sensing.honeywell.com 5
eliminating the need to service or
replace the sensor during its application
life. Industry-leading Total Error Band
provides the sensor’s true accuracy
over a compensated temperature
range of 0°C to 50°C [32°F to 122°F],
eliminating individual sensor testing
and calibration (which can increase
manufacturing time and process)
supporting system accuracy and warranty
requirements, helping optimize system
uptime, and providing excellent sensor
interchangeability. Industry-leading
accuracy reduces software needed to
correct system inaccuracies, minimizing
system design time, supporting system
accuracy and warranty requirements,
and helping to optimize system uptime.
High burst pressures allow the sensor to
endure a wide range of conditions while
maintaining a high level of sensitivity
which measures even the smallest
change in pressure, simplifying the
design process. High working pressure
ranges allow the sensors to be used
continuously well above the calibrated
pressure range. Modular, flexible
design with many package styles (with
the same industry-leading stability),
pressure ports, and options simplify
integration into the device manufacturer’s
application. Onboard signal conditioning
typically allows for the removal of signal
conditioning components from the
PCB, reducing costs and simplifying
production processes. Meets IPC/JEDEC
J-STD-020D.1 Moisture Sensitivity Level
1 requirements which allows the customer
to avoid the thermal and mechanical
damage during solder reflow attachment
and/or repair that lesser rated products
would incur, and allows unlimited floor
life when stored as specified (<30 ºC/85
%RH), simplifying storage and reducing
scrap. Customers may position the
sensor in the most optimal point in the
system, eliminating concern for positional
effects. Reduced susceptibility to
application-specific vibration that occurs
with changes in pressure minimizes
inaccurate pressure readings. Custom
calibration typically allows for the removal
of additional components associated
with signal conditioning from the PCB,
reducing PCB size as well as costs often
associated with those components.
Internal diagnostic functions increase
system reliability. Extremely low power
consumption (less than 10 mW, typ.),
provides extended battery life, and
promotes energy efficiency. I2C- or SPI-
compatible 14-bit digital output (min.
12-bit sensor resolution) accelerates
performance through reduced conversion
requirements and the convenience of
direct interface to microprocessors or
microcontrollers; analog output also
available. Miniature 10 mm x 10 mm
[0.39 in x 0.39 in] package is very small
when compared to most board mount
pressure sensors. Potential applications
include medical (ventilators, anesthesia
machines, spirometers, nebulizers,
hospital room air pressure) and industrial
(VAV (Variable Air Volume) control, static
duct pressure, clogged HVAC (Heating,
Ventilation, and Air Conditioning) filter
detection, HVAC transmitters indoor air
quality).
TruStability™ SSC Series.
Features: Proprietary Honeywell
technology • Industry-leading long-term
stability, Total Error Band, and accuracy
• High burst pressures • High working
pressure ranges • Industry-leading
flexibility • Excellent repeatability
• Onboard signal conditioning • Wide
variety of pressure ranges • Meets IPC/
JEDEC J-STD-020D.1 Moisture Sensitivity
Level 1 requirements • Insensitive
to mounting orientation • Custom
calibration • Insensitive to vibration
• Internal diagnostic functions • Energy
efficient • I2C- or SPI-compatible digital
output or analog output • Small size •
RoHS compliant • Protected by multiple
global patents • Intended for use with
non-corrosive, non-ionic working fluids
Benefits: Proprietary Honeywell
technology combines high sensitivity with
high overpressure and burst pressure
to give the customer more flexibility
in sensor implementation and reduce
the customer design requirements for
protecting the sensor without sacrificing
the ability to sense very small changes
in pressure. Industry-leading long-term
stability minimizes system calibration
needs, maximizes system performance,
and helps support system uptime
by eliminating the need to service or
replace the sensor during its application
life. Industry-leading Total Error Band
provides the sensor’s true accuracy
over a compensated temperature range
of -20°C to 85°C [-4°F to 185°F],
eliminating individual sensor testing
and calibration (which can increase
manufacturing time and process)
supporting system accuracy and warranty
requirements, helping optimize system
uptime, and providing excellent sensor
interchangeability. Industry-leading
accuracy reduces software needed to
correct system inaccuracies, minimizing
system design time, supporting system
accuracy and warranty requirements,
and helping to optimize system uptime.
High burst pressures allow the sensor to
endure a wide range of conditions while
maintaining a high level of sensitivity
which measures even the smallest
change in pressure, simplifying the
design process. High working pressure
ranges allow the sensors to be used
continuously well above the calibrated
pressure range. Modular, flexible
design with many package styles (with
the same industry-leading stability),
pressure ports, and options simplify
integration into the device manufacturer’s
application. Onboard signal conditioning
typically allows for the removal of signal
conditioning components from the
PCB, reducing costs and simplifying
production processes. Meets IPC/JEDEC
J-STD-020D.1 Moisture Sensitivity Level
1 requirements which allows the customer
to avoid the thermal and mechanical
damage during solder reflow attachment
and/or repair that lesser rated products
would incur, and allows unlimited floor
life when stored as specified (<30 ºC/85
%RH), simplifying storage and reducing
scrap. Customers may position the
sensor in the most optimal point in the
system, eliminating concern for positional
effects. Reduced susceptibility to
application-specific vibration that occurs
with changes in pressure minimizes
inaccurate pressure readings. Custom
calibration typically allows for the removal
of additional components associated
with signal conditioning from the PCB,