RClamp0564P
Final Datasheet Rev 3.2
Mar 14, 2017
www.semtech.com 1
Semtech
RClamp0564P
PROTECTION PRODUCTS
Features
• High ESD Withstand Voltage
IEC 61000-4-2 (ESD) 10kV (contact)
• Ultra-Low Capacitance: 0.17pF Typical
• Very Small PCB Area
• Protects Four High-Speed Data Lines
• Working Voltage: 5V
• Low Dynamic Resistance: 0.65 Ohms
• Large Operating Bandwidth: 12GHz
• Solid-State Silicon-Avalanche Technology
Mechanical Characteristics
• SGP2010N5 Package
• Pb-Free, Halogen Free, RoHS/WEEE Compliant
• Nominal Dimensions: 2.0 x 1.0 x 0.50 mm
• Lead Pitch: 0.40mm
• Lead Finish: NiPdAu
• Marking : Marking Code
• Packaging : Tape and Reel
Applications
• HDMI 1.4, HDMI1.4b and HDMI 2.0
• DisplayPort
• USB 3.0 and USB 3.1
• USB Type-C
• Thunderbolt
• MIPI / MDDI
Nominal Dimensions in mm
Nominal Dimensions Schematic
Femto Farad RailClamp®
4-Line, 170fF ESD Protection
Description
RClamp®0564P is an ultra low capacitance ESD
protection device specically designed to protect high-
speed dierential lines. It oers desirable characteristics
for board level protection including fast response time,
low operating and clamping voltage, and no device
degradation.
RClamp0564P features extremely good ESD protection
characteristics highlighted by low peak ESD clamping
voltage, and high ESD withstand voltage (+/-10kV
contact per IEC 61000-4-2). RClamp0564P is designed
to minimize both the ESD peak clamping and the TLP
clamping. Package inductance is reduced at each
pin resulting in lower peak ESD clamping voltage.
RClamp0564P has a typical capacitance of 0.17pF
allowing it to be used in high bandwidth applications
such as HDMI 2.0 4K/2K, Thunderbolt, and USB 3.1. Each
device will protect four high-speed data lines operating
up to 5 volts.
RClamp0564P is in a 5-pin SGP2010N5 package
measuring 2.0 x 1.0mm with a nominal height of
0.50mm. The leads have a nominal pin-to-pin pitch of
0.40mm. Flow- through package design simplies PCB
layout and maintains signal integrity on high-speed lines.
2.00
0.50
1.00
12
0.40 BSC
Pin 3
GND
RClamp0564P
Final Datasheet Rev 3.2
Mar 14, 2017
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Absolute Maximum Ratings
Electrical Characteristics (T=25OC unless otherwise specied)
Rating Symbol Value Units
Peak Pulse Current (tp = 8/20µs) IPP 3 A
ESD per IEC 61000-4-2 (Contact)(1)
ESD per IEC 61000-4-2 (Air)(2) VESD
±10
±15 kV
Operating Temperature TJ-40 to +85 OC
Storage Temperature TSTG -55 to +150 OC
Parameter Symbol Conditions Min. Typ. Max. Units
Reverse Stand-O Voltage VRWM -40OC to 85OC 5 V
Reverse Breakdown Voltage VBR It = 10mA -40OC to 85OC 6.5 9.5 10.5 V
Holding Current IH100 mA
Reverse Leakage Current IRVRWM = 5V T = 25OC 1 50 nA
T = 85OC 10 150 nA
Clamping Voltage3VCIPP = 3A, tp = 8/20µs 4 V
ESD Clamping Voltage4VCIPP = 4A, tp = 0.2/100ns (TLP) 5.5 V
ESD Clamping Voltage4VCIPP = 16A, tp = 0.2/100ns (TLP) 13.5 V
Dynamic Resistance4, 5 RDYN tp = 0.2/100ns (TLP) 0.65 Ohms
Junction Capacitance CJVR = 0V, f = 1MHz T = 25OC 0.17 0.20 pF
Cuto Frequency FC-3dB 12 GHz
Notes:
(1) Measured with a 40dB attenuator, 50 Ohm scope input impedance, 2GHz bandwidth. ESD gun return path connected to Ground Refer-
ence Plane (GRP)
(2) In-System ESD withstand voltage
(3) Measured using a 1.2/50us voltage, 8/20us current combination waveform. Clamping is dened as the peak voltage across the device
after the device snaps back to a conducting state.
(4) Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns.
(5) Dynamic resistance calculated from ITLP = 4A to ITLP = 16A
RClamp0564P
Final Datasheet Rev 3.2
Mar 14, 2017
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Typical Characteristics
ESD Clamping (+8kV Contact per IEC 61000-4-2) ESD Clamping (-8kV Contact per IEC 61000-4-2)
TLP IV Curve - Positive Pulse
Capacitance vs. Reverse Voltage
-2
0
2
4
6
8
10
12
14
16
0 2 4 6 8 10 12 14
TLP Current (A)
Clamping Voltage (V)
TransmissionLinePulseTest
(TLP)Settings:
tp=100ns,tr=0.2ns,
ITLP andVTLP averagingwindow:
t1=70nstot2=90ns
0
0.02
0.04
0.06
0.08
0.1
0.12
0.14
0.16
0.18
0.2
0123456
Junction Capacitance - C
J(pF)
Voltage (V)
f=1MHz
-16
-14
-12
-10
-8
-6
-4
-2
0
2
-14 -12 -10 -8 -6 -4 -2 0
TLP Current (A)
Clamping Voltage (V)
TransmissionLinePulseTest
(TLP)Settings:
tp=100ns,tr=0.2ns,
ITLP andVTLP averagingwindow:
t1=70nstot2=90ns
‐3
‐2.5
‐2
‐1.5
‐1
‐0.5
0
0.01 0.1 1 10
InsertionLoss‐ IL(dB)
Frequency(GHz)
0
20
40
60
80
100
120
140
-10 0 10 20 30 40 50 60 70 80
Clamping Voltage - VC(V)
Time (ns)
Measuredwith50Ohmscopeinput
impedance,2GHzbandwidth.Corrected
for50Ohm,40dBattenuator.ESDgun
returnpathconnectedtoESDgroundplane.
-140
-120
-100
-80
-60
-40
-20
0
-10 0 10 20 30 40 50 60 70 80
ESD Clamping Voltage (V)
Time (ns)
Measuredwith50Ohmscopeinput
impedance,2GHzbandwidth.Corrected
for50Ohm,40dBattenuator.ESDgun
returnpathconnectedtoESDgroundplane.
Measuredwith50Ohmscopeinput
impedance,2GHzbandwidth.Corrected
for50Ohm,40dBattenuator.ESDgun
returnpathconnectedtoESDgroundplane.
TLP IV Curve - Negative Pulse
Insertion Loss (S21)
RClamp0564P
Final Datasheet Rev 3.2
Mar 14, 2017
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HDMI Type A Connector
RClamp0564P
RClamp0564P
RClamp7538P
HPD
+5V
SDA
SCL
HEC_DAT
CEC
CLK-
CLK+
D0-
D0+
D1-
D1+
D2-
D2+
Horizontal Scale: 28ps/div
Vertical Scale: 200mV/div
Data Rate: 5.94 Gb/s
Mask: HDMI 2.0
Horizontal Scale: 28ps/div
Vertical Scale: 200mV/div
Data Rate: 5.94 Gb/s
Mask: HDMI 2.0
Application Information
HDMI 2.0 Protection Example 5.94Gb/s Eye Diagram with RClamp0564P
5.94Gb/s Eye Diagram without RClamp0564P
A typical HDMI 2.0 protection solution is shown below.
RClamp0564P is used to protect two high-speed dif-
ferential data pairs. Line pairs are routed through pins
1, 5 and pins 3, 4. Ground connection is made at pin 2.
RClamp0564P has little aect on a 5.94Gb/s signal with
an HDMI 2.0 eye mask as shown in the eye diagrams
below. Two RClamp0564P are required to protect all four
clock and data dierential pairs. The remaining six lines
can also be protected using RClamp0564P. However,
since they are not as sensitive to capacitive loading as the
TMDS lines, a device such as RClamp7538P may be used
as shown.
Device Placement
Placement of the protection component is a critical ele-
ment for eective ESD suppression. TVS diodes should
be placed as close to the connector as possible to reduce
transient coupling to nearby traces. Ground connections
should be made directly to the ground plane using mi-
cro-vias. This reduces parasitic inductance in the ground
path and minimizes the clamping voltage seen by the
protected device.
HDMI 2.0 Interface Protection
HDMI 2.0 chips are constantly exposed to external ESD
and cable discharge threats. Adding external ESD protec-
tion is critical but can be challenging. Both electrical and
mechanical requirements must be considered. HDMI 2.0
provides the necessary bandwidth to support the higher
resolution and frame rates of Ultra HD. This is accom-
plished by increasing the data rate on each data lane
from 3.4 Gbps to 6 Gbps, which means the protection
device must present an extremely low capacitance to
preserve signal integrity. The external protection device
should also have good ESD protection properties includ-
ing low ESD peak clamping voltage and low dynamic
resistance. Mechanically, the package design should
allow the traces to easily ow through the package. This
is important since dierential pair trace lengths should
be matched to avoid signal skew.
Protection Solutions
RClamp0564P has been specically designed to protect
high-speed interfaces. It has a typical capacitance of
0.17pF and a ow through package design.
RClamp0564P
Final Datasheet Rev 3.2
Mar 14, 2017
www.semtech.com 5
Semtech
1
2
5
8
9
11
13
14
16
19
20
Lane 0 +
Lane 0 -
Lane 1 +
Lane 1 -
Lane 2 +
Lane 2 -
Lane 3 +
Lane 3 -
Config 1
Config 2
AUX +
AUX -
Hot Plug
Return
Power
GND
GND
GND
GND
GND
RClamp0564P
RClamp0564P
RClamp7538P DisplayPort
Connector
15
17
18
12
10
7
6
4
3
Application Information
DisplayPort Protection Example
Protection Solutions
RClamp0564P has been specically designed to protect
high-speed interfaces. It has a typical capacitance of
0.17pF and a ow through package design. A typical
DisplayPort protection solution is shown below.
RClamp0564P is used to protect two high-speed
dierential data pairs. Line pairs are routed through pins
1, 5 and pins 3, 4. Ground connection is made at pin 2.
Two RClamp0564P are required to protect all four clock
and data dierential pairs. The remaining six lines can
also be protected using RClamp0564P. However, since
they are not as sensitive to capacitive loading as the ML
lines, a device such as RClamp7538P may be used as
shown.
Device Placement
Placement of the protection component is a critical
element for eective ESD suppression. TVS diodes
should be placed as close to the connector as possible
to reduce transient coupling to nearby traces. Ground
connections should be made directly to the ground
plane using micro-vias. This reduces parasitic inductance
in the ground path and minimizes the clamping voltage
seen by the protected device.
DisplayPort Interface Protection
DisplayPort chips are constantly exposed to external
ESD and cable discharge threats. Adding external
ESD protection is critical but can be challenging.
Both electrical and mechanical requirements must
be considered. DisplayPort version 1.4 can use the
HBR3 transmission mode (32.4 Gbits/s) provides the
necessary bandwidth to support the higher resolution
and frame rates of Ultra HD. This is accomplished by
increasing the data rate on each data lane from 5.4
Gbps to 8.1 Gbps, which means the protection device
must present an extremely low capacitance to preserve
signal integrity. The external protection device should
also have good ESD protection properties including low
ESD peak clamping voltage and low dynamic resistance.
Mechanically, the package design should allow the
traces to easily ow through the package. This is
important since dierential pair trace lengths should be
matched to avoid signal skew.
RClamp0564P
Final Datasheet Rev 3.2
Mar 14, 2017
www.semtech.com 6
Semtech
Applications Information
Assembly Guidelines
The small size of this device means that some care must
be taken during the mounting process to insure reliable
solder joints. The gure at the right details Semtech’s
recommended mounting pattern. Recommended
assembly guidelines are shown in Table 1. Note that
these are only recommendations and should serve only
as a starting point for design since there are many factors
that aect the assembly process. Exact manufacturing
parameters will require some experimentation to get the
desired solder application. Semtech’s recommended
mounting pattern is based on the following design
guidelines:
Land Pattern
The recommended land pattern follows IPC standards and is
designed for maximum solder coverage. Detailed dimensions
are shown elsewhere in this document.
Solder Stencil
Stencil design is one of the key factors which will determine
the volume of solder paste which is deposited onto the land
pad. The area ratio of the stencil aperture will determine how
well the stencil will print. The area ratio takes into account the
aperture shape, aperture size, and stencil thickness. An area
ratio of 0.70 – 0.75 is preferred for the subject package. The
area ratio of a rectangular aperture is given as:
Area Ratio = (L * W )/ (2 * (L + W) * T)
Where:
L = Aperture Length
W = Aperture Width
T = Stencil Thickness
Semtech recommends a stencil thickness of 0.100mm for
this device. The stencil should be laser cut with electro-
polished nish. The stencil should have a positive taper of
approximately 5 degrees. Electro polishing and tapering
the walls results in reduced surface friction and better paste
release. For small pitch components, Semtech recommends
a square aperture with rounded corners for consistent solder
release. Due to the small aperture size, a solder paste with
Type 4 or smaller particles are recommended.
Recommended Mounting Pattern
All Dimensions are in mm.
Component
Land Pad. Stencil opening
0.200
0.400 0.025
0.650
0.025
0.200
2.000
0.300
1.000
0.800
Table 1 - Recommended Assembly Guidelines
Assembly Parameter Recommendation
Solder Stencil Design Laser Cut, Electro-Polished
Aperture Shape Rectangular with rounded
corners
Solder Stencil Thickness 0.100mm (0.004”)
Solder Paste Type Type 4 size sphere or smaller
Solder Reow Prole Per JEDEC J-STD-020
PCB Solder pad Design Non-Solder Mask Dened
PCB Pad Finish OSP or NiAu
RClamp0564P
Final Datasheet Rev 3.2
Mar 14, 2017
www.semtech.com 7
Semtech
Outline Drawing - SGP2010N5
Land Pattern - SGP2010N5
A
aaa C
B
C
b
bbb
aaa
N
L
e1
D
DIM
A1
A
0.25
0.15 0.20
0.35
0.25
0.08
0.10
5
0.30
2.00
0.80 BSC
MILLIMETERS
MAX
0.05
0.55
DIMENSIONS
MIN
0.00
NOM
0.45
0.02
0.50
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
NOTES:
1.
1.00
E
2.081.95
0.95 1.08
PIN 1
INDICATOR
(LASER MARK)
SEATING
PLANE
12
N
D
E
A
e0.40 BSC
bbb C A B
e
e1
D/2
bxN
(0.025-0.075) E/2
LxN
A1
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
NOTES:
2.
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
1.
DIM
X
Y
P1
G
C
MILLIMETERS
(0.85)
0.20
0.60
0.80
0.25
DIMENSIONS
1.45
Z
Y
Z
P
P1
G
(C) P0.40
X
RClamp0564P
Final Datasheet Rev 3.2
Mar 14, 2017
www.semtech.com 8
Semtech
Marking Code
Tape and Reel Specication
Ordering Information
Part Number Qty per Reel Reel Size
RClamp0564P.TNT 10000 7 Inch
RailClamp and RClamp are registered trademarks of Semtech Corporation.
0564P
YYWW
Notes: YYWW = Alphanumeric Date Code
Pin 1 Location (Towards Sprocket Holes )
0564P
YYWW
0564P
YYWW
0564P
YYWW
0564P
YYWW
RClamp0564P
Final Datasheet Rev 3.2
Mar 14, 2017
9
Semtech
Contact Information
Semtech Corporation
200 Flynn Road, Camarillo, CA 93012
Phone: (805) 498-2111, Fax: (805) 498-3804
www.semtech.com
IMPORTANT NOTICE
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guide only and Semtech assumes no liability for any errors in this document, or for the application or design described herein. Semtech reserves the right
to make changes to the product or this document at any time without notice. Buyers should obtain the latest relevant information before placing orders
and should verify that such information is current and complete. Semtech warrants performance of its products to the specications applicable at the time
of sale, and all sales are made in accordance with Semtech’s standard terms and conditions of sale.
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fees which could arise.
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