CLASSIFICATION
PRODUCT SPECIFICATION
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DS-13xx-2400-102
REV.
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SUBJECT
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Power Electronics R&D Center
Wireless Connectivity
Panasonic Industrial Devices Europe GmbH
APPROVED
CHECKED
DESIGNED
Product Specification
Manufacturer
Panasonic Industrial Devices Europe GmbH
Zeppelinstrasse 19
21337 Lüneburg
Germany
By purchase of any of the products described in this document the customer accepts
the document's validity and declares their agreement and understanding of its
contents and recommendations. Panasonic reserves the right to make changes as
required at any time without notification. Please consult the most recently issued
Product Specification before initiating or completing a design.
© Panasonic Industrial Devices Europe GmbH 2017.
All rights reserved.
This Product Specification does not lodge the claim to be complete and free of
mistakes.
CLASSIFICATION
PRODUCT SPECIFICATION
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REV.
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SUBJECT
CLASS 1 or 2 BLUETOOTH MODULE
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TABLE OF CONTENTS
1 About this document....................................................................................................................... 4
1.1 Purpose .............................................................................................................................................. 4
1.2 Revision History ................................................................................................................................. 4
1.3 Related Documents ........................................................................................................................... 5
1.4 General Information ........................................................................................................................... 5
1.5 Contact Us ......................................................................................................................................... 6
2 New PAN13x5B, PAN13x6B and PAN1326C ................................................................................ 7
3 Key Features .................................................................................................................................. 8
4 Applications for the Module ............................................................................................................ 8
5 Description for the Module ............................................................................................................. 9
6 Detailed Description .....................................................................................................................10
6.1 Terminal Layout ............................................................................................................................... 10
6.2 Pin Description ................................................................................................................................. 11
6.3 Device Power Supply ....................................................................................................................... 12
6.4 Clock Inputs ..................................................................................................................................... 14
7 Bluetooth Features .......................................................................................................................14
8 Block Diagram ..............................................................................................................................15
9 Test Conditions ............................................................................................................................16
10 General Device Requirements and Operation .............................................................................16
10.1 Absolute Maximum Ratings ............................................................................................................. 16
10.2 Recommended Operating Conditions .............................................................................................. 17
10.3 Current Consumption ....................................................................................................................... 17
10.4 General Electrical Characteristics .................................................................................................... 18
10.5 nSHUTD Requirements ................................................................................................................... 18
10.6 External Digital Slow Clock Requirements ....................................................................................... 18
11 Host Controller Interface ..............................................................................................................19
12 Audio/Voice Codec Interface ........................................................................................................20
12.1 PCM Hardware Interface .................................................................................................................. 20
12.2 Data Format ..................................................................................................................................... 20
12.3 Frame Idle Period ............................................................................................................................ 21
12.4 Clock-Edge Operation ...................................................................................................................... 21
12.5 Two-Channel PCM Bus Example ..................................................................................................... 22
12.6 Audio Encoding ................................................................................................................................ 22
12.7 Improved Algorithm For Lost Packets .............................................................................................. 22
12.8 Bluetooth/PCM Clock Mismatch Handling........................................................................................ 23
12.9 Bluetooth Inter-IC Sound (I2S) ......................................................................................................... 23
12.10 Current Consumption for Different Bluetooth Scenarios .................................................................. 23
13 Bluetooth RF Performance ...........................................................................................................24
14 Soldering Temperature-Time Profile (for reflow soldering) ..........................................................27
14.1 For leadfree solder ........................................................................................................................... 27
15 Module Dimension ........................................................................................................................28
15.1 Module Dimensions PAN131X without Antenna .............................................................................. 28
15.2 Module Dimensions PAN132X with Antenna ................................................................................... 29
16 Footprint of the Module ................................................................................................................30
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16.1 Footprint PAN131x without antenna ................................................................................................ 30
16.2 Footprint PAN132x with antenna ..................................................................................................... 31
17 Labeling Drawing ..........................................................................................................................32
18 Mechanical Requirements ............................................................................................................32
19 Recommended Foot Pattern ........................................................................................................33
19.1 Recommended foot pattern PAN131x without antenna ................................................................... 33
19.2 Recommended foot pattern PAN132x with antenna ........................................................................ 34
20 Radiation Pattern ..........................................................................................................................35
21 Layout Recommendations with Antenna (PAN132x) ...................................................................36
22 Bluetooth LE (LOW ENERGY) PAN1316/26 ...............................................................................37
22.1 Network Topology ............................................................................................................................ 37
22.2 Module Features .............................................................................................................................. 37
22.3 Current consumption for different LE scenarios ............................................................................... 37
23 ANT PAN1317/27 .........................................................................................................................38
23.1 Network topology ............................................................................................................................. 38
23.2 Module Features ............................................................................................................................. 38
23.3 ANT Current consumption ................................................................................................................ 39
24 Triple mode (BR/EDR + Bluetooth low energy or ANT) PAN1323 .............................................39
24.1 Triple Mode Current consumption .................................................................................................... 39
25 Development of Applications ........................................................................................................40
25.1 Tools to be needed .......................................................................................................................... 40
26 Reliability Tests ............................................................................................................................41
27 Cautions .......................................................................................................................................42
27.1 Design Notes ................................................................................................................................... 42
27.2 Installation Notes ............................................................................................................................. 42
27.3 Usage Conditions Notes .................................................................................................................. 42
27.4 Storage Notes .................................................................................................................................. 43
27.5 Safety Cautions ................................................................................................................................ 43
27.6 Other cautions .................................................................................................................................. 44
27.7 Life Support Policy ........................................................................................................................... 44
28 Packaging .....................................................................................................................................45
28.1 Packaging of PAN131x without antenna .......................................................................................... 45
28.2 Packaging for PAN132x with antenna .............................................................................................. 48
29 Ordering Information ....................................................................................................................49
30 RoHS Declaration .........................................................................................................................49
31 Regulatory Information .................................................................................................................50
31.1 FCC for US ...................................................................................................................................... 50
31.2 Industry Canada Certification ........................................................................................................... 52
31.3 European Conformity according to RED (2014/53/EU) .................................................................... 54
31.4 Japanese Radio Law and Japanese Telecommunications Business Law
Compliance ................................................................................................................................................. 55
31.5 Korean Certification ......................................................................................................................... 55
31.6 Bluetooth SIG Statement ................................................................................................................. 55
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1 ABOUT THIS DOCUMENT
1.1 PURPOSE
This product specification describes Panasonic’s HCI, Class 1.5 , TI based, Bluetooth®
1
modules, series number 13xx.
For detailed family overview that includes part numbers see Chapter 29, Ordering Information.
Non-antenna versions will be refered to as PAN131x, versions with antenna will be refered to as
PAN132x in this document.
For information and features on Bluetooth Low Energy 4.0 refer to Chapter 21, for information
on ANT refer to Chapter 23.
1.2 REVISION HISTORY
Revision
Date
Modification / Remarks
1.00
04.11.2010
1st internal Release.
1.01
03.12.2010
Included reference to PAN1325 Application Note. AN-1325-2420-111.pdf.
1.02
10.01.2011
Changed wording in Chapter 31.2 ”Industry Canada Certification”.
1.03
23.05.2011
Included DOC for PAN1315 series. Included PAN13xx ANT and BLE Addendum Rev1.x.pdf
reference. Included Note for IO voltage and MLD_OUT pin.
1.04
02.07.2011
Corrected wording in Chapter 31.3 European Conformity.
1.05
28.10.2011
Including CC2560A silicon PAN1315A HW40 at Chapter 2, Chapter New PAN13x5 and
Chapter 0. Deleted ES label in Chapter.
1.06
15.11.2011
Added overview for the core specification and their addendums. Updated front page. Updated
Related Documents.
3.00
11.01.2012
Merging PAN13xx documents into this specification and correct some format.
3.10
16.01.2012
Minor mistakes fixed.
3.20
29.05.2012
DoC replaced with revised version.
3.30
11.06.2012
Added triple mode stack Module PAN1323, add PAN1323 to ordering and software information
overview, Software Block Diagram added, Bluetooth Inter IC-Sound chapter information added
Layout Recommandations with Antenna added, Application Note LGA added
3.31
27.06.2012
Added design information to use low pass filter (chapter 11.1 / 11.9) for better noise
surpression when using PCM interface.
3.40
18.07.2012
Re-organize chapter Regulatory Information and added 2 chapters.
3.50
31.10.2012
Changed the Overview in chapter Ordering Information
Included -40°C to 85°C Version ENW898xxA2KF. So called K-Version.
3.60
17.05.2013
Changed FCC-ID for models ENW89823xxx and ENW89827xxx.
3.70
31.05.2013
DoC replaced with revised version, updated links.
3.71
15.08.2013
Added component values for low pass filter on PCM interface.
3.80
11.11.2013
Changed CC2567 to CC2564 in chapter ordering information.
3.90
03.12.2013
Included CC2560/4B PAN1325/6B in chapter 2.
1
Bluetooth is a registered trademark of the Bluetooth Special Interest Group.
CLASSIFICATION
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Revision
Date
Modification / Remarks
4.00
19.12.2013
Updated chapter European Conformity.
4.10
10.01.2014
Added chapter 20 Radiation Pattern.
4.20
28.02.2014
Changed chapter Key Features according to EN regulations.
4.3
24.09.2014
Added chapter 27.
4.4
06.11.2014
Added DoC.
4.5
29.04.2015
Removed chapter 27 and updated chapter 8 Block Diagram.
4.6
07.05.2015
Removed Taiwan Regulatory chapter.
4.61
19.05.2015
Deleted Chapter 2.1 Software Blockdiagram.
4.7
11.06.2015
Changed the wording in chapter 8 Block Diagram.
4.8
23.09.2015
Added Japanese radio law requirements for labeling.
4.9
09.03.2017
Added CC2564C in the product description. Added new partnumber.
5.0
14.06.2017
Editorial changes. Added RED declaration. Added Korean certification chapter.
1.3 RELATED DOCUMENTS
For an update, please refer to the the respective homepage.
[1] PAN1323ETU Design-Guide:
http://www.panasonic.com/industrial/includes/pdf/PAN1323ETUDesignGuide.pdf
[2] CC2560 Product Bulletin: http://focus.ti.com/pdfs/wtbu/cc2560_slyt377.pdf
[3] Bluetooth SW for MSP430 is supported by IAR IDE service pack 5.10.6 and later. Use full IAR
version edition (not the kick-start version). You can find info on IAR at
http://www.iar.com/website1/1.0.1.0/3/1/ and www.MSP430.com . Note, that there is an option
for a 30-day free version of IAR evaluation edition.
[4] PAN13xx CAD data: http://www.pedeu.panasonic.de/pdf/174ext.zip
[5] To help with the implementation of this reference design, Eagle formatted application and layout
files are available on the web at the address below.
[6] www.panasonic.com/industrial/includes/pdf/PAN1323ETU_Eagle_Ver1_1.zip
[7] Application Note Land Grid Array: http://www.pedeu.panasonic.de/pdf/184ext.pdf
1.4 GENERAL INFORMATION
This document may contain errors. Panasonic reserves the right to make corrections, modifications,
enhancements, improvements, and other changes to its literature at any time. Customers should
obtain the latest relevant information before placing orders and should verify that such information
is current and complete. All products are sold subject to Panasonic’s terms and conditions of sale
supplied at the time of order acknowledgment.
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Engineering Samples (ES)
If Engineering Samples are delivered to the customer, these samples have the status
“Engineering Samples”. This means that the design of this product is not yet concluded.
Engineering Samples may be partially or fully functional, and they may differ from the published
Product Specification.
Engineering Samples are not qualified and they are not to be used for reliability testing or series
production.
Disclaimer
The customer acknowledges that samples may deviate from the Product Specification and may
bear defects due to their status of development and the lack of qualification mentioned above.
Panasonic rejects any liability or product warranty for Engineering Samples. In particular,
Panasonic disclaims liability for damages caused by:
The use of the Engineering Sample other than for evaluation purposes, particularly the
installation or integration in another product to be sold by the customer,
Deviation or lapse in function of the Engineering Sample,
Improper use of the Engineering Sample.
Panasonic Industrial Devices Europe GmbH disclaims any liability for consequential and
incidental damages. In case of any queries regarding the Engineering Samples, please contact
your local sales partner or the related product manager.
1.5 CONTACT US
Please contact your local Panasonic Sales office for details on additional product options and
services:
For Panasonic Sales assistance in the EU, visit
https://eu.industrial.panasonic.com/about-us/contact-us
Email: wireless@eu.panasonic.com
For Panasonic Sales assistance in North America, visit the Panasonic Sales & Support Tool to
find assistance near you at
https://na.industrial.panasonic.com/distributors
Please visit the Panasonic Wireless Technical Forum to submit a question at
https://forum.na.industrial.panasonic.com
Please refer to the Panasonic Wireless Connectivity website for further information on our
products and related documents:
For complete Panasonic product details in the EU, visit
http://pideu.panasonic.de/products/wireless-modules.html
For complete Panasonic product details in North America, visit
http://www.panasonic.com/rfmodules
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2 NEW PAN13X5B, PAN13X6B AND PAN1326C
The PAN13x5B and PAN13x6B/C Series are based on Texas Instruments CC2560B and
CC2564B/C controller respectively. The PAN13x5B/13x6B Series Modules support assisted
mode for the HFP1.6 (WBS) profile or the A2DP profile. The PAN13x6B also supports 10 LE
connections (instead of 6 before).
The C Version implements new BLE features according to the BT4.2 Standard like enhanced
security and faster transfer data. Refer to the supported feature set of the BLE stack.
Compatibility:
PAN1315(A/B) and PAN1316(B) are 100% footprint compatible
PAN1325(A/B) and PAN1326(B/C) are 100% footprint compatible
NOTE: In the following chapters PAN13x5, PAN13x6 naming also considers the A, B and C
version.
As an updated initialization script resident on the application microcontroller is required for
modules based on the CC2560A and CC2564A/B/C, compatibility between the basic, A and B
and C version is dependent on the Bluetooth stack.
BT-Stack solutions provided by software development partners are available for most
processors, including linux based host systems.
For detailed family overview that includes part numbers see Chapter 29 Ordering Information.
Contact your stack provider or local Panasonic sales company for currently available Bluetooth
Profiles.
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3 KEY FEATURES
Bluetooth specification up to V4.2 (C-Version)
Surface mount type 6.5(9.5 w. Ant.) x 9.0 x 1.8 mm³
Up to 10 dBm Tx power with transmit power control
High sensitivity (-93 dBm typ.)
Texas Instrument’s CC256X BlueLink 7.0 inside
Fast Connection Setup
Extended SCO Link
Supports convenient direct connection to battery (2.2-4.8 V),
or connect to DC/DC (1.7-1.98 V) for improved power efficiency
Internal crystal oscillator (26MHz)
Fully shielded for immunity
Full Bluetooth data rate up to 2,178kbps asymmetric
Support for Bluetooth power saving modes (Sniff, Hold)
Support for very low-power modes (deep sleep and power down)
Optional support for ultra-low-power mode. Standby with Battery-Backup
PCM Interface Master / Slave supporting 13 or 16 bit linear, 8 bit µ-law or A-law Codecs and
CVSD transcoders on up to 3 SCO channels
Full 8- to 128-bit encryption
UART, I²C and PCM Interface
IO operating voltage = 1.8 V nominal
Bluetooth profiles such as SPP, A2DP and others are available. Refer to Panasonic’s RF
module website for a listing of the most current releases.
Manufactured in conformance with RoHS
4 APPLICATIONS FOR THE MODULE
All Embedded Wireless Applications
Smart Phones
Cable Replacement
Industrial Control
Automotive
Medical
Access Points
Scanners
Consumer Electronics
Wireless Sensors
Monitoring and Control
Low Power
Access Points
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5 DESCRIPTION FOR THE MODULE
The PAN1315 and PAN1315A are short-range, Class 1 or 2, HCI modules for implementing
Bluetooth functionality into various electronic devices. A block diagram can be found in Chapter
8.
Communication between the module and the host controller is carried out via UART.
New designs can be completed quickly by mating the PAN13xx series modules with Texas
Instruments’ MSP430BT5190 that contains Mindtree’s EtherMind Bluetooth Protocol Stack and
serial port profile, additional computing power can be achieved by choosing TI’s Stellaris ARM7
controller that includes StoneStreet One's A2DP profile. Other BT profiles are available on custom
development basis.
Additional controllers are also supported by the PAN13xx series by using a TI/Panasonic software
development partner to port the Bluetooth stack and profiles. Mindtree's Software Development Kit
(SDK) is available on TI's website -- www.ti.com/connectivity.com
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6 DETAILED DESCRIPTION
6.1 TERMINAL LAYOUT
6.1.1 Terminal Layout PAN131x without antenna
17 15 13
14
11
9
8
6
53
2
21
22 10
4
16
Top View
9,00 mm
6,50 mm
20
23
1
24
19
18 12
7
Pad = 24 x 0.60mm x 0.60mm
Module Height 1.8 mm
2
I = input; O = output; IO = bidirectional; P = power; PU = pulled up; PD = pulled down
3
I/O Type: Digital I/O cells. HY = input hysteresis, current = typ. output current
4
No signals are allowed on the IO pins if no VDD_IO (Pin 22) power supplied, except pin 7, 8, 17-19.
No
Pin Name
Pull at
Reset
Def.
Dir. 2
I/O Type 3
Description of Options (Common)
1
GND
Connect to Ground
2
TX_DBG
PU
O
2 mA
Logger output
3
HCI_CTS
PU
I
8 mA
HCI UART clear-to-send.
4
HCI_RTS
PU
O
8 mA
HCI UART request-to-send.
5
HCI_RX
PU
I
8 mA
HCI UART data receive
6
HCI_TX
PU
O
8 mA
HCI UART data transmit
7
AUD_FSYNC
PD
IO
4 mA
PCM frame synch. (NC if not used) Fail safe4
8
SLOW_CLK_IN
I
32.768-kHz clock in Fail safe
9
NC
IO
Not connected
10
MLDO_OUT
O
Main LDO output (1.8 V nom.)
11
CL1.5_LDO_IN
I
PA LDO input
12
GND
Connect to Ground
13
RF
IO
Bluetooth RF IO
14
GND
Connect to Ground
15
MLDO_IN
I
Main LDO input
16
nSHUTD
PD
I
Shutdown input (active low).
17
AUD_OUT
PD
O
4 mA
PCM data output. (NC if not used) Fail safe
18
AUD_IN
PD
I
4 mA
PCM data input. (NC if not used) Fail safe
19
AUD_CLK
PD
IO
HY, 4 mA
PCM clock. (NC if not used) Fail safe
20
GND
Connect to Ground
21
NC
EEPROM I²C SDA (Internal)
22
VDD_IO
PI
I/O power supply 1.8 V Nom
23
NC
EEPROM I²C SCL (Internal)
24
NC
IO
Not connected
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6.1.2 Terminal Layout PAN132x with antenna
17 15 13
14
11
9
8
6
53
2
21
22 10
4
16
Pad = 28 x 0.60mm x 0.60mm
Top View
9.00 0,55
1.80
9.50
0,60
20
23
1
24
19
18 12
7
A
C
B
D
No
Pin Name
Pull at
Reset
Def.
Dir. 5
I/O Type 6
Description of Options (Common)
A
GND
Connect to Ground
B
GND
Connect to Ground
C
GND
Connect to Ground
D
GND
Connect to Ground
No 1-24 see above in Chapter 5.1.1. Except PIN 13 is not connected. For RF conducted
measurements, either use the PAN1323ETU or de-solder the antenna and solder an antenna
connector to the hot pin.
6.2 PIN DESCRIPTION
Pin Name
No
ESD 7
(V)
Pull at
Reset
Def.
Dir. 8
I/O Type 9
Description of Options
Bluetooth IO SIGNALS
HCI_RX
5
750
PU
I
8 mA
HCI UART data receive
5
I = input; O = output; IO = bidirectional; P = power; PU = pulled up; PD = pulled down
6
I/O Type: Digital I/O cells. HY = input hysteresis, current = typ. output current
7
ESD: Human Body Model (HBM). JEDEC 22-A114
8
I = input; O = output; IO = bidirectional; P = power; PU = pulled up; PD = pulled down
9
I/O Type: Digital I/O cells. HY = input hysteresis, current = typ output current
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Pin Name
No
ESD 7
(V)
Pull at
Reset
Def.
Dir. 8
I/O Type 9
Description of Options
HCI_TX
6
750
PU
O
8 mA
HCI UART data transmit
HCI_RTS
4
750
PU
O
8 mA
HCI UART request-to-send.
HCI_CTS
3
750
PU
I
8 mA
HCI UART clear-to-send.
AUD_FYSNC
7
500
PD
IO
4 mA
PCM frame synch (NC if not used) Fail safe
AUD_CLK
19
500
PD
IO
HY, 4 mS
PCM clock (NC if not used) Fail safe
AUD_IN
18
500
PD
I
4 mA
PCM data input (NC if not used) Fail safe
AUD_OUT
17
500
PD
O
4 mA
PCM data output (NC if not used) Fail safe
TX_DBG
2
1000
PU
O
2 mA
Logger output
OPTION: nTX_DBG – logger out (low = 1)
CLOCK SIGNALS
SLOW_CLK_IN
8
1000
I
32.768-kHz clock in Fail safe
Bluetooth ANALOG SIGNALS
RF
13
1000
IO
Bluetooth RF IO (not connected with antenna)
nSHUTD
16
1000
PD
I
Shutdown input (active low).
Bluetooth POWER AND GND SIGNALS
VDD_IO
22
1000
PI
I/O power supply 1.8 V Nom
MLDO_IN
15
1000
I
Main LDO input
Connect directly to battery or to a pre-regulated 1.8-V supply
MLDO_OUT
10
1000
O
Main LDO output (1.8 V nom.) Can not be used as 1.8V supply
due to internal connection to the RF part.
CL1.5_LDO_IN
11
1000
I
PA LDO input
Connect directly to battery or to a pre-regulated 1.8-V supply
GND
1
P
Connect to Ground
GND
12
P
Connect to Ground
GND
14
P
Connect to Ground
GND
20
P
Connect to Ground
EEPROM IO SIGNALS (EEPROM is optional in PAN13x product line)
NC
23
1000
PU/PD
I
HY, 4mA
EEPROM I²C SCL (Internal)
NC
21
1000
PU/PD
IO
HY, 4mA
EEPROM I²C IRQ (Internal)
Remark:
HCI_CTS is an input signal to the CC256X device:
- When HCI_CTS is low, then CC256X is allowed to send data to Host device.
- When HCI_CTS is high, then CC256X is not allowed to send data to Host device.
6.3 DEVICE POWER SUPPLY
The PAN13XX Bluetooth radio solution is intended to work in devices with a limited power
budget such as cellular phones, headsets, hand-held PC’s and other battery-operated devices.
One of the main differentiators of the PAN13XX is its power management – its ability to draw as
little current as possible.
The PAN13XX device requires two kinds of power sources:
1. Main power supply for the Bluetooth - VDD_IN = VBAT
2. Power source for the 1.8 V I/O ring - VDD_IO
The PAN13XX includes several on-chip voltage regulators for increased noise immunity. The
PAN13XX can be connected either directly to the battery or to an external 1.8-V DC to DC
converter.
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There are three ways to supply power:
1. Full-VBAT system (Maximum RF output power, but not optimum system power):
2. Full-DC2DC system (Lower RF output power, but optimum system power):
3. Mixed DC2DC-VBAT system (Maximum RF output power and optimum system power, but
requires routing of VBAT):
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6.4 CLOCK INPUTS
The slow clock is always supplied from an external source. It is connected to the SLOW_CLK_IN
pin number 8 and can be a digital signal with peak to peak of 0-1.8 V.
The slow clock's frequency accuracy must be 32.768 kHz 250 ppm for Bluetooth usage
(according to the Bluetooth specification).
The Slow Clock 32.768 kHz is mandatory to start the internal controller, otherwise the module
does not start up.
7 BLUETOOTH FEATURES
Support of Bluetooth2.1+EDR (Lisbon Release) up to HCI level.
Very fast AFH algorithm for both ACL and eSCO.
Supports typically 4 dBm Class 2 TX power w/o external PA, improving Bluetooth link
robustness. Adjusting the host settings, the TX power can be increased to 10 dBm. However
it is important, that the national regulations and Bluetooth specification are met.
Digital Radio Processor (DRP) single-ended 50 ohm.
Internal temperature detection and compensation ensures minimal variation in the RF
performance over temperature.
Flexible PCM and I2S digital audio/voice interfaces: Full flexibility of data-format (Linear, a-
Law, µ-Law), data-width, data order, sampling and slot positioning, master/slave modes, high
clock rates up to 15 MHz for slave mode (or 4.096 MHz for Master Mode). Lost packet
concealment for improved audio.
Proprietary low-power scan method for page and inquiry scans, achieves page and inquiry
scans at 1/3rd normal power.
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8 BLOCK DIAGRAM
PAN131x
CC256x
BT-HCI
from TI
Crystal
26 MHz
Filter
Vsupply
Slow Clock 32.768 kHz
Audio PCM / I2S
UART
PAN132x
CC256x
BT-HCI
from TI
Crystal
26 MHz
Filter
Vsupply
Slow Clock 32.768 kHz
Audio PCM / I2S
UART
Note: The Slow Clock 32.768 kHz is mandatory, otherwise the module does not start up, refer to
Chapter 6.4 for additional information.
Note: The IO are 1.8V driven and might need external level shifter and LDO. The MLDO_OUT
PIN can not be used as reference due to RF internal connection.
The total capacity will not exceed 2.8uF and the total inductance will not exceed 0nH. There are
no voltage multiplying or voltage boosting circuits.
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9 TEST CONDITIONS
Measurements shall be made under room temperature and humidity unless otherwise specified.
10 GENERAL DEVICE REQUIREMENTS AND OPERATION
Temperature 25 ± 10°C
Humidity 40 to 85%RH
SW-Patch V2.30
Supply Voltage 3.3V
All specifications are over temperature and process, unless indicated otherwise.
10.1 ABSOLUTE MAXIMUM RATINGS
Over operating free-air temperature range (unless otherwise noted).
Note
All parameters are measured as follows unless stated otherwise:
VDD_IN 10 = 3.3 V, VDD_IO = 1.8 V.
No
See 11
Value
Unit
Ratings Over Operating Free-Air Temperature Range
1
VDD_IN
Supply voltage range
–0.5 to 5.5
V 12
2
VDDIO_1.8V
–0.5 to 2.145
V
3
Input voltage to RF (Pin 13)
–0.5 to 2.1
V
4
Operating ambient temperature range
–40 to 8513
°C
5
Storage temperature range
–40 to 125
°C
6
Bluetooth RF inputs (Pin 13)
10
dBm
7
ESD: Human Body Model (HBM). JEDEC 22-A114
500
V
10
VDD_IN is supplied to MLDO_IN (Pin 15) and CL1.5_LDO_IN (Pin 11), other options are described in Chapter 6.3.
11
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
12
Maximum allowed depends on accumulated time at that voltage: VDD_IN is defined in Reference schematics. When DC2DC supply is
used, maximum voltage into MLDO_OUT and LDO_IN = 2.145 V.
13
Older generation parts, which are not recommended for new designs, will support a temperature range -20 to 70. See chapter 28,
ordering information, for details.
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10.2 RECOMMENDED OPERATING CONDITIONS
No
Rating
Condition
Symbol
Min
Max
Unit
1
Power supply voltage 14
VDD_IN
1.7
4.8
V
2
IO power supply voltage
VDD_IO
1.62
1.92
V
3
High-level input voltage
Default
VIH
0.65 x VDD_IO
VDD_IO
V
4
Low-level input voltage
Default
VIL
0
0.35 x VDD_IO
V
5
IO Input rise/fall times, 10% to 90% 15
Tr/Tf
1
10
ns
6
Maximum ripple on VDD_IN (Sine wave) for
1.8 V (DC2DC) mode
0 to 0.1 MHz
60
mVp-p
0.1 to 0.5 MHz
50
0.5 to 2.5 MHz
30
2.5 to 3.0 MHz
15
> 3.0 MHz
5
7
Voltage dips on VDD_IN (VBAT) (duration =
577 s to
2.31 ms, period = 4.6 ms)
400
mV
8
Maximum ambient operating temperature 16
85
C
9
Minimum ambient operating temperature 17
-40
10.3 CURRENT CONSUMPTION
No
Characteristics
Min
25°C
Typ
25°C
Max
25°C
Min
-40°C
Typ
-40°C
Max
-40°C
Min
+85°C
Typ
+85°C
Max
+85°C
Unit
1
Current consumption in
shutdown mode 18
1
3
7
A
2
Current consumption in deep
sleep mode 19
40
105
700
A
14
Excluding 1.98 < VDD_IN < 2.2 V range – not allowed.
15
Asynchronous mode.
16
The device can be reliably operated for 7 years at Tambient of 85°C, assuming 25% active mode and 75% sleep
mode (15,400 cumulative active power-on hours).
Older generation parts, which are not recommended for new designs, will support a temperature range -20 to
70. See chapter 28, ordering information, for details.
17
The device can be reliably operated for 7 years at Tambient of 85°C, assuming 25% active mode and 75% sleep
mode (15,400 cumulative active power-on hours).
Older generation parts, which are not recommended for new designs, will support a temperature range -20 to
70. See chapter 28, ordering information, for details.
18
Vbat + Vio
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No
Characteristics
Min
25°C
Typ
25°C
Max
25°C
Min
-40°C
Typ
-40°C
Max
-40°C
Min
+85°C
Typ
+85°C
Max
+85°C
Unit
3
Total IO current consumption
for active mode
1
1
1
mA
4
Current consumption during
transmit DH5 full throughput
40
mA
10.4 GENERAL ELECTRICAL CHARACTERISTICS
No
Rating
Condition
Min
Max
Value
1
High-level output voltage, VOH
at 2/4/8 mA
0.8 x VDD_IO
VDD_IO
V
at 0.1 mA
VDD_IO – 0.2
VDD_IO
V
2
Low-level output voltage, VOL
at 2/4/8 mA
0
0.2 x VDD_IO
V
at 0.1 mA
0
0.2
V
3
IO input impedance
Resistance
1
M
Capacitance
5
pF
4
Output rise/fall times,10% to 90% (Digital pins)
CL = 20 pF
10
Ns
5
IO pull
currents
TX_DBG,
PCM bus
PU
typ = 6.5
3.5
9.7
µA
PD
typ = 27
9.5
55
All others
PU
typ = 100
100
300
µA
PD
typ = 100
100
360
10.5 NSHUTD REQUIREMENTS
No
Parameter
Symbol
Min
Max
Unit
1
Operation mode level 20
VIH
1.42
1.98
V
2
Shutdown mode level
VIL
0
0.4
V
3
Minimum time for nSHUT_DOWN low to reset the device
5
ms
4
Rise/fall times
Tr/Tf
20
µs
10.6 EXTERNAL DIGITAL SLOW CLOCK REQUIREMENTS
No
Characteristics
Condition
Symbol
Min
Typ
Max
Unit
1
Input slow clock frequency
32768
Hz
2
Input slow clock accuracy
(Initial + temp + aging)
Bluetooth
±250
Ppm
19
Vbat + Vio + Vsd (shutdown)
20
Internal pull down retains shut down mode when no external signal is applied to this pin.
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No
Characteristics
Condition
Symbol
Min
Typ
Max
Unit
3
Input transition time Tr/Tf –
10% to 90%
Tr/Tf
100
Ns
4
Frequency input duty cycle
15%
50%
85%
5
Phase noise
at 1 kHz
-125
dBc/Hz
6
Jitter
Integrated over 300 to
15000 Hz
1
Hz
7
Slow clock input voltage
limits
Square wave, DC coupled
VIH
0.65 x
VDD_IO
VDD_IO
V peak
VIL
0
0.35 x
VDD_IO
8
Input impedance
1
M
9
Input capacitance
5
pF
11 HOST CONTROLLER INTERFACE
The CC256X incorporates one UART module dedicated to the host controller interface (HCI)
transport layer. The HCI interface transports commands, events, ACL, and synchronous data
between the Bluetooth device and its host using HCI data packets.
The UART module supports H4 (4-wires) protocol with maximum baud rate of 4 Mbps for all fast
clock frequencies.
After power up the baud rate is set for 115.2 kbps, irrespective of fast clock frequency. The baud
rate can thereafter be changed with a vendor specific command. The CC256X responds with a
Command Complete Event (still at 115.2 kbps), after which the baud rate change takes place.
HCI hardware includes the following features:
• Receiver detection of break, idle, framing, FIFO overflow, and parity error conditions
• Transmitter underflow detection
• CTS/RTS hardware flow control
The interface includes four signals: TXD, RXD, CTS, and RTS. Flow control between the host
and the CC256X is byte-wise by hardware.
Flow control is obtained by the following:
When the UART RX buffer of the CC256X passes the “flow control” threshold, it will set the
UART_RTS signal high to stop transmission from the host.
When the UART_CTS signal is set high, the CC256X will stop its transmission on the interface.
In case HCI_CTS is set high in the middle of transmitting a byte, the CC256X will finish
transmitting the byte and stop the transmission.
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12 AUDIO/VOICE CODEC INTERFACE
The codec interface is a fully-dedicated programmable serial port that provides the logic to
interface to several kinds of PCM or I2S codec’s. PAN13XX supports all voice coding schemes
required by Bluetooth specification – Log PCM (A-Law or μ-Law) and Linear (CVSD). In addition, module
also supports transparent scheme:
• Two voice channels
• Master / slave modes
• µ-Law, A-Law, Linear, Transparent coding schemes
• Long and short frames
• Different data sizes, order, and positions.
• High rate PCM interface for EDR
• Enlarged interface options to support a wider variety of codecs
• PCM bus sharing
12.1 PCM HARDWARE INTERFACE
The PCM interface is one implementation of the codec interface. It contains the following four
lines:
• Clock – configurable direction (input or output)
• Frame Sync – configurable direction (input or output)
• Data In – Input
• Data Out – Output/3-state
The Bluetooth device can be either the master of the interface where it generates the clock and
the frame-sync signals, or slave where it receives these two signals. The PCM interface is fully
configured by a vendor specific command.
For slave mode, clock input frequencies of up to 16 MHz are supported. At clock rates above 12
MHz, the maximum data burst size is 32 bits. For master mode, the CC256X can generate any
clock frequency between 64 kHz and 6 MHz.
When the I2S bus is used in an application, Panasonic recommends adding a low pass filter
(series resistor and capacitor to GND) to the bus for better noise suppression. Connecting the
host μController/DSP directly with the module’s I2S interface is not recommended.
The suggested low pass filter component values are:
470pf
120 ohms
12.2 DATA FORMAT
The data format is fully configurable:
• The data length can be from 8 to 320 bits, in 1-bit increments, when working with two channels,
or up to 640 bits when using 1 channel. The Data length can be set independently for each
channel.
• The data position within a frame is also configurable in with 1 clock (bit) resolution and can be
set independently (relative to the edge of the Frame Sync signal) for each channel.
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• The Data_In and Data_Out bit order can be configured independently. For example; Data_In
can start with the MSB while Data_Out starts with LSB. Each channel is separately configurable.
The inverse bit order (that is, LSB first) is supported only for sample sizes up to 24 bits.
• It is not necessary for the data in and data out size to be the same length.
• The Data_Out line is configured to ‘high-Z’ output between data words. Data_Out can also be
set for permanent high-Z, irrespective of data out. This allows the CC256X to be a bus slave in a
multi-slave PCM environment. At power up, Data Out is configured as high-Z.
12.3 FRAME IDLE PERIOD
The codec interface has the capability for frame idle periods, where the PCM clock can “take a
break” and become ‘0’ at the end of the PCM frame, after all data has been transferred.
The CC256X supports frame idle periods both as master and slave of the PCM bus.
When CC256X is the master of the interface, the frame idle period is configurable. There are two
configurable parameters:
• Clk_Idle_Start – Indicates the number of PCM clock cycles from the beginning of the frame until
the beginning of the idle period. After Clk_Idle_Start clock cycles, the clock will become ‘0’.
• Clk_Idle_End – Indicates the time from the beginning of the frame till the end of the idle period.
This time is given in multiples of PCM clock periods.
The delta between Clk_Idle_Start and Clk_Idle_End is the clock idle period.
For example, for PCM clock rate = 1 MHz, frame sync period = 10 kHz, Clk_Idle_Start = 60,
Clk_Idle_End = 90.
Between each two frame syncs there are 70 clock cycles (instead of 100). The clock idle period
starts 60 clock cycles after the beginning of the frame, and lasts 90 – 60 = 30 clock cycles. This
means that the idle period ends 100 – 90 = 10 clock cycles before the end of the frame. The data
transmission must end prior to the beginning of the idle period.
12.4 CLOCK-EDGE OPERATION
The codec interface of the CC256X can work on the rising or the falling edge of the clock. It also
has the ability to sample the frame sync and the data at inversed polarity.
This is the operation of a falling-edge-clock type of codec. The codec is the master of the PCM
bus. The frame sync signal is updated (by the codec) on the falling clock edge and therefore
shall be sampled (by the CC256X) on the next rising clock. The data from the codec is sampled
(by the CC256X) on the clock falling edge.
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12.5 TWO-CHANNEL PCM BUS EXAMPLE
In below figure, a 2-channel PCM bus is shown where the two channels have different word
sizes and arbitrary positions in the bus frame. (FT stands for Frame Timer)
12.6 AUDIO ENCODING
The CC256X codec interface can use one of four audio-coding patterns:
• A-Law (8-bit)
• µ-Law (8-bit)
• Linear (8- or 16-bit)
12.7 IMPROVED ALGORITHM FOR LOST PACKETS
The CC256X features an improved algorithm for improving voice quality when received voice
data packets are lost. There are two options:
• Repeat the last sample – possible only for sample sizes up to 24 bits. For sample sizes >24
bits, the last byte is repeated.
• Repeat a configurable sample of 8 to 24 bits (depends on the real sample size), in order to
simulate silence (or anything else) in the PCM bus. The configured sample will be written in a
specific register for each channel.
The choice between those two options is configurable separately for each channel.
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12.8 BLUETOOTH/PCM CLOCK MISMATCH HANDLING
In Bluetooth RX, the CC256X receives RF voice packets and writes these to the codec I/F. If the
CC256X receives data faster than the codec I/F output allows, an overflow will occur. In this
case, the Bluetooth has two possible behaviour modes: ‘allow overflow’ and ‘don’t allow
overflow’.
• If overflow is allowed, the Bluetooth will continue receiving data and will overwrite any data not
yet sent to the codec.
• If overflow is not allowed, RF voice packets received when buffer is full will be discarded.
12.9 BLUETOOTH INTER-IC SOUND (I2S)
The CC256X can be configured as an Inter-IC Sound (I2S) serial interface to an I2S codec
device. In this mode, the CC256X audio codec interface is configured as a bi-directional, full-
duplex interface, with two time slots per frame: Time slot 0 is used for the left channel audio data
and time slot 1 for the right channel audio data. Each time slot is configurable up to 40 serial
clock cycles in length and the frame is configurable up to 80 serial clock cycles in length.
Do not connect the microcontroller/DSP directly to the module’s PCM interface, a simple RC low
pass filter is recommended to improve noise suppression.
12.10 CURRENT CONSUMPTION FOR DIFFERENT BLUETOOTH SCENARIOS
The following table gives average current consumption for different Bluetooth scenarios.
Conditions: VDD_IN = 3.6 V, 25°C, 26-MHz fast clock, nominal unit, 4 dBm output power.
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13 BLUETOOTH RF PERFORMANCE
No
Characteristics
Typ
BT Spec
Max
BT Spec
Min
Class1
Class1
1
Average Power Hopping DH5 [dBm] 22, 23
7.2
20
4
2
Average Power: Ch0 [dBm] 22, 23
7.5
20
4
3
Peak Power: Ch0 [dBm] 22, 23
7.7
23
4
Average Power: Ch39 [dBm] 22, 23
7.0
20
4
5
Peak Power: Ch39 [dBm] 22, 23
7.2
23
6
Average Power: Ch78 [dBm] 22, 23
6.7
20
4
7
Peak Power: Ch78 [dBm] 22, 23
7.0
23
8
Max. Frequency Tolerance: Ch0 [kHz]
-2.6
75
-75
9
Max. Frequency Tolerance: Ch39 [kHz]
-2.2
75
-75
10
Max. Frequency Tolerance: Ch78 [kHz]
-2.1
75
-75
11
Max. Drift: Ch0_DH1 [kHz]
3.6
25
-25
12
Max. Drift: Ch0_DH3 [kHz]
3.7
40
-40
13
Max. Drift: Ch0_DH5 [kHz]
4.0
40
-40
14
Max. Drift Rate: Ch0_DH1 [kHz]
-2.6
20
-20
15
Max. Drift Rate: Ch0_DH3 [kHz]
-3.2
20
-20
16
Max. Drift Rate: Ch0_DH5 [kHz]
-3.3
20
-20
17
Max. Drift: Ch39_DH1 [kHz]
4.0
25
-25
18
Max. Drift: Ch39_DH3 [kHz]
4.3
40
-40
19
Max. Drift: Ch39_DH5 [kHz]
4.3
40
-40
20
Max. Drift Rate: Ch39_DH1 [kHz]
-3.1
20
-20
21
Max. Drift Rate: Ch39_DH3 [kHz]
-3.6
20
-20
22
Max. Drift Rate: Ch39_DH5 [kHz]
-3.7
20
-20
23
Max. Drift: Ch78_DH1 [kHz]
4.1
25
-25
24
Max. Drift: Ch78_DH3 [kHz]
4.5
40
-40
25
Max. Drift: Ch78_DH5 [kHz]
4.4
40
-40
26
Max. Drift Rate: Ch78_DH1 [kHz]
-3.4
20
-20
27
Max. Drift Rate: Ch78_DH3 [kHz]
-3.9
20
-20
28
Max. Drift Rate: Ch78_DH5 [kHz]
-4.1
20
-20
29
Delta F1 Avg: Ch0 [kHz]
159.5
175
140
30
Delta F2 Max.: Ch0 [%]
100.0
99.9
31
Delta F2 Avg/Delta F1 Avg: Ch0
0.9
0.8
32
Delta F1 Avg: Ch39 [kHz]
159.8
175
140
33
Delta F2 Max.: Ch39 [%]
100.0
99.9
34
Delta F2 Avg/Delta F1 Avg: Ch39
0.9
0.8
35
Delta F1 Avg: Ch78 [kHz]
159.1
175
140
36
Delta F2 Max.: Ch78 [%]
100.0
99.9
37
Delta F2 Avg/Delta F1 Avg: Ch78
0.9
0.8
45
Sensitivity
-93.0
-81
46
f(H)-f(L): Ch0 [kHz]
918.4
1000
47
f(H)-f(L): Ch39 [kHz]
918.3
1000
48
f(H)-f(L): Ch78 [kHz]
918.2
1000
49
ACPower -3: Ch3 [dBm]
-51.5
-40
50
ACPower -2: Ch3 [dBm]
-50.4
-40
CLASSIFICATION
PRODUCT SPECIFICATION
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No
Characteristics
Typ
BT Spec
Max
BT Spec
Min
Class1
Class1
51
ACPower -1: Ch3 [dBm]
-18.5
52
ACPower Center: Ch3 [dBm]
8.1
20
4
53
ACPower +1: Ch3 [dBm]
-19.2
54
ACPower +2: Ch3 [dBm]
-50.7
-40
55
ACPower +3: Ch3 [dBm]
-53.3
-40
56
ACPower -3: Ch39 [dBm]
-51.6
-40
57
ACPower -2: Ch39 [dBm]
-50.7
-40
58
ACPower -1: Ch39 [dBm]
-19.0
59
ACPower Center: Ch39 [dBm]
7.7
20
4
60
ACPower +1: Ch39 [dBm]
-19.7
61
ACPower +2: Ch39 [dBm]
-50.9
-40
62
ACPower +3: Ch39 [dBm]
-53.2
-40
63
ACPower -3: Ch75 [dBm]
-51.7
-40
64
ACPower -2: Ch75 [dBm]
-50.7
-40
65
ACPower -1: Ch75 [dBm]
-19.2
66
ACPower Center: Ch75 [dBm]
7.5
20
4
67
ACPower +1: Ch75 [dBm]
-20.0
68
ACPower +2: Ch75 [dBm]
-51.0
-40
69
ACPower +3: Ch75 [dBm]
-53.4
-40
70
omega i 2-DH5: Ch0 [kHz]
-4.7
75
-75
71
omega o + omega i 2-DH5: Ch0 [kHz]
-6.0
75
-75
72
omega o 2-DH5: Ch0 [kHz]
-1.5
10
-10
73
DEVM RMS 2-DH5: Ch0 [%]
0.0
0.2
74
DEVM Peak 2-DH5: Ch0 [%]
0.1
0.35
75
DEVM 99% 2-DH5: Ch0 [%]
100.0
99
76
omega i 3-DH5: Ch0 [kHz]
-3.7
75
-75
77
omega o + omega i 3-DH5: Ch0 [kHz]
-5.8
75
-75
78
omega o 3-DH5: Ch0 [kHz]
-2.6
10
-10
79
DEVM RMS 3-DH5: Ch0 [%]
0.0
0.13
80
DEVM Peak 3-DH5: Ch0 [%]
0.1
0.25
81
DEVM 99% 3-DH5: Ch0 [%]
100.0
99
82
omega i 2-DH5: Ch39 [kHz]
-4.8
75
-75
83
omega o + omega i 2-DH5: Ch39 [kHz]
-6.1
75
-75
84
omega o 2-DH5: Ch39 [kHz]
-1.4
10
-10
85
DEVM RMS 2-DH5: Ch39 [%]
0.0
0.2
86
DEVM Peak 2-DH5: Ch39 [%]
0.1
0.35
87
DEVM 99% 2-DH5: Ch39 [%]
100.0
99
88
omega i 3-DH5: Ch39 [kHz]
-3.8
75
-75
89
omega o + omega i 3-DH5: Ch39 [kHz]
-5.9
75
-75
90
omega o 3-DH5: Ch39 [kHz]
-2.6
10
-10
91
DEVM RMS 3-DH5: Ch39 [%]
0.0
0.13
92
DEVM Peak 3-DH5: Ch39 [%]
0.1
0.25
93
DEVM 99% 3-DH5: Ch39 [%]
100.0
99
94
omega i 2-DH5: Ch78 [kHz]
-4.9
75
-75
95
omega o + omega i 2-DH5: Ch78 [kHz]
-6.2
75
-75
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No
Characteristics
Typ
BT Spec
Max
BT Spec
Min
Class1
Class1
96
omega o 2-DH5: Ch78 [kHz]
-1.4
10
-10
97
DEVM RMS 2-DH5: Ch78 [%]
0.0
0.2
98
DEVM Peak 2-DH5: Ch78 [%]
0.1
0.35
99
DEVM 99% 2-DH5: Ch78 [%]
100.0
99
100
omega i 3-DH5: Ch78 [kHz]
-3.8
75
-75
101
omega o + omega i 3-DH5: Ch78 [kHz]
-6.0
75
-75
102
omega o 3-DH5: Ch78 [kHz]
-2.7
10
-10
103
DEVM RMS 3-DH5: Ch78 [%]
0.0
0.13
104
DEVM Peak 3-DH5: Ch78 [%]
0.1
0.25
105
DEVM 99% 3-DH5: Ch78 [%]
100.0
99
No
Characteristics
Condition
Min
Typ
Max
BT Spec
Unit
1
Operation frequency range
2402
2480
MHz
2
Channel spacing
1
MHz
3
Input impedance
50
4
Sensitivity, Dirty Tx on
GFSK, BER = 0.1%
-93.0
-70
dBm
Pi/4-DQPSK, BER = 0.01%
-92.5
-70
8DPSK, BER = 0.01%
-85.5
-70
No
Characteristics
Condition
Typ
Max
Unit
1
Tx and Rx out-of-band emissions
Output signal = 7dBm
30 kHz to 1 GHz 21, 22, 23
-30
dBm
1 to 12.75 GHz 21, 22, 23
-30
2
2nd harmonic
at 7dBm output power 21, 22, 23
-30
dBm
3
3rd harmonic
at 7dBm output power 21, 22, 23
-30
dBm
The values are measured conducted. Better suppression of the spurious emissions with an
antenna can be expected as, antenna frequently have band pass filter characteristics.
21
Includes effects of frequency hopping
22
Average according FCC, IC and ETSI requirements. Above +7dBm output power (refer also to 23) the
customer has to verify the final product against national regulations.
23
+7dBm related to power register value 18, according to TI service pack 2.30
CLASSIFICATION
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14 SOLDERING TEMPERATURE-TIME PROFILE (FOR REFLOW SOLDERING)
14.1 FOR LEADFREE SOLDER
Our used temp. profile
for reflow soldering
Temp.[°C]
Time [s]
230°C -250°C max.
220°C
150°C – 190°C
90 30s
30 +20/-10s
Reflow permissible cycle: 2
Opposite side reflow is prohibited due to module weight.
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15 MODULE DIMENSION
15.1 MODULE DIMENSIONS PAN131X WITHOUT ANTENNA
No.
Item
Dimension
Tolerance
Remark
1
Width
6.50
0.20
2
Lenght
9.00
0.20
3
Height
1.80
0.20
With case
15.1.1 PAN131X Module Drawing
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15.2 MODULE DIMENSIONS PAN132X WITH ANTENNA
No.
Item
Dimension
Tolerance
Remark
1
Width
9.50
0.20
2
Lenght
9.00
0.20
3
Height
1.80
0.20
With case
15.2.1 PAN132X Module Drawing
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16 FOOTPRINT OF THE MODULE
16.1 FOOTPRINT PAN131X WITHOUT ANTENNA
All dimensions are in millimeters.
The outer dimensions have a tolerance of 0.2mm.
The layout is symetric to center. The inner pins (2,4,6,9,11,14,16,18,21,23) are shifted to the
center by 1mm.
0.90
1.70
6,50
0.90
1.80
9,00
17 15 13
14 12
11
9
8
7
6
53
2
1
23
24
21
18
19
20
22 10
4
16
Pad = 24 x 0.60mm x 0.60mm
Top View
1.80
2.70
2.95
3.95
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16.2 FOOTPRINT PAN132X WITH ANTENNA
All dimensions are in millimeters.
The outer dimensions have a tolerance of 0.2mm.
The layout is symetric to center. The inner pins (2,4,6,9,11,14,16,18,21,23) are shifted to the
center by 1mm.
2.70
0.90
1.70
9.50
0.90
1.80
9,00
17 15 13
14 12
11
9
8
7
6
53
2
1
23
24
21
18
19
20
22 10
4
16
Pad = 28 x 0.60mm x 0.60mm
Top View
1.80
2.95
3.95
A
C
B
D
1.80
2.70
0.55
1.00 1.80
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17 LABELING DRAWING
The above pictures show the laser marking on the top case, this is only an example.
1: Brand Name
2: Hardware Version
3: Order Number
4: 2D Data Matrix Code
5: KCC Logo
6: MIC Logo/ID
7: Lot code
8: PIN1 Marking
9: FCC ID
18 MECHANICAL REQUIREMENTS
No.
Item
Limit
Condition
1
Solderability
More than 75% of the soldering area shall be
coated by solder
Reflow soldering with
recommendable temperature profile
2
Resistance to soldering
heat
It shall be satisfied electrical requirements and not
be mechanical damage
See Chapter 14.1
CLASSIFICATION
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19 RECOMMENDED FOOT PATTERN
19.1 RECOMMENDED FOOT PATTERN PAN131X WITHOUT ANTENNA
Dimensions in mm.
17 15 13
14 12
11
9
8
7
6
53
2
1
23
24
21
18
19
20
22 10
4
16
Pad = 24 x 0.60mm x 0.60mm
Top View
9,00
6,50
6,00
8,50
The land pattern dimensions above are meant to serve only as a guide. This information is
provided without any legal liability.
For the solder paste screen, use as a first guideline the same foot print as shown in the figure
above. Solder paste screen cutouts (with slightly different dimensions) might be optimum
depending on your soldering process. For example, the solder paste screen thickness chosen
might have an effect. The solder screen thickness depends on your production standard 120µm
to 150µm is recommended.
IMPORTANT:
Although the bottom side of PAN131X is fully coated, no copper such as through hole vias,
planes or tracks on the board component layer should be located below the PAN131X to avoid
creating a short. In cases where a track or through hole via has to be located under the module,
it must be kept away from PAN131X bottom pads. The PAN131X multilayer pcb contains an
inner RF shielding plane, therefore no pcb shielding plane below the module is needed.
When using an onboard ceramic antenna, place the antenna on the edge of your carrier board (if
allowable).
If you have any questions on these points, contact your local Panasonic representative.
Schematics and layouts may be sent to wireless@eu.panasonic.com for final review.
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19.2 RECOMMENDED FOOT PATTERN PAN132X WITH ANTENNA
Dimensions in mm.
The land pattern dimensions above are meant to serve only as a guide.
For the solder paste screen, use as a first guideline the same foot print as shown in the Figure
above. Solder paste screen cutouts (with slightly different dimensions) might be optimum
depending on your soldering process. For example, the solder paste screen thickness chosen
might have an effect. The solder screen thickness depends on your production standard 120μm
to 150μm is recommended.
IMPORTANT: In cases where a track or through hole via has to be located under the module, it
must be kept away from PAN132X bottom pads. The PAN132X multilayer pcb contains an inner
RF shielding plane, therefore no pcb shielding plane below the module is needed.
If you have any questions on these points, contact your local Panasonic representative.
Schematics and layouts may be sent to wireless@eu.panasonic.com for final review.
17 15 13
14
11
9
8
6
53
2
21
22 10
4
16
Pad = 28 x 0.60mm x 0.60mm
Top View
9.00 0,55
1.80
9.50
0,60
20
23
1
24
19
18 12
7
A
C
B
D
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20 RADIATION PATTERN
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21 LAYOUT RECOMMENDATIONS WITH ANTENNA (PAN132X)
CLASSIFICATION
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22 BLUETOOTH LE (LOW ENERGY) PAN1316/26
22.1 NETWORK TOPOLOGY
Bluetooth Low Energy is designed to reduce power consumption. It can be put into a sleep mode
and is only activated for event activities such as sending files to a gateway, PC or mobile phone.
Furthermore the maximum power consumption is set to less than 15 mA and the average power
consumption is about 1 uA. The benefits of low energy consumption are short messages and
establishing very fast connections (few ms). Using these techniques, energy consumption is
reduced to a tenth of a Classic Bluetooth unit. Thus, a small coin cell – such as a CR2032 – is
capable of powering a device for up to 10 years of operation.
To be backwards compatible with Classic Bluetooth and to be able to offer an affordable solution for
very inexpensive devices, Panasonic Low Energy Bluetooth modules are offered in two versions:
Dual-mode: Bluetooth Low Energy technology combined with Classic Bluetooth functionality on a
single module. Dual mode devices act as gateways between these two technologies.
Single Mode: Bluetooth Low Energy technology to optimize power consumption, which is particularly
useful for products powered by small batteries. These modules have embedded controllers allowing
the module to operate autonomously in low cost applications that lack intelligence.
22.2 MODULE FEATURES
Fully compliant with Bluetooth 4.0:
Optimized for proximity and sports use
Supports up to 10 simultaneous connections
Multiple sniff instances are tightly coupled to minimize power consumption
Independent buffering allows a large number of multiple connections without affecting
BR/EDR performance
Includes built-in coexistence and prioritization handling for BR/EDR and LE
22.3 CURRENT CONSUMPTION FOR DIFFERENT LE SCENARIOS
Conditions: VDD_IN = 3.6 V, 25°C, 26-MHz fast clock, nominal unit, 10 dBm output power
Mode
Description
Average Current
Unit
Advertising, non-connectable
Advertising in all 3 channels
1.28msec advertising interval
15Bytes advertise Data
104
µA
Advertising, discoverable
Advertising in all 3 channels
1.28msec advertising interval
15Bytes advertise Data
121
µA
Scanning
Listening to a single frequency per window
1.28msec scan interval
11.25msec scan window
302
µA
Connected
(master role)
500msec connection interval
0msec Slave connection latency
Empty Tx/Rx LL packets
169
µA
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23 ANT PAN1317/27
ANT+ (sometimes ANT + or ANT Plus) is an interoperability function that can be added to the
base ANT protocol (a proprietary wireless sensor network technology).
23.1 NETWORK TOPOLOGY
ANT™ is a wireless sensor network protocol operating in the 2.4 GHz spectrum. Designed for ultra-
low power, ease of use, efficiency and scalability, ANT supports peer-to-peer, star, tree and fixed
mesh topologies. It provides reliable data communications, flexible and adaptive network operation
and cross-talk immunity. The ANT protocol stack is compact, requiring minimal microcontroller
resources to reduce system costs, lighten the computational burden and improve efficiency. Low-
level security is implemented to allow user-defined network security.
PAN1317/1327 provides the first wireless, single-chip solution with dual-mode ANT and Bluetooth
connectivity with inclusion of TI’s CC2564 device. This solution wirelessly connects 13 million ANT-
based devices to the more than 3 billion Bluetooth endpoint devices used by people every day,
creating new market opportunities for companies building ANT products and Bluetooth products
alike. CC2564 requires 80% less board area than a design with two single-mode solutions (one
ANT+, one Bluetooth) and increases the wireless transmission range up to two times the distance of
a single-mode ANT+ solution.
23.2 MODULE FEATURES
Fully compliant with ANT protocol:
• ANT solution optimized for fitness, health and consumers use cases
• Supports up to eight simultaneous connections, various network topologies and high-resolution
proximity pairing
• Includes built-in coexistence and prioritization handling for BR/EDR and ANT
Features
Benefits
Dual-mode ANT+ and Bluetooth (Bluetooth v2.1 +
EDR) on a single chip
- Requires 80% less board area than any dual module or device
design
- Reduces costs associated with incorporating two wireless
technologies
Fully validated optimized single antenna solution
- Enables simultaneous operation of ANT+ and Bluetooth without
the need for two devices or modules
- Includes built-in coexistence
Best-in-class Bluetooth and ANT RF performance:
- +10 dBm Tx power with transmit power control
- -93 dBm sensitivity
- Delivers twice the distance between the aggregator and ANT
sensor device than competitive single-mode ANT solutions
- Enables a robust and high-throughput connection with extended
range
Support for:
- ANT+ ultra low power (master and slave devices)
- Bluetooth power saving modes (park, sniff, hold)
- Bluetooth ultra low power modes (deep sleep,
power down)
- Improves battery life and power efficiency of the finished product
Turnkey solution:
- Ease of integration into system allows quick time to market
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- Fully integrated module
- Complete development kit with software and
documentation
- TI MSP430 hardware and software platform
integration (optional)
- Reduces costs and time associated with certification
23.3 ANT CURRENT CONSUMPTION
Mode
Description
Average Current
Unit
Rx message mode
250msec interval
380
µA
Rx message mode
500msec interval
205
µA
Rx message mode
1000msec interval
118
µA
24 TRIPLE MODE (BR/EDR + BLUETOOTH LOW ENERGY OR ANT) PAN1323
The PAN1323 has been engineered to give designers the flexibility to implement Bluetooth
Classic (BR/EDR), Bluetooth Low Energy or ANT into an application using a single module,
reducing cost and footprint area. Refer to the paragraphs above for complete descriptions on
each of the three protocols. The module is fully hardware compatible with the PAN1315, 16, 17,
25, 26 and 27. A highly efficent single RF block serves all three protocols. Protocols access the
RF block using time division multiplexing. The application layer determines the priority and timing
of the RF block. Customers interested in this unique module are encouraged to contact
StoneStreetOne for a Bluetooth SIG certified stack. Note ANT and BLE can not be used
simultaniously.
24.1 TRIPLE MODE CURRENT CONSUMPTION
The current consumption of the PAN1323 is a function of the protocol that the module is running at
any point in time. Refer to the paragraphs above for details on current consumption for each of the
three protocols or software vendor.
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25 DEVELOPMENT OF APPLICATIONS
For software versions visit the following links:
www.panasonic.com/rfmodules
http://processors.wiki.ti.com/index.php/CC256x_Forum_Guidelines_and_FAQs
25.1 TOOLS TO BE NEEDED
PAN1323ETU
In addition you need the software development environment, e.g. IAR Embedded Workbench,
refer to:
http://processors.wiki.ti.com/index.php/CC256x_Bluetooth
http://processors.wiki.ti.com/index.php/CC256x_Forum_Guidelines_and_FAQs
Evaluation kits and modules are available through Panasonic’s network of authorized
distributors. For any additional information, please visit www.panasonic.com/rfmodules.
Tool
Source
TI – MSP-EXP430F5438 – Experimenter Board
MSP-EXP430F5438
TI – MSP-FET430UIF430 – Debugging Interface
MSP-FET430UIF430
PAN1323EMK – Bluetooth Evaluation Module Kit for MSP430
TI PAN1323EMK
Panasonic PAN1323ETU
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26 RELIABILITY TESTS
The measurement should be done after being exposed to room temperature and humidity for 1
hour.
No.
Item
Limit
Condition
1
Vibration test
Electrical parameter should be in
specification
a) Freq.:10~50Hz,Amplitude:1.5mm
a) 20min. / cycle,1hrs. each of XYZ axis
b) Freq.:30~100Hz, 6G
b) 20min. / cycle,1hrs. each of XYZ axis
2
Shock test
the same as above
Dropped onto hard wood from height of 50cm for 3 times
3
Heat cycle test
the same as above
-40°C for 30min. and +85°C for 30min.;
each temperature 300 cycles
4
Moisture test
the same as above
+60°C, 90% RH, 300h
5
Low temp. test
the same as above
-40°C, 300h
6
High temp. test
the same as above
+85°C, 300h
CLASSIFICATION
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27 CAUTIONS
Failure to follow the guidelines set forth in this document may result in degrading of the product’s
functions and damage to the product.
27.1 DESIGN NOTES
(1) Follow the conditions written in this specification, especially the control signals of this
module.
(2) The supply voltage has to be free of AC ripple voltage (for example from a battery or
a low noise regulator output). For noisy supply voltages, provide a decoupling circuit
(for example a ferrite in series connection and a bypass capacitor to ground of at
least 47uF directly at the module).
(3) This product should not be mechanically stressed when installed.
(4) Keep this product away from heat. Heat is the major cause of decreasing the life of
these products.
(5) Avoid assembly and use of the target equipment in conditions where the products’
temperature may exceed the maximum tolerance.
(6) The supply voltage should not be exceedingly high or reversed. It should not carry
noise and/or spikes.
(7) Keep this product away from other high frequency circuits.
27.2 INSTALLATION NOTES
(1) Reflow soldering is possible twice based on the conditions in Chapter 15.
Set up the temperature at the soldering portion of this product according to this
reflow profile.
(2) Carefully position the products so that their heat will not burn into printed circuit
boards or affect the other components that are susceptible to heat.
(3) Carefully locate these products so that their temperatures will not increase due to the
effects of heat generated by neighboring components.
(4) If a vinyl-covered wire comes into contact with the products, then the cover will melt
and generate toxic gas, damaging the insulation. Never allow contact between the
cover and these products to occur.
(5) This product should not be mechanically stressed or vibrated when reflowed.
(6) To repair a board by hand soldering, keep the conditions of this chapter.
(7) Do not wash this product.
(8) Refer to the recommended pattern when designing a board.
(9) Pressing on parts of the metal cover or fastening objects to the metal will cause
damage to the unit.
27.3 USAGE CONDITIONS NOTES
(1) Take measures to protect the unit against static electricity.
If pulses or other transient loads (a large load applied in a short time) are applied to
the products, check and evaluate their operation befor assembly on the final
products.
(2) Do not use dropped pr odu c ts.
(3) Do not touch, damage or soil the pins.
CLASSIFICATION
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REV.
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(4) Follow the recommended condition ratings about the power supply applied to this
product.
(5) Electrode peeling strength: Do not add pressure of more than 4.9N when soldered on
PCB.
(6) Pressing on parts of the metal cover or fastening objects to the metal cover will
cause damage.
(7) These products are intended for general purpose and standard use in general
electronic equipment, such as home appliances, office equipment, information and
communication equipment.
27.4 STORAGE NOTES
(1) The module should not be stressed mechanically during storage.
(2) Do not store these products in the following conditions or the performance
characteristics of the product, such as RF performance will be adversely affected:
Storage in salty air or in an environment with a high concentration of corrosive gas,
such as Cl2, H2S, NH3, SO2, or NOX
Storage in direct sunlight
Storage in an environment where the temperature may be outside the range of 5°C to
35°C range, or where the humidity may be outside the 45 to 85% range.
Storage of the products for more than one year after the date of delivery Storage
period: check the adhesive strength of the embossed tape and soldering after 6
months of storage.
(3) Keep this product away from water, poisonous gas and corrosive gas.
(4) This product should not be stressed or shocked when transported.
(5) Follow the specification when stacking packed crates (max. 10).
27.5 SAFETY CAUTIONS
These specifications are intended to preserve the quality assurance of products and individual
components.
Before use, check and evaluate the operation when mounted on your products. Abide by these
specifications, without deviation when using the products. These products may short-circuit. If
electrical shocks, smoke, fire, and/or accidents involving human life are anticipated when a short
circuit occurs, then provide the following failsafe functions, as a minimum.
(1) Ensure the safety of the whole system by installing a protection circuit and a
protection device.
(2) Ensure the safety of the whole system by installing a redundant circuit or another
system to prevent a single fault causing an unsafe status.
CLASSIFICATION
PRODUCT SPECIFICATION
No.
DS-13xx-2400-102
REV.
5.0
SUBJECT
CLASS 1 or 2 BLUETOOTH MODULE
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27.6 OTHER CAUTIONS
(1) This specification sheet is copyrighted.
(2) Do not use the pr oducts f or other pur pos es than t hose listed.
(3) Be sure to provide an appropriate fail-safe function on your product to prevent an
additional damage that may be caused by the abnormal function or the failure of the
product.
(4) This product has been manufactured without any ozone chemical controlled under
the Montreal Protocol.
(5) These products are not intended for other uses, other than under the special
conditions shown below. Before using these products under such special conditions,
check their performance and reliability under the said special conditions carefully to
determine whether or not they can be used in such a manner.
In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places where
liquid may splash.
In direct sunlight, outdoors, or in a dusty environment
In an environment where condensation occurs .
In an environment with a high concentration of harmful gas (e.g. salty air, HCl, Cl2,
SO2, H2S, NH3, and NOX)
(6) If an abnormal voltage is applied due to a problem occurring in other components or
circuits, replace these products with new products because they may not be able to
provide normal performance even if their electronic characteristics and appearances
appear satisfactory.
(7) When you have any question or uncertainty, contact Panasonic.
27.7 LIFE SUPPORT POLICY
This Panasonic product is not designed for use in life support appliances, devices, or systems
where malfunction can reasonably be expected to result in a significant personal injury to the
user, or as a critical component in any life support device or system whose failure to perform can
be reasonably expected to cause the failure of the life support device or system, or to affect its
safety or effectiveness. Panasonic customers using or selling these products for use in such
applications do so at their own risk and agree to fully indemnify Panasonic for any damages
resulting.
CLASSIFICATION
PRODUCT SPECIFICATION
No.
DS-13xx-2400-102
REV.
5.0
SUBJECT
CLASS 1 or 2 BLUETOOTH MODULE
PAGE
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28 PACKAGING
28.1 PACKAGING OF PAN131X WITHOUT ANTENNA
28.1.1 Tape Dimension
to centreline of pocket.
Cumulative tolerance of 10 sprocket
holes is ± 0.20 .
Measured from centreline of sprocket
hole to centreline of pocket.
(I)
(II)
(III)
(IV) Other material available.
ALL DIMENSIONS IN MILLIMETRES UNLESS OTHERWISE STATED.
W
F
P1
+/- 0.10
+/- 0.10
+/- 0.30
7.50
12.00
16.00
K1 2.00 +/- 0.10
Estimated max. length : 72 meter/22B3 reel
Forming format : Flatbed - 9
2.80
+/- 0.10
+/- 0.10
9.40
Bo
Ko
6.90
Ao+/- 0.10
Y
Y
X
X
SECTION
Y-Y
SCALE 3.5
: 1
SECTION
X-X
SCALE 3.5
: 1
28.1.2 Packing in Tape
trailer (empty)
1 x circumference /
hub
(min 160mm)
component
packed area
standard
1500pcs
leader (empty)
minimum 10 pitch Top cover tape more
than 1 x
circumference plus
100mm to avoid
fixing of tape end on
sealed modules.
Direction of unreeling (for customer)
PAN1315 01/01
ENW89809M5A
YYWWDLL
FCC ID: T7V1315 Machine
readable
2D-Barcode
PAN1315 01/01
ENW89809M5A
YYWWDLL
FCC ID: T7V1315 Machine
readable
2D-Barcode
Empty spaces in component packed area shall be less than two per reel and those spaces shall
not be consecutive.
Top cover tape shall not be found on reel holes and shall not stick out from reel.
Component direction
CLASSIFICATION
PRODUCT SPECIFICATION
No.
DS-13xx-2400-102
REV.
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SUBJECT
CLASS 1 or 2 BLUETOOTH MODULE
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28.1.3 Reel Dimension
PAN1315 01/01
ENW89809M5A
YYWWDLL
FCC ID: T7V1315 Machine
readable
2D-Barcode
Direction of
unreeling
(for customer)
Pin 1 Marking
(Top Side)
Pin 1 Marking
(Bottom Side)
Circle r = 0.5 mm
on solder resist
near Pin 1
A BD NW2
MAX MIN MIN ±1.0 MAX
13 +0.5 25.0 +2.0 24.4 +3.0
-0.2 -0.0 -0.5
*Latch (2PC)
All dimensions in millimeters unless otherwise stated
Assembly
Method
24mm
330.0
1.5
20.2
100.0
30.4
*Latch
TAPE SIZE
C
W1
W3
CLASSIFICATION
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REV.
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28.1.4 Label for Package
PAN1315
Customer Code ENW89818C2JF
105 mm
51 mm
(1T) Lot code [YYWWDLL] Example from above:
YY year printed 08
WW normal calendar week printed 01
D day printed 5 (Friday)
L line identifier, if more as one printed 1
L lot identifier per day printed 1
(1P) Customer Order Code, if any, otherwise company name will be printed
(2P) Panasonic Order Code refer to chapter 29 Ordering Information
(9D) Date code as [YYWW]
(Q) Quantity [XXXX], variable max. 1500
(HW/SW) Hardware /Software Release
28.1.5 Total Package
barcode
label
moisture-sensitive print
(already exist on barrier bag) barcode
label
desiccant 1) 2)
moisture indicator
barrier bag
sealed
inner carton box
size 340 x 340 x 41 mm³
1) quantity of desiccant according
to calculation
2) optional: desiccant placed into
the corner of the barrier bag
CLASSIFICATION
PRODUCT SPECIFICATION
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REV.
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CLASS 1 or 2 BLUETOOTH MODULE
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28.2 PACKAGING FOR PAN132X WITH ANTENNA
28.2.1 Tape Dimension
Measured from centreline of sprocket holeMeasured from centreline of sprocket hole
Cumulative tolerance of 10 sprocket
Measured from centreline of sprocket
to centreline of pocket.
holes is ± 0.20 .
hole to centreline of pocket.
(I)
(II)
(III)
(IV) Other material available.
ALL DIMENSIONS IN MILLIMETRES UNLESS OTHERWISE STATED.
W
F
P1
+/- 0.10
+/- 0.10
+/- 0.30
7.50
12.00
16.00
K1 2.00 +/- 0.10
2.80
+/- 0.10
+/- 0.10
9.40
Bo
Ko
9.90Ao +/- 0.10
Tooling code: Flatbed - 9
Estimated Max Length: 72m per 22B3
Y
Y
X
X
SECTION Y-
Y
SCALE 3.5 :
1
SECTION X-
X
SCALE 3.5 :
1
28.2.2 Packing in Tape
trailer (empty)
1 x circumference /hub
(min 160mm)
component
packed area
standard
1500pcs
leader (empty)
minimum 10 pitch Top cover tape more
than 1 x
circumference plus
100mm to avoid
fixing of tape end on
sealed modules.
Direction of unreeling (for customer)
All other packaging information is similar to Chapter 28.1
Pin1 Marking
CLASSIFICATION
PRODUCT SPECIFICATION
No.
DS-13xx-2400-102
REV.
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29 ORDERING INFORMATION
Model
Temp.
Part Number
TI-Device
Remark
PAN1315A
-20°C to +70°C
ENW89829C2JF
CC2560A
NR for new designs
PAN1315A
-40°C to +85°C
ENW89829C2KF
CC2560A
NR for new designs
PAN1315B
-40°C to +85°C
ENW89829C3KF
CC2560B
Recommended for new designs
PAN1316
-20°C to +70°C
ENW89823C2JF
CC2564
NR for new designs
PAN1316
-40°C to +85°C
ENW89823C2KF
CC2564
NR for new designs
PAN1316B
-40°C to +85°C
ENW89823C3KF
CC2564B
Recommended for new designs
PAN1317
-20°C to +70°C
ENW89827C2JF
CC2564
NR for new designs
PAN1317
-40°C to +85°C
ENW89827C2KF
CC2564
NR for new designs
PAN1323
-20°C to +70°C
ENW89842A2JF
CC2564
NR for new designs
PAN1323
-40°C to +85°C
ENW89842A2KF
CC2564
NR for new designs
PAN1325A
-20°C to +70°C
ENW89829A2JF
CC2560A
NR for new designs
PAN1325A
-40°C to +85°C
ENW89829A2KF
CC2560A
NR for new designs
PAN1325B
-40°C to +85°C
ENW89829A3KF
CC2560B
Recommended for new designs
PAN1326
-20°C to +70°C
ENW89823A2JF
CC2564
NR for new designs
PAN1326
-40°C to +85°C
ENW89823A2KF
CC2564
NR for new designs
PAN1326B
-40°C to +85°C
ENW89823A3KF
CC2564B
NR for new designs
PAN1326C
-40°C to +85°C
ENW89823A4KF
CC2564C
Recommended for new designs
PAN1327
-20°C to +70°C
ENW89827A2JF
CC2564
NR for new designs
PAN1327
-40°C to +85°C
ENW89827A2KF
CC2564
NR for new designs
NR: Not recommended
ETU: Easy to use development board
30 ROHS DECLARATION
The latest declaration of environmental compatibility (RoHS and REACH) for supplied products
can be found on the Panasonic website in the “Downloads” section of the respective product.
CLASSIFICATION
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No.
DS-13xx-2400-102
REV.
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SUBJECT
CLASS 1 or 2 BLUETOOTH MODULE
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31 REGULATORY INFORMATION
31.1 FCC FOR US
31.1.1 FCC Notice
The devices PAN13xx, for details refer to Chapter 28 in this document, including the
antennas, which are listed in Chapter 34.1.5 of this data sheet, complies with Part 15 of the
FCC Rules. The device meets the requirements for modular transmitter approval as detailed
in FCC public Notice DA00-1407.transmitter. Operation is subject to the following two
conditions: (1) This device may not cause harmful interference, and (2) This device must
accept any interference received, including interference that may cause undesired operation.
31.1.2 Caution
The FCC requires the user to be notified that any changes or modifications made to this device
that are not expressly approved by Panasonic Industrial Devices Europe GmbH may void the
user's authority to operate the equipment.
This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable
protection against harmful interference in a residential installation. This equipment generates,
uses and can radiate radio frequency energy and, if not installed and used in accordance with
the instructions, may cause harmful interference to radio communications. However, there is no
guarantee that interference will not occur in a particular installation. If this equipment does cause
harmful interference to radio or television reception, which can be determined by turning the
equipment off and on, the user is encouraged to try to correct the interference by one or more of
the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver
is connected.
Consult the dealer or an experienced radio/TV technician for help
31.1.3 Labeling Requirements
The Original Equipment Manufacturer (OEM) must ensure that FCC labelling requirements are
met. This includes a clearly visible label on the outside of the OEM enclosure specifying the
appropriate Panasonic FCC identifier for this product as well as the FCC Notice above. The FCC
identifiers are:
FCC ID: T7V1315 for PAN1315 and PAN1325
FCC ID: T7V1316 for PAN1316, PAN1317, PAN1326 and PAN1327
These FCC identifiers are valid for all PAN13xx modules, for details, see the Chapter 29.
Ordering Information. In any case the end product must be labelled exterior with
"Contains FCC ID: T7V1315" (PAN1315, PAN1325) or
"Contains FCC ID: T7V1316" (PAN1316, PAN1317, PAN1326 and PAN1327).
31.1.4 Antenna Warning
For the related part number of PAN13xx refer to Chapter 29. Ordering Information.
These devices are tested with a standard SMA connector and with the antennas listed below.
When integrated in the OEMs product, these fixed antennas require installation preventing end-
users from replacing them with non-approved antennas. Any antenna not in the following tables
must be tested to comply with FCC Section 15.203 for unique antenna connectors and Section
CLASSIFICATION
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REV.
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15.247 for emissions. The FCC identifier for this device with the antenna listed below are the
same (FCC ID: T7V1315 or T7V1316).
31.1.5 Approved Antenna List (PAN1315, PAN1325)
Note: We are able to qualify your antenna and will add to this list as that process is completed.
Item
Part Number
Manufacturer
Frequency Band
Type
Gain (dBi)
1
2450AT43B100
Johanson Technologies
2.4GHz
Chip-Antenna
+1.3
2
LDA212G3110K
Murata
2.4GHz
Chip-Antenna
+0.9
3
4788930245
Würth Elektronik
2.4GHz
Chip-Antenna
+0.5
31.1.6 Approved Antenna List (PAN1316, PAN1317, PAN1326, PAN1327)
Note: We are able to qualify your antenna and will add to this list as that process is completed.
Item
Part Number
Manufacturer
Frequency Band
Type
Gain (dBi)
1
LDA212G3110K
Murata
2.4GHz
Chip-Antenna
+0.9
2
ANT2012
Yageo
2.4GHz
Chip-Antenna
+0.9
31.1.7 RF Exposure PAN13xx
To comply with FCC RF Exposure requirements, the Original Equipment Manufacturer (OEM)
must ensure that the approved antenna in the previous tables must be installed.
The preceding statement must be included as a CAUTION statement in manuals for products
operating with the approved antennas in the previous table to alert users on FCC RF Exposure
compliance.
Any notification to the end user of installation or removal instructions about the integrated radio
module is not allowed.
The radiated output power of PAN13xx with mounted ceramic antenna
(FCC ID: T7V1315 or T7V1316) is far below the FCC radio frequency exposure limits.
Nevertheless, the PAN13xx shall be used in such a manner that the potential for human contact
during normal operation is minimized.
End users may not be provided with the module installation instructions. OEM integrators and
end users must be provided with transmitter operating conditions for satisfying RF exposure
compliance.
CLASSIFICATION
PRODUCT SPECIFICATION
No.
DS-13xx-2400-102
REV.
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SUBJECT
CLASS 1 or 2 BLUETOOTH MODULE
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31.2 INDUSTRY CANADA CERTIFICATION
31.2.1 IC Notice
This device complies with Industry Canada RSS-210 (Rev.8). Operation is subject to the
following two conditions
1) this device may not cause interference, and
2) this device must accept any interference, including interference that may cause undesired
operation of the device.
PAN131x is licensed to meet the regulatory requirements of Industry Canada (IC), license:
IC: 216Q-1315 (PAN1315, PAN1325)
IC: 216Q-1316 (PAN1316, PAN1317, PAN1326, PAN1327)
Manufacturers of mobile, fixed or portable devices incorporating this module are advised to
clarify any regulatory questions and ensure compliance for SAR and/or RF exposure limits.
Users can obtain Canadian information on RF exposure and compliance from www.ic.gc.ca.
This device has been designed to operate with the antennas listed in Tables 31.1.5 and 31.1.6
above, having a maximum gain of 1.3 dBi (PAN13x6: 0.9dBi). Antennas not included in this list or
having a gain greater than 1.3 dBi (PAN13x6: 0.9dBi) are strictly prohibited for use with this
device. The required antenna impedance is 50 ohms. The antenna used for this transmitter must
not be co-located or operating in conjunction with any other antenna or transmitter. Due to the
model size the IC identifier is displayed in the installation instruction.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio
exempts de licence. L'exploitation est autorisée aux deux conditions suivantes :
(1) l'appareil ne doit pas produire de brouillage, et
(2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le
brouillage est susceptible d'en compromettre le fonctionnement.
PAN131x est garanti conforme aux dispositions règlementaires d’Industry Canada (IC), licences:
IC: 216Q-1315 (PAN1315, PAN1325)
IC: 216Q-1316 (PAN1316, PAN1317, PAN1326, PAN1327)
Il est recommandé aux fabricants d’appareils fixes, mobiles ou portables de consulter la
réglementation en vigueur et de vérifier la conformité de leurs produits relativement aux limites
d’exposition aux rayonnements radiofréquence ainsi qu’au débit d’absorption spécifique
maximum autorisé.
Des informations pour les utilisateurs sur la réglementation Canadienne concernant l’exposition
aux rayonnements RF sont disponibles sur le site www.ic.gc.ca.
Ce produit a été développé pour fonctionner spécifiquement avec les antennes listées dans le
tableau ci-dessus, présentant un gain maximum de 1.3dBi (PAN13x6:0.9dBi). Des antennes
autres que celles listées ici, ou présentant un gain supérieur à 1.3dBi (PAN13x6: 0.9dBi) ne
doivent en aucune circonstance être utilises en combinaison avec ce produit. L’impédance des
antennes compatibles est 50Ohm. L’antenne utilisée avec ce produit ne doit ni être située à
proximité d’une autre antenne ou d’un autre émetteur, ni être utilisée conjointement avec une
autre antenne ou un autre émetteur. En raison de la taille du produit, l’identifiant IC est fourni
dans le manuel d’installation.
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REV.
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31.2.2 Labeling Requirements
The Original Equipment Manufacturer (OEM) must ensure that IC labelling requirements are met.
This includes a clearly visible label on the outside of the OEM enclosure specifying the
appropriate Panasonic IC identifier for this product as well as the IC Notice above. The IC
identifiers are:
IC: 216Q-1315 (PAN1315, PAN1325)
IC: 216Q-1316 (PAN1316, PAN1317, PAN1326, PAN1327)
These IC identifiers are valid for all PAN13xx modules, for details, see the Chapter 29. Ordering
Information. In any case the end product must be labelled exterior with
"Contains IC: 216Q-1315" (PAN1315, PAN1325) or
"Contains IC: 216Q-1316" (PAN1316, PAN1317, PAN1326 and PAN1327).
Obligations d’étiquetage
Les fabricants d’équipements (OEM) doivent s’assurer que les obligations d’étiquetage du
produit final sont remplies. Ces obligations incluent une étiquette clairement visible à l’extérieur
de l’emballage externe, comportant l’identifiant IC du module Panasonic inclus, ainsi que la
notification ci-dessus.
Les identifiants IC sont:
IC: 216Q-1315 (PAN1315, PAN1325)
IC: 216Q-1316 (PAN1316, PAN1317, PAN1326, PAN1327)
Ces identifiants sont valides pour tous les modules PAN13xx (Chapter 29. Ordering Information).
Dans tous les cas les produits finaux doivent indiquer sur leur emballage externe une des
mentions suivantes:
"Contient IC: 216Q-1315” (PAN1315, PAN1325) ou
"Contient IC: 216Q-1316” (PAN1316, PAN1317, PAN1326, PAN1327).
CLASSIFICATION
PRODUCT SPECIFICATION
No.
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REV.
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SUBJECT
CLASS 1 or 2 BLUETOOTH MODULE
PAGE
54 of 55
PANASONIC’S CODE
See Chapter Ordering Information
DATE
14.06.2017
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH
www.pideu.panasonic.de
31.3 EUROPEAN CONFORMITY ACCORDING TO RED (2014/53/EU)
All modules described in this Product Specification comply with the standards according to the
following LVD (2014/35/EU), EMC-D (2014/30/EU) together with the RED (2014/53/EU) articles:
3.1a Safety/Health: EN60950-1:2006+A11:2009+A1:2010+A12:2011+AC:2011+A2:2013
EN62311:2008
3.1b EMC: EN 301 489-1 V2.1.1:2017-02
EN 301 489-17 V3.1.1:2017-02
3.2 Radio: EN 300 328 V2.1.1:2016-11
As a result of the conformity assessment procedure described in the 2014/53/EU Directive, the
end customer equipment should be labelled as follows:
PAN13xx and its model versions in the specified reference design can be used in all countries of the
European Economic Area (Member States of the EU, European Free Trade Association States
[Iceland, Liechtenstein, Norway]), Monaco, San Marino, Andorra, and Turkey.
CLASSIFICATION
PRODUCT SPECIFICATION
No.
DS-13xx-2400-102
REV.
5.0
SUBJECT
CLASS 1 or 2 BLUETOOTH MODULE
PAGE
55 of 55
PANASONIC’S CODE
See Chapter Ordering Information
DATE
14.06.2017
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH
www.pideu.panasonic.de
31.4 JAPANESE RADIO LAW AND JAPANESE TELECOMMUNICATIONS
BUSINESS LAW COMPLIANCE
This device is granted pursuant to the Japanese Radio Law (電波法).
This device should not be modified (otherwise the granted designation number will
become invalid)
The following models are qualified for the Japanese market:
ENW89823A2KF MIC ID: [R]202-LSD072
ENW89823A3KF MIC ID: [R]202-LSD072
ENW89829A2KF MIC ID: [R]202-LSD073
ENW89829A3KF MIC ID: [R]202-LSD073
31.5 KOREAN CERTIFICATION
This device is granted pursuant to the Korean Law.
This device should not be modified (otherwise the granted designation number will become
invalid).
1. Indicate the following expression on the product where it can be easily seen: “This radio
equipment can be crossed during operation.”
“該当の無線設備は運用の中で電波混信可能性がある"という文具を同設備のちゃんと見える所に
表
示すること => “該当の無線設備は運用の中で電波混信可能性がある"
2. The manufacturer and installer should fully inform the operator or users: “This radio equipment
cannot provide a service relevant to the human life safety, as it can be crossed” through the User
Manual etc.
製作者及び設置者は当該の無線設備が電波混信可能性があるので人命安全と係わるサービスは
出
来ないことをマニュアルなどを通じて運用者及び使用者に充分に知らせること
=> "該当の無線設備が電波混信可能性がありますので人命安全と係わるサービスは出来ません"
The MSIP number is: MSIP-CRM-Pid-ENW89823A3KF
This ID is valid for:
ENW89823A3KF
31.6 BLUETOOTH SIG STATEMENT
The Design is listed as Controller Subsystem with QDID: B019784
https://www.bluetooth.org/tpg/QLI_viewQDL.cfm?qid=19784