(1,00 mm) .0394"
MEC1-RA, MEC1-EM SERIES
MEC1–120–02–L–D–RA1–SL
MEC1–130–02–L–D–EM2
MEC1–120–02–F–D–EM2
WWW.SAMTEC.COM
(No. of Positions + 2) x
(1,00) .03937 + (2,54) .100
(No. of Positions + 2)
x (1,00) .03937
(0,36) .014
(1,00)
.03937
(8,89)
.350
(0,64)
.025
(3,12) .123
(1,27)
.050
(11,68)
.460 (11,94)
.470
(1,78)
.070
DIA
(1,24)
.049
01
02
(8,13)
.320
(2,51)
.099
(6,81)
.268
MEC1 POSITIONS
PER ROW
PLATING
OPTION D
1
For complete specifi cations and
recommended PCB layouts see
www.samtec.com?MEC1-RA
Insulator Material:
Black LCP
Contact Material:
Phosphor Bronze
Plating: Au or Sn over
50µ" (1,27 µm) Ni
Current Rating:
1.6 A per pin
(2 adjacent pins powered)
Operating Temp Range:
-55°C to +125°C
Insertion Depth:
(5,84 mm) .230" to
(8,13 mm) .320"
RoHS Compliant: Ye s
Processing:
Lead–Free Solderable: Ye s
SMT Lead Coplanarity:
(0,10 mm) .004" max (05-40)
(0,15 mm) .006" max (50-70)
05, 08, 20, 30,
40, 50, 60, 70
–F
= Gold fl ash
on contact,
Matte Tin
on tail
–L
= 10µ"
(0,25 µm)
Gold on
contact,
Matte Tin
on tail
CARD
SLOT
–02
= (1,60 mm)
.062"
thick card
F-213 (Rev 30SEP13)
Note: Some sizes, styles and
options are non-standard,
non-returnable.
SL
Mates with:
(1,60 mm)
.062" card
Mates with:
(1,60 mm)
.062" card
• Elevated body
height
• Other platings
Contact Samtec.
RA1 NP
MEC1 POSITIONS
PER ROW
PLATING
OPTION D
1
05, 08, 20, 30,
40, 50, 60, 70
02 EM2 NP
For complete specifi cations and
recommended PCB layouts see
www.samtec.com?MEC1-EM
Insulator Material:
Black LCP
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over
50µ" (1,27 µm) Ni
Current Rating:
1.8 A per pin
(2 adjacent pins powered)
Operating
Temp Range:
-55°C to +125°C
Insertion Depth:
(5,84 mm) .230" to
(8,13 mm) .320"
RoHS Compliant:
Ye s
Lead–Free Solderable:
Ye s
–F
= Gold fl ash on contact,
Matte Tin on tail
–L
= 10µ" (0,25 µm) Gold on contact,
Matte Tin on tail
APPLICATION
Samtec recommends that pads
on the mating board be Gold plated.
SPECIFICATIONS
SPECIFICATIONS
RIGHT ANGLE/EDGE MOUNT SOCKETS
MEC1-RA
6,81 mm Stack Height Rated @ 3dB Insertion Loss*
Single-Ended Signaling 4.5 GHz / 9 Gbps
Differential Pair Signaling 5.5 GHz / 11 Gbps
*Performance data includes effects of a non-optimized PCB.
Complete test data available at www.samtec.com?MEC1-RA
or contact sig@samtec.com
Note: While optimized for 50Ω
applications, this connector
with alternative signal/ground
patterns may also perform well in
certain 75Ω applications. Contact
Samtec for further information.
–NP
= No Polarization
(8 positions only)
Leave Blank for
polarization
–NP
= No Polarization
(8 positions only)
Leave Blank for
polarization
POSITIONS
PER ROW
POLARIZED
POSITIONS
05 3, 4
08 5, 6
20 15, 16
30 21, 22
40 31, 32
50 41, 42
60 31, 32, 63 & 64
70 53, 54, 115 & 116
POSITIONS
PER ROW
POLARIZED
POSITIONS
05 3, 4
08 5, 6
20 15, 16
30 21, 22
40 31, 32
50 41, 42
60 31, 32, 63
& 64
70 53, 54, 115
& 116
ALSO
AVAILABLE
(MOQ Required)
(No. of Positions + 2) x
(1,00) .03937 + (12,45) .490
02
(1,19)
.047
(0,38)
.015
(No. of Positions + 2)
x (1,00) .03937
(0,36)
.014
(8,89)
.350
(1,00)
.03937
(4,57)
.180
(3,15)
.124
(6,81)
.268
±
01
(4,70)
.185
(8,13)
.320
(5,21)
.205
• Edge mount leads
for (0,80 mm) .031"
thick board
• Other platings
Contact Samtec.
ALSO
AVAILABLE
(MOQ Required)
For complete scope of
recognitions see
www.samtec.com/quality
For complete scope of
recognitions see
www.samtec.com/quality
RECOGNITIONS
RECOGNITIONS
Note: Some sizes,
styles and options
are non-standard,
non-returnable.
Note: While optimized for 50Ω applications,
this connector with alternative signal/ground
patterns may also perform well in certain
75Ω applications. Contact Samtec for
further information.
