3.2X1.6mm SMD CHIP LED LAMP APK3216SECK SUPER BRIGHT ORANGE Features Description !3.2mmX1.6mm SMT LED, 1.1mm THICKNESS. The Super Bright Orange source color devices are !LOW POWER CONSUMPTION. made with DH InGaAlP on GaAs substrate Light !WIDE VIEWING ANGLE. Emitting Diode. !IDEAL FOR BACKLIGHT AND INDICATOR. ! VARIOUS COLORS AND LENS TYPES AVAILABLE. !PACKAGE :2000PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.2(0.0079") unless otherwise noted. 3. Specifications are subject to change without notice. SPEC NO: DSAC0238 APPROVED:J.Lu REV NO: V.2 CHECKED:Allen Liu DATE:MAR/24/2003 DRAWN: L.ZHANG PAGE: 1 OF 4 Selection Guide P ar t N o . Dic e APK3216SECK Iv (m c d ) @ 20 m A L en s Ty p e SUPER BRIGHT ORANGE ( InGaAlP) WATER CLEAR V i ew i n g An g l e Min . Ty p . 21/2 70 25 0 90 Note: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at T)=25C Sy m b o l Par am et er peak Peak Wavelength Super Bright Orange D Dominate Wavelength Super Bright Orange 1/2 D ev i c e Ty p . Spectral Line Half-width Super Bright Orange Un it s Tes t Co n d it io n s 6 10 nm IF = 2 0 m A 601 nm IF = 2 0 m A 29 nm IF = 2 0 m A pF V F = 0 V; f = 1 M Hz 2.5 V IF = 2 0 m A 10 uA VR = 5V C Capacitance Super Bright Orange 15 VF Forward Voltage Super Bright Orange 2.1 IR Reverse Current Super Bright Orange Max . Absolute Maximum Ratings at T)=25C Par am et er Su p er B r ig h t Or an g e Un it s Power dissipation 75 mW DC Forward Current 30 mA Peak Forward Current [1] 195 mA Reverse Voltage 5 V Operating/Storage Temperature -40C To +85C Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. SPEC NO: DSAC0238 APPROVED:J.Lu REV NO: V.2 CHECKED:Allen Liu DATE:MAR/24/2003 DRAWN: L.ZHANG PAGE: 2 OF 4 Super Bright Orange SPEC NO: DSAC0238 APPROVED:J.Lu APK3216SECK REV NO: V.2 CHECKED:Allen Liu DATE:MAR/24/2003 DRAWN: L.ZHANG PAGE: 3 OF 4 APK3216SECK SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: DSAC0238 APPROVED:J.Lu REV NO: V.2 CHECKED:Allen Liu DATE:MAR/24/2003 DRAWN: L.ZHANG PAGE: 4 OF 4