PolyZen
Polymer Enhanced Zener Diode
PRODUCT: ZEN056V260A16YC
DOCUMENT: SCD28844
REV LETTER: A
REV DATE: OCTOBER 11, 2014
PAGE NO.: 1 OF 8
Specification Status: RELEASED
GENERAL DESCRIPTION
TE PolyZen devices are polymer
enhanced, precision Zener
diode. They offer resettable
protection against multi-Watt
fault events without the need for
multi-Watt heat sinks.
PolyZen Zener diode was
selected due to its relatively flat
voltage vs current response.
This helps improve output
voltage clamping, even when
input voltage is high and diode
currents are large.
An advanced feature of the PolyZen devices is that the Zener
diode is thermally coupled to a resistively non-linear, polymer
PTC (positive temperature coefficient) substrate. The PTC
substrate is fully integrated into the device, and is electrically in
series between VIN and the diode clamped VOUT.
This advanced PTC substrate responds to either extended
diode heating or overcurrent events by transitioning from a low
to high resistance state, also known as ”tripping”. A tripped PTC
will limit current and generate voltage drop. It helps to protect
both the Zener diode and the follow-on electronics and
effectively increases the diode’s power handling capability.
The polymer enhanced Zener diode helps protect sensitive
portable electronics from damage caused by inductive voltage
spikes, voltage transients, incorrect power supplies and reverse
bias. These devices are particularly suitable for portable
electronics and other low-power DC devices.
BENEFITS
Stable Zener diode helps shield downstream
electronics from overvoltage and reverse bias
Trip events shut out overvoltage and reverse bias
sources
Analog nature of trip events minimizes upstream
inductive spikes
Integrated protection on over current,
over voltage, over temperature and ESD
Minimal power dissipation requirements
Single component placement
FEATURES
Overvoltage transient suppression
Stable VZ vs fault current
Time delayed, overvoltage trip
Time delayed, reverse bias trip
Multi-Watt power handling capability
Integrated device construction
RoHS Compliant
TARGET APPLICATIONS
DC power port protection in portable electronics
DC power port protection for systems using
barrel jacks for power input
Internal overvoltage & transient suppression
DC output voltage regulation
TYPICAL APPLICATION BLOCK DI AGRA M
GND
V
IN
V
OUT
Regulated
Output
R
Load
Protected downstream
electronics
1
2
3
+
Power Supply
(External or Internal)
PolyZen Protected Electronics
PolyZen
Device
GND
V
IN
V
OUT
Regulated
Output
R
Load
Protected downstream
electronics
1
2
3
+
Power Supply
(External or Internal)
PolyZen Protected Electronics
GND
V
IN
V
OUT
Regulated
Output
R
Load
Protected downstream
electronics
1
2
3
+
Power Supply
(External or Internal)
PolyZen Protected Electronics
PolyZen
Device
PolyZen
Polymer Enhanced Zener Diode
PRODUCT: ZEN056V260A16YC
DOCUMENT: SCD28844
REV LETTER: A
REV DATE: OCTOBER 11, 2014
PAGE NO.: 2 OF 8
CONFIGURATION INFORMATION
Pin Configuration (Top View) Block Diagram
PIN DESCRIPTION
Pin Number Pin Name Pin Function
1 VIN VIN. Device input
2 GND
GND
3 VOUT VOUT. Zener regulated voltage output
MECHANICAL DIMMEN SION S
DEFINITION of TERMS
IPTC Current flowing through the PTC portion of the
circuit
IFLT RMS fault current flowing through the diode
IOUT Current flowing out the VOUT pin of the device
Trip Event A condition where the PTC transitions to a high
resistance state, thereby significantly limiting IPTC
and related currents.
Trip
Endurance
Time the PTC portion of the device remains in a
high resistance state.
Min Typ Max
mm
(in)
Length A 4.80
(0.190)
5.00
(0.197)
5.20
(0.206)
Width B 3.80
(0.150)
4.00
(0.158)
4.20
(0.166)
Height C 1.20
(0.047)
1.30
(0.051)
1.40
(0.055)
1
VIN
GND
2
1
VOUT
3
2
GND
IFLT
VIN
IOUT
IPTC, IHOLD
VOUT
GND
IFLT
VIN
IOUT
IPTC, IHOLD
VOUT
PolyZen
Polymer Enhanced Zener Diode
PRODUCT: ZEN056V260A16YC
DOCUMENT: SCD28844
REV LETTER: A
REV DATE: OCTOBER 11, 2014
PAGE NO.: 3 OF 8
GENERAL SPECIFICATIONS1-3, 12 (Typical unless otherwise specified)
ELECTRICAL CHARACTERISTICS
VZ4
(V) Izt4
(A)
Leakage Current IHOLD5
@20ºC
(A)
IHOLD
@60ºC
(A)
RTYP6
(Ohms) R1Max7
(Ohms)
VINT Max8
(V)
Min Max Test Voltage
(V) Max Current
(mA) VINT
Max (V)
Test
Current
(A)
5.35 5.85 0.1 5.25 10 2.6 2 0.040 0.055 16 5
MAXIMUM RATINGS
VIN Max9 IFLT Max10 Peak pulse
current ESD withstand
(IEC 61000-4-2) Temperature Tripped Power
Dissipation11
Max
VIN Max
(V)
Test
Current
(A)
IFLT Max
(A)
Test
voltage
(V)
8/20 µs pulse
(IEC 61000-4-5)
(A)
Contact
(KV) Ai r
(KV) Operating
(ºC) Storage
(ºC) Value
(W)
Test
Voltage
(V)
20 3 3 16 150 +/- 30 +/- 30 -40 to +85 -40 to +85 1.0 20
-16 -3 -40 -12
Note 1: Electrical characteristics determined at 25ºC unless otherwise specified.
Note 2: This device is intended for limited fault protection. Repeated trip events or extended trip endurance can degrade the device and
may affect performance to specifications. Performance impact will depend on multiple factors including, but not limited to,
voltage, trip current, trip duration, trip cycles, load condition and circuit design. For details or ratings specific to your application
contact TE Connectivity Circuit Protection Division directly.
Note 3: Specifications developed using 1.0 ounce 0.045” wide copper traces on dedicated FR4 test boards. Performance in your
application may vary.
Note 4: Izt is the current at which Vz is measured (VZ = VOUT). Additional VZ values are available on request.
Note 5: IHOLD: Maximum steady state current (current entering or exiting the VIN pin of the device) that will not generate a trip event at
the specified temperature. Specification assumes IFLT (current flowing through the Zener diode) is sufficiently low so as to
prevent the diode from acting as a heat source. Testing is conducted with an “open” Zener.
Note 6: RTYP: Resistance between VIN and VOUT pins during normal operation at room temperature.
Note 7: R1Max: The maximum resistance between VIN and VOUT pins at room temperature, one hour after first tripped event or after
reflow soldering.
Note 8: VINT Max: VINT Max is defined as the maximum voltage at which devices can be survived according to typical qualification
process at the specified voltage and current. VINT Max testing is conducted using a "shorted" load (VOUT = 0 V). VINT Max is a
survivability rating, not a performance rating. For performance ratings, see Note 2.
Note 9: VIN Max: For practical application, Polyzen devices are polymer enhanced diode, it use the Polymer PTC technology to offer the
diode resettable protection against continuous overvoltage fault events. VIN Max is defined as the maximum voltage rating of the
whole device at which devices can be survived according to typical qualification process at specified voltage and current.
Testing conducted with no load connected to VOUT. VIN Max is a survivability rating, not a performance rating. For performance
ratings, see Note 2.
Note 10: IFLT Max: Maximum RMS fault current the device can withstand and remain resettable. Specification is dependent on the
direction of current flow through the device. RMS fault currents above IFLT Max may permanently damage the PolyZen device.
Specification assumes IOUT = 0. Testing conducted with no load connected to VOUT.
Note 11: The power dissipated by the device when in the “tripped” state, as measured on TE test boards (see note 3).
Note 12: Specifications based on limited qualification data and subject to change.
PolyZen
Polymer Enhanced Zener Diode
PRODUCT: ZEN056V260A16YC
DOCUMENT: SCD28844
REV LETTER: A
REV DATE: OCTOBER 11, 2014
PAGE NO.: 4 OF 8
RECOMMENDED PAD DIMENSIONS (mm) RECOMMENDED PAD LAYOUT (mm)
RECOMMENDED SOLDER REFLOW PROFILE
Avoid scratching the package when the device surface temperature is great than 85 ºC
250
PolyZen
Polymer Enhanced Zener Diode
PRODUCT: ZEN056V260A16YC
DOCUMENT: SCD28844
REV LETTER: A
REV DATE: OCTOBER 11, 2014
PAGE NO.: 5 OF 8
TYPICAL DEVICE CHARA CTERISTICS
PolyZen
Polymer Enhanced Zener Diode
PRODUCT: ZEN056V260A16YC
DOCUMENT: SCD28844
REV LETTER: A
REV DATE: OCTOBER 11, 2014
PAGE NO.: 6 OF 8
PolyZen
Polymer Enhanced Zener Diode
PRODUCT: ZEN056V260A16YC
DOCUMENT: SCD28844
REV LETTER: A
REV DATE: OCTOBER 11, 2014
PAGE NO.: 7 OF 8
PACKAGING Packaging Tape & Reel Standard Box
ZEN056V260A16YC 4000 20000
REEL DIMENSIONS ( mm)
TAPE DIMENSIONS (mm)
PolyZen
Polymer Enhanced Zener Diode
PRODUCT: ZEN056V260A16YC
DOCUMENT: SCD28844
REV LETTER: A
REV DATE: OCTOBER 11, 2014
PAGE NO.: 8 OF 8
DEVICE MARKINGS INFORMATION
MATERIALS INFORMATIO N
ROHS Compliant ELV Compliant Pb-Free Halogen Free*
* Halogen Free refers to: Br≤900ppm, Cl≤900ppm, Br+Cl≤1500ppm.
All information, including illustrations, is believed to be accurate and reliable. Users, however, should independently evaluate the
suitability of and test each product selected for their application. Tyco Electronics Corporation and/or its Affiliates in the TE Connectivity
Ltd. family of companies (“TE”) makes no warranties as to the accuracy or completeness of the information, and disclaims any liability
regarding its use. TE’s only obligations are those in the TE Standard Terms and Conditions of Sale and in no case will TE be liable for
any incidental, indirect, or consequential damages arising from the sale, resale, use, or misuse of its products. Specifications are subject
to change without notice. In addition, TE reserves the right to make changes to materials or processing that do not affect compliance with
any applicable specification without notification to Buyer. Without express written consent by an officer of TE, TE does not authorize the
use of any of its products as components in nuclear facility applications, aerospace, or in critical life support devices or systems.
© 2014 Tyco Electronics Corporation, a TE Connectivity Ltd. company. All rights reserved.
Markings Vz Hold
current Special
code
052XF 5.6V 2.6A F
#### Last 4 digits of batch number
HF
