INTEGRATED CIRCUITS DIVISION
www.ixysic.com
DS-CPC1822-R03 1
CPC1822
4V Output Solar Cell
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Part # Description
CPC1822N 8-Pin Clear Molded SOIC Package (100/Tube)
CPC1822NTR 8-Pin Clear Molded SOIC Package (2000/Reel)
Parameter Rating Units
Open Circuit Voltage 4 V
Short Circuit Current 50 uA
* Direct sunlight (Approximately 6000 lux)
Applications
Features
Description
Ordering Information
Pin Configuration
• Portable Electronics
• Solar Battery Chargers
• Battery Operated Equipment
• Consumer Electronics
• Off-Grid Installation
• Wireless Sensors and Detection
• Flame Detection
• Self Powered Sunlight/ Light Detection
• Self Powered Products
• Remote Installation
• 4V Output
• Triggers with Natural Sunlight
• Provides True Wireless Power
• No EMI/RFI Generation
• Wave Solderable
• Replacement of Discrete Components
• Solid State Reliability
• Small 8-Pin Surface Mount SOIC
The CPC1822 is a monolithic photovoltaic string of
solar cells with switching circuitry. When operating
in sunlight or a bright artificial light environment the
optical energy will activate the cell array and generate
a voltage at the output. The solar cells are capable
of generating a floating source voltage and current
sufficient to drive and power CMOS ICs, logic gates
and/or provide “trickle charge” for battery applications.
1
45V-
V+
8
2
3
7
6
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
2R03
CPC1822
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Absolute Maximum Ratings
Electrical Characteristics
PERFORMANCE DATA*
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
Parameter Ratings Units
Reverse Voltage 10 V
Operational Temperature -40 to +85 °C
Storage Temperature -40 to +125 °C
Electrical absolute maximum ratings are at 25°C
Parameter Conditions Symbol Min Typ Max Units
Output Characteristics @ 25°C
Open Circuit Voltage Direct Sun (6000 lux) VOC - 4.2 - V
High Intensity Lamp VOC - 4.5 - V
Short Circuit Current Direct Sun (6000 lux) ISC -50 -µA
Normalized Open Circuit Output
Voltage vs. Light Intensity
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
00246 8
,I
G
HT)NTENSIT
Y
LUXs
10
.ORMALIZED/UTPUT6OLTAGE6
Normalized Short Circuit
Output Current vs. Light Intensity
2.50
2.25
2.00
1.75
1.50
1.25
1.00
0.75
0.50
0.25
0.00
0246 8
,IGHT)NTENSITYLUXs
Normalized Output Current (P!
10
Normalized Open Circuit Output Voltage
vs. Incident Angle of Light
to Photodiode Surface
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0 204060 80
In
c
i
de
n
t
An
g
l
e
(
D
eg
r
ees)
100
Normalized Output Voltage (V)
Normalized Short Circuit Output Current
vs. Incident Angle of Light to
Photodiode Surface
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0 204060 80
Incident Angle (Degrees)
Normalized Output Current (PA)
100
INTEGRATED CIRCUITS DIVISION
CPC1822
www.ixysic.com 3
R03
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Rating
CPC1822N MSL 3
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device Maximum Temperature x Time
CPC1822N 260ºC for 30 seconds
Board Wash
Clare recommends the use of no-clean flux formulations. However, board washing to remove flux residue is
acceptable, and the use of a short drying bake may be necessary. Chlorine-based or Fluorine-based solvents or
fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used.
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INTEGRATED CIRCUITS DIVISION
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC1822-R03
©Copyright 2012, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/17/2012
For additional information please visit our website at: www.ixysic.com
CPC1822
4
MECHANICAL DIMENSIONS
8-Pin SOIC Package Recommended PCB Land Pattern
Dimensions
mm
(inches)
PIN 1
0.33 - 0.51
(0.013 - 0.020)
5.80 - 6.20
(0.23 - 0.24)
3.80 - 4.00
(0.15 - 0.16)
1.27 TYP
(0.05 TYP)
0.40 - 1.27
(0.016 - 0.050)
0.19 - 0.25
(0.008 - 0.010)
1.35 - 1.75
(0.053 - 0.069)
0.10 - 0.25
(0.004 - 0.010)
4.80 - 5.00
(0.19 - 0.20)
0.394 - 0.648
(0.016 - 0.026)
1.27
(0.050)
5.40
(0.213)
1.55
(0.061)
0.60
(0.024)
NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2
Dimensions
mm
(inches)
Tape and Reel Packaging for 8-Pin SOIC-N Surface Mount Package
Top Cover
Tape
P = 8.00 ± 0.10
(0.315 ± 0.004)
W = 12.00 ± 0.30
(0.472 ± 0.012)
B0 = 5.30 ± 0.10
(0.209 ± 0.004)
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
A0 = 6.50 ± 0.10
(0.256 ± 0.004)
330.2 DIA.
(13.00 DIA.)
User Direction of Feed
K0= 2.10 ± 0.10
(0.083 ± 0.004)
5.50 ± 0.10
(0.217 ± 0.004)
2.00 ± 0.10
(0.079 ± 0.004)
4.00 ± 0.10
(0.157 ± 0.004) 1.75 ± 0.10
(0.069 ± 0.004)
