FMM5017VF Ku Band Power Amplifier MMIC FEATURES High Output Power: 29.0dBm(typ.) High Linear Gain: 20.0dB(typ.) Low Input VSWR Impedance Matched Zin/Zout = 50 Small Hermetic Metal-Ceramic SMT Package(VF-pkg) DESCRIPTION The FMM5017VF is a MMIC amplifier that contains a three-stage amplifier, internally matched, for standard communications in the 14.0 to 14.5GHz frequency range. This product is well suited for VSAT applications as a driver or output stage with less than 1 Watt and lower cost. Eudyna's stringent Quality Assurance Program assures the highest reliability and consistent performance. ABSOLUTE MAXIMUM RATING Item Symbol Rating Unit 12 -7 17 -55 to +125 V V dBm o C RECOMMENDED OPERATING CONDITION Item Symbol Condition Unit DC Input Voltage DC Input Voltage Operating Case Temperature 10 -5 -40 to +85 V V o C DC Input Voltage DC Input Voltage Input Power Storage Temperature VDD VGG Pin Tstg VDD VGG Tc o ELECTRICAL CHARACTERISTICS (Case Temperature Tc=25 C) Item Symbol Frequency Output Power at 1dB G.C.P. Linear Gain Gain Flatness Input VSWR Output VSWR Power Monitor ( Rmon=10Kohm ) DC Input Current DC Input Current f P1dB G G VSWRi VSWRo Vmon IDD IGG Condition VDD=10V VGG=-5V f =14.0-14.5GHz Pout=28dBm VDD=10V VGG=-5V Limit Min. Typ. Max. Unit 14.0 28.0 18.0 - GHz dBm dB dB V mA mA 29.0 20.0 1.0 2:1 2.3:1 2.5 700 15 G.C.P.:Gain Compresstion Point ESD Class 0 Note : Based on EIAJ ED-4701 C-111A(C=100pF, R=1.5k ) CASE STYLE Edition 2.0 September 2004 VF 1 ~ 199V 15 1.5 2.3:1 3:1 1000 20 FMM5017VF Ku band Power Amplifier MMIC 2 FMM5017VF Ku Band Power Amplifier MMIC S-PARAMETER INPUT/OUTPUT RETURN LOSS vs. FREQUENCY Vdd=10V, Vgg=-5V SMALL SIGNAL GAIN vs. FREQUENCY Vdd=10V, Vgg=-5V 30 - -5 -10 Input Return Loss 25 Output Return Loss Small Signal Gain [dB] Input/Output Return Loss [dB] 0 -15 -20 -25 -30 20 15 10 5 -35 -40 13.6 13.8 14.0 14.2 14.4 14.6 0 13.6 14.8 13.8 14.0 14.2 14.4 14.6 14.8 Frequency [GHz] Frequency [GHz] VDD=10V, VGG=-5V Frequency [ MHz ] 13800 13900 14000 14100 14200 14300 14400 14500 14600 14700 S11 S21 S12 S22 MAG ANG MAG ANG MAG ANG MAG ANG 0.074 0.100 0.109 0.119 0.125 0.138 0.147 0.156 0.174 0.196 -61.1 -62.8 -69.8 -76.2 -86.0 -93.2 -102.6 -112.8 -124.2 -136.3 11.417 11.014 11.331 10.909 11.088 10.730 10.728 10.562 10.353 9.941 -6.7 -27.2 -38.0 -55.3 -69.1 -83.9 -98.6 -113.4 -128.9 -146.6 0.007 0.001 0.004 0.007 0.009 0.005 0.007 0.007 0.005 0.007 -77.6 -66.1 -134.6 -114.5 -133.9 -110.5 -88.3 -100.2 172.4 -158.7 0.341 0.289 0.250 0.203 0.170 0.126 0.081 0.027 0.057 0.128 -86.2 -87.2 -89.6 -89.4 -93.2 -94.5 -104.1 -137.0 96.0 69.3 3 FMM5017VF Ku band Power Amplifier MMIC Package Outline PIN ASSIGMENT 1 : VDD 2 : RF in 3 : VGG 4 : Pmon 5 : RF out 6 : VDD 4 FMM5017VF Ku Band Power Amplifier MMIC Mounting Instructions for VF Package 1. Screw Mounting (1) The flange of package may be attached using screws. Torque conditions are shown in table 1. Table 1. Recommended and Maximum Torque for Screw Mounting Package Recommended Recommended screw Torque M2.0 10 N-cm (0.9 lb-in) VF Maximum Torque 15 N-cm (1.3 lb-in) (2) First, tighten the screws with a torque driver set to 5 N-cm. (3) The surface finish of the heat sink should be better than 0.8 m, and the surface flatness must be better than 10 m. (4) Silicon based heat sink compounds should not be used for the thermal conductive grease. They cause poor grounding of the source flange, contamination and long term degradation of thermal resistance between the FET package and heat sink. 2. Solder Mounting (1) Recommended solder are Tin-Lead solder (63Sn/37Pb), Lead-Free solder (Sn3.0Ag-0.5Cu)*1 or equivalent. (2) For soldering, Tin-Lead solder (63Sn/37Pb) or Lead-Free solder (Sn-3.0Ag0.5Cu)*1 shall be used. (*1: The figure displays with weight %. A predominantly tin-rich alloy with 3.0% silver and 0.5% copper.) (3) Recommended Flux is Rosin type with chlorine content: 0.2% or less and a low halogen content. After soldering, the flux residue should be removed by appropriate cleaning methods. (4) The recommended soldering conditions are as follows: Partial heating method (soldering iron, spot laser/air) Product terminal temperature: 260 deg-C, max. 10 s./terminal or 400 deg-C, max. 3 s./terminal 5 FMM5017VF Ku band Power Amplifier MMIC Recommended Bias Circuit and Internal Block Diagram PIN ASSIGMENT 1 : VDD 2 : RF in 3 : VGG 4 : Pmon 5 : RF out 6 : VDD Note 1: The capacitors are recommended on the bias supply line, close to the package, in order to prevent video oscillations which could damage the module. Note 2: Two pins of VDD are internally connected respectively. Note 3: The external resistor ( 10Kohm ) on the board is necessary to monitor the output power. 6 FMM5017VF Ku Band Power Amplifier MMIC For further information please contact : Eudyna Devices USA Inc. 2355 Zanker Rd. San Jose, CA 95131-1138, U.S.A. TEL: (408) 232-9500 FAX: (408) 428-9111 www.us.eudyna.com Eudyna Devices Inc. products contain gallium arsenide (GaAs) which can be hazardous to the human body and the environment. For safety, observe the following procedures: Do not put these products into the mouth. Do not alter the form of this product into a gas, powder, or liquid through burning, crushing, or chemical processing as these byproducts are dangerous to the human body if inhaled, ingested, or swallowed. Eudyna Devices Europe Ltd. Network House Norreys Drive Maidenhead, Berkshire SL6 4FJ United Kingdom TEL: +44 (0) 1628 504800 FAX: +44 (0) 1628 504888 Observe government laws and company regulations when discarding this product. This product must be discarded in accordance with methods specified by applicable hazardous waste procedures. Eudyna Devices Asia Pte. Ltd. Hong Kong Branch Rm.1101,Ocean Centre, 5 Canton Road Tsim Sha Tsui, Kowloon, Hong kong TEL: +852-2377-0227 FAX: +852-2377-3921 Eudyna Devices Inc. JAPANESE SALES OFFICE(Head Office) 1, Kanai-cho, Sakae-ku, Yokohama, 244-0845, Japan Tel: +81-45-853-8150 Fax: +81-45-853-8170 www.eudyna.com Eudyna Devices Incorporated reserves the right to change products and specifications without notice. The information does not convey any license under rights of Eudyna Devices Incorporated or others. (c) 2004 Eudyna Devices USA Inc. Printed in U.S.A. 7