LM185-1.2-N, LM285-1.2-N, LM385-1.2-N www.ti.com SNVS742E - JANUARY 2000 - REVISED APRIL 2013 LM185-1.2-N/LM285-1.2-N/LM385-1.2-N Micropower Voltage Reference Diode Check for Samples: LM185-1.2-N, LM285-1.2-N, LM385-1.2-N FEATURES 1 * * * * * * 2 * 1% and 2% Initial Tolerance Operating Current of 10A to 20mA 1 Dynamic Impedance Low Temperature Coefficient Low Voltage Reference--1.235V 2.5V Device and Adjustable Device Also Available LM185-2.5 Series and LM185 Series, respectively DESCRIPTION The LM185-1.2-N/LM285-1.2-N/LM385-1.2-N are micropower 2-terminal band-gap voltage regulator diodes. Operating over a 10A to 20mA current range, they feature exceptionally low dynamic impedance and good temperature stability. On-chip trimming is used to provide tight voltage tolerance. Since the LM185-1.2-N band-gap reference uses only transistors and resistors, low noise and good long term stability result. Careful design of the LM185-1.2-N has made the device exceptionally tolerant of capacitive loading, making it easy to use in almost any reference application. The wide dynamic operating range allows its use with widely varying supplies with excellent regulation. The extremely low power drain of the LM185-1.2-N makes it useful for micropower circuitry. This voltage reference can be used to make portable meters, regulators or general purpose analog circuitry with battery life approaching shelf life. Further, the wide operating current allows it to replace older references with a tighter tolerance part. The LM185-1.2-N is rated for operation over a -55C to 125C temperature range while the LM285-1.2-N is rated -40C to 85C and the LM385-1.2-N 0C to 70C. The LM185-1.2-N/LM285-1.2-N are available in a hermetic TO package and the LM285-1.2-N/LM3851.2-N are also available in a low-cost TO-92 molded package, as well as SOIC and SOT-23. CONNECTION DIAGRAM Figure 1. T0-92 Package (LP) (Bottom View) Figure 3. SOIC Package * Pin 3 is attached to the Die Attach Pad (DAP) and should be connected to Pin 2 or left floating. Figure 2. SOT-23 Figure 4. TO Package (NDV) (Bottom View) 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2000-2013, Texas Instruments Incorporated LM185-1.2-N, LM285-1.2-N, LM385-1.2-N SNVS742E - JANUARY 2000 - REVISED APRIL 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ABSOLUTE MAXIMUM RATINGS (1) (2) (3) Reverse Current 30mA Forward Current 10mA Operating Temperature Range (4) LM185-1.2-N -55C to +125C LM285-1.2-N -40C to +85C LM385-1.2-N ESD Susceptibility 0C to 70C (5) 2kV -55C to +150C Storage Temperature Soldering Information TO-92 package: 10 sec. 260C TO package:10 sec. 300C SOIC and SOT-23 Pkg. Vapor phase (60 sec.) 215C Infrared (15 sec.) 220C See AN-450 "Surface Mounting Methods and Their Effect on Product Reliability" for other methods of soldering surface mount devices. (1) (2) (3) (4) (5) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional. For specifications and test conditions, see the Electrical Characteristics. The specifications apply only for the test conditions listed. Refer to RETS185H-1.2 for military specifications. If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications. For elevated temperature operation, see Table 1. The human body model is a 100 pF capacitor discharged through a 1.5 k resistor into each pin. Table 1. TJ(max) for Elevated Temperature Operation 2 Submit Documentation Feedback DEVICE TJ(max) (C) LM185-1.2-N 150 LM285-1.2-N 125 LM385-1.2-N 100 Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N LM185-1.2-N, LM285-1.2-N, LM385-1.2-N www.ti.com SNVS742E - JANUARY 2000 - REVISED APRIL 2013 ELECTRICAL CHARACTERISTICS (1) LM185-1.2-N Parameter Conditions Typ LM185BX-1.2-N LM385B-1.2-N LM185BY-1.2-N LM385BX-1.2-N LM285-1.2-N LM385BY-1.2-N LM385-1.2-N Units (Limit) LM285BX-1.2-N LM285BY-1.2-N Tested Limit (2) (3) Reverse Breakdown TA = 25C, Voltage 10A IR 20mA Minimum Operating Current Reverse Breakdown Voltage Change with Current 1.23 5 Design Limit (4) 1.223 10 Design Limit (4) 1.223 1.247 8 Tested Limit (2) 1 1.5 V(Min) 1.260 15 20 LM385M3-1.2-N 10A IR 1mA Design Limit (4) 1.205 1.247 20 Tested Limit (2) 1 1.5 V(Max) 15 20 A 10 15 (Max) 1 1.5 mV (Max) 1mA IR 20mA 10 20 20 25 20 25 mV (Max) IR = 100A, f = 20Hz 1 Wideband Noise IR = 100A, 60 V (rms) 10Hz f 10kHz Long Term Stability IR = 100A, T = 1000 Hr, 20 ppm Reverse Dynamic Impedance TA = 25C 0.1C Average Temperature Coefficient (5) IR = 100A X Suffix 30 30 ppm/C Y Suffix 50 50 ppm/C All Others 150 150 150 ppm/C (Max) (1) (2) (3) (4) (5) Parameters identified with boldface type apply at temperature extremes. All other numbers apply at TA = TJ = 25C. Production tested. A military RETS electrical specification is available on request. Specified by design. Not production tested. These limits are not used to calculate average outgoing quality levels. The average temperature coefficient is defined as the maximum deviation of reference voltage at all measured temperatures between the operating TMAX and TMIN, divided by TMAX - TMIN. The measured temperatures are -55C, -40C, 0C, 25C, 70C, 85C, 125C. THERMAL CHARACTERISTICS Thermal Resistance JA (junction to ambient) JC (junction to case) Copyright (c) 2000-2013, Texas Instruments Incorporated TO-92 TO SOIC SOT-23 180C/W (0.4 leads) 170C/W (0.125 leads) 440C/W 165C/W 283C/W N/A 80C/W N/A N/A Submit Documentation Feedback Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N 3 LM185-1.2-N, LM285-1.2-N, LM385-1.2-N SNVS742E - JANUARY 2000 - REVISED APRIL 2013 www.ti.com TYPICAL PERFORMANCE CHARACTERISTICS 4 Reverse Characteristics Reverse Characteristics Figure 5. Figure 6. Forward Characteristics Temperature Drift of 3 Representative Units Figure 7. Figure 8. Reverse Dynamic Impedance Reverse Dynamic Impedance Figure 9. Figure 10. Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N LM185-1.2-N, LM285-1.2-N, LM385-1.2-N www.ti.com SNVS742E - JANUARY 2000 - REVISED APRIL 2013 TYPICAL PERFORMANCE CHARACTERISTICS (continued) Noise Voltage Filtered Output Noise Figure 11. Figure 12. Response Time Figure 13. Copyright (c) 2000-2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N 5 LM185-1.2-N, LM285-1.2-N, LM385-1.2-N SNVS742E - JANUARY 2000 - REVISED APRIL 2013 www.ti.com TYPICAL APPLICATIONS Figure 14. Wide Input Range Reference Figure 15. Micropower Reference from 9V Battery Figure 16. Reference from 1.5V Battery *IQ 30A Figure 17. Micropower* 5V Regulator 6 Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N LM185-1.2-N, LM285-1.2-N, LM385-1.2-N www.ti.com SNVS742E - JANUARY 2000 - REVISED APRIL 2013 *IQ 20A standby current Figure 18. Micropower* 10V Reference Figure 19. Copyright (c) 2000-2013, Texas Instruments Incorporated Figure 20. Precision 1A to 1mA Current Sources Submit Documentation Feedback Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N 7 LM185-1.2-N, LM285-1.2-N, LM385-1.2-N SNVS742E - JANUARY 2000 - REVISED APRIL 2013 www.ti.com METER THERMOMETERS Calibration 1. Short LM385-1.2-N, adjust R3 for IOUT= temp at 1A/K 2. Remove short, adjust R2 for correct reading in centigrade IQ at 1.3V500A IQ at 1.6V2.4mA Figure 21. 0C-100C Thermometer Figure 22. *2N3638 or 2N2907 select for inverse HFE 5 Select for operation at 1.3V IQ 600A to 900A Figure 23. Lower Power Thermometer 8 Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N LM185-1.2-N, LM285-1.2-N, LM385-1.2-N www.ti.com SNVS742E - JANUARY 2000 - REVISED APRIL 2013 Calibration 1. Short LM385-1.2-N, adjust R3 for IOUT= temp at 1.8A/K 2. Remove short, adjust R2 for correct reading in F Figure 24. 0F-50F Thermometer Adjustment Procedure 1. Adjust TC ADJ pot until voltage across R1 equals Kelvin temperature multiplied by the thermocouple Seebeck coefficient. 2. Adjust zero ADJ pot until voltage across R2 equals the thermocouple Seebeck coefficient multiplied by 273.2. Figure 25. Micropower Thermocouple Cold Junction Compensator Copyright (c) 2000-2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N 9 LM185-1.2-N, LM285-1.2-N, LM385-1.2-N SNVS742E - JANUARY 2000 - REVISED APRIL 2013 www.ti.com Thermocouple Seebeck R1 R2 Voltage Voltage Type Coefficient () () Across R1 Across R2 @ 25C (mV) (V/C) (mV) J 52.3 523 1.24k 15.60 14.32 T 42.8 432 1k 12.77 11.78 K 40.8 412 953 12.17 11.17 S 6.4 63.4 150 1.908 1.766 Typical supply current 50A Calibration 1. Adjust R1 so that V1 = temp at 1mV/K 2. Adjust V2 to 273.2mV IQ for 1.3V to 1.6V battery voltage = 50A to 150A Figure 26. Centigrade Thermometer 10 Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N LM185-1.2-N, LM285-1.2-N, LM385-1.2-N www.ti.com SNVS742E - JANUARY 2000 - REVISED APRIL 2013 SCHEMATIC DIAGRAM Copyright (c) 2000-2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N 11 LM185-1.2-N, LM285-1.2-N, LM385-1.2-N SNVS742E - JANUARY 2000 - REVISED APRIL 2013 www.ti.com REVISION HISTORY Changes from Revision D (April 2013) to Revision E * 12 Page Changed layout of National Data Sheet to TI format .......................................................................................................... 11 Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N PACKAGE OPTION ADDENDUM www.ti.com 9-Mar-2021 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) (6) LM185BYH-1.2/NOPB ACTIVE TO NDU 2 1000 RoHS & Green SNAGCU Level-1-NA-UNLIM -55 to 125 ( LM185BYH1.2, LM1 85BYH1.2) LM185H-1.2/NOPB ACTIVE TO NDU 2 1000 RoHS & Green SNAGCU Level-1-NA-UNLIM -55 to 125 ( LM185H1.2, LM185 H1.2) LM285BXM-1.2/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 285BX M1.2 LM285BXMX-1.2/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 285BX M1.2 LM285BXZ-1.2/LFT4 ACTIVE TO-92 LP 3 2000 RoHS & Green SN N / A for Pkg Type LM285BXZ-1.2/NOPB ACTIVE TO-92 LP 3 1800 RoHS & Green SN N / A for Pkg Type -40 to 85 285BX Z-1.2 LM285BYM-1.2/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 285BY M1.2 LM285BYMX-1.2/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 285BY M1.2 LM285M-1.2/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 LM285 M1.2 LM285MX-1.2/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 LM285 M1.2 LM285Z-1.2/NOPB ACTIVE TO-92 LP 3 1800 RoHS & Green SN N / A for Pkg Type -40 to 85 LM28 5Z-1.2 LM385BM-1.2/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM 0 to 70 LM385 BM1.2 LM385BMX-1.2 NRND SOIC D 8 2500 Non-RoHS & Green Call TI Call TI 0 to 70 LM385 BM1.2 LM385BMX-1.2/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM 0 to 70 LM385 BM1.2 LM385BXM-1.2/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM 0 to 70 385BX M1.2 LM385BXMX-1.2/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM 0 to 70 385BX M1.2 LM385BXZ-1.2/NOPB ACTIVE TO-92 LP 3 1800 RoHS & Green SN N / A for Pkg Type 0 to 70 385BX Addendum-Page 1 285BX Z-1.2 Samples PACKAGE OPTION ADDENDUM www.ti.com 9-Mar-2021 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) (6) Z-1.2 LM385BYM-1.2/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM 0 to 70 385BY M1.2 LM385BYMX-1.2/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM 0 to 70 385BY M1.2 LM385BYZ-1.2/NOPB ACTIVE TO-92 LP 3 1800 RoHS & Green SN N / A for Pkg Type 0 to 70 385BY Z-1.2 LM385BZ-1.2/NOPB ACTIVE TO-92 LP 3 1800 RoHS & Green SN N / A for Pkg Type 0 to 70 LM385 BZ1.2 LM385M-1.2 NRND SOIC D 8 95 Non-RoHS & Green Call TI Call TI 0 to 70 LM385 M1.2 LM385M-1.2/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM 0 to 70 LM385 M1.2 LM385M3-1.2 NRND SOT-23 DBZ 3 1000 Non-RoHS & Green Call TI Call TI 0 to 70 R11 LM385M3-1.2/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM 0 to 70 R11 LM385M3X-1.2 NRND SOT-23 DBZ 3 3000 Non-RoHS & Green Call TI Call TI 0 to 70 R11 LM385M3X-1.2/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM 0 to 70 R11 LM385MX-1.2/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM 0 to 70 LM385 M1.2 LM385Z-1.2/LFT3 ACTIVE TO-92 LP 3 2000 RoHS & Green SN N / A for Pkg Type LM385 Z-1.2 LM385Z-1.2/LFT4 ACTIVE TO-92 LP 3 2000 RoHS & Green SN N / A for Pkg Type LM385 Z-1.2 LM385Z-1.2/NOPB ACTIVE TO-92 LP 3 1800 RoHS & Green SN N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. Addendum-Page 2 0 to 70 LM385 Z-1.2 Samples PACKAGE OPTION ADDENDUM www.ti.com 9-Mar-2021 (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 29-Sep-2019 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM285BXMX-1.2/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM285BYMX-1.2/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM285MX-1.2/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM385BMX-1.2 SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM385BMX-1.2/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM385BXMX-1.2/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM385BYMX-1.2/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM385M3-1.2 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM385M3-1.2/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM385M3X-1.2 SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM385M3X-1.2/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM385MX-1.2/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 29-Sep-2019 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM285BXMX-1.2/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM285BYMX-1.2/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM285MX-1.2/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM385BMX-1.2 SOIC D 8 2500 367.0 367.0 35.0 LM385BMX-1.2/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM385BXMX-1.2/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM385BYMX-1.2/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM385M3-1.2 SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM385M3-1.2/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM385M3X-1.2 SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM385M3X-1.2/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM385MX-1.2/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 PACKAGE OUTLINE D0008A SOIC - 1.75 mm max height SCALE 2.800 SMALL OUTLINE INTEGRATED CIRCUIT C SEATING PLANE .228-.244 TYP [5.80-6.19] A .004 [0.1] C PIN 1 ID AREA 6X .050 [1.27] 8 1 2X .150 [3.81] .189-.197 [4.81-5.00] NOTE 3 4X (0 -15 ) 4 5 B 8X .012-.020 [0.31-0.51] .010 [0.25] C A B .150-.157 [3.81-3.98] NOTE 4 .069 MAX [1.75] .005-.010 TYP [0.13-0.25] 4X (0 -15 ) SEE DETAIL A .010 [0.25] .004-.010 [0.11-0.25] 0 -8 .016-.050 [0.41-1.27] DETAIL A (.041) [1.04] TYPICAL 4214825/C 02/2019 NOTES: 1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed .006 [0.15] per side. 4. This dimension does not include interlead flash. 5. Reference JEDEC registration MS-012, variation AA. www.ti.com EXAMPLE BOARD LAYOUT D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 8X (.061 ) [1.55] SYMM SEE DETAILS 1 8 8X (.024) [0.6] 6X (.050 ) [1.27] SYMM 5 4 (R.002 ) TYP [0.05] (.213) [5.4] LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:8X METAL SOLDER MASK OPENING EXPOSED METAL .0028 MAX [0.07] ALL AROUND SOLDER MASK OPENING METAL UNDER SOLDER MASK EXPOSED METAL .0028 MIN [0.07] ALL AROUND SOLDER MASK DEFINED NON SOLDER MASK DEFINED SOLDER MASK DETAILS 4214825/C 02/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 8X (.061 ) [1.55] SYMM 1 8 8X (.024) [0.6] 6X (.050 ) [1.27] SYMM 5 4 (R.002 ) TYP [0.05] (.213) [5.4] SOLDER PASTE EXAMPLE BASED ON .005 INCH [0.125 MM] THICK STENCIL SCALE:8X 4214825/C 02/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com PACKAGE OUTLINE LP0003A TO-92 - 5.34 mm max height SCALE 1.200 SCALE 1.200 TO-92 5.21 4.44 EJECTOR PIN OPTIONAL 5.34 4.32 (1.5) TYP SEATING PLANE (2.54) NOTE 3 2X 4 MAX (0.51) TYP 6X 0.076 MAX SEATING PLANE 2X 2.6 0.2 3X 12.7 MIN 3X 3X 0.55 0.38 0.43 0.35 2X 1.27 0.13 FORMED LEAD OPTION STRAIGHT LEAD OPTION OTHER DIMENSIONS IDENTICAL TO STRAIGHT LEAD OPTION 3X 2.67 2.03 4.19 3.17 3 2 1 3.43 MIN 4215214/B 04/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Lead dimensions are not controlled within this area. 4. Reference JEDEC TO-226, variation AA. 5. Shipping method: a. Straight lead option available in bulk pack only. b. Formed lead option available in tape and reel or ammo pack. c. Specific products can be offered in limited combinations of shipping medium and lead options. d. Consult product folder for more information on available options. www.ti.com EXAMPLE BOARD LAYOUT LP0003A TO-92 - 5.34 mm max height TO-92 0.05 MAX ALL AROUND TYP FULL R TYP METAL TYP (1.07) 3X ( 0.85) HOLE 2X METAL (1.5) 2X (1.5) 2 1 (R0.05) TYP 3 2X (1.07) (1.27) SOLDER MASK OPENING 2X SOLDER MASK OPENING (2.54) LAND PATTERN EXAMPLE STRAIGHT LEAD OPTION NON-SOLDER MASK DEFINED SCALE:15X 0.05 MAX ALL AROUND TYP ( 1.4) 2X ( 1.4) METAL 3X ( 0.9) HOLE METAL (R0.05) TYP 2 1 (2.6) SOLDER MASK OPENING 3 2X SOLDER MASK OPENING (5.2) LAND PATTERN EXAMPLE FORMED LEAD OPTION NON-SOLDER MASK DEFINED SCALE:15X 4215214/B 04/2017 www.ti.com TAPE SPECIFICATIONS LP0003A TO-92 - 5.34 mm max height TO-92 13.7 11.7 32 23 (2.5) TYP 0.5 MIN 16.5 15.5 11.0 8.5 9.75 8.50 19.0 17.5 6.75 5.95 2.9 TYP 2.4 3.7-4.3 TYP 13.0 12.4 FOR FORMED LEAD OPTION PACKAGE 4215214/B 04/2017 www.ti.com MECHANICAL DATA NDU0002A H02A (Rev F) www.ti.com 4203227/C PACKAGE OUTLINE DBZ0003A SOT-23 - 1.12 mm max height SCALE 4.000 SMALL OUTLINE TRANSISTOR C 2.64 2.10 1.4 1.2 PIN 1 INDEX AREA 1.12 MAX B A 0.1 C 1 0.95 3.04 2.80 1.9 3X 3 0.5 0.3 0.2 2 (0.95) C A B 0.25 GAGE PLANE 0 -8 TYP 0.10 TYP 0.01 0.20 TYP 0.08 0.6 TYP 0.2 SEATING PLANE 4214838/C 04/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Reference JEDEC registration TO-236, except minimum foot length. www.ti.com EXAMPLE BOARD LAYOUT DBZ0003A SOT-23 - 1.12 mm max height SMALL OUTLINE TRANSISTOR PKG 3X (1.3) 1 3X (0.6) SYMM 3 2X (0.95) 2 (R0.05) TYP (2.1) LAND PATTERN EXAMPLE SCALE:15X SOLDER MASK OPENING METAL SOLDER MASK OPENING METAL UNDER SOLDER MASK 0.07 MIN ALL AROUND 0.07 MAX ALL AROUND NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED SOLDER MASK DETAILS 4214838/C 04/2017 NOTES: (continued) 4. Publication IPC-7351 may have alternate designs. 5. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN DBZ0003A SOT-23 - 1.12 mm max height SMALL OUTLINE TRANSISTOR PKG 3X (1.3) 1 3X (0.6) SYMM 3 2X(0.95) 2 (R0.05) TYP (2.1) SOLDER PASTE EXAMPLE BASED ON 0.125 THICK STENCIL SCALE:15X 4214838/C 04/2017 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 7. Board assembly site may have different recommendations for stencil design. www.ti.com IMPORTANT NOTICE AND DISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES "AS IS" AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources. TI's products are provided subject to TI's Terms of Sale (https:www.ti.com/legal/termsofsale.html) or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI's provision of these resources does not expand or otherwise alter TI's applicable warranties or warranty disclaimers for TI products.IMPORTANT NOTICE Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2021, Texas Instruments Incorporated