74AHC132D-T - Philips Semiconductors / NXP Semiconductors

DATA SH EET

Product speciﬁcation

Supersedes data of 1999 May 31

File under Integrated Circuits, IC06

1999 Sep 24

INTEGRATED CIRCUITS

74AHC132; 74AHCT132

Quad 2-input NAND Schmitt trigger

1999 Sep 24 2

Philips Semiconductors Product speciﬁcation

Quad 2-input NAND Schmitt trigger 74AHC132; 74AHCT132

FEATURES

•ESD protection:

HBM EIA/JESD22-A114-A

exceeds 2000 V;

MM EIA/JESD22-A115-A

exceeds 200 V

CDM EIA/JESD22-C101

exceeds 1000 V

•Balanced propagation delays

•Inputsacceptsvoltageshigherthan

VCC

•For AHC only:

operates with CMOS input levels

•For AHCT only:

operates with TTL input levels

•Specified from

−40 to +85 and +125 °C.

DESCRIPTION

The 74AHC/AHCT132 are

high-speed Si-gate CMOS devices

and are pin compatible with Low

power Schottky TTL (LSTTL). They

are specified in compliance with

JEDEC standard No. 7A.

The 74AHC/AHCT132 contain four

2-input NAND gates which accept

standard input signals. They are

capable of transforming slowly

changing input signals into sharply

defined, jitter free output signals.

The gate switches at different points

for positive and negative-going

signals. The difference between the

positive voltage VT+ and the negative

VT− is defined as the hysteresis

voltage VH.

FUNCTION TABLE

See note 1.

Note

1. H = HIGH voltage level; L = LOW voltage level.

QUICK REFERENCE DATA

GND = 0 V; Tamb =25°C; tr=t

f≤3.0 ns.

Notes

1. CPD is used to determine the dynamic power dissipation (PDin µW).

PD=C

PD ×VCC2×fi+∑(CL×VCC2×fo) where:

fi= input frequency in MHz;

fo= output frequency in MHz;

∑(CL×VCC2×fo) = sum of outputs;

CL= output load capacitance in pF;

VCC = supply voltage in Volts.

2. The condition is VI= GND to VCC.

INPUTS OUTPUT

nA nB nY

LLH

LHH

HLH

HHL

SYMBOL PARAMETER CONDITIONS TYPICAL UNIT

AHC AHCT

tPHL/tPLH propagation delay

nA to nY CL= 15 pF;

VCC =5V 3.3 3.5 ns

CIinput capacitance VI=V

CC or GND 3.0 3.0 pF

COoutput capacitance 4.0 4.0 pF

CPD power dissipation

capacitance CL= 50 pF;

f = 1 MHz;

notes 1 and 2

11 14 pF

ORDERING INFORMATION

OUTSIDE NORTH

AMERICA NORTH AMERICA PACKAGES

PINS PACKAGE MATERIAL CODE

74AHC132D 74AHC132D 14 SO plastic SOT108-1

74AHC132PW 74AHC132PW DH 14 TSSOP plastic SOT402-1

74AHCT132D 74AHCT132D 14 SO plastic SOT108-1

74AHCT132PW 74AHCT132PW DH 14 TSSOP plastic SOT402-1

1999 Sep 24 3

Philips Semiconductors Product speciﬁcation

Quad 2-input NAND Schmitt trigger 74AHC132; 74AHCT132

PINNING

PIN SYMBOL DESCRIPTION

1, 4, 9 and 12 1A to 4A data inputs

2, 5, 10 and 13 1B to 4B data inputs

3, 6, 8 and 11 1Y to 4Y data outputs

7 GND ground (0 V)

14 VCC DC supply voltage

Fig.1 Pin configuration.

handbook, halfpage

MNA406

132

GND 3Y

VCC

Fig.2 Logic symbol.

MNA407

handbook, halfpage

1999 Sep 24 4

Philips Semiconductors Product speciﬁcation

Quad 2-input NAND Schmitt trigger 74AHC132; 74AHCT132

Fig.3 IEC logic symbol.

handbook, halfpage

10 8

MNA408

13 11

Fig.4 Logic diagram (one Schmitt trigger).

MNA409

handbook, halfpage

RECOMMENDED OPERATING CONDITIONS

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134); voltages are referenced to GND (ground = 0 V).

Notes

1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

2. For SO packages: above 70 °C the value of PDderates linearly with 8 mW/K.

For TSSOP packages: above 60 °C the value of PDderates linearly with 5.5 mW/K.

SYMBOL PARAMETER CONDITIONS 74AHC 74AHCT UNIT

MIN. TYP. MAX. MIN. TYP. MAX.

VCC DC supply voltage 2.0 5.0 5.5 4.5 5.0 5.5 V

VIinput voltage 0 −5.5 0 −5.5 V

VOoutput voltage 0 −VCC 0−VCC V

Tamb operating ambient temperature

range see DC and AC

characteristics per

device

−40 +25 +85 −40 +25 +85 °C

−40 +25 +125 −40 +25 +125 °C

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

VCC DC voltage −0.5 +7.0 V

VIinput voltage range −0.5 +7.0 V

IIK DC input diode current VI<−0.5 V; note 1 −−20 mA

IOK DC output diode current VO<−0.5 Vor VO>V

CC + 0.5 V; note 1 −±20 mA

IODC output source or sink current −0.5V<V

O<V

CC + 0.5 V −±25 mA

ICC DC VCC or GND current −±75 mA

Tstg storage temperature range −65 +150 °C

PDpower dissipation per package for temperature range: −40 to +125 °C; note 2 −500 mW

1999 Sep 24 5

Philips Semiconductors Product speciﬁcation

Quad 2-input NAND Schmitt trigger 74AHC132; 74AHCT132

DC CHARACTERISTICS

Type 74AHC132

Over recommended operating conditions; voltage are referenced to GND (ground = 0 V).

SYMBOL PARAMETER

TEST CONDITIONS Tamb (°C)

UNIT

OTHER VCC (V) 25 −40 to +85 −40 to +125

MIN. TYP. MAX. MIN. MAX. MIN. MAX.

VT+ positive going

threshold 3.0 −− 2.2 −2.2 −2.2 V

4.5 −− 3.15 −3.15 −3.15

5.5 −− 3.85 −3.85 −3.85

VT−negative going

threshold 3.0 0.9 −−0.9 −0.9 −V

4.5 1.35 −−1.35 −1.35 −

5.5 1.65 −−1.65 −1.65 −

VHhysteresis

(VT+ −VT−)3.0 0.3 −1.2 0.3 1.2 0.25 1.2 V

4.5 0.4 −1.4 0.4 1.4 0.35 1.4

5.5 0.5 −1.6 0.5 1.6 0.45 1.6

VOH HIGH-level output

voltage; all

outputs

VI=V

IH or VIL;

IO=−50 µA2.0 1.9 2.0 −1.9 −1.9 −V

3.0 2.9 3.0 −2.9 −2.9 −

4.5 4.4 4.5 −4.4 −4.4 −

HIGH-level output

voltage VI=V

IH or VIL;

IO=−4.0 mA 3.0 2.58 −−2.48 −2.40 −V

VI=V

IH or VIL;

IO=−8.0 mA 4.5 3.94 −−3.8 −3.7 −

VOL LOW-level output

voltage; all

outputs

VI=V

IH or VIL;

IO=50µA2.0 −0 0.1 −0.1 −0.1 V

3.0 −0 0.1 −0.1 −0.1

4.5 −0 0.1 −0.1 −0.1

LOW-level output

voltage VI=V

IH or VIL;

IO=4mA 3.0 −− 0.36 −0.44 −0.55 V

VI=V

IH or VIL;

IO=8mA 4.5 −− 0.36 −0.44 −0.55

IIinput leakage

current VI=V

CC or GND 5.5 −− 0.1 −1.0 −2.0 µA

ICC quiescent supply

current VI=V

CC or GND;

IO=0 5.5 −− 2.0 −20 −40 µA

CIinput capacitance −310−10 −10 pF

1999 Sep 24 6

Philips Semiconductors Product speciﬁcation

Quad 2-input NAND Schmitt trigger 74AHC132; 74AHCT132

Type 74AHCT132

Over recommended operating conditions; voltage are referenced to GND (ground = 0 V).

SYMBOL PARAMETER

TEST CONDITIONS Tamb (°C)

UNIT

OTHER VCC (V) 25 −40 to +85 −40 to +125

MIN. TYP. MAX. MIN. MAX. MIN. MAX.

VT+ positive going

threshold 4.5 −− 1.9 −1.9 −1.9 V

5.5 −− 2.1 −2.1 −2.1 V

VT−negative going

threshold 4.5 0.5 −−0.5 −0.5 −V

5.5 0.6 −−0.6 −0.6 −V

VHhysteresis

(VT+ −VT−)4.5 0.3 −1.4 0.3 1.4 0.3 1.4 V

5.5 0.3 −1.5 0.3 1.5 0.3 1.5 V

VOH HIGH-leveloutput

voltage; all

outputs

VI=V

IH or VIL;

IO=−50 µA4.5 4.4 4.5 −4.4 −4.4 −V

HIGH-leveloutput

voltage VI=V

IH or VIL;

IO=−8.0 mA 4.5 3.94 −−3.8 −3.7 −V

VOL LOW-level output

voltage; all

outputs

VI=V

IH or VIL;

IO=50µA4.5 −0 0.1 −0.1 −0.1 V

LOW-level output

voltage VI=V

IH or VIL;

IO=8mA 4.5 −− 0.36 −0.44 −0.55 V

IIinput leakage

current VI=V

CC or GND 5.5 −− 0.1 −1.0 −2.0 µA

ICC quiescent supply

current VI=V

CC or GND;

IO=0 5.5 −− 2.0 −20 −40 µA

∆ICC additional

quiescent supply

current per input

VI=V

CC −2.1 V

other inputs at

VCC or GND;

IO=0

4.5 to 5.5 −− 1.35 −1.5 −1.5 mA

CIinput capacitance −310−10 −10 pF

1999 Sep 24 7

Philips Semiconductors Product speciﬁcation

Quad 2-input NAND Schmitt trigger 74AHC132; 74AHCT132

AC CHARACTERISTICS

Type 74AHC132

GND = 0 V; tr=t

f≤3.0 ns.

Notes

1. Typical values at VCC = 3.3 V.

2. Typical values at VCC = 5.0 V.

Type 74AHCT132

GND = 0 V; tr=t

f≤3.0 ns.

Note

1. Typical values at VCC = 5.0 V.

SYMBOL PARAMETER

TEST CONDITIONS Tamb (°C)

UNIT

WAVEFORMS CL25 −40 to +85 −40 to +125

MIN. TYP. MAX. MIN. MAX. MIN. MAX.

VCC = 3.0 to 3.6 V; note 1

tPHL/tPLH propagationdelay

nA, nB to nY see Figs 5 and 6 15 pF −4.4 11.9 1.0 14.0 1.0 15.0 ns

50 pF −6.2 15.4 1.0 17.5 1.0 19.5 ns

VCC = 4.5 to 5.5 V; note 2

tPHL/tPLH propagationdelay

nA, nB to nY see Figs 5 and 6 15 pF −3.3 7.7 1.0 9.0 1.0 10.0 ns

50 pF −4.7 9.7 1.0 11.0 1.0 12.5 ns

SYMBOL PARAMETER

TEST CONDITIONS Tamb (°C)

UNIT

WAVEFORMS CL25 −40 to +85 −40 to +125

MIN. TYP. MAX. MIN. MAX. MIN. MAX.

VCC = 4.5 to 5.5 V; note 1

tPHL/tPLH propagationdelay

nA, nB to nY see Figs 5 and 6 15 pF −3.5 7.0 1.0 8.0 1.0 9.0 ns

50 pF −5.0 8.0 1.0 9.0 1.0 10.0 ns

1999 Sep 24 8

Philips Semiconductors Product speciﬁcation

Quad 2-input NAND Schmitt trigger 74AHC132; 74AHCT132

AC WAVEFORMS

Fig.5 The input (nA, nB) to output (nY) propagation delays.

FAMILY VI INPUT

REQUIREMENTS VM(1)

INPUT VM(1)

OUTPUT

AHC GND to VCC 50% VCC 50% VCC

AHCT GND to 3.0 V 1.5 V 50% VCC

handbook, halfpage

MNA410

tPHL tPLH

VM(1)

nA, nB INPUT

nY OUTPUT

GND

VCC

VOH

VOL

Fig.6 Load circuitry for switching times.

handbook, full pagewidth

open

GND

VCC

VIVO

MNA219

D.U.T.

1000 Ω

PULSE

GENERATOR

TEST S1

tPLH/tPHL open

tPLZ/tPZL VCC

tPHZ/tPZH GND

1999 Sep 24 9

Philips Semiconductors Product speciﬁcation

Quad 2-input NAND Schmitt trigger 74AHC132; 74AHCT132

TRANSFER CHARACTERISTIC WAVEFORMS

Fig.7 Transfer characteristics.

handbook, halfpage

MNA207

VT+VT−

Fig.8 The definition of VT+,V

T−and VH.

handbook, halfpage

MNA208

VIVH

VT+

VT−

Fig.9 Typical AHC transfer characteristics;

VCC = 3.0 V.

handbook, halfpage

001 3

1.5

0.5

MNA411

2VI (V)

ICC

(mA)

Fig.10 Typical AHC transfer characteristics;

VCC = 4.5 V.

handbook, halfpage

(V)

ICC

(mA)

MNA412

1234

1999 Sep 24 10

Philips Semiconductors Product speciﬁcation

Quad 2-input NAND Schmitt trigger 74AHC132; 74AHCT132

Fig.11 Typical AHC transfer characteristics;

VCC = 5.5 V.

handbook, halfpage

02 6

MNA413

4VI (V)

ICC

(mA)

Fig.12 Typical AHCT transfer characteristics;

VCC = 4.5 V.

handbook, halfpage

(V)

ICC

(mA)

MNA414

1234

Fig.13 Typical AHCT transfer characteristics;

VCC = 5.5 V.

handbook, halfpage

02 6

MNA415

4VI (V)

ICC

(mA)

Fig.14 Relaxation oscillator.

For AHC:

For AHCT:

--- 1

0.55 RC×

---------------------------

≈=

--- 1

0.60 RC×

---------------------------

≈=

handbook, halfpage

MNA416

VCC

1999 Sep 24 11

Philips Semiconductors Product speciﬁcation

Quad 2-input NAND Schmitt trigger 74AHC132; 74AHCT132

PACKAGE OUTLINES

UNIT A

max. A1A2A3bpcD

(1) E(1) (1)

ELL

pQZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC EIAJ

inches

1.75 0.25

0.10 1.45

1.25 0.25 0.49

0.36 0.25

0.19 8.75

8.55 4.0

3.8 1.27 6.2

5.8 0.7

0.6 0.7

0.3 8

0.25 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.0

0.4

SOT108-1

detail X

vMA

(A )

076E06S MS-012AB

pin 1 index

0.069 0.010

0.004 0.057

0.049 0.01 0.019

0.014 0.0100

0.0075 0.35

0.34 0.16

0.15 0.050

1.05

0.041

0.244

0.228 0.028

0.024 0.028

0.012

0.01

0.25

0.01 0.004

0.039

0.016

95-01-23

97-05-22

0 2.5 5 mm

scale

SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1

1999 Sep 24 12

Philips Semiconductors Product speciﬁcation

Quad 2-input NAND Schmitt trigger 74AHC132; 74AHCT132

UNIT A1A2A3bpcD

(1) E(2) (1)

ELL

pQZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC EIAJ

mm 0.15

0.05 0.95

0.80 0.30

0.19 0.2

0.1 5.1

4.9 4.5

4.3 0.65 6.6

6.2 0.4

0.3 0.72

0.38 8

0.13 0.10.21.0

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

0.75

0.50

SOT402-1 MO-153 94-07-12

95-04-04

0.25

14 8

detail X

(A )

vMA

0 2.5 5 mm

scale

TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1

max.

1.10

pin 1 index

1999 Sep 24 13

Philips Semiconductors Product speciﬁcation

Quad 2-input NAND Schmitt trigger 74AHC132; 74AHCT132

SOLDERING

Introduction to soldering surface mount packages

Thistext givesa verybrief insightto acomplex technology.

A more in-depth account of soldering ICs can be found in

our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).

There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering is not always suitable

for surface mount ICs, or for printed-circuit boards with

high population densities. In these situations reflow

soldering is often used.

Reﬂow soldering

Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied

tothe printed-circuit boardbyscreen printing,stencillingor

pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,

infrared/convection heating in a conveyor type oven.

Throughput times (preheating, soldering and cooling) vary

between 100 and 200 seconds depending on heating

method.

Typical reflow peak temperatures range from

215 to 250 °C. The top-surface temperature of the

packages should preferable be kept below 230 °C.

Wave soldering

Conventional single wave soldering is not recommended

forsurfacemountdevices(SMDs)orprinted-circuitboards

with a high component density, as solder bridging and

non-wetting can present major problems.

To overcome these problems the double-wave soldering

method was specifically developed.

If wave soldering is used the following conditions must be

observed for optimal results:

•Use a double-wave soldering method comprising a

turbulent wave with high upward pressure followed by a

smooth laminar wave.

•For packages with leads on two sides and a pitch (e):

– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the

transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the

printed-circuit board.

The footprint must incorporate solder thieves at the

downstream end.

•Forpackageswithleadsonfoursides, thefootprint must

be placed at a 45°angle to the transport direction of the

printed-circuit board. The footprint must incorporate

solder thieves downstream and at the side corners.

During placement and before soldering, the package must

be fixed with a droplet of adhesive. The adhesive can be

applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the

adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.

Manual soldering

Fix the component by first soldering two

diagonally-opposite end leads. Use a low voltage (24 V or

less) soldering iron applied to the flat part of the lead.

Contact time must be limited to 10 seconds at up to

300 °C.

When using a dedicated tool, all other leads can be

soldered in one operation within 2 to 5 seconds between

270 and 320 °C.

1999 Sep 24 14

Philips Semiconductors Product speciﬁcation

Quad 2-input NAND Schmitt trigger 74AHC132; 74AHCT132

Suitability of surface mount IC packages for wave and reﬂow soldering methods

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package

cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the

Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these

products can reasonably be expected to result in personal injury. Philips customers using or selling these products for

use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such

improper use or sale.

PACKAGE SOLDERING METHOD

WAVE REFLOW(1)

BGA, SQFP not suitable suitable

HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not suitable(2) suitable

PLCC(3), SO, SOJ suitable suitable

LQFP, QFP, TQFP not recommended(3)(4) suitable

SSOP, TSSOP, VSO not recommended(5) suitable

Data sheet status

Objective speciﬁcation This data sheet contains target or goal speciﬁcations for product development.

Preliminary speciﬁcation This data sheet contains preliminary data; supplementary data may be published later.

Product speciﬁcation This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or

more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation

of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation

is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

1999 Sep 24 15

Philips Semiconductors Product speciﬁcation

Quad 2-input NAND Schmitt trigger 74AHC132; 74AHCT132

NOTES

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

1999 68

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Tel. +64 9 849 4160, Fax. +64 9 849 7811

Norway: Box 1, Manglerud 0612, OSLO,

Tel. +47 22 74 8000, Fax. +47 22 74 8341

Pakistan: see Singapore

Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,

Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474

Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,

Tel. +48 22 5710 000, Fax. +48 22 5710 001

Portugal: see Spain

Romania: see Italy

Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. +7 095 755 6918, Fax. +7 095 755 6919

Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,

Tel. +65 350 2538, Fax. +65 251 6500

Slovakia: see Austria

Slovenia: see Italy

South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,

Tel. +27 11 471 5401, Fax. +27 11 471 5398

South America: Al. Vicente Pinzon, 173, 6th floor,

04547-130 SÃO PAULO, SP, Brazil,

Tel. +55 11 821 2333, Fax. +55 11 821 2382

Spain: Balmes 22, 08007 BARCELONA,

Tel. +34 93 301 6312, Fax. +34 93 301 4107

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,

Tel. +46 8 5985 2000, Fax. +46 8 5985 2745

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,

Tel. +41 1 488 2741 Fax. +41 1 488 3263

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,

TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,

209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,

Tel. +66 2 745 4090, Fax. +66 2 398 0793

Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,

ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,

252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,

MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,

Tel. +1 800 234 7381, Fax. +1 800 943 0087

Uruguay: see South America

Vietnam: see Singapore

Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. +381 11 62 5344, Fax.+381 11 63 5777

Printed in The Netherlands 245002/02/pp16 Date of release: 1999 Sep 24 Document order number: 9397 750 06294