LX7167 3MHz, 2.4A Step Down Converter Features Description 2.4A Step-down Regulator Operational Input Supply Voltage Range: 3V-5.5V Integrated PMOS and NMOS Load Current from Zero to 2.4A 3MHz Switching Frequency SKIP Pulse to Improve Light Load Efficiency Input UVLO and OV Protection Enable Pin Power Good Internal Soft-start Cycle-by-Cycle Over Current Protection Hiccup Mode Operation Under FB UVLO RoHS Compliant for Pb Free LX7167 is a step-down PWM Switching Regulator IC with integrated high side P-CH and low side NCH MOSFETs. The IC operates using a hysteretic control topology with a full load operating switching frequency of 3MHz allowing small output filter components while maintaining excellent dynamic load response. The operational input voltage range of LX7167 is from 3V to 5.5V. The part has a Power Save Mode (PSM) that automatically transitions between PWM and PSM mode depending on the load current. This allows the converter's efficiency to remain high when load current drops. There is a Power Good function to indicate the status of the IC. In the shutdown mode, the IC's current consumption is reduced to less than 1A and the output capacitor is discharged. Applications Other features of the part are: a) Cycle-by-cycle current limit followed by HICCUP mode which reduces the overall power dissipation of the internal MOSFETs, b) thermal protection and internal digital soft start. The LX7167 is available in a 2mm x 2mm 8 pin exposed pad DFN package. HDD Set-Top Box LCD TV's Notebook/Netbook Routers Video Cards PC Peripherals PoE Powered Devices Smart Phone 100k VIN 8 PVIN CIN 7 VCC PG 6 SW 2 LX7167 EN PGND GND VOUT 0.68F C9 FB 5 PGOOD R1 1% COUT 4 1 R2 1% 3 Figure 1 * Typical Application of LX7167 Aug 2013 Rev. 1.1 www.microsemi.com (c) 2013 Microsemi Corporation 1 3MHz 2.4A Synchronous Buck Converter Pin Configuration and Pinout 1 8 PVIN PGND SW 3 GND 7167 xxxx 2 7 VCC 6 PG 5 4 EN FB Figure 2 * Pinout DFN 2mmx2mm 8L Top View Marking: First Line 7167 Second Line YWWA (Year/Work Week/Lot Code) Ordering Information Ambient Temperature Type Package -10C to 85C RoHS Compliant, Pb-free DFN 2mmx2mm 8L Part Number Packaging Type LX7167CLD Bulk / Tube LX7167CLD-TR Tape and Reel Pin Description Pin Number Pin Designator 1 PGND 2 SW 3 GND 4 FB Voltage feedback pin. Connect to the output terminal through a resistor divider network to set the output voltage of the regulator to the desired value. 5 EN Pull this pin higher than 1V will enable the controller. When pulled low, the IC will turn off and the Internal discharge FET will turn on to discharge the output capacitor through the SW pin. 6 PG 7 VCC 8 PVIN Power PAD 2 Description Ground pin for the power stage. Switch-node pin. Connect the output inductor between this pin and output capacitor. When the chip is DISABLED, the internal discharge resistor will be enabled to discharge the output capacitance. The current will flow into this pin. Ground pin. Power-good pin. This is an open-drain output and should be connected to a voltage rail with an external pull-up resistor. During the power on, this pin switches from LOW to HI state when FB voltage reaches above the power good threshold and the internal soft start has finished its operation. It will be pulled low when the FB falls below the power-good threshold minus the hysteresis. It will turn back on when the pull FB rises above the threshold. Analog input voltage terminal. Connect this pin to VIN with a 10ohm resistor and connect a 1F ceramic capacitor from VCC to GND. Input voltage terminal of the regulator. A minimum of 10F, X5R type ceramic capacitor must be connected as close as possible from this pin to PGND plane to insure proper operation. For good thermal connection, this PAD must be connected using thermal VIAs to the GND plane and to the LAND pattern of the IC. Block Diagram Block Diagram VIN Lo VOUT R1 Co VFB Rl R2 Hysteresis = XmV Delay = Xns - ramp + Freq Correction Freq Ref Hysteretic Engine Vref Figure 3 * Simplified Block Diagram of LX7167 3 3MHz 2.4A Synchronous Buck Converter Absolute Maximum Ratings Parameter Min Max Units PVIN, EN, FB, PG to GND -0.3 7 V SW to GND -0.3 7 V SW to GND ( Shorter than 50ns) -2 7 V Junction Temperature 0 150 C Storage Temperature -65 150 C 260 (+0,-5) C Peak Package Solder Reflow Temperature (40s, reflow) Note: Performance is not necessarily guaranteed over this entire range. These are maximum stress ratings only. Exceeding these ratings, even momentarily, can cause immediate damage, or negatively impact long-term operating reliability Operating Ratings Parameter Min Max Units VCC, PVIN 3 5.5 V VOUT 0.6 VIN - 0.5 V Ambient Temperature -10 85 C 0 2.4 A Output Current Thermal Properties Thermal Resistance Typ Units JA 75 C/W Note: The JA number assumes no forced airflow. Junction Temperature is calculated using TJ = TA + (PD x JA). In particular, JA is a function of the PCB construction. The stated number above is for a four-layer board in accordance with JESD-51 (JEDEC). Electrical Characteristics Note: Unless otherwise specified, the following specifications apply over the operating ambient temperature of -10C TA 85C except where otherwise noted with the following test conditions: VCC = PVIN = 5V. Typical parameter refers to TJ = 25C Symbol Parameter Test Condition Min Typ Max Units Operating Current IQ Input Current ILOAD = 0 ISHDN Input Current at Shut Down VEN = GND 350 A 0.1 2 2.4 2.8 A PVIN Input UVLO PVIN Under Voltage Lockout UVLO Hysteresis 4 PVIN rising 260 V mV Electrical Characteristics Symbol Parameter Test Condition Min Typ Max TA = 25C 0.594 0.600 0.606 -10C to 85C 0.591 Units FEEDBACK VREF Feedback Voltage IFB FB Pin Input Current 0.609 10 V nA Line Regulation PVIN from 3V to 5.5V 0.70 % Load Regulation ILOAD = 0 to 2A. Note 1 1.0 %/A 70 %VREF FB UVLO VFBUVLO FB UVLO Threshold OUTPUT DEVICE RDSON_H RDSON of High Side 95 150 m RDSON_L RDSON of Low Side 75 100 m IL Peak Current Limit 3.5 4.5 A TSH Thermal Shutdown Threshold 150 C TH Thermal Shutdown Hysteresis 20 C 6.1 V 2.6 PVIN OVP OVPR Rising Threshold OVPF Falling Threshold 5.5 V OSCILLATOR FREQUENCY f Switching Frequency 2.6 3 3.4 MHz SOFT START TSS Soft Start Time From EN High to VOUT reach regulation 500 s THICCUP Hiccup Time VFB = 0.2V 1.2 ms EN INPUT ENVIN Input High ENVIL Input Low 1 V ENH Hysteresis 0.1 ENII Input Bias 0.01 0.4 V 1 A V PG ( Power Good) VPG Power Good Transition High Threshold VPGHY Hysteresis PGRDSON Power Good Internal FET RDSON 83 % Either VFB rising or falling 40 mV VCC = 5V 100 300 0.01 1 A PG FET Leakage Current PG internal Glitch Filter Note 1 5 s OUTPUT DISCHARGE Internal Discharge Resistor 80 200 1400 Note 1: Guaranteed by design, not tested during production. 5 3MHz 2.4A Synchronous Buck Converter Typical Performance Curves -- (Efficiency) 100 Efficiency (%) 90 80 70 60 VOUT = 0.9V 50 VOUT = 1.2V VOUT = 1.8V 40 1 10 100 Load Current (mA) 1000 Figure 4 * Efficiency vs. Output Current with 3.3V Input 100 Efficiency (%) 90 80 70 60 VOUT = 0.9V VOUT = 1.2V VOUT = 1.8V VOUT = 2.5V VOUT = 3.3V 50 1 10 100 Load Current (mA) Figure 5 * Efficiency vs. Output Current with 5V Input 6 1000 Typical Performance Curves -- (Step Load Response.) Typical Performance Curves -- (Step Load Response.) Figure 6 * Step Response (VIN = 5V, VOUT = 3.3V, L = 0.47H, COUT = 22F) 7 3MHz 2.4A Synchronous Buck Converter Theory of Operation / Application Information Basic Operation The operation of the controller consists of comparing the VFB voltage to an internal reference. When the VFB voltage is lower than the VREF, the upper switch turns on. When the VFB voltage is higher than VREF, the upper switch turns off and the lower switch turns on. An internal ramp is used to stabilize the switching frequency and keep the VFB immune to the output capacitor, CO, value or parasitic components (i.e. esr, esl). In addition, a frequency control loop ensures the switching frequency is constant under continuous conduction mode of operation. At light load, the converter automatically reduces the switching frequency to optimize efficiency while ensuring the ripple voltage is low. Setting of the Output Voltage The LX7167A develops a 0.6V reference voltage between the feedback pin, FB, and the signal ground. The output voltage is set by a resistive divider according to the following formula: ( ) The output component values are recommended below. VOUT L R1 R2 0.47H & 0.68H 1V 66.5k 100k 100k 49.9k 158k 49.9k 158k 34.8k 1.0H 0.47H & 0.68H 1.8V 1.0H 0.47H & 0.68H 2.5V 1.0H 0.47H & 0.68H 3.3V 1.0H 8 COUT 22F 2x22F 4x22F 22F 2x22F 4x22F 22F 2x22F 4x22F 22F 2x22F 4x22F 22F 2x22F 4x22F 22F 2x22F 4x22F 22F 2x22F 4x22F 22F 2x22F 4x22F C9 5V input 15pF 22pF 27pF 10pF 15pF 22pF 22pF 33pF 47pF 22pF 33pF 47pF 3.3V input 10pF 15pF 22pF 12pF 22pF 27pF 10pF 15pF 22pF 15pF 22pF 27pF 15pF 22pF 33pF 22pF 27pF 33pF - Theory of Operation / Application Information Start Up The reference (VREF) is ramped up from zero voltage to 0.6V in 500s. During this time, the PG is pulled low. When the reference reaches 0.6V, signaling the end of the soft start cycle, the PG pin will go high within 5s. Over Current Protection The IC has the ability to protect against all types of short circuit protection. It has cycle by cycle short protection that turns off the upper MOSFET and ends the cycle when the current exceeds the OCP threshold, when this occurs, the off-time is at least 200ns before the upper FET is turned on again. After startup, if the FB pin drops below the Feedback UVLO threshold, the chip will go into a hiccup mode of operation. This helps to protect against a crowbar short circuit. The FB UVLO Alarm is not active during startup. Hiccup Mode of Operation Hiccup mode of operation will protect the IC during a short of the output. After startup, it will be triggered when the FB UVLO is exceeded. Input Over Voltage Protection The IC is protected against damage when the input voltage rapidly rises to the absolute maximum level. When the input voltage rises over the PVIN OVP rising threshold, the IC will turn off switching. It will resume switching when the input voltage drops below the PVIN OVP falling threshold with hysteresis. Typical Application Diagram 100k VIN 22F X5R 8 PVIN 0.01F 10 7 VCC PG 6 SW 2 LX7167 EN PGND GND VOUT 0.47F C9 FB 5 PGOOD R1 100k 1% 2*10F X5R 4 1 R2 49.9k 1% 3 Figure 7 * LX7167 Typical Application Diagram 9 3MHz 2.4A Synchronous Buck Converter PACKAGE OUTLINE DIMENSIONS L D E2 Dim E D2 b top bottom A3 A side e A1 A A1 A3 b D D2 e E E2 L MILLIMETERS MIN MAX 0.70 0.80 0 0.05 0.20 ref 0.18 0.30 2.00 BSC 1.55 1.80 0.50 BSC 2.00 BSC 0.75 1.00 0.20 0.40 INCHES MIN MAX 0.0276 0.0315 0 0.0020 0.0079 ref 0.0071 0.0118 0.0787 BSC 0.0610 0.0709 0.0197 BSC 0.0787 BSC 0.0295 0.0394 0.0079 0.0157 Figure 8 * 8 Pin Plastic DFN 2x2mm Dual Exposed Pad Package Dimensions Note: 1. Dimensions do not include mold flash or protrusions; these shall not exceed 0.155mm(.006") on any side. Lead dimension shall not include solder coverage. Note: 2. Dimensions are in mm, inches are for reference only. 10 LAND PATTERN RECOMMENDATION LAND PATTERN RECOMMENDATION Center Thermal Pad R 2x0.3 0.8 1.4 63% Printed solder coverage on thermal pad 1.7 0.5 2.4 0.9 6x0.5 PCB Land Pattern Defined Pad 0.28 Figure 9 * 8 Pin Plastic DFN 2x2mm Dual Exposed Pad Package Footprint Disclaimer: This PCB land pattern recommendation is based on information available to Microsemi by its suppliers. The actual land pattern to be used could be different depending on the materials and processes used in the PCB assembly, end user must account for this in their final layout. Microsemi makes no warranty or representation of performance based on this recommended land pattern. PRODUCTION DATA - Information contained in this document is proprietary to Microsemi and is current as of publication date. This document may not be modified in any way without the express written consent of Microsemi. Product processing does not necessarily include testing of all parameters. Microsemi reserves the right to change the configuration and performance of the product and to discontinue product at any time. 11 Microsemi Corporation (NASDAQ: MSCC) offers a comprehensive portfolio of semiconductor solutions for: aerospace, defense and security; enterprise and communications; and industrial and alternative energy markets. Products include high-performance, high-reliability analog and RF devices, mixed signal and RF integrated circuits, customizable SoCs, FPGAs, and complete subsystems. Microsemi is headquartered in Aliso Viejo, Calif. Learn more at www.microsemi.com. Microsemi Corporate Headquarters One Enterprise, Aliso Viejo CA 92656 USA Within the USA: +1(949) 380-6100 Sales: +1 (949) 380-6136 Fax: +1 (949) 215-4996 (c) 2013 Microsemi Corporation. All rights reserved. Microsemi and the Microsemi logo are trademarks of Microsemi Corporation. All other trademarks and service marks are the property of their respective owners. LX7167-3/1.1