Ku Band Power Amplifier MMIC
FEATURES
・High Output Power: 29.0dBm(typ.)
・High Linear Gain: 20.0dB(typ.)
・Low Input VSWR
・Impedance Matched Zin/Zout = 50Ω
・Small Hermetic Metal-Ceramic SMT Package(VF-pkg)
Edition 2.0
Sept emb er 2004 1
FMM5017VF
DESCRIPTION
The FMM5017VF is a MMIC amplifier that contains a three-stage amplifier,
internally matched, for standard communications in the 14.0 to 14.5GHz
frequency range. This product is well suited for VSAT applications as a driver
or output stage with less than 1 Watt and lower cost.
Eudyna’s stringent Quality Assurance Program assures the highest reliability and consistent performance.
ABSOLUTE MAXIMUM RATING
Item Symbol Unit
DC Input Voltage VDD V
DC Input Voltage VGG V
Input Power Pin dBm
Storage Temper ature Tst g
o
C
RECO M MENDED O PERATING CO NDI TION
Item Symbol Unit
DC Input Voltage VDD V
DC Input Voltage VGG V
Operatin g Case Temp er at ure Tc
o
C
ELECTRI CA L CHA RA CTERI STI CS (Case Temper at ur e Tc= 25
o
C)
Min. Typ. Max.
Frequency f 14.0 - 15 GHz
Output Power at 1dB G.C.P. P1dB 28.0 29.0 - dBm
Linear Gain G 18.0 20.0 - dB
Gain Flatness ∆
∆∆
∆G-1.01.5dB
Input VSWR VSWRi - 2:1 2.3:1 -
Output VSWR VSWRo - 2.3:1 3:1 -
Pow er Monitor ( Rmon=10 Kohm ) Vmon
Pout=28dBm
-2.5- V
DC Input Current IDD - 70 0 1000 mA
DC Input Current IGG - 15 20 mA
G.C.P. : G ain Co mp r esstio n Po in t
ESD
Not e : Bas ed on E IA J E D-4701 C-111A (C= 100pF, R=1.5kΩ)
CASE STYLE
Unit
V
DD
=10V
VGG=-5V
f=14.0-14.5GHz
V
F
Class 0 ~ 199V
VDD=10V
VGG=-5V
Item Symbol Condition Limit
-55 to +125
-40 to +85
Condition
10
-5
Ratin
g
12
-7
17
Ku band Power Amplifier MMIC
2
FMM5017VF
3
FMM5017VF
Ku Band Power Amplifier MMIC
■
■■
■ S-PARAMETER
INPUT/OUTPUT RETURN LOSS vs. FREQUENCY
Vdd=10V, Vgg=-5V SMALL SIGNAL GAIN vs. FREQUENCY
Vdd=10V, Vgg=-5V
-40
-35
-30
-25
-20
-15
-10
-5
0
13.6 13.8 14.0 14.2 14.4 14.6 14.8
Fre quency [GHz ]
Input/Output Return Loss [dB]
0
5
10
15
20
25
30
13.6 13.8 14.0 14.2 14.4 14.6 14.8
Fre quency [GHz ]
Small Signal Gain [dB]
- Input Return Loss
- Output Return Loss
V
DD=10V, VGG=-5
V
Frequency S11 S21 S12 S22
[ MHz ] MAG ANG MAG
A
NG MAG
A
NG MAG
A
NG
13800 0.074 -61.1 11.417 -6.7 0.007 -77.6 0.341 -86.2
13900 0.100 -62.8 11.014 -27.2 0.001 -66.1 0.289 -87.2
14000 0.109 -69.8 11.331 -38.0 0.004 -134.6 0.250 -89.6
14100 0.119 -76.2 10.909 -55.3 0.007 -114.5 0.203 -89.4
14200 0.125 -86.0 11.088 -69.1 0.009 -133.9 0.170 -93.2
14300 0.138 -93.2 10.730 -83.9 0.005 -110.5 0.126 -94.5
14400 0.147 -102.6 10.728 -98.6 0.007 -88.3 0.081 -104.1
14500 0.156 -112.8 10.562 -113.4 0.007 -100.2 0.027 -137.0
14600 0.174 -124.2 10.353 -128.9 0.005 172.4 0.057 96.0
14700 0.196 -136.3 9.941 -146.6 0.007 -158.7 0.128 69.3
Ku band Power Amplifier MMIC
4
FMM5017VF
■
■■
■ Package Outline
PIN ASSIGMENT
1 : VDD
2 : RF in
3 : VGG
4 : Pmon
5 : RF out
6 : VDD
5
FMM5017VF
Ku Band Power Amplifier MMIC
1. Screw Mounting
(1) The flange of package may be attached using screws. Torque conditions are
shown in tabl e 1.
Table 1. Reco mmended and Maximum Torq ue f or Screw Mounting
Package Recommended
screw
Recommended
Torque Maximum Torque
VF M2.0 10 N-cm (0.9 lb-in) 15 N-cm (1.3 lb-in)
(2) First, tighten the screws with a torque drive r set to 5 N-cm.
(3) The surface finish of the h eat si nk shoul d b e bet ter than 0.8 µm, and the surface
flatness must be bet t er t han 10 µm.
(4) Silicon based heat sink compounds should not be used for the thermal
conductive grease. They cause poor grounding of the source flange,
conta min atio n and long t erm degradation of thermal resist ance bet ween t he FET
pac kage and heat sink.
2. Solder Mount in g
(1) Recommended solder are Tin-Lead solder (63Sn/37Pb), Lead-Free solder (Sn-
3.0Ag-0.5Cu)*1 or equivalent.
(2) For soldering, Tin-Lead solder (63Sn/37Pb) or Lead-Free solder (Sn-3.0Ag-
0.5Cu)*1 shall be used. (*1: The figure displays with weight %. A predominantly
tin-rich alloy with 3.0% silver and 0.5% copper.)
(3) Recommended Flux is Rosin type with chlorine content: 0.2% or less and a low
halogen content. After soldering, the flux residue should be removed by
appropriate c leaning methods.
(4) The recomme nded solder ing conditions are as fo llows:
Partial heating method (soldering iron, spot laser/air)
Product terminal temperature: 260 deg-C, max. 10 s./terminal or
400 deg-C, max. 3 s./terminal
■
■■
■ Mounting Instructions for VF Package
Ku band Power Amplifier MMIC
FMM5017VF
6
■
■■
■ Recommended Bias Circuit and Internal Block Diagram
PIN ASSIGMENT
1 : VDD
2 : RF in
3 : VGG
4 : Pmon
5 : RF out
6 : VDD
Note 1: The capacitors are recommended on the bias supply line, close to the package,
in order to prevent video oscillations which could damage the module.
Note 2: Two pins of VDD are internally connected respectively.
Note 3: The external resistor ( 10Kohm ) on the board is necessary to monitor the output
power.
FMM5017VF
7
Ku Band Power Amplifier MMIC
For further informat ion please contact :
Eudyna Devices USA Inc.
2355 Zanker Rd.
San Jose, CA 95131-1138, U.S.A.
TEL: (408) 232-9500
FAX: (408) 428-9111
www.us.eudyna.com
Eudyna Devices Europe Ltd.
Network House
Norreys Drive
Maidenhead, Berkshire SL6 4FJ
United Kingdom
TEL: +44 (0) 1628 504800
FAX: +44 (0) 1628 504888
Eudyna Devices Incorporated reserves the right to change products and specifications without notice.
The information does not convey any license under rights of Eudyna Devices Incorporated or others.
Eudyna Devices Inc. products contain gall ium arsenide
(GaAs) whi ch can be ha zardous t o the hu man body and the
env i r onmen t . Fo r safet y , observe the fol l owing proc e dure s:
・Do not put these products into the mouth.
・Do not a lte r t he form of th is product int o a gas, po wder, or liqui d
through burning, crushing, or ch emical process in g as these by-
products are dangerous to the human body if inhaled, ingested, or
swallowed.
・Observe government laws and company regulations when
discarding this product. This product must be discarded in
accordance with methods specified by applicable hazardous waste
procedures.
Eudyna Devices Asia Pte. Ltd.
Hong Kong Branch
Rm.1101,Ocean Centre, 5 Canton Road
Tsim Sha Tsui, Kowloon, Hong kong
TEL: +852-2377-0227
FAX: +852-2377-3921
Eudyna Devices Inc.
JAPANESE SALES OFFICE(Head Office)
1, Kanai-cho, Sakae-ku, Yokohama,
244-0845, Japan
Tel: +81-45-853-8150
Fax: +81-45-853-8170
www.eudyna.com
© 2004 Eudyna Devices USA Inc.
Print e d in U.S . A.
