2007-04-19
1
BAS21...
Silicon Switching Diode
• For high-speed switching applications
• High breakdown voltage
• Pb-free (RoHS compliant) package1)
• Qualified according AEC Q101
BAS21 BAS21-03W BAS21U
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Type Package Configuration Marking
BAS21
BAS21-03W
BAS21U
SOT23
SOD323
SC74
single
single
parallel triple
JSs
D
JSs
Maximum Ratings at TA = 25°C, unless otherwise specified
Parameter Symbol Value Unit
Diode reverse voltage VR200 V
Peak reverse voltage VRM 250
Forward current IF250 mA
Peak forward current IFM 625
Peak forward current IFM 625 mA
Surge forward current, t = 10 µs IFS 4 A
Non-repetitive peak surge forward current IFSM -
Total power dissipation
BAS21, TS ≤ 70°C
BAS21-03W, TS ≤ 124°C
BAS21U, TS ≤ 122°C
Ptot
350
250
250
mW
Junction temperature Tj150 °C
Storage temperature Tstg -65 ... 150
1Pb-containing package may be available upon special request
2007-04-19
2
BAS21...
Thermal Resistance
Parameter Symbol Value Unit
Junction - soldering point1)
BAS21
BAS21-03W
BAS21U
RthJS
≤ 230
≤ 105
≤ 110
K/W
Electrical Characteristics at TA = 25°C, unless otherwise specified
Parameter Symbol Values Unit
min. typ. max.
DC Characteristics
Breakdown voltage
I(BR) = 100 µA V(BR) 250 - - V
Reverse current
VR = 200 V
VR = 200 V, TA = 150 °C
IR
-
-
-
-
0.1
100
µA
Forward voltage
IF = 100 mA
IF = 200 mA
VF
-
-
-
-
1
1.25
V
AC Characteristics
Diode capacitance
VR = 0 V, f = 1 MHz CT- - 5 pF
Reverse recovery time
IF = 30 mA, IR = 30 mA, measured at IR = 3mA,
RL = 100 Ω
trr - - 50 ns
Test circuit for reverse recovery time
EHN00018
Oscillograph
Ι
F
D.U.T.
Puls generator: tp = 1µs, D = 0.05
tr = 0.6ns, Ri = 50Ω
Oscillograph: R = 50Ω , tr = 0.35ns, C ≤ 1pF
1For calculation of RthJA please refer to Application Note Thermal Resistance
2007-04-19
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BAS21...
Reverse current IR = ƒ (TA)
VR = 200V
10 0 50 100 150
BAS 19...21 EHB00027
µ
T
A
Ι
R
˚C
0
-2
5
5
5
max
typ.
A
10
-1
10
10
1
10
2
Forward Voltage VF = ƒ (TA)
IF = Parameter
0.00
BAS 19...21 EHB00029
T
A
VF
˚C
0.5
1.0
V
1.5
50 100 150
F
Ι
= 625 mA
mA250
100 mA
10 mA
Forward current IF = ƒ (VF)
0.0
0
EHB00028BAS 19...21
Ι
V
F
F
100
200
300
400
500
600
700
mA
800
0.5 1.0 V 1.5
Forward current IF = ƒ (TS)
BAS21-03W
0 15 30 45 60 75 90 105 120 °C 150
TS
0
50
100
150
200
mA
300
IF
2007-04-19
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BAS21...
Forward current IF = ƒ (TS)
BAS21U
0 15 30 45 60 75 90 105 120 °C 150
TS
0
50
100
150
mA
250
IF
Permissible Puls Load RthJS = ƒ (tp)
BAS21
10 -6 10 -5 10 -4 10 -3 10 -2 10 0
stP
-1
10
0
10
1
10
2
10
3
10
RthJS
D = 0.5
0.2
0.1
0.05
0.02
0.01
0.005
0
Permissible Pulse Load
IFmax/ IFDC = ƒ (tp)
BAS21
10 -6 10 -5 10 -4 10 -3 10 -2 10 0
stP
0
10
1
10
2
10
IFmax/IFDC
D = 0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
Permissible Puls Load RthJS = ƒ (tp)
BAS21-03W
10 -6 10 -5 10 -4 10 -3 10 -2 10 0
stP
-1
10
0
10
1
10
2
10
3
10
K/W
RthJS
D=0.5
0.2
0.1
0.05
0.02
0.01
0.005
0
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BAS21...
Permissible Pulse Load
IFmax/ IFDC = ƒ (tp)
BAS21-03W
10 -6 10 -5 10 -4 10 -3 10 -2 10 0
stP
0
10
1
10
2
10
IFmax/IFDC
D=0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
Permissible Pulse Load
IFmax/ IFDC = ƒ (tp)
BAS21U
10 -6 10 -5 10 -4 10 -3 10 -2 10 0
stP
0
10
1
10
2
10
IFmax/IFDC
D=0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
Permissible Puls Load RthJS = ƒ (tp)
BAS21U
10 -6 10 -5 10 -4 10 -3 10 -2 10 0
stP
-1
10
0
10
1
10
2
10
3
10
K/W
RthJS
D=0.5
0.2
0.1
0.05
0.02
0.01
0.005
0
2007-04-19
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BAS21...
Package SC74
Package Outline
Foot Print
Standard Packing
0.5
0.95
1.9
2.9
546
321
1.1 MAX.
(0.35)
(2.25)
±0.2
2.9 B
0.2
+0.1
-0.05
0.35
Pin 1
marking
M
B6x
0.95
1.9
0.15
-0.06
+0.1
1.6
10˚ MAX.
A
±0.1
2.5
0.25
10˚ MAX.
±0.1
±0.1
A0.2
M
0.1 MAX.
2.7
4
3.15
Pin 1
marking
8
0.2
1.15
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
For symmetric types no defined Pin 1 orientation in reel.
Manufacturer
2005, June
Date code (Year/Month)
BCW66H
Type code
Pin 1 marking
Laser marking
Marking Layout (Example)
Small variations in positioning of
Date code, Type code and Manufacture are possible.
2007-04-19
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BAS21...
Package SOD323
Package Outline
Foot Print
Marking Layout (Example)
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
BAR63-03W
Type code
Cathode marking
Laser marking
0.80.8
0.6
1.7
marking
Cathode
±0.2
2.5
0.25
0.3
1
-0.05
M
A
+0.1
+0.2
2
1.25
-0.1
+0.05
-0.2
1.7
0.3
0.15
-0.06
+0.1
0
±0.05
+0.2
-0.1
A
0.9
+0.2
-0.1
±0.15
0.45
0.2
4
8
2.9
1
2
1.35
0.65
Cathode
marking
2007-04-19
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BAS21...
Package SOT23
Package Outline
Foot Print
Marking Layout (Example)
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
EH
s
BCW66
Type code
Pin 1
0.8
0.9 0.91.3
0.8 1.2
0.25 MBC
1.9
-0.05
+0.1
0.4
±0.1
2.9
0.95
C
B
0...8˚
0.2 A
0.1 MAX.
10˚ MAX.
0.08...0.15
1.3
±0.1
10˚ MAX.
M
2.4
±0.15
±0.1
1
A
0.15 MIN.
1)
1) Lead width can be 0.6 max. in dambar area
12
3
3.15
4
2.65
2.13
0.9
8
0.2
1.15
Pin 1
Manufacturer
2005, June
Date code (YM)
2007-04-19
9
BAS21...
Edition 2006-02-01
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2007.
All Rights Reserved.
Attention please!
The information given in this dokument shall in no event be regarded as a guarantee
of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any
examples or hints given herein, any typical values stated herein and/or any information
regarding the application of the device, Infineon Technologies hereby disclaims any
and all warranties and liabilities of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices
please contact your nearest Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest
Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or
systems with the express written approval of Infineon Technologies, if a failure of
such components can reasonably be expected to cause the failure of that
life-support device or system, or to affect the safety or effectiveness of that
device or system.
Life support devices or systems are intended to be implanted in the human body,
or to support and/or maintain and sustain and/or protect human life. If they fail,
it is reasonable to assume that the health of the user or other persons
may be endangered.
