REVISIONS LTR DESCRIPTION DATE (vn-mo-pa) | APPROVED REV SHEET REV SHEET REV STATUS REV OF SHEETS SHEET 14124) 31415 16 i7 Es fo fofiihe tisha 5 | 16 PMIC WA DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 STANDARDIZED MILITARY MICROCIRCUITS, MEMORY, DIGITAL, CMOS, DRAWING 2k X 8 STATIC RAM (SRAM), MONOLITHIC THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS SIZE CAGE CODE AND AGENCIES OF THE 16_OCTOBER 1989 A 67268 5962-89690 B REVISION LEVEL AMSC NIA SHEET 1 DESC FORM 193 SEP 87 DISTRIBUTION STATEMENT A. Approved for public release; distribution is untimited. * U.S. GOVERNMENT PRINTING OFFICE: 1987 748-129/60911 5962-E14001. SCOPE 1.1 Scope. This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices. 1.2 Part number. The complete part number shall be as shown in the following example: 5962-89690 ol J xX TS T T T { | | | | Drawing number Device type Case outline Lead finish per (1.2.1) (1.2.2) MIL-M-38510 1.2.1 Device types. The device types shall identify the circuit function as follows: Device type Generic number Circuit function Access time 01 See 6.6 2K X 8 CMOS SRAM 25 ns 02 See 6.6 2K X 8 CMOS SRAM 20 ns 1.2.2 Case outlines. The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows: Outline letter Case outline J D-3 (24-lead, 1.290" x .610" x .225"), dual-in-line package K F-6 (24-lead, .640" x .420" x .090"), flat package L D-9 (24-lead, 1.280" x .310" x .200"), dual-in-line package X C-12 (32-terminal, .560" x .458" x .120"), rectangular chip carrier package Y Figure 1 (24-terminal, .308" x .408" x .078"), rectangular chip carrier package Z C-11 (28-terminal, .560" x .358" x .120"), rectangular chip carrier package 3 C-4 (28-terminal, .460" x .460" x .100"}, square chip carrier package 1.3 Absolute maximum ratings. 1/ Supply voltage range (Vcc} ----------+--- -0.5 V dc to 7 V dc Input voltage range 2/- -------+---+--- 0.5 V to Vcc + 0.5 Output voltage range in high impedance state - - - - -0.5 V de to 7 V dc Output current - - ---------+--+-+------- 20 mA Storage temperature range - ------------ -65C to +150C Power dissipation (Pp) - -----+---+-----+-- 864 mW Lead temperature (soldering, 10 seconds) - - - ~ - - +275-C Junction temperature (Tj) - ------------ +175-C Thermal resistance, junction-to-case (Qye): Cases J, K, L, X, Z, and 3 -~------+--+-+- See MIL-M-38510, appendix C Case Y----------+-----+--+--+---+--+--+--4 20 C/W T7__All voltages are with respect to GND. 2/ Vy. (minimum) of -3 V de for short pulse durations of 20 ns or less. Prolonged operation at Vi_ levels below -1 V dc will result in excessive currents that may damage the device. STANDARDIZED 7 MILITARY DRAWING 5962-89690 DEFENSE ELECTRONICS SUPPLY CENTER REVISION LEVEL SHEET DAYTON, OHIO 45444 5 DESC FORM 193A SEP 87 > # U. S. GOVERNMENT PRINTING OFFICE: 1988549-9041.4 Recommended operating conditions. Supply voltage range (Vcc) - - - - --------- 4.5 V de minimum to 5.5 V de maximum High level input voltage range (Vyq) - - - - - - - - 2.2 V dc minimum to Vcc + 0.5 V de maximum ; Low level input voltage range (Vq;) 3/ - - - - - - - -0.5 V de minimum to 0.8 V dc maximum Case operating temperature range (Te cere eee ~55 C to +125 C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standard,and bulletin. Unless otherwise specified, the following specification, standard, and bulletin of the Tssue listed in that issue of the Department of Defense Index of Specifications and Standards specified in the solicitation, form a part of this drawing to the extent specified herein. SPECIFICATION MILITARY MIL-M- 38510 - Microcircuits, General Specification for. STANDARD MILITARY MIL-STD-883 - Test Methods and Procedures for Microelectronics. BULLETIN MILITARY MI L-BUL-103 - List of Standardized Military Drawings (SMD's). (Copies of the specification, standard, and bulletin required by manufacturers in connection with specific acquisition functions should be obtained from the contracting activity or as directed by the contracting activity.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing shall take precedence. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with 1.2.1 of 1 MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shalt be as specified in MIL-M-30510 and herein. 3.2.1 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.2 Truth table. The truth table shall be as specified on figure 3. 3.2.3 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3/ YL (minimum) of -3 V de for short pulse durations of 20 ns or less. Prolonged operation at Vi, levels below -1 V dc will result in excessive currents that may damage the device. STANDARDIZED _ 5962-89690 MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER REVISION LEVEL SHEET DAYTON, OHIO 45444 3 DESC FORM 1 93A + U.S. GOVERNMENT PRINTING OFFICE: 1988--549-904 SEP 87TABLE I. Electrical performance characteristics. [ T Test Symbol .. conditions | { Group A {Device Limits [Unit -55C < Te +125 C isubgroups{ types i 4.5. V < Voc < 5.5 V { se es I l l { { { i i { { Min { Max { [ Vss = 0 Vv | { { { { { unless otherwise specified [ | { I { | V/ 2/ 3/ 4/ | | I { i | i | | { { { | I [ [ .- | Operating supply current (Iccy {tayay = tayay (minimum), { 1,2,3 1 O1 i 4438 { mA { Wee = 5.5 V, CE = Vy, i { iat other inputs at Vy, | | 02 ! {150 I [ l I I I l Standby power supply iIcc2 [CE > Vyry, a? other inputs { 1,2,3 [1 01 { {45 {mA current TTL { i< VL or > Vin, Voc = 5.5 VV, I l f | | rt =!b MHz | o2 | {50 | [ { T [ [ i ( Standby power supply (Iccg3 ICE > (Vcc -0.2 ), f = O MHz, { 1,2,3 [| ATI | { 20 | mA current CMOS { [Voc = 5.5 V, all other inputs {| { | | | _ i [< 0.2 V or > (Vee -0.2 V) { i { { { { { I | { I { T i oT f [ i i Input leakage current, (Iie =6iVece = 5-5 , { 1,2,3 [ Atl {-10 (10 | pA any input | {VIN = OV to 5.5 V ! ! [ [ [ { [ l [ Off-state output leakage [Io_k {Vcc = 5.5 V, { 1,2,3 { All j[-10 (10 { wA current I (Vin =O V to 5.5 V ! | { { i i i i [ i I f [ i Output high voltage (You {Iquy = -4.0 mA, Veco = 4.5 V, | 1,2,3 {| All |{ 2.4 | Vv ( {Vir = 0.8 V, Vyy = 2.2 V | i | { ( i | { { { { i [ i I | [ I | Output low voltage Vor (Igyt = 8.0 mA, Voc = 4.5 V, i 1,2,3 { All { i0.4{ Vv { {(Vi_ = 0.8 V, Vey = 2.2 V | { I { { i { i l { { { [ I i [ i i i Input capacitance 5/ iC iVyn = OV, : { 4 { All | ( 8.0 | pF ~ | {f = 1.0 MHz, Ta = +25 C, { { { i ( | {see 4.3.1 ( i { { { I i I To I i [ Output capacitance 5/ (Cour (Your = 0 V, : | 4 { All { { 8.0 | pF ~ | (f = 1.0 MHz, Ta = +25 C, { { { | { { {see 4.3.1c t i | i { f I I [ [ [ | Read cycle time |tavaY ! ! 9,10,11 {| Ol { 25 | { ns | [ i | 02 { 20 | | See footnotes at end of table. STANDARDIZED A 506 2-89690 MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER REVISION LEVEL SHEET DAYTON, OHIO 45444 4 DESC FORM 193A SEP 87 # U. 8. GOVERNMENT PRINTING OFFICE: 1988549-904TABLE 1. Electrical performance characteristics ~ Continued. I | T I I I Test [Symbol | Conditions | Group A [Device {Limits [Unit | | -58C < Tr < +125C |subgroups| types | T i | | 4.5. V <Vc < 5.5 V | | | Min | Max | I | Vog = OV { | i | \ | | unless otherwise specified | I | I l | I V/ 2/ 3/ 4/ I I | \ | { | I | | I \ | | | { i I | Address access Itavqv | {9,10,11 | o1 | 1.25. | ns time | | | | | | 1 o2 | 0) I | I I I T Output hold after addressitaygy | 19,10,11 | o1 i 0 | | ns change | | | I | T T | { | 1 o2 Jj] ol i 0 bl 9,10,11 ol | 0 utput enable to output 10, ns active 5/ 6/ | OLX | | | | | 1 | I I | o2 {| of | | | I I I I I Output enable access time Ito gy ! 9,10,11 | o1 | | 16 {1 ns | | | | o2 | [| 15 | h Itevox | [91011 | 01 |od | Chip enable to output 9,10 0 ns active. 5/ 6/" jELOX | i es ee ee 0 | I { | o2 [| 01] \ | { I I I T T Chip enable access time IteLgy |! | 9,10,11 | O1 | | 25 |ns J | | | o2 | {20 | I I T I I Chip enable to output Itengz | 19,10,11 | o1 | 115 ins in high Z 5/ 6/ | | | l | { | 02 [15 | T I I I I | Write recovery time Ityiay | 19,10,11 | ol | oO | | ns I I | I [ J T I { | | o2. 4 01 | I I | T T T T Chip enable to lteLwH | 1 9,10,11 | ol 120 | | ns end-of-write | | | l i | | o2 [15 | I | | I | I I I Address valid to [taywH | {9,10,11 | ol [120 | | ns end-of-write I | \ T T T T { | | | o2 (415 | | i I | | I I I Address to WE setup time ltaviL 9,10,11 | O21 | O | i ns I | | | o2 | 01 I { | | | \ i | Address to CE setup time ItAVEL 9,10,11 01,02 0 ns See footnotes at end of table. STANDARDIZED SIZE MILITARY DRAWING A 5962-89690 DEFENSE ELECTRONICS SUPPLY CENTER REVISION LEVEL SHEET DAYTON, OHIO 45444 5 DESC FORM 193A SE P 8 7 w U. S. GOVERNMENT PRINTING OFFICE: 1988-549-904TABLE I. Electrical performance characteristics - Continued. { { { I I Test {Symbol | Conditions { Group A [Device [{ Limits {Unit { | -58C <Te< +125C |subgroups| types | 1 { { ( 4.5 < < vee < 5.5 ( { {| Min | Max | { | { [ i { i | | unless SSSerwise specified [| { { { { { | L/ 2/ 3/ 4/ | { { { i I { i { I i i [ [ I I [ | [ Output enable to output itougz | {9,10,11 {| o1 | { 16 (ns in high Z 5/ 6/ | | TOT i { { i o2 | { 15 | { [ [ | { i | Write enable pulse width {tia WH i ! 9,10,11 { O01 { 20] { ns { { | | { 02 [{ 18 { [ | | I T i I Data setup to ltpywH { 9,10,11 o1_{ 15 { ns end-of-write { { | I of i { { 02 =| (12 [ I | Tr I t Data hold after itwupx | {9,10,11 {| Ol { O | { ns end-of-write ( ( { i I t { o2 { Oo | [ { [ I I I Tr Chip-enable pulse width (tery | i 9,10,11 | o1 f{ 20 [ ns during write { { { | { { ( { o2 {15 | T | I { T v T Write enable pulse setup [tween | { 9,10,12 [| 01 { 20 { ns time { | { I | [ { { o2 {15 i [ { | | I { TT Write enable to output [twoz | { 9,10,11 | 01 | i 15 {ns in high Z S/ 6/ I { { I { { o2 | ( 15 / 1/ All voltages referenced to Vss. 2/ Negative undershoots to a minimum of -0.3 V are allowed with a maximum of 50 ns pulse width. 3/ AC measurements assume transition time < 5 ns and input levels are from s6 to 3.0 V. ~ Qutput load is specified on figure 4. Reference timing levels are at 1.5 4/ For timing waveforms, see figure 4. 5/ Tested initially, and after any design or process change which could affect these parameters, and therefore shall be guaranteed to the limits specified in table I. Transition measured +500 mV from steady-state value. 6/ This parameter measured +500 mV from steady-state output voltage. Load capcitance is 5.0 pF, see figure 4. STANDARDIZED SIZE A 5962-89690 MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER REVISION LEVEL SHEET DAYTON, OHIO 45444 6 SEP DESC FORM 193A 37 w U. S. GOVERNMENT PRINTING OFFICE: 1988549-904950 1040 uo o : nN Inches mm .008 0.20 -020 0.50 .030 0.76 . 040 1.01 - 045 1.14 -050 1,27 .055 1.39 062 1.57 -065 1.67 .078 1.98 292 7.41 .308 7.82 .392 9.95 - 408 10.36 ' BOTTOM 050 .008 R pe} O78 Ly 040 24 PLS ,062 Coy Co 408 | +392 . (4 a Lj: Co N= / SIDE TOP O66 heat . 308 7050 a aa .292 NOTES: 1. Dimensions are in inches. ; 2. Metric equivalents are given for general information only. FIGURE 1. Case outline Y (24-terminal, .308" x .408" x .078"), rectangular chip carrier package. STANDARDIZED A 5962-89690 MILITARY DRAWING REVISION LEVEL SHEET DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 DESC FORM 193A SEP 87 * U. S, GOVERNMENT PRINTING OFFICE: 1988549-904Device types 01 and 02 Case outlines aK LY 3,z x Terminal number Terminal symbol | \ | | | | | | | | | \ I | | I I | | | 1 1az 1 Az) ONG 2 AG ! AG ! NC ! | 3 a5 [AS [NC | ! 4 ! AA ! Aa AT | 5 [as 1A3 LAG | 6 | A2 | A2 AS | 7 ;AL ~NC Fae | 8 AO ! NC A3 l 9 L1/oO} AL Taz | ! 10 ! 1/0 1 AO Al l 11 [1/02 |i/oll ao | ! 12 lyss | 1/02 | we ! | 13 [1/03 | 1/03 | 1/00 | ! 14 lio4al vss | 1/01 | | 15 11/05 | 1/04 | 1/02 | 16 Hio6 | 1/05 |b vss | l 17 11/07 | 1/06 iNC | 18 | CE 1707! 1/03 | | 19 [Alo | 1/08 1 1/04 | ! 20 OF TE ! 1/0 5 ! | 21 [\WoOCi NC OL 1/06 | ! 22 | AQ NC 1/07 ! | 23 { AS { A10 | CE | ! 24 Ico | OE Of Ato | | 25 | --- | WE | DE I Poe ee | l 27 f--- [as Inc | 7 T TT 1 1 | 38 I beg fan | Inputs ! 170 | Mode | Power | 1 I | 29 fe Je pags | [CE WE OE 1/00 - 1/07) l ! 30 Pee | ae | NC ! Ta x x [ HI-Z | Standby | Standby | | 31 | --- | NC | | L Ho-L { Data output | Read | Active | | | | | jt H H j HI-2 j Read | Active | | 32 porte pout | Vcc | { L L xX | Data input | Write | Active | FIGURE 2. Terminal connections. FIGURE 3. Truth table. STANDARDIZED A MILITARY DRAWING 5962-89690 DEFENSE ELECTRONICS SUPPLY CENTER REVISION LEVEL SHEET DAYTON, OHIO 45444 8 DESC FORM 193A SE P B7 U. S. GOVERNMENT PRINTING OFFICE: 1986549-904Sv RI= 480Q 5V OUTPUT UNDER TEST Ri= 480Q R2=255 2 AN CL= 30 pF! OUTPUT UNDER TEST R2=255 2 sx CL=5 pF? = T~ CONFIGURATION (a) OR (EQUIVALENT CIRCUIT ) t C. INCLUDES JIG AND SCOPE = CAPACITANCES CONFIGURATION (b) OR(EQUIVALENT CIRCUIT) (FoR tELQX,*EHaz,*wLez, Lorox AND tOHQz) # 290% ~K90 % 3v 10% 10% OV tr : tf NOTES: 1. tp and te < 5 ns. AN switching characteristics and timing requirements assume test conditions as depicted in configuration (a) and configuration (b) with timing references of 1.5 V (50% reference point} as shown in the subsequent timing diagrams. FIGURE 4. Load circuit and switching waveforms. STANDARDIZED SIZE MILITARY DRAWING A 5962-89690 DEFENSE ELECTRONICS SUPPLY CENTER REVISION LEVEL SHEET DAYTON, OHIO 45444 9 DESC FORM 193A SEP 87 % U. S. GOVERNMENT PRINTING OFFIGE: 1988546-905Read cycle timing from address (see note) tavav ae AG- AIO KX x Vin Vv Te tava |p ST ee Ivoi- Vou 1/08 PREVIOUS DATA VALID DATA VALID VoL NOTE: When WE is high, CE is low, and OE is low, device is continuously selected. Read cycle timing from chip enable (see note) + tavav e\ ff. vin cE 5 Vit jag - bE gy _| oC \ x | Vin toLove : fe LoHaz VIL . bovex EHQZ ~~ Vv DATA OUT HZ CORR X DATA VALID yoarzt p+ VELOX BANS Vor NOTE: When WE is high, address is valid prior to or simultaneously with the high-to-1ow transition of CE FIGURE 4. Load circuit and switching waveforms - Continued. STANDARDIZED SIZE MILITARY DRAWING A 5962-89690 DEFENSE ELECTRONICS SUPPLY CENTER REVISION LEVEL SHEET DAYTON, OHIO 45444 10 DESC FORM 193A SE p 87 # U. S. GOVERNMENT PRINTING OFFICE: 1986--549-904Write cycle timing controlled by from chip enable (see note 1) [* bavav | v A0-AIO x 1H Vit Pt CAVEL t ELEH om v ze [ Vin CE a a rn ~ bay WH 1. VIL WHAY 9 | tovwH r[ a twupx vie DATA Koara Vin IN VALIO V pete oe it DATA DATA UNDEFINED - Hi-z VOH VoL NOTES: 1. CE or WE must be high during address transitions. 2. Data I/0 pins enter high-impedance state, as shown when CE is held low during write. Write cycle timing controlled by write enable (see note 1) Lavav ViH Vit Lf TTT." ce _\\\ Vie tavwH : | bwHav - _ eo vin We * \ k t t Vie t vw | [7 bovwH WHDX -~ | x Vin DATA DATA VALID x Vit la pwr Vv f/f. OH vO DATA UNDEFINED HI-Z __- vy NOTES: OL 1. CE or WE must be high during address transitions. 2. The internal write time of the memory if defined by the overlap of CE low and WE low. Both signals must be low to initiate a write, and either signal can terminate a write by going high. The data input setup and hold timing should be referenced to the rising edge of the signal that terminates the write. Data I/0 pins enter high-impedance state, as shown when CE is held low during write. FIGURE 4. Load circuit and switching waveforms - Continued. STANDARDIZED SIZE MILITARY DRAWING A 5962-89690 DEFENSE ELECTRONICS SUPPLY CENTER REVISION LEVEL SHEET DAYTON, OHIO 45444 11 DESC FORM 193A SEP 87 any # U. S. GOVERNMENT PRINTING OFFICE: 1988549-9043.2.4 Load circuit and switching waveforms. The load circuit and switching waveforms shall] be as specified on Figure 4. 3.2.5 Die overcoat. Polyimide and silicone coatings are allowable as an overcoat on the die for alpha particle protection provided that each coated microcircuit inspection lot (see MIL-M-38510, inspection lot, class B paragraph) shall be subjected to and pass the internal water vapor test (see method 1018 of MIL-STD-883). The frequency of the internal water vapor testing may not be decreased unless approved by the preparing activity. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-STD-883 (see 3.i herein). The part shal? be marked with the part number listed in 1.2 herein. In addition, the manufacturer's part number may also be marked as listed in MIL-BUL-103 (see 6.6 herein). 3.6 Certificate of compliance. A certificate of compliance shal1 be required from a manufacturer in order to be Tisted as an approved source of supply in MIL-BUL-103 (see 6.6 herein). The certificate of compliance submitted to DESC-ECS prior to listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-STD-883 (see 3.1 herein) and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-STD-883 (see 3.1 herein) shall be provided with each tot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DESC-ECS shall be required in accordance with MIL-STD-883 (see 3.1 herein). 3.9 Verification and review. DESC, DESC's agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with section 4 of MIL -M-3BS10 to the extent specified in MIL-STD-883 (see 3.1 herein). 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on ail devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-882. (1) Test condition D using the circuit submitted with the certificate of compliance (see 3.6 herein). (2) Ta = *125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 oF MIL-STD-88F imeradtng groups A, B, , and D inspections. The following additional criteria shal] apply. STANDARDIZED MILITARY DRAWING 5962-89690 DEFENSE ELECTRONICS SUPPLY CENTER REVISION LEVEL SHEET DAYTON, OHIO 45444 i DESC FORM 193A tr U. 8. GOVERNMENT PRINTING OFFICE: 1988549-904 SEP 874.3.1 TABLE II. Electrical test requirements. T I | | MIL-STD-883 test requirements | Subgroups | { (per method | | | 5005, table I) | I I iT lInterim electrical parameters (method 5004} | =-- l | { I |Final electrical test parameters (method 5004) | 1*,2,3,7*, I | | 8B,9, teat | \ | I \Group A test requirements (method 5005) 1 1,2,3,4**,7***, | | ( (8A, 88) ***,9, 10,111 | I | {Groups C and D end-point electrical | 2,3,7,8A,8B (method 5005) * PDA applies to subgroups 1 and 7. xe See 4.3.1c. wee See 4.3.14. Group A_inspection. Tests shall be as specified in table II herein. Subgroups 5 and 6 in table I, method 5005 of MIL-STD-883 shall be omitted. Subgroup 4 (C IN and Coyy measurements) shall be measured for the initial characterizatiun and Otter any process or design changes which may affect capacitance. Sample size is 15 devices with no failures, and all input and output terminals tested. Subgroups 7 and 8 tests shall include verification of the truth table. Groups C and D inspections. End-point electrical parameters shall be as specified in table II herein. Steady-state life test conditions, method 1005 of MIL-STD-883. {1) Test condition D using the circuit submitted with the certificate of compliance (see 3.6 herein). (2) Ta = *125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-M-38510. STANDARDIZED SIZE MILITARY DRAWING A 5962-89690 DEFENSE ELECTRONICS SUPPLY CENTER REVISION LEVEL SHEET DAYTON, OHIO 45444 13 DESC FORM 193A SEP 87 U.S. GOVERNMENT PRINTING OFFICE: 1988549.9046. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use when military specifications do not exist and qualified military devices that will perform the required function are not available for OEM application. When a military specification exists and the product covered by this drawing has been qualified for listing on QPL-38510, the device specified herein will be inactivated and will not be used for new design. The QPL-38510 product shall be the preferred item for all applications. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. 6.3 Configuration control of SMD's. Al] proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished in accordance with MIL-STD-481 using DD Form 1693, Engineering Change Proposal (Short Form). 6.4 Record of users. Military and industrial users shall inform Defense Electronics Supply Center when a system application requires configuration control and the applicable SMD. DESC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronics devices (FSC 5962) should contact DESC-ECS, telephone (513) 296-6022. 6.5 Comments. Comments on this drawing should be directed to DESC-ECS, Dayton, Ohio 45444, or telephone (513) 296-5375. 6.6 Approved sources of supply. Approved sources of supply are listed in MIL-BUL-103. Additional sources wi e added to MIL-BUL-103 as they become available. The vendors listed in MIL-BUL-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DESC-ECS. The approved sources of supply listed below are for information purposes only and are current only to the date of the last action of this document. T | { | { Military drawing { Vendor i Vendor | | part number | CAGE { similar part | { | number | number 1/ { t | i | { T | \ | 5962-8969001JX | 61772 | 1DT6116SA25DB | i | 65786 1CY6116A-25DMB \ { Tr I \ | 5962-8969001KX | 61772 | 1DT6116SA25EB { | | 65786 ICY7C128A-25KMB \ I ] | | i 01295 |SMJ68CE16-25JDM | | | 65786 {CY7C128A-25DMB | | 5962-8969001LX | 61772 | IDT6116SA25TDB { | | 75569 {P4C116-25DMB | | | 6Y440 IMT5C1608C-25883C | { | I | { | 65786 |CY6117A-25LMB | | 5962-8969001XX { 61772 | IDT6116SA25L32B | | i 01295 ISMJ68CE16-25FGM | | i I | | 5962-8969001YX | 61772 | IDT6116SA25L24B | I | 65786 |CY7C128A-25LMB | See footnote at end of table. STANDARDIZED A MILITARY DRAWING 5962-89690 DEFENSE ELECTRONICS SUPPLY CENTER REVISION LEVEL SHEET DAYTON, OHIO 45444 14 DESC FORM 193A SE Pp 87 tr U. S. GOVERNMENT PRINTING OFFICE: 1988549-904| { { { Military drawing | Vendor { Vendor { part number | CAGE { similar part { | | number number 1/ { | | I I ( { { 65786 (CY6116A-25LMB { { 5962-89690013X { 61772 {IDT6116SA25L28B | [ i { [ { 5962-8969001 ZX { 6Y440 {MT5C 1608EC-25883C } { { { { { I { { 5962-8969002JX { 61772 {IDT6116SA20DB { i 65786 {CY6116A-20DMB ! [ | { 5962-8969002KX { 61772 {IDT6116SA20EB i { { 65786 {CY7C128A-20KMB | { qT I { 5962-8969002LX 65786 {CY7C128A-20DMB { 61772 { IDT6116SA20TDB { { i 75569 (P4C116-20DMB i | 6Y440 (MT5C1608C-20883C | [ TT | {| 65786 (CY6117A-20LMB { 5962-8969002XX { 61772 { IDT6116SA20L32B | { I I 5962-8969002YX { 61772 {IDT6116SAZ0L24B i | i 65786 (CY7C128A-20LMB | ! I { 5962 -8969002ZX i 6Y440 {MT5C1608EC-20883C | I I 7 {| 65786 {C6116A-20LMB { {| 5962-89690023X { 61772 ({I1DT6116SA20L28B | ( { 6440 {MT5C1608EC-20883C | 1/ Caution. Do not use this number for item acquisition. Ttems acquired to this number may not satisfy the performance requirements of this drawing. Vendor CAGE Vendor name _humber__ and address 01295 Texas Instruments, Incorporated P.0. Box 60448 Midland, TX 79711-0448 6440 Micron Technology 2805 E. Columbia Road Boise, ID 83706 STANDARDIZED SIZE 5962-89690 MILITARY DRAWING A : DEFENSE ELECTRONICS SUPPLY CENTER REVISION LEVEL SHEET DAYTON, OHIO 45444 15 DESC FORM 193A SEP 87 % U.S. GOVERNMENT PRINTING OFFICE: 1988549-904Vendor CAGE Vendor name number. and address 61772 Integrated Device Technology, Incorporated 3236 Scott Boulevard Santa Clara, CA 95054 65786 Cypress Semiconductor 3901 N. First Street San Jose, CA 95134 75569 Performance Semiconductor Corporation 610 East Weddell Drive Sunnyvale, CA 94089 STANDARDIZED NT : MILITARY DRAWING 4 5962-89690 DEFENSE ELECTRONICS SUPPLY CENTER | REVISION LEVEL - 1 SHEET DAYTON, OHIO 45444 16 DESC FORM 193A SE P 87 % U.S. GOVERNMENT PRINTING OFFICE: 1988549-904