Semiconductor Components Industries, LLC, 2000
May, 2000 – Rev. 3 1Publication Order Number:
MC74HC4040A/D
MC74HC4040A
12-Stage Binary Ripple
Counter
High–Performance Silicon–Gate CMOS
The MC74C4040A is identical in pinout to the standard CMOS
MC14040. The device inputs are compatible with standard CMOS
outputs; with pullup resistors, they are compatible with LSTTL
outputs.
This device consists of 12 master–slave flip–flops. The output of
each flip–flop feeds the next and the frequency at each output is half of
that of the preceding one. The state counter advances on the
negative–going edge of the Clock input. Reset is asynchronous and
active–high.
State changes of the Q outputs do not occur simultaneously because
of internal ripple delays. Therefore, decoded output signals are subject
to decoding spikes and may have to be gated with the Clock of the
HC4040A for some designs.
Output Drive Capability: 10 LSTTL Loads
Outputs Directly Interface to CMOS, NMOS, and TTL
Operating Voltage Range: 2 to 6 V
Low Input Current: 1 µA
High Noise Immunity Characteristic of CMOS Devices
In Compliance With JEDEC Standard No. 7A Requirements
Chip Complexity: 398 FETs or 99.5 Equivalent Gates
LOGIC DIAGRAM
Q1
9
Q2
7
Q3
6
Q4
5
Q5
3
Q6
2
Q7
4
Q8
13
Q9
12
Q10
14
Clock 10
Reset 11 Pin 16 = VCC
Pin 8 = GND
1516 14 13 12 11 10
21 34567
VCC 9
8
Q11 Q10 Q8 Q9 Reset Clock Q1
Q12 Q6 Q5 Q7 Q4 Q3 Q2 GND
Pinout: 16–Lead Plastic Package
(Top View)
Q11
15
Q12
1
SO–16
D SUFFIX
CASE 751B
http://onsemi.com
TSSOP–16
DT SUFFIX
CASE 948F
1
16
PDIP–16
N SUFFIX
CASE 648
1
16
1
16
MARKING
DIAGRAMS
1
16
MC74HC4040AN
AWLYYWW
1
16
HC4040A
AWLYWW
A = Assembly Location
WL = W afer Lot
YY = Year
WW = Work Week
HC40
40A
ALYW
1
16
Device Package Shipping
ORDERING INFORMATION
MC74HC4040AN PDIP–16 2000 / Box
MC74HC4040AD SOIC–16 48 / Rail
MC74HC4040ADR2 SOIC–16 2500 / Reel
MC74HC4040ADT TSSOP–16 96 / Rail
MC74HC4040ADTR2 TSSOP–16 2500 / Reel
FUNCTION TABLE
Clock Reset Output State
X
L
L
H
No Charge
Advance to Next State
All Outputs Are Low
MC74HC4040A
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2
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
MAXIMUM RATINGS*
ÎÎÎÎ
ÎÎÎÎ
Symbol
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Parameter
ÎÎÎÎÎ
ÎÎÎÎÎ
Value
ÎÎÎ
ÎÎÎ
Unit
ÎÎÎÎ
ÎÎÎÎ
VCC
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
DC Supply Voltage (Referenced to GND)
ÎÎÎÎÎ
ÎÎÎÎÎ
– 0.5 to + 7.0
ÎÎÎ
ÎÎÎ
V
ÎÎÎÎ
ÎÎÎÎ
Vin
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
DC Input Voltage (Referenced to GND)
ÎÎÎÎÎ
ÎÎÎÎÎ
– 0.5 to VCC + 0.5
ÎÎÎ
ÎÎÎ
V
ÎÎÎÎ
ÎÎÎÎ
Vout
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
DC Output Voltage (Referenced to GND)
ÎÎÎÎÎ
ÎÎÎÎÎ
– 0.5 to VCC + 0.5
ÎÎÎ
ÎÎÎ
V
ÎÎÎÎ
ÎÎÎÎ
Iin
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
DC Input Current, per Pin
ÎÎÎÎÎ
ÎÎÎÎÎ
±20
ÎÎÎ
ÎÎÎ
mA
ÎÎÎÎ
ÎÎÎÎ
Iout
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
DC Output Current, per Pin
ÎÎÎÎÎ
ÎÎÎÎÎ
±25
ÎÎÎ
ÎÎÎ
mA
ÎÎÎÎ
ÎÎÎÎ
ICC
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
DC Supply Current, VCC and GND Pins
ÎÎÎÎÎ
ÎÎÎÎÎ
±50
ÎÎÎ
ÎÎÎ
mA
ÎÎÎÎ
Î
ÎÎ
Î
ÎÎÎÎ
PD
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î
ÎÎÎÎÎÎÎÎÎÎÎÎ
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Power Dissipation in Still Air, Plastic DIP†
SOIC Package†
TSSOP Package†
ÎÎÎÎÎ
Î
ÎÎÎ
Î
ÎÎÎÎÎ
750
500
450
ÎÎÎ
Î
Î
Î
ÎÎÎ
mW
ÎÎÎÎ
ÎÎÎÎ
Tstg
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Storage Temperature Range
ÎÎÎÎÎ
ÎÎÎÎÎ
– 65 to + 150
ÎÎÎ
ÎÎÎ
_
C
ÎÎÎÎ
Î
ÎÎ
Î
ÎÎÎÎ
TL
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î
ÎÎÎÎÎÎÎÎÎÎÎÎ
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Lead Temperature, 1 mm from Case for 10 Seconds
Plastic DIP, SOIC or TSSOP Package
ÎÎÎÎÎ
Î
ÎÎÎ
Î
ÎÎÎÎÎ
260
ÎÎÎ
Î
Î
Î
ÎÎÎ
_
C
*Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
Derating Plastic DIP: – 10 mW/
_
C from 65
_
to 125
_
C
SOIC Package: – 7 mW/
_
C from 65
_
to 125
_
C
TSSOP Package: – 6.1 mW/
_
C from 65
_
to 125
_
C
For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High–Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
ÎÎÎÎ
ÎÎÎÎ
Symbol
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Parameter
ÎÎÎ
ÎÎÎ
Min
ÎÎ
ÎÎ
Max
ÎÎÎ
ÎÎÎ
Unit
ÎÎÎÎ
ÎÎÎÎ
VCC
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
DC Supply Voltage (Referenced to GND)
ÎÎÎ
ÎÎÎ
2.0
ÎÎ
ÎÎ
6.0
ÎÎÎ
ÎÎÎ
V
ÎÎÎÎ
ÎÎÎÎ
Vin, Vout
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
DC Input Voltage, Output V oltage (Referenced to GND)
ÎÎÎ
ÎÎÎ
0
ÎÎ
ÎÎ
VCC
ÎÎÎ
ÎÎÎ
V
ÎÎÎÎ
ÎÎÎÎ
TA
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Operating Temperature Range, All Package Types
ÎÎÎ
ÎÎÎ
– 55
ÎÎ
ÎÎ
+ 125
ÎÎÎ
ÎÎÎ
_
C
ÎÎÎÎ
Î
ÎÎ
Î
Î
ÎÎ
Î
ÎÎÎÎ
tr, tf
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Input Rise and Fall T ime VCC = 2.0 V
(Figure 1) VCC = 3.0 V
VCC = 4.5 V
VCC = 6.0 V
ÎÎÎ
Î
Î
Î
Î
Î
Î
ÎÎÎ
0
0
0
0
ÎÎ
ÎÎ
ÎÎ
ÎÎ
1000
600
500
400
ÎÎÎ
Î
Î
Î
Î
Î
Î
ÎÎÎ
ns
DC CHARACTERISTICS (Voltages Referenced to GND)
V
Guaranteed Limit
Symbol Parameter Condition
V–55 to 25°C85°C125°CUnit
VIH Minimum High–Level Input
Voltage Vout = 0.1V or VCC –0.1V
|Iout| 20µA2.0
3.0
4.5
6.0
1.50
2.10
3.15
4.20
1.50
2.10
3.15
4.20
1.50
2.10
3.15
4.20
V
VIL Maximum Low–Level Input
Voltage Vout = 0.1V or VCC – 0.1V
|Iout| 20µA2.0
3.0
4.5
6.0
0.50
0.90
1.35
1.80
0.50
0.90
1.35
1.80
0.50
0.90
1.35
1.80
V
VOH Minimum High–Level Output
Voltage Vin = VIH or VIL
|Iout| 20µA2.0
4.5
6.0
1.9
4.4
5.9
1.9
4.4
5.9
1.9
4.4
5.9
V
Vin =VIH or VIL |Iout| 2.4mA
|Iout| 4.0mA
|Iout| 5.2mA
3.0
4.5
6.0
2.48
3.98
5.48
2.34
3.84
5.34
2.20
3.70
5.20
VOL Maximum Low–Level Output
Voltage Vin = VIH or VIL
|Iout| 20µA2.0
4.5
6.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
V
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high–impedance cir-
cuit. For proper operation, Vin and
Vout should be constrained to the
range GND
v
(Vin or V out)
v
VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
MC74HC4040A
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3
DC CHARACTERISTICS (Voltages Referenced to GND)
Symbol Unit
Guaranteed Limit
VCC
V
ConditionParameter
Symbol Unit125°C85°C–55 to 25°C
VCC
V
ConditionParameter
Vin = VIH or VIL |Iout| 2.4mA
|Iout| 4.0mA
|Iout| 5.2mA
3.0
4.5
6.0
0.26
0.26
0.26
0.33
0.33
0.33
0.40
0.40
0.40
Iin Maximum Input Leakage Current Vin = VCC or GND 6.0 ±0.1 ±1.0 ±1.0 µA
ICC Maximum Quiescent Supply
Current (per Package) Vin = VCC or GND
Iout = 0µA6.0 4 40 160 µA
NOTE:Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor High–Speed CMOS Data Book
(DL129/D).
AC CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6 ns)
Guaranteed Limit
Symbol Parameter
V–55 to 25°C85°C125°CUnit
fmax Maximum Clock Frequency (50% Duty Cycle)
(Figures 1 and 4) 2.0
3.0
4.5
6.0
10
15
30
50
9.0
14
28
45
8.0
12
25
40
MHz
tPLH,
tPHL Maximum Propagation Delay, Clock to Q1*
(Figures 1 and 4) 2.0
3.0
4.5
6.0
96
63
31
25
106
71
36
30
115
88
40
35
ns
tPHL Maximum Propagation Delay, Reset to Any Q
(Figures 2 and 4) 2.0
3.0
4.5
6.0
45
30
30
26
52
36
35
32
65
40
40
35
ns
tPLH,
tPHL Maximum Propagation Delay, Qn to Qn+1
(Figures 3 and 4) 2.0
3.0
4.5
6.0
69
40
17
14
80
45
21
15
90
50
28
22
ns
tTLH,
tTHL Maximum Output T ransition Time, Any Output
(Figures 1 and 4) 2.0
3.0
4.5
6.0
75
27
15
13
95
32
19
15
110
36
22
19
ns
Cin Maximum Input Capacitance 10 10 10 pF
NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the ON
Semiconductor High–Speed CMOS Data Book (DL129/D).
* For TA = 25°C and CL = 50 pF, typical propagation delay from Clock to other Q outputs may be calculated with the following equations:
VCC = 2.0 V : tP = [93.7 + 59.3 (n–1)] ns VCC = 4.5 V : tP = [30.25 + 14.6 (n–1)] ns
VCC = 3.0 V : tP = [61.5 + 34.4 (n–1)] ns VCC = 6.0V : tP = [24.4 + 12 (n–1)] ns
Typical @ 25°C, VCC = 5.0 V
CPD Power Dissipation Capacitance (Per Package)* 31 pF
*Used to determine the no–load dynamic power consumption: PD = CPD VCC2f + ICC VCC. For load considerations, see Chapter 2 of the
ON Semiconductor High–Speed CMOS Data Book (DL129/D).
MC74HC4040A
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4
TIMING REQUIREMENTS (Input tr = tf = 6 ns)
V
Guaranteed Limit
Symbol Parameter
V–55 to 25°C85°C125°CUnit
trec Minimum Recovery T ime, Reset Inactive to Clock
(Figure 2) 2.0
3.0
4.5
6.0
30
20
5
4
40
25
8
6
50
30
12
9
ns
twMinimum Pulse Width, Clock
(Figure 1) 2.0
3.0
4.5
6.0
70
40
15
13
80
45
19
16
90
50
24
20
ns
twMinimum Pulse Width, Reset
(Figure 2) 2.0
3.0
4.5
6.0
70
40
15
13
80
45
19
16
90
50
24
20
ns
tr, tfMaximum Input Rise and Fall Times
(Figure 1) 2.0
3.0
4.5
6.0
1000
800
500
400
1000
800
500
400
1000
800
500
400
ns
NOTE:Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor High–Speed CMOS Data Book
(DL129/D).
PIN DESCRIPTIONS
INPUTS
Clock (Pin 10)
Negative–edge triggering clock input. A high–to–low
transition on this input advances the state of the counter.
Reset (Pin 11)
Active–high reset. A high level applied to this input
asynchronously resets the counter to its zero state, thus
forcing all Q outputs low.
OUTPUTS
Q1 thru Q12 (Pins 9, 7, 6, 5, 3, 2, 4, 13, 12, 14, 15, 1)
Active–high outputs. Each Qn output divides the Clock
input frequency by 2N.
SWITCHING WAVEFORMS
t
f
Clock
Q1
VCC
GND
90%
50%
10%
t
r
tw
90%
50%
10%
tPHL
1/fMAX
tPLH
tTLH tTHL
Clock VCC
GND
tw
trec
50%
Figure 1. Figure 2.
Reset VCC
GND
50%
Any Q 50%
tPHL
MC74HC4040A
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5
SWITCHING WAVEFORMS (continued)
50%
Qn VCC
GND
50%
Qn+1
CL*
*Includes all probe and jig capacitance
TEST
POINT
DEVICE
UNDER
TEST
OUTPUT
Figure 3. Figure 4. Test Circuit
tPLH tPHL
Figure 5. Expanded Logic Diagram
Clock 10 C
C
R
Reset 11
Q
Q
C
C
R
Q
Q
Q1
9
C
C
Q
Q
C
C
Q
Q
C
C
Q
Q
C
C
Q
Q2
7
Q3
6
Q10
14
Q11
15
Q12
1
Q4 = Pin 5
Q5 = Pin 3
Q6 = Pin 2
Q7 = Pin 4
Q8 = Pin 13
Q9 = Pin 12
VCC = Pin 16
GND = Pin 8
MC74HC4040A
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6
Clock
Reset
Q1
1 2 4 8 16 32 64 128 256 512 1024 2048 4096
Q2
Q3
Q4
Q5
Q6
Q7
Q8
Q10
Q11
Figure 6. Timing Diagram
Q9
Q12
APPLICATIONS INFORMATION
Time–Base Generator
A 60Hz sinewave obtained through a 100 K resistor
connected to a 120 Vac power line through a step down
transformer is applied to the input of the MC54/74HC14A,
Schmitt-trigger inverter. The HC14A squares–up the input
waveform and feeds the HC4040A. Selecting outputs Q5,
Q10, Q11, and Q12 causes a reset every 3600 clocks. The
HC20 decodes the counter outputs, produces a single
(narrow) output pulse, and resets the binary counter. The
resulting output frequency is 1.0 pulse/minute.
HC4040A
Figure 7. Time–Base Generator
Clock Q5
Q10
Q11
Q12
VCC
13
12
10
9
1
2
4
5
8
1/2
HC20 1/2
HC20 6
1/6 of HC14A
20 pF
100 K
1.0 Pulse/Minute
Output
VCC
110 V ac 15 – 30
Volts
MC74HC4040A
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7
PACKAGE DIMENSIONS
PDIP–16
N SUFFIX
CASE 648–08
ISSUE R NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
B
FC
S
HGD
J
L
M
16 PL
SEATING
18
916
K
PLANE
–T–
M
A
M
0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.740 0.770 18.80 19.55
B0.250 0.270 6.35 6.85
C0.145 0.175 3.69 4.44
D0.015 0.021 0.39 0.53
F0.040 0.70 1.02 1.77
G0.100 BSC 2.54 BSC
H0.050 BSC 1.27 BSC
J0.008 0.015 0.21 0.38
K0.110 0.130 2.80 3.30
L0.295 0.305 7.50 7.74
M0 10 0 10
S0.020 0.040 0.51 1.01
____
SOIC–16
D SUFFIX
CASE 751B–05
ISSUE J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
18
16 9
SEATING
PLANE
F
J
M
RX 45
_
G
8 PLP
–B–
–A–
M
0.25 (0.010) B S
–T–
D
K
C
16 PL
S
B
M
0.25 (0.010) A S
T
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A9.80 10.00 0.386 0.393
B3.80 4.00 0.150 0.157
C1.35 1.75 0.054 0.068
D0.35 0.49 0.014 0.019
F0.40 1.25 0.016 0.049
G1.27 BSC 0.050 BSC
J0.19 0.25 0.008 0.009
K0.10 0.25 0.004 0.009
M0 7 0 7
P5.80 6.20 0.229 0.244
R0.25 0.50 0.010 0.019
____
MC74HC4040A
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8
PACKAGE DIMENSIONS
TSSOP–16
DT SUFFIX
CASE 948F–01
ISSUE O
ÇÇÇ
ÇÇÇ
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A4.90 5.10 0.193 0.200
B4.30 4.50 0.169 0.177
C––– 1.20 ––– 0.047
D0.05 0.15 0.002 0.006
F0.50 0.75 0.020 0.030
G0.65 BSC 0.026 BSC
H0.18 0.28 0.007 0.011
J0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L6.40 BSC 0.252 BSC
M0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH OR
GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER
SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K
DIMENSION A T MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED AT
DATUM PLANE –W–.
____
SECTION N–N
SEATING
PLANE
IDENT.
PIN 1
18
16 9
DETAIL E
J
J1
B
C
D
A
K
K1
H
G
ÉÉÉ
ÉÉÉ
DETAIL E
F
M
L
2X L/2
–U–
S
U0.15 (0.006) T
S
U0.15 (0.006) T
S
U
M
0.10 (0.004) V S
T
0.10 (0.004)
–T–
–V–
–W–
0.25 (0.010)
16X REFK
N
N
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without further notice to any products herein. SCILLC makes no warranty , representation or guarantee regarding the suitability of its products for any particular
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MC74HC4040A/D
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