, Inc. ARTIK 053/053s Module Datasheet
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Wi-Fi Subsystem
The ARTIK 053/053s Module has an 802.11b/g/n Wi-Fi subsystem. The Wi-Fi subsystem has the following features:
• 802.11™ b/g/n support at 2.4GHz
• 20MHz single stream (802.11n)
•WPA/WPA2
• Dedicated Wi-Fi Processor subsystem with 480MHz 32-bit ARM Cortex R4 supported by 32KB I-Cache and
16KB D-Cache.
GPIO Interfaces
The ARTIK 053/053s Module has flexible General Purpose Input Output (GPIO) interfaces:
• 60 configurable GPIO ports
• Independently configurable for either general purpose input or output
• 43 configurable for alternate functionality
• Configurable internal pull-up or pull-down resistors
SPI Interfaces
The ARTIK 053/053s Module has four SPI interfaces, each with the following features:
• Full duplex communication
• 8, 16 or 32-bit shift registers and bus interface
• Motorola SPI protocol and National Semiconductor Microwire protocol
• Master and slave mode operation
• Two independent 32-bit wide transmit/receive FIFOs
• Transmit and receive speeds up to 50MHz
I2C Interfaces
The ARTIK 053/053s Module has four high speed multi-master I2C interfaces available, with speeds up to 3.4Mbps.
PWM Interfaces
The ARTIK 053/053s Module has six PWM timers, each with the following features:
• 32 bits of resolution for each PWM signal
• Two 8-bit prescalers (first level of division) and 5 clock dividers/multiplexers for second-level division
• Continuous run or one-shot pulse mode
• Dead zone generator to avoid simultaneous change of multiple PWM signals
• Interrupt generation
Samsung Semiconductor, Inc. ARTIK 053/053s Module Datasheet
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I2S Interface
The ARTIK 053/053s Module has one I2S interface with the following features:
• Each channel includes a 32-bit × 64 data FIFO for both transmit and receive
• Supports stereo I2S bus channels with external DMA-based operations
• Can mix two sound sources from a primary and secondary source
• Serial data transfer formats of 8 bits, 16 bits, or 24 bits per channel
• Supports both MSB and LSB justified data formats
• Can be used in I2S slave mode
ADC Interfaces
The ARTIK 053/053s Module has four analog-to-digital converter (ADC) channels. Each interface has the following
features:
• 12-bit resolution
• ADC conversion clock at 1.08 mega-samples per second (MSPS) using a main 6.5MHz clock
• Supports sample averaging over 1, 2, 4, 8, 16, 32, or 64 samples
• Differential non-linearity error range of ±2 LSB bits (value of ±2)
• Integral non-linearity error range of ±3 LSB bits (value of ±6)
• Top and bottom offset error range of ±4 LSB bits (value of ±10)
• Voltage range up to 1.8V
Figure 3 depicts the dynamic behavior between input voltage on the ADC and resulting LSB value in the ADC
register.
Figure 3. ADC LSB behavior
Result (LSB)
Analog in (V)
Top
offset
Bottom
offset
Real
value
Ideal
value
Ideal value
with offset
Samsung Semiconductor, Inc. ARTIK 053/053s Module Datasheet
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UART Interfaces
The ARTIK 053/053s Module has five 2-pin UART interfaces; UART0 (RXD/TXD has a level-shifter FET to support a 5V
UART interface and is used in the debug block. Each has the following features:
• Can be operated in DMA or interrupt-based mode
• Support for 5, 6, 7, or 8-bit serial data transmit and receive
• Programmable baud rate
• One or two stop-bit insertion
Samsung Semiconductor, Inc. ARTIK 053/053s Module Datasheet
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MODULE PAD PHYSICAL LAYOUT
The ARTIK 053/053s Module utilizes 79 signal, power, and ground pads. The figure below shows how the physical
layout orients the signal pads assigned at the edge of the ARTIK 053/053s Module. Figure 1 shows the edge pads
and the signal names.
Figure 4. ARTIK 053/053s Module Edge Pinout (Top View)
Samsung Semiconductor, Inc. ARTIK 053/053s Module Datasheet
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MODULE PAD SIGNAL DEFINITIONS
The tables below describes the characteristics of the ARTIK 053/053s Module pad signals. Some signals can be
configured for alternate functionality. The remaining signals have dedicated functionality. Refer to the following
column definitions.
•Pad Number defines the signal pad on the edge of the module. Refer to Figure 4 for pad/signal physical
layout.
•Pad Name defines the net list name of the signal. The pad name may reflect on one of the possible optional
signal functionality, and dictates the default power-on function.
•GPIO Name defines a generic name for referring to GPIO signals regardless of their current configured
functionality. The name order is the same order as the GPIO signals appear in the GPIO configuration
registers.
•PU/PD defines the power-on state of the internal pull up/pull down definition. PU:pull up, PD:pull down, N:no
pull up/down.
•GPIO Drive defines the power-on state drive strength of GPIO and other signals. Configurable to 2mA, 4mA,
8mA, or 12mA. Do not use GPIO signals to power discrete components directly (such as LEDs). Use an
external driver device instead (such as a transistor).
•Option 1 - Option 6 lists the alternative functionality some signals can be configured to. Those signals
without any options are dedicated to their function. The pad name signifies the default power-on state.
Table 1. ARTIK 053/053s Module Pinout Signal Descriptions
Pad
Number
Pad Name
& Default
Function
GPIO
Name PU/PD GPIO
Drive Option 1 Option 2 Option 3 Option 4 Option 5 Option 6
1GND––––– – – – –
2 XGPIO26 GPIO43 PD 2mA GP Input GP Output I2S_0_SDO – – –
3 XGPIO25 GPIO42 PD 2mA GP Input GP Output I2S_0_LRCK – – –
4 XGPIO24 GPIO41 PD 2mA GP Input GP Output I2S_0_BCLK – – –
5 XGPIO21 GPIO38 PD 2mA GP Input GP Output – – – NWEINT_GPG2[5]
6 XGPIO19 GPIO36 PD 2mA GP Input GP Output – – – NWEINT_GPG2[3]
7 XGPIO18 GPIO35 PD 2mA GP Input GP Output – – – NWEINT_GPG2[2]
8 XGPIO17 GPIO34 PD 2mA GP Input GP Output – – – NWEINT_GPG2[1]
9 XGPIO14 GPIO31 PD 2mA GP Input GP Output – – – NWEINT_GPG1[6]
10 XGPIO13 GPIO30 PD 2mA GP Input GP Output – – – NWEINT_GPG1[5]
11 XGPIO16 GPIO33 PD 2mA GP Input GP Output – – – NWEINT_GPG2[0]
12 XGPIO15 GPIO32 PD 2mA GP Input GP Output – – – NWEINT_GPG1[7]
13 XGPIO20 GPIO37 PD 2mA GP Input GP Output – – – NWEINT_GPG2[4]
14 XADC0AIN_1 – – – – – – – – –
15 XADC0AIN_0 – – – – – – – – –
16 XADC0AIN_2 – – – – – – – – –
17 XADC0AIN_3 – – – – – – – – –
18 XGPIO23 GPIO40 PD 2mA GP Input GP Output – – – NWEINT_GPG2[7]
19 XGPIO22 GPIO39 PD 2mA GP Input GP Output – – – NWEINT_GPG2[6]
20 GND – – – – – – – – –
21 XRESET_N – – – – – – – – –
22 XJTAG_TMS – PU – – – – – – –
23 XJTAG_TDI – PU – – – – – – –
24 XJTAG_TCK – PD – – – – – – –
25 XJTAG_TDO – PD 2mA – – – – – –
Samsung Semiconductor, Inc. ARTIK 053/053s Module Datasheet
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26 XJTAG_TRST_N – PD – – – – – – –
27 3V3_EXT_LDO2 – – – – – – – – –
28 XEINT_0 GPIO45 PD 2mA GP Input GP Output – – – NWEINT_GPA0[0]
29 XEINT_2 GPIO47 PD 2mA GP Input GP Output – – – NWEINT_GPA0[2]
30 XEINT_1 GPIO46 PD 2mA GP Input GP Output – – – NWEINT_GPA0[1]
31 GND – – – – – – – – –
32 DC_5V_12V – – – – – – – – –
33 XI2C0_SCL GPIO48 PD 8mA GP Input GP Output HSI2C_0_SCL – – –
34 XI2C0_SDA GPIO49 PD 8mA GP Input GP Output HSI2C_0_SDA – – –
35 XI2C1_SCL GPIO50 PD 8mA GP Input GP Output HSI2C_1_SCL – – –
36 XI2C1_SDA GPIO51 PD 8mA GP Input GP Output HSI2C_1_SDA – – –
37 XDEBUG_TXD GPIO55 PD 8mA GP Input GP Output Xdebug_TXD – – –
38 XDEBUG_RXD GPIO54 PD 8mA GP Input GP Output Xdebug_RXD – – –
39 XGPIO28 GPIO14 PD 8mA GP Input GP Output – – – –
40 XPWMTOUT_4 GPIO15 PD 8mA GP Input GP Output PWM_TOUT_5 – – –
41 XPWMTOUT_1 GPIO11 PD 8mA GP Input GP Output PWM_TOUT_1 COUNTER_0 UART_3_RTSn –
42 XPWMTOUT_0 GPIO10 PD 8mA GP Input GP Output PWM_TOUT_0 – UART_3_CTSn –
43 XPWMTOUT_5 GPIO16 PD 8mA GP Input GP Output PWM_TOUT_6 – – –
44 XPWMTOUT_2 GPIO12 PD 8mA GP Input GP Output PWM_TOUT_2 – – –
45 XPWMTOUT_3 GPIO13 PD 8mA GP Input GP Output PWM_TOUT_3 – – –
46 XUART0_TXD GPIO53 PD 8mA GP Input GP Output UART_0_TXD – – –
47 XUART0_RXD GPIO52 PD 8mA GP Input GP Output UART_0_RXD – – –
48 XSPI0_MISO GPIO02 PD 8mA GP Input GP Output SPI_0_MISO – – –
49 XSPI0_CSN GPIO01 PD 8mA GP Input GP Output SPI_0_CSn – – –
50 XSPI0_MOSI GPIO03 PD 8mA GP Input GP Output SPI_0_MOSI – – –
51 XSPI0_CLK GPIO00 PD 8mA GP Input GP Output SPI_0_CLK – – –
52 XUART1_TXD GPIO05 PD 8mA GP Input GP Output UART_1_TXD UART_2_RTSn – –
53 XUART1_RXD GPIO04 PD 8mA GP Input GP Output UART_1_RXD UART_2_CTSn – –
54 XUART2_RXD GPIO06 PD 8mA GP Input GP Output UART_2_RXD – – –
55 XUART2_TXD GPIO07 PD 8mA GP Input GP Output UART_2_TXD – – –
56 XUART3_RXD GPIO08 PD 8mA GP Input GP Output UART_3_RXD – – –
57 XUART3_TXD GPIO09 PD 8mA GP Input GP Output UART_3_TXD – – –
58 XGPIO12 GPIO29 PD 2mA GP Input GP Output – – – NWEINT_GPG1[4]
59 XGPIO10 GPIO27 PD 2mA GP Input GP Output SPI_3_MISO – – NWEINT_GPG1[2]
60 XGPIO9 GPIO26 PD 2mA GP Input GP Output SPI_3_CSn – – NWEINT_GPG1[1]
61 XGPIO11 GPIO28 PD 2mA GP Input GP Output SPI_3_MOSI – – NWEINT_GPG1[3]
62 XGPIO6 GPIO23 PD 2mA GP Input GP Output SPI_2_MISO – – –
63 XGPIO8 GPIO25 PD 2mA GP Input GP Output SPI_3_CLK – – NWEINT_GPG1[0]
64 XGPIO7 GPIO24 PD 2mA GP Input GP Output SPI_2_MOSI – – –
65 XGPIO2 GPIO19 PD 2mA GP Input GP Output HSI2C_3_SCL – – –
66 XGPIO4 GPIO21 PD 2mA GP Input GP Output SPI_2_CLK – – –
67 XGPIO5 GPIO22 PD 2mA GP Input GP Output SPI_2_CSn – – –
68 XGPIO1 GPIO18 PD 2mA GP Input GP Output HSI2C_2_SDA – – –
69 XGPIO3 GPIO20 PD 2mA GP Input GP Output HSI2C_3_SDA – – –
70 XGPIO0 GPIO17 PD 2mA GP Input GP Output HSI2C_2_SCL – – –
71 XSPI1_MISO GPIO58 PD 2mA GP Input GP Output SPI_1_MISO – – –
72 XSPI1_CLK GPIO56 PD 2mA GP Input GP Output SPI_1_CLK – – –
73 XSPI1_MOSI GPIO59 PD 2mA GP Input GP Output SPI_1_MOSI – – –
Table 1. ARTIK 053/053s Module Pinout Signal Descriptions (Continued)
Pad
Number
Pad Name
& Default
Function
GPIO
Name PU/PD GPIO
Drive Option 1 Option 2 Option 3 Option 4 Option 5 Option 6
Samsung Semiconductor, Inc. ARTIK 053/053s Module Datasheet
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74 XSPI1_CSN GPIO57 PD 2mA GP Input GP Output SPI_1_CSn – – –
75 XGPIO27 GPIO44 PD 2mA GP Input GP Output I2S_0_SDI – – –
76 GND – – – – – – – – –
77 GND – – – – – – – – –
78 GND – – – – – – – – –
79 GND – – – – – – – – –
Table 1. ARTIK 053/053s Module Pinout Signal Descriptions (Continued)
Pad
Number
Pad Name
& Default
Function
GPIO
Name PU/PD GPIO
Drive Option 1 Option 2 Option 3 Option 4 Option 5 Option 6
Samsung Semiconductor, Inc. ARTIK 053/053s Module Datasheet
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MODULE PAD SIGNAL DEFINITIONS BY FUNCTION
GPIO Interface
Table 2. GPIO Interface
GPIO
Name
Pad Name
& Default
Function
Pad
Number PU/PD GPIO
Drive Option 1 Option 2 Option 3 Option 4 Option 5 Option 6
GPIO00 XSPI0_CLK 51 PD 8mA GP Input GP Output SPI_0_CLK – – –
GPIO01 XSPI0_CSN 49 PD 8mA GP Input GP Output SPI_0_CSn – – –
GPIO02 XSPI0_MISO 48 PD 8mA GP Input GP Output SPI_0_MISO – – –
GPIO03 XSPI0_MOSI 50 PD 8mA GP Input GP Output SPI_0_MOSI – – –
GPIO04 XUART1_RXD 53 PD 8mA GP Input GP Output UART_1_RXD UART_2_CTSn – –
GPIO05 XUART1_TXD 52 PD 8mA GP Input GP Output UART_1_TXD UART_2_RTSn – –
GPIO06 XUART2_RXD 54 PD 8mA GP Input GP Output UART_2_RXD – – –
GPIO07 XUART2_TXD 55 PD 8mA GP Input GP Output UART_2_TXD – – –
GPIO08 XUART3_RXD 56 PD 8mA GP Input GP Output UART_3_RXD – – –
GPIO09 XUART3_TXD 57 PD 8mA GP Input GP Output UART_3_TXD – – –
GPIO10 XPWMTOUT_0 42 PD 8mA GP Input GP Output PWM_TOUT_0 – UART_3_CTSn –
GPIO11 XPWMTOUT_1 41 PD 8mA GP Input GP Output PWM_TOUT_1 COUNTER_0 UART_3_RTSn –
GPIO12 XPWMTOUT_2 44 PD 8mA GP Input GP Output PWM_TOUT_2 – – –
GPIO13 XPWMTOUT_3 45 PD 8mA GP Input GP Output PWM_TOUT_3 – – –
GPIO14 XGPIO28 39 PD 8mA GP Input GP Output – – – –
GPIO15 XPWMTOUT_4 40 PD 8mA GP Input GP Output PWM_TOUT_5 – – –
GPIO16 XPWMTOUT_5 43 PD 8mA GP Input GP Output PWM_TOUT_6 – – –
GPIO17 XGPIO0 70 PD 2mA GP Input GP Output HSI2C_2_SCL – – –
GPIO18 XGPIO1 68 PD 2mA GP Input GP Output HSI2C_2_SDA – – –
GPIO19 XGPIO2 65 PD 2mA GP Input GP Output HSI2C_3_SCL – – –
GPIO20 XGPIO3 69 PD 2mA GP Input GP Output HSI2C_3_SDA – – –
GPIO21 XGPIO4 66 PD 2mA GP Input GP Output SPI_2_CLK – – –
GPIO22 XGPIO5 67 PD 2mA GP Input GP Output SPI_2_CSn – – –
GPIO23 XGPIO6 62 PD 2mA GP Input GP Output SPI_2_MISO – – –
GPIO24 XGPIO7 64 PD 2mA GP Input GP Output SPI_2_MOSI – – –
GPIO25 XGPIO8 63 PD 2mA GP Input GP Output SPI_3_CLK – – NWEINT_GPG1[0]
GPIO26 XGPIO9 60 PD 2mA GP Input GP Output SPI_3_CSn – – NWEINT_GPG1[1]
GPIO27 XGPIO10 59 PD 2mA GP Input GP Output SPI_3_MISO – – NWEINT_GPG1[2]
GPIO28 XGPIO11 61 PD 2mA GP Input GP Output SPI_3_MOSI – – NWEINT_GPG1[3]
GPIO29 XGPIO12 58 PD 2mA GP Input GP Output – – – NWEINT_GPG1[4]
GPIO30 XGPIO13 10 PD 2mA GP Input GP Output – – – NWEINT_GPG1[5]
GPIO31 XGPIO14 9 PD 2mA GP Input GP Output – – – NWEINT_GPG1[6]
GPIO32 XGPIO15 12 PD 2mA GP Input GP Output – – – NWEINT_GPG1[7]
GPIO33 XGPIO16 11 PD 2mA GP Input GP Output – – – NWEINT_GPG2[0]
GPIO34 XGPIO17 8 PD 2mA GP Input GP Output – – – NWEINT_GPG2[1]
GPIO35 XGPIO18 7 PD 2mA GP Input GP Output – – – NWEINT_GPG2[2]
GPIO36 XGPIO19 6 PD 2mA GP Input GP Output – – – NWEINT_GPG2[3]
GPIO37 XGPIO20 13 PD 2mA GP Input GP Output – – – NWEINT_GPG2[4]
GPIO38 XGPIO21 5 PD 2mA GP Input GP Output – – – NWEINT_GPG2[5]
Samsung Semiconductor, Inc. ARTIK 053/053s Module Datasheet
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I2C Interface
GPIO39 XGPIO22 19 PD 2mA GP Input GP Output – – – NWEINT_GPG2[6]
GPIO40 XGPIO23 18 PD 2mA GP Input GP Output – – – NWEINT_GPG2[7]
GPIO41 XGPIO24 4 PD 2mA GP Input GP Output I2S_0_BCLK – – –
GPIO42 XGPIO25 3 PD 2mA GP Input GP Output I2S_0_LRCK – – –
GPIO43 XGPIO26 2 PD 2mA GP Input GP Output I2S_0_SDO – – –
GPIO44 XGPIO27 75 PD 2mA GP Input GP Output I2S_0_SDI – – –
GPIO45 XEINT_0 28 PD 2mA GP Input GP Output – – – NWEINT_GPA0[0]
GPIO46 XEINT_1 30 PD 2mA GP Input GP Output – – – NWEINT_GPA0[1]
GPIO47 XEINT_2 29 PD 2mA GP Input GP Output – – – NWEINT_GPA0[2]
GPIO48 XI2C0_SCL 33 PD 8mA GP Input GP Output HSI2C_0_SCL – – –
GPIO49 XI2C0_SDA 34 PD 8mA GP Input GP Output HSI2C_0_SDA – – –
GPIO50 XI2C1_SCL 35 PD 8mA GP Input GP Output HSI2C_1_SCL – – –
GPIO51 XI2C1_SDA 36 PD 8mA GP Input GP Output HSI2C_1_SDA – – –
GPIO52 XUART0_RXD 47 – 8mA GP Input GP Output UART_0_RXD – – –
GPIO53 XUART0_TXD 46 – 8mA GP Input GP Output UART_0_TXD – – –
GPIO54 XSPI1_CLK 72 PD 2mA GP Input GP Output SPI_1_CLK – – –
GPIO55 XSPI1_CSN 74 PD 2mA GP Input GP Output SPI_1_CSn – – –
GPIO56 XSPI1_MISO 71 PD 2mA GP Input GP Output SPI_1_MISO – – –
GPIO57 XSPI1_MOSI 73 PD 2mA GP Input GP Output SPI_1_MOSI – – –
Table 3. I2C Interface
Pad Name
& Default
Function
Pad
Number
GPIO
Name PU/PD GPIO
Drive Option 1 Option 2 Option 3 Option 4 Option 5 Option 6
XI2C0_SCL 33 GPIO48 PD 8mA GP Input GP Output HSI2C_0_SCL – – –
XI2C0_SDA 36 GPIO49 PD 8mA GP Input GP Output HSI2C_0_SDA – – –
XI2C1_SCL 35 GPIO50 PD 8mA GP Input GP Output HSI2C_1_SCL – – –
XI2C1_SDA 36 GPIO51 PD 8mA GP Input GP Output HSI2C_1_SDA – – –
XGPIO0 70 GPIO00 PD 2mA GP Input GP Output HSI2C_2_SCL – – –
XGPIO1 68 GPIO01 PD 2mA GP Input GP Output HSI2C_2_SDA – – –
XGPIO2 65 GPIO02 PD 2mA GP Input GP Output HSI2C_3_SCL – – –
XGPIO3 69 GPIO03 PD 2mA GP Input GP Output HSI2C_3_SDA – – –
Table 2. GPIO Interface (Continued)
GPIO
Name
Pad Name
& Default
Function
Pad
Number PU/PD GPIO
Drive Option 1 Option 2 Option 3 Option 4 Option 5 Option 6
Samsung Semiconductor, Inc. ARTIK 053/053s Module Datasheet
20
SPI Interface
I2S Interface
ADC Interface
Table 4. SPI Interface
Pad Name
& Default
Function
Pad
Number
GPIO
Name PU/PD GPIO
Drive Option 1 Option 2 Option 3 Option 4 Option 5 Option 6
XSPI0_CLK 51 GPIO00 PD 8mA GP Input GP Output SPI_0_CLK – – –
XSPI0_CSN 49 GPIO01 PD 8mA GP Input GP Output SPI_0_CSn – – –
XSPI0_MISO 48 GPIO02 PD 8mA GP Input GP Output SPI_0_MISO – – –
XSPI0_MOSI 50 GPIO03 PD 8mA GP Input GP Output SPI_0_MOSI – – –
XSPI1_CLK 72 GPIO56 PD 2mA GP Input GP Output SPI_1_CLK – – –
XSPI1_CSN 74 GPIO57 PD 2mA GP Input GP Output SPI_1_CSn – – –
XSPI1_MISO 71 GPIO58 PD 2mA GP Input GP Output SPI_1_MISO – – –
XSPI1_MOSI 73 GPIO59 PD 2mA GP Input GP Output SPI_1_MOSI – – –
XGPIO5 67 GPIO22 PD 2mA GP Input GP Output SPI_2_CSn – – –
XGPIO4 66 GPIO21 PD 2mA GP Input GP Output SPI_2_CLK – – –
XGPIO6 62 GPIO23 PD 2mA GP Input GP Output SPI_2_MISO – – –
XGPIO7 64 GPIO24 PD 2mA GP Input GP Output SPI_2_MOSI – – –
XGPIO9 60 GPIO26 PD 2mA GP Input GP Output SPI_3_CSn – – NWEINT_GPG1[1]
XGPIO11 61 GPIO28 PD 2mA GP Input GP Output SPI_3_MOSI – – NWEINT_GPG1[3]
XGPIO8 63 GPIO25 PD 2mA GP Input GP Output SPI_3_CLK – – NWEINT_GPG1[0]
XGPIO10 59 GPIO27 PD 2mA GP Input GP Output SPI_3_MISO – – NWEINT_GPG1[2]
Table 5. I2S Interface
Pad Name
& Default
Function
Pad
Number
GPIO
Name PU/PD GPIO
Drive Option 1 Option 2 Option 3 Option 4 Option 5 Option 6
XGPIO24 4 GPIO41 PD 2mA GP Input GP Output I2S_0_BCLK – – –
XGPIO25 3 GPIO42 PD 2mA GP Input GP Output I2S_0_LRCK – – –
XGPIO26 2 GPIO43 PD 2mA GP Input GP Output I2S_0_SDO – – –
XGPIO27 75 GPIO44 PD 2mA GP Input GP Output I2S_0_SDI – – –
Table 6. ADC Interface
Pad Name
& Default
Function
Pad
Number
GPIO
Name PU/PD GPIO
Drive Option 1 Option 2 Option 3 Option 4 Option 5 Option 6
XADC0AIN_0 15 – – – – – – – – –
XADC0AIN_1 14 – – – – – – – – –
XADC0AIN_2 16 – – – – – – – – –
XADC0AIN_3 17 – – – – – – – – –
Samsung Semiconductor, Inc. ARTIK 053/053s Module Datasheet
21
PWM Interface
UART Interface
Debug Interface
Table 7. PWM Interface
Pad Name
& Default
Function
Pad
Number
GPIO
Name PU/PD GPIO
Drive Option 1 Option 2 Option 3 Option 4 Option 5 Option 6
XPWMTOUT_0 42 GPIO10 PD 8mA GP Input GP Output PWM_TOUT_0 – UART_3_CTSn –
XPWMTOUT_1 41 GPIO11 PD 8mA GP Input GP Output PWM_TOUT_1 COUNTER_0 UART_3_RTSn –
XPWMTOUT_2 44 GPIO12 PD 8mA GP Input GP Output PWM_TOUT_2 – – –
XPWMTOUT_3 45 GPIO13 PD 8mA GP Input GP Output PWM_TOUT_3 – – –
XPWMTOUT_4 40 GPIO15 PD 8mA GP Input GP Output PWM_TOUT_5 – – –
XPWMTOUT_5 43 GPIO16 PD 8mA GP Input GP Output PWM_TOUT_6 – – –
Table 8. UART Interface
Pad Name
& Default
Funtion
Pad
Number
GPIO
Name PU/PD GPIO
Drive Option 1 Option 2 Option 3 Option 4 Option 5 Option 6
XUART0_RXD 47 GPIO52 PD 8mA GP Input GP Output UART_0_RXD – – –
XUART0_TXD 46 GPIO53 PD 8mA GP Input GP Output UART_0_TXD – – –
XUART1_RXD 53 GPIO04 PD 8mA GP Input GP Output UART_1_RXD UART_2_CTSn – –
XUART1_TXD 52 GPIO05 PD 8mA GP Input GP Output UART_1_TXD UART_2_RTSn – –
XUART2_RXD 54 GPIO06 PD 8mA GP Input GP Output UART_2_RXD – – –
XUART2_TXD 55 GPIO07 PD 8mA GP Input GP Output UART_2_TXD – – –
XUART3_RXD 56 GPIO08 PD 8mA GP Input GP Output UART_3_RXD – – –
XUART3_TXD 57 GPIO09 PD 8mA GP Input GP Output UART_3_TXD – – –
Table 9. Debug Interface
Pad Name
& Default
Function
Pad
Number
GPIO
Name PU/PD GPIO
Drive Option 1 Option 2 Option 3 Option 4 Option 5 Option 6
XJTAG_TCK 24 – PD – – – – – – –
XJTAG_TMS 22 – PU – – – – – – –
XJTAG_TDI 23 – PU – – – – – – –
XJTAG_TDO 25 – PD – – – – – – –
XJTAG_TRST_N 26 – PD – – – – – – –
XDEBUG_RXD 38 GPIO54 PD 8mA GP Input GP Output Xdebug_RXD – – –
XDEBUG_TXD 37 GPIO55 PD 8mA GP Input GP Output Xdebug_TXD – – –
Samsung Semiconductor, Inc. ARTIK 053/053s Module Datasheet
22
INT Interface
Reset Interface
Power Interface
Table 10. Interrupt Interface
Pad Name
& Default
Function
Pad
Number
GPIO
Name PU/PD GPIO
Drive Option 1 Option 2 Option 3 Option 4 Option 5 Option 6
XEINT_0 28 GPIO45 PD 2mA GP Input GP Output – – – NWEINT_GPA0[0]
XEINT_1 30 GPIO46 PD 2mA GP Input GP Output – – – NWEINT_GPA0[1]
XEINT_2 29 GPIO47 PD 2mA GP Input GP Output – – – NWEINT_GPA0[2]
XGPIO8 63 GPIO25 PD 2mA GP Input GP Output SPI_3_CLK – – NWEINT_GPG1[0]
XGPIO9 60 GPIO26 PD 2mA GP Input GP Output SPI_3_CSn – – NWEINT_GPG1[1]
XGPIO10 59 GPIO27 PD 2mA GP Input GP Output SPI_3_MISO – – NWEINT_GPG1[2]
XGPIO11 61 GPIO28 PD 2mA GP Input GP Output SPI_3_MOSI – – NWEINT_GPG1[3]
XGPIO12 58 GPIO29 PD 2mA GP Input GP Output – – – NWEINT_GPG1[4]
XGPIO13 10 GPIO30 PD 2mA GP Input GP Output – – – NWEINT_GPG1[5]
XGPIO14 9 GPIO31 PD 2mA GP Input GP Output – – – NWEINT_GPG1[6]
XGPIO15 12 GPIO32 PD 2mA GP Input GP Output – – – NWEINT_GPG1[7]
XGPIO16 11 GPIO33 PD 2mA GP Input GP Output – – – NWEINT_GPG2[0]
XGPIO17 8 GPIO34 PD 2mA GP Input GP Output – – – NWEINT_GPG2[1]
XGPIO18 7 GPIO35 PD 2mA GP Input GP Output – – – NWEINT_GPG2[2]
XGPIO19 6 GPIO36 PD 2mA GP Input GP Output – – – NWEINT_GPG2[3]
XGPIO20 13 GPIO37 PD 2mA GP Input GP Output – – – NWEINT_GPG2[4]
XGPIO21 5 GPIO38 PD 2mA GP Input GP Output – – – NWEINT_GPG2[5]
XGPIO22 19 GPIO39 PD 2mA GP Input GP Output – – – NWEINT_GPG2[6]
XGPIO23 18 GPIO40 PD 2mA GP Input GP Output – – – NWEINT_GPG2[7]
Table 11. Reset Interface
Pad Name Pad Number
XRESET_N 21
Table 12. Power Interface
Pad Name Pad Number
3V3_EXT_LDO a
a. Voltage reference only; do not use to power external devices
27
DC_5V_12V 32
GND [1, 20, 76, 77, 78, 79]
Samsung Semiconductor, Inc. ARTIK 053/053s Module Datasheet
23
ELECTRICAL SPECIFICATIONS
Absolute Maximum Rating
Recommended Operating Conditions
The recommended operation of the ARTIK 053/053s Module is based on the operating conditions listed in Table 14
Table 13. Absolute Maximum Ratings
PAD
Number Symbol Description Min Typ Max Units
[32] VIN Input voltage VIN on the high-efficiency step-down converter – – 20 V
[2-19],
[21-26],
[28-31],
[33-45],
[48-75]
Vundershoot Undershoot voltage for I/O -0.3 – – V
[31] PWR_RST - -0.3 6 V
[46, 47]
VMAX Based on 3.3V I/O signaling – – 60 V
IMAX
Continuous – – 305 mA
Pulsed – – 800 mA
Table 14. Recommended Operating Conditions
Parameter Symbol Min Typ Max Units
Main Power Supply: PAD: 32 DC_5V_12V 4.75 13.5 V
Operating Temperature Tc-20 – 85 °C
Samsung Semiconductor, Inc. ARTIK 053/053s Module Datasheet
24
DC Electrical Characteristics
Table 15. GPIO DC Electrical Characteristics
PAD
Number Symbol Description Condition Min Typ Max Units
[2-13, 18,
19],
[21-26],
[28-31],
[33-45],
[48-75]
VTOL Tolerant External Voltage 3.3 Power Off and On – – 3.6 V
VIH
High-Level Input Voltage
CMOS Interface – 2.31 – 3.6 V
VIL
Low-Level Input Voltage
CMOS Interface VDD = 3.3V ± 10% -0.3 – 0.7 V
ΔVHysteresis Voltage – 0.15 – – V
IIH
High-Level Input Current
Input Buffer VIN = 3.3V VDD = 3.3V Power On -3 – 3
μAVDD= 3.3V Power Off & SNS=0 -5 – 5
Input Buffer Pull-Down VIN = 3.3V VDD = 3.3V ± 10% 13 40 90
IIL
Low-Level Input Current
Input Buffer VIN = 0V VDD = 3.3V Power On and Off -3 – 3
μA
Input Buffer Pull-Down VIN = 0V VDD = 3.3V -13 – -90
VOH Output High Voltage IOH = 2.0mA, 4.0mA, 8.0mA and 12.0mA 2.64 – 3.3 V
VOL Output Low Voltage IOL = -2.0mA, -4.0mA, -8.0mA and -12.0mA 0 – 0.66
VOZ Output Hi-Z Current – -5 – 5 μA
CIN Input Capacitance Any input and bi-directional buffers – – 5 pF
COUT Output Capacitance Any output buffers – – 5 pF
Table 16. GPIO Signal Drive Strengths
State Currents: Max conditions VDD = 3.3V Units
02mA
14mA
28 (default)mA
312mA
Samsung Semiconductor, Inc. ARTIK 053/053s Module Datasheet
25
Power and Current Consumption
The values in this table are nominal. Measurements were taken on sample boards at room temperature using a wide-
input-range (5–12V) system power supply.
ESD Ratings
Table 17. ADC DC Electrical Characteristics
PAD
Number Symbol Description Condition Min Typ Max Units
[14-17]
VIH High Level Input Voltage Guaranteed Logic High Level 1.26 – 1.8 V
VIL Low Level Input Voltage Guaranteed Logic Low Level 0 – 0.54 V
VOH Output High Voltage IOH = 2mA, 4mA, 8mA and 12mA 1.44 – 1.8 V
VOL Output Low Voltage IOL = 2mA, 4mA, 8mA and 12mA 0 – 0.36 V
IRPU Input Pull-Up Resistor
Current
VPAD = 0 15 – 77 μA
IRPD Input Pull-Down Resistor
Current
VPAD = 1.8 17 – 77 μA
VHInput Hysteresis – 0.18 – – V
IPAD Input Leakage Current
for Non Tolerant Cells
DVDD = 1.8, VPAD = 0 or 1.8V -6 – +6 μA
IOZ Off State Leakage
Current
DVDD = 1.8, VPAD = 0 or 1.8V -6 – +6 μA
Table 18. ARTIK 053/053s Module Power Consumption
Category Scenario Condition Throughput
Conditions
Current
(mA)
Power
(W)
Wi-Fi 802.11b Tx 5V supply; transfer packet using iperf3 @ 11 Mbps & max TX power – 362 ±30 1.8
12V supply; transfer packet using iperf3 @ 11 Mbps & max TX power – 151 ±15 1.8
802.11n Tx 5V supply; transfer packet using iperf3 @ 25 Mbps Max 254 ±25 1.27
12V supply; transfer packet using iperf3 @ 25 Mbps Max 110 ±10 1.32
802.11n Rx 5V supply; transfer packet using iperf3 @ 25 Mbps Max 191 ±20 0.955
12V supply; transfer packet using iperf3 @ 25 Mbps Max 85 ±10 1.02
802.11n Idle 5V supply; DTIM3 – 46.5 ±5 0.233
12V supply; DTIM3 – 23.3 ±3 0.279
Table 19. ESD Ratings
Parameter Min Typ Max Units
ESD stress voltage Human Body Model (JEDEC) -1.0 – 1.0 kV
ESD stress voltage Charged Device Model –250– V
Samsung Semiconductor, Inc. ARTIK 053/053s Module Datasheet
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RF Electrical Characteristics
Table 20. Tx Performance Characteristics
Parameter Min Typ Max Units
RF frequency range 2412 - 2472 GHz
11b (1-11Mbps) –16–dBm
11g (6-54Mbps) –14–dBm
11n, HT20 (MCS0-7) –12–dBm
Table 21. Rx Performance Characteristics a
a. Measured in a conduction test performed in a shielded room
Parameter Min Typ Max Units
RF frequency range 2412 – 2472 GHz
11b (1Mbps) –-97.2–dBm
11b (11Mbps) –-89.1–dBm
11g (6Mbps) –-94.1–dBm
11g (54Mbps) –-76.2–dBm
11n, HT20 (MCS0) –-93.9– dBm
11n, HT20 (MCS07) –-73.8–dBm
Samsung Semiconductor, Inc. ARTIK 053/053s Module Datasheet
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MECHANICAL SPECIFICATIONS
Figure 5 shows the mechanical dimensions of the ARTIK 053/053s Module. All dimensions are in mm.
Figure 5. ARTIK 053/053s Module Mechanical Dimensions
The top layer “NO PCB ROUTING” gray areas are to prevent any shorts between exposed vias or traces and
unused ARTIK 053/053s Module pads.
Diagram is not drawn to scale
Samsung Semiconductor, Inc. ARTIK 053/053s Module Datasheet
28
Module Antenna Placement Requirements
The ARTIK 053/053s Module has an integrated on-module antenna. The figure below describes the required
restrictions on location when placing the ARTIK 053/053s Module on your native PCB design. In addition, adhere to
the following guidelines:
• To avoid severe Wi-Fi radiation loss, Samsung Semiconductor, Inc. strongly recommends allocating a “No
PCB Routing or Power Planes” metal-free area of at least 5×6.7mm (all layers) next to the on-module antenna,
as shown in Figure 6.
• Locate the antenna area at the edge of your PCB board, and as far away from other electronics as possible.
Figure 6. Module Placement Restrictions
ARTIK 053s
Module
Wi‐FiAntenna
Keep‐outArea
Keep‐
out
Area
Keep‐
out
Area
5mm 5mm
6.7mm
PCBDesignRoutingPCBDesignRouting
6.7mm
Samsung Semiconductor, Inc. ARTIK 053/053s Module Datasheet
29
CERTIFICATION AND COMPLIANCE
CE
The ARTIK 053/053s Module is in compliance with each applicable article of the Radio Equipment Directive (RED)
Compliance with the following standards was confirmed:
• Article 3.1a (Health and Safety) EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2001 + A2:2013
• Article 3.1.b (EMC) EN 301 489-1 V2.1.1
EN 301 489-17 V3.1.1
• Article 3.2 (Radio spectrum use) EN 300 328 V2.1.1
EN 62311:2008
For a formal notified body statement of opinion contact your sales representative.
FCC Regulatory Disclosures
This device complies with Part 15 of the FCC`s Rules. Operation is subject to the following two Conditions: (1) This
device may not cause harmful interference, and (2) This device must accept any interference received, including
interference that may cause undesirable operation.
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15
of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a
residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed
and used in accordance with the instructions, may cause harmful interference to radio communications. However,
there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful
interference to radio or television reception, which can be determined by turning the equipment off and on, the user
is encouraged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/ TV technician for help.
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This
equipment should be installed and operated with a minimum distance of 20cm between the transmitter’s radiating
structure(s) and the body of the user or nearby persons.
This module is intended for OEM integration. The OEM integrator is responsible for FCC compliance and compliance
with all applicable regulations including those for modular transmitters 47 C.F.R. 15.212. The OEM product must
comply with all applicable labeling requirements including those contained in 15 C.F.R. 15.19. The OEM is solely
responsible for certification and testing and labeling of its own products. In addition to any independently required
labels, the OEM shall also affix to the outside of a device into which the module is installed a label referring to the
enclosed module. This exterior label should be prepared in a legible font and permanently affixed and using the
wording “Contains Transmitter Module FCCID: A3LCWAM210S.”
The OEM is required to ensure that the end product integrates this module so as to maintain a minimum distance of
20 cm between the equipment’s radiating structure(s) and the body of the user or nearby persons. The OEM shall
also advise its end user of this requirement as required by applicable rules.
Samsung Semiconductor, Inc. ARTIK 053/053s Module Datasheet
30
The OEM shall require that the end user of its product be informed that the FCC radio frequency exposure guidelines
for an uncontrolled environment can be satisfied. The OEM shall further inform its end user that any change or
modifications to this module not expressly approved by the manufacturer will void the warranty and the users’
authority to operate the equipment.
Samsung Semiconductor, Inc. ARTIK 053/053s Module Datasheet
31
Industry Canada Regulatory Disclosures
Industry Canada Statement
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following
two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.
Cet appareil est conforme avec Industrie Canada exempts de licence standard RSS (s). L’opération est soumise aux
deux conditions suivantes:(1) cet appareil ne peut causer d’interférences, et?(2) cet appareil doit accepter toute
interférence, y compris les interférences qui peuvent causer un mauvais fonctionnement de l’appareil.
Industry Canada Radiation Exposures Statement and Limitations on Use
This equipment complies with IC RSS-102 radiation exposure limits set forth for an uncontrolled environment. This
equipment should be installed and operated with minimum distance 20 cm between the radiator and your body. This
equipment should be installed and must not be co-located or operating in conjunction with any other antenna or
transmitter.
In the United States and Canada, only Channel 1~11 can be operated and these channel assignments deal only with
the 2.4 GHz range.
The end product must be labeled to display the Industry Canada certification number of the module
Contains transmitter module IC: 649E-CWAM210S
Le dispositif d’accueil doivent être étiquetés pour afficher le numéro de certification d’Industrie Canada du module.
Contient module émetteur IC : 649E-CWAM210S
KC
The ARTIK 053/053s Module complies with the standards set by the Korean communications commission (KC).
KC Identifier: MSIP-CRM-SEC-CWAM210S
SRRC
Both the ARTIK 053/053s Module complies with the standards set by the People’s Republic of China.
CMIIT ID: 2017DJ0869(M)
Samsung Semiconductor, Inc. ARTIK 053/053s Module Datasheet
32
EU Regulatory Disclosures
CE Statement
The following statement must be supplied with each product but can be printed in the user manual, the packaging, or
provided as a separated leaflet.
Hereby, Samsung declares that this IoT Module is in compliance with the essential requirements and other
relevant provisions of Article 3 Essential requirements of the R&TTE Equipment Directive 1999/5/EC, 2014/
53/EU and RoHS directive 2011/65/EU.
“The declaration of conformity may be consulted at www.artik.io/certification”
The OEM is required to ensure that the end product integrates this module so as to maintain a minimum distance of
20 cm between the equipment’s radiating structure(s) and the body of the user or nearby persons. The OEM shall
also advise its end user of this requirement as required by applicable rules.
Samsung Semiconductor, Inc. ARTIK 053/053s Module Datasheet
33
ORDERING INFORMATION
For volume ordering of evaluation kits, contact a sales representative in your area or visit:
https://www.artik.io/contact-us/
Type Order Number Description
ARTIK 053s Module SIP-0P5WRS302 One ARTIK 053s Module
ARTIK 053s Development Kit SIP-KITNXF002 One ARTIK 053s Module
One Embedded Evaluation Board
Samsung Semiconductor, Inc. ARTIK 053/053s Module Datasheet
LEGAL INFORMATION
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH THE SAMSUNG ARTIK™ DEVELOPMENT KIT
AND ALL RELATED PRODUCTS, UPDATES, AND DOCUMENTATION (HEREINAFTER "SAMSUNG PRODUCTS"). NO
LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS
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SAMSUNG PRODUCTS ARE GOVERNED EXCLUSIVELY BY THE SAMSUNG ARTIK™ DEVELOPER LICENSE AGREEMENT
THAT YOU AGREED TO WHEN YOU REGISTERED AS A DEVELOPER TO RECEIVE THE SAMSUNG PRODUCTS. EXCEPT
AS PROVIDED IN THE SAMSUNG ARTIK™ DEVELOPER LICENSE AGREEMENT, SAMSUNG ELECTRONICS CO., LTD. AND
ITS AFFILIATES (COLLECTIVELY, "SAMSUNG") ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT
LIMITATION CONSEQUENTIAL OR INCIDENTAL DAMAGES, AND SAMSUNG DISCLAIMS ANY EXPRESS OR IMPLIED
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SAMSUNG RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION, DOCUMENTATION AND SPECIFICATIONS
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Samsung Products are not intended for use in medical, life support, critical care, safety equipment, or similar
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This document and all information discussed herein remain the sole and exclusive property of Samsung. All brand
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Copyright © 2017 Samsung Electronics Co., Ltd.
All rights reserved. No part of this publication may be reproduced, stored in a retrieval system, or transmitted in any
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34
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Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" basis,
without warranties of any kind. This document and all information discussed herein remain the sole and exclusive property of Samsung
Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property right is granted by one party to the
other party under this document, by implication, estoppel or other-wise. Samsung products are not intended for use in life support, critical
care, medical, safety equipment, or similar applications where product failure could result in loss of life or personal or physical harm, or any
military or defense application, or any governmental procurement to which special terms or provisions may apply. For updates or additional
information about Samsung products, contact your nearest Samsung office. All brand names, trademarks and registered trademarks belong
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