Chip Resistor Array Chip Resistor Array EXB1 : 0201 Array EXB2 : 0402 Array EXB3 : 0603 Array EXBN : 0402 Array EXBV : 0603 Array EXBS : 0805 Array Type: Features High density 2 resistors in 0.8 mm 0.6 mm size 4 resistors in 1.4 mm 0.6 mm size 2 resistors in 1.0 mm 1.0 mm size 4 resistors in 2.0 mm 1.0 mm size 8 resistors in 3.8 mm 1.6 mm size 2 resistors in 1.6 mm 1.6 mm size 4 resistors in 3.2 mm 1.6 mm size 4 resistors in 5.1 mm 2.2 mm size (EXB14V) (EXB18V) (EXB24V) (EXB28V, N8V) (EXB2HV) (EXB34V, V4V) (EXB38V, V8V) (EXBS8V) Improvement of placement efficiency Placement efficiency of Chip Resistor Array is two, four or eight times of the flat type chip resistor Explanation of Part Numbers 1 2 3 4 5 6 7 8 9 10 11 E X B V 8 V 4 7 2 J V Product Code Thick Film Chip Resistor Networks Chip Resistor Array Type: inches 1 2 3 N V S 0201 Array 0402 Array 0603 Array 0402 Array 0603 Array 0805 Array Convex Terminal No. of Terminal 4 4 Terminal 8 8 Terminal H 16 Terminal Schematics V Concave Terminal Construction (Example : Concave Terminal) Packaging Methods Resistance Value Resistance Packaging Type Isolated The first two digits are Tolerance Code type significant figures of J 5 % Embossed Carrier Taping EXBS8V Nil 4 mm pitch resistance value and 0 Jumper the third one denotes Punched Carrier Taping EXB14V, 18V, the number of zeros X 2 mm pitch 24V, 28V, N8V following. Jumper is Punched Carrier Taping EXB2HV, 34V, expressed by R00 V 4 mm pitch 38V, V4V, V8V Example: 222: 2.2 k Schematics Isolated type 14V, 24V, 34V, V4V 18V, 28V, N8V, 38V, V8V, S8V 2 resistors 4 resistors 4 3 8 7 6 5 1 2 1 2 3 4 Protective coating 2HV Alumina substrate Thick film resistive element 8 resistors Electrode (Outer) Electrode (Between) 16 15 14 13 12 11 10 9 1 8 Electrode (Inner) 2 3 4 5 6 7 Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Mar. 2008 Chip Resistor Array Dimensions in mm (not to scale) (1) Convex Terminal type EXB14V, 24V, 34V EXB28V, 38V A2 G P T P L G B B G W W G B A1 B A1 T L EXB2HV G B W G B A1 A2 P T L Dimensions (mm) Type (inches) L W T A1 A2 B P G Mass (Weight) [g/1000 pcs.] EXB14V (02012) 0.80 0.10 0.60 0.10 0.35 0.10 0.35 0.10 -- 0.15 0.10 (0.50) 0.15 0.10 0.5 EXB24V (04022) 1.00 0.10 1.00 0.10 0.35 0.10 0.40 0.10 -- 0.18 0.10 (0.65) 0.25 0.10 1.2 EXB28V (04024) 2.00 0.10 0.10 0.10 0.10 0.10 (0.50) 0.25 0.10 2.0 EXB2HV (04028) 3.80 0.10 1.60 0.10 0.45 0.10 0.35 0.10 0.30 0.10 (0.50) 0.30 0.10 9.0 EXB34V (06032) 1.60 0.20 1.60 0.15 0.50 0.10 0.65 0.15 (0.80) 0.30 0.20 3.5 3.20 0.20 1.60 0.15 0.50 0.10 0.65 0.15 0.35 0.20 EXB38V (06034) 1.00 0.35 0.45 0.35 0.10 0.20 0.35 0.10 -- 0.45 0.15 0.30 0.20 0.30 0.20 (0.80) (2) Concave Terminal type EXBV4V EXBN8V, V8V, S8V A2 P L G G B B G W W G B A1 B A1 7.0 ( ) Reference P T T L Dimensions (mm) Type (inches) L W T A1 A2 B P G Mass (Weight) [g/1000 pcs.] EXBN8V (04024) 2.00 0.10 1.00 0.10 0.45 0.10 0.30 0.10 0.30 0.10 0.20 0.15 (0.50) 0.30 0.15 3.0 EXBV4V (06032) 1.60 +0.20 -0.10 1.60 +0.20 -0.10 0.60 0.10 0.60 0.10 0.30 0.15 (0.80) 0.45 0.15 5.0 EXBV8V (06034) 3.20 +0.20 -0.10 1.60 +0.20 -0.10 0.60 0.10 0.60 0.10 0.30 0.15 (0.80) 0.45 0.15 10 EXBS8V (08054) 5.08+0.20 -0.10 0.50 0.15 (1.27) 0.55 0.15 30 2.20 +0.20 -0.10 0.70 0.20 0.80 0.15 -- 0.60 0.10 0.80 0.15 ( ) Reference (3) Flat Terminal type G EXB18V A2 B G W B A1 P T L Dimensions (mm) Type (inches) L W T A1 A2 B P G EXB18V (02014) 1.40 0.10 0.60 0.10 0.35 0.10 0.20 0.10 0.20 0.10 0.10 0.10 (0.40) 0.20 0.10 Mass (Weight) [g/1000 pcs.] 1.0 ( ) Reference Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Feb. 2006 Chip Resistor Array Ratings Item Specifications Item Resistance Range 10 to 1 M:E24 series Resistance Tolerance J: 5 % 14V,18V (1) Limiting Element Voltage 2HV Max. Rated Continuous 24V,28V,N8V,38V,34V,V4V,V8V Working Voltage S8V 4 terminal 14V,24V,V4V,34V ( ) Number of Terminals 18V,28V,N8V,38V,V8V,S8V 8 terminal 16 terminal 14V,24V,V4V,34V 2 terminal Number of Resistors 18V,28V,N8V,38V,V8V,S8V 4 terminal 2HV 8 terminal 14V,28V,N8V 0.031 W/element 18V 0.031 W/element (0.1 W/package) Power Rating at 70 C 24V,V4V,34V,V8V,38V 0.063 W/element S8V 0.1 W/element 2HV 0.063 W/element (0.25 W/package) Max. Over-load Voltage (2) 12.5 V 25 V 50 V 100 V 14V,18V 25 V 2HV 50 V 24V,28V,N8V,38V,34V,V4V,V8V 100 V 200 V S8V T.C.R. 20010 -6/C(ppm/C) Category Temperature Range (Operating Temperature Range) -55 C to 125 C 0.5 A 14V,18V Jumper Array 2HV Specifications Rated Current 2HV,24V,28V,N8V,38V,34V,V4V,V8V 1 A S8V 2A 14V,18V 1A Max, Overload Current 2HV,24V,28V,N8V,38V,34V,V4V,V8V 2 A 4A S8V (1) Rated Continuous Working Voltage (RCWV) shall be determined from RCWV=Power Rating Resistance Value, or Limiting Element Voltage (max. RCWV) listed above, whichever less. (2) Overload (Short-time Overload) Test Voltage (SOTV) shall be determined from SOTV=2.5 Power Rating or max. Overload (Voltage) listed above whichever less. Power Derating Curve For resistors operated in ambient temperature above 70 C, power rating shall be derated in accordance with the figure on the right. Rated Load (%) 100 -55 C 70 C 80 60 40 20 0 -60 -40 -20 0 125 C 20 40 60 80 100 120 140 160 180 Ambient Temperature (C) Packaging Methods (Taping) Standard Quantity Type Kind of Taping Pitch (P1) Quantity 2 mm 10000 pcs./reel EXB14V, 18V EXB24V, 28V EXBN8V EXB2HV Punched Carrier Taping EXB34V, 38V 4 mm EXBV4V, V8V EXBS8V Embossed Carrier Taping 5000 pcs./reel 2500 pcs./reel Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Feb. 2006 Chip Resistor Array Carrier Tape Unit (mm) Punched Carrier Embossed Carrier P1 P2 P0 B W F E D0 P1 (2 mm pitch) A T T D1 (Only Emboss) Type A EXB14V B 0.70 +0.10 -0.05 EXB18V W F E 1.20 0.10 EXB28V EXBN8V 4.10 0.15 EXB34V 1.95 0.20 1.95 0.15 1.95 0.20 EXBV8V 3.60 0.20 2.80 0.20 D1 T 0.520.05 2.00 0.10 8.00 0.20 3.50 0.05 1.75 0.10 3.60 0.20 EXBV4V EXBS8V D 0 P0 2.20 0.10 EXB2HV EXB38V P2 1.60 0.10 1.20 0.10 EXB24V P1 0.95+0.05 -0.10 2.00 0.05 4.00 0.10 1.50 +0.10 -0 _ 0.70 0.05 4.00 0.10 0.840.05 5.70 0.20 12.00 0.30 5.50 0.20 1.60 max. 1.50 +0.10 -0 Taping Reel Unit (mm) T B C A A Type EXB14V,18V EXB24V,28V EXBN8V EXB2HV EXB34V,38V EXBV4V,V8V EXBS8V B C 180.0 +0 13.0 1.0 -3.0 60 min. W T 9.0 1.0 11.41.0 13.0 1.0 15.42.0 W Land pattern design Recommended land pattern design for Network chip is shown below. f d a Conductor a Solder Resist b c b c (Not to scale) Type Dimensions Unit (mm) (Not to scale) Type Dimensions a b c d a b c 14V 0.30 0.30 0.30 0.80 to 0.90 18V 24V 0.5 0.35 to 0.40 0.30 1.4 to 1.5 V4V,V8V 0.7 to 0.9 0.4 to 0.45 0.4 to 0.45 34V,38V 0.7 to 0.9 0.4 to 0.5 S8V 1 to 1.2 Unit (mm) f 0.20 to 0.30 0.15 to 0.20 0.15 to 0.20 0.80 to 0.90 2 to 2.4 0.4 to 0.5 2.2 to 2.6 0.5 to 0.75 0.5 to 0.75 3.2 to 3.8 Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Jun. 2008 Chip Resistor Array f a f b Type 28V N8V d c d c d a b (Not to scale) Dimensions Unit (mm) a b c d f 0.40 0.525 0.25 0.25 1.40 0.45 to 0.50 0.35 to 0.38 0.25 0.25 1.40 to 2.00 b Type 2HV d c d c d c d c d c d c d a 1.00 b (Not to scale) Dimensions Unit (mm) b c d f 0.425 0.25 0.25 2.00 Recommended Soldering Conditions Recommendations and precautions are described below. Recommended soldering conditions for reflow * Reflow soldering shall be performed a maximum of two times. * Please contact us for additional information when used in conditions other than those specified. * Please measure the temperature of the terminals and study every kind of solder and printed circuit board for solderability before actual use. Temperature Peak Preheating Heating For soldering (Example : Sn/Pb) Preheating Main heating Peak Temperature 140 C to 160 C Above 200 C 235 5 C Time 60 s to 120 s 30 s to 40 s max. 10 s For lead-free soldering (Example : Sn/Ag/Cu) Temperature Time Preheating 150 C to 180 C 60 s to 120 s Main heating Above 230 C 30 s to 40 s Peak max. 260 C max. 10 s Time Flow soldering * We do not recommend flow soldering, because a solder bridge may form. Safety Precautions The following are precautions for individual products. Please also refer to the precautions common to Fixed Resistors shown on page ER3 of this catalog. 1. Take measures against mechanical stress during and after mounting of Chip Resistor Array (hereafter called the resistors) so as not to damage their electrodes and protective coatings. Be careful not to misplace the resistors on the land patterns. Otherwise, solder bridging may occur. 2. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations of the resistors when installed in your products before use. Never exceed the rated power. Otherwise, the performance and/or reliability of the resistors may be impaired. 3. Do not use halogen-based or other high-activity flux. Otherwise, the residue may impair the resistors' performance and/or reliability. 4. When soldering with a soldering iron, never touch the resistors' bodies with the tip of the soldering iron. When using a soldering iron with a high temperature tip, finish soldering as quickly as possible (within three seconds at 350 C max.). 5. As the amount of applied solder becomes larger, the mechanical stress applied to the resistors increases, causing problems such as cracks and faulty characteristics. Avoid applying an excessive amounts of solder. 6. Do not apply shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the resistors' protective coatings and bodies may be chipped, affecting their performance. 7. Avoid excessive bending of printed circuit boards in order to protect the resistors from abnormal stress. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Feb. 2006 Safety Precautions (Common precautions for Fixed Resistors) * When using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the specifi cations with us in advance. The design and specifi cations in this catalog are subject to change without prior notice. * Do not use the products beyond the specifications described in this catalog. * This catalog explains the quality and performance of the products as individual components. Before use, check and evaluate their operations when installed in your products. * Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment where a defect in these products may cause the loss of human life or other significant damage, such as damage to vehicles (au to mo bile, train, vessel), traffi c lights, medical equipment, aerospace equipment, elec tric heating appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment. Systems equipped with a protection circuit and a protection device Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault (1) Precautions for use * These products are designed and manufactured for general and stan dard use in general elec tron ic equipment (e.g. AV equipment, home electric ap plianc es, offi ce equipment, information and com mu ni cation equipment) * These products are not intended for use in the following special conditions. Before using the products, carefully check the effects on their quality and performance, and determine whether or not they can be used. 1. In liquid, such as water, oil, chemicals, or organic solvent 2. In direct sunlight, outdoors, or in dust 3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2 4. Electric Static Discharge (ESD) Environment These components are sensitive to static electricity and can be damaged under static shock (ESD). Please take measures to avoid any of these environments. Smaller components are more sensitive to ESD environment. 5. Electromagnetic Environment Avoid any environment where strong electromagnetic waves exist. 6. In an environment where these products cause dew condensation 7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with resin or other materials * These products generate Joule heat when energized. Carefully position these products so that their heat will not affect the other components. * Carefully position these products so that their temperatures will not exceed the category temperature range due to the effects of neighboring heat-generating components. Do not mount or place heat-generating components or inflammables, such as vinyl-coated wires, near these products . * Note that non- cleaning solder, halogen-based highly active fl ux, or water-soluble fl ux may deteriorate the performance or reliability of the products. * Carefully select a fl ux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water residues. Otherwise, the insulation performance may be deteriorated. (2) Precautions for storage The performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your company, provided that they remain packed as they were when delivered and stored at a temperature of 5 C to 35 C and a relative humidity of 45 % to 85 %. Even within the above guarantee periods, do not store these products in the following conditions. Otherwise, their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials) may be deformed or deteriorated, resulting in mounting failures. 1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2 2. In direct sunlight <Package markings> Package markings include the product number, quantity, and country of origin. In principle, the country of origin should be indicated in English. Oct. 2007 - ER3 -