September 2013 Doc ID 10889 Rev 5 1/27
1
VN610SP-E
Single channel high-side driver
Features
■
ECOPACK
®
: lead free and RoHS compliant
■
Automotive Grade: compliance with AEC
guidelines
■
Output current: 45 A
■
CMOS compatible inputs
■
Proportional load current sense
■
Undervoltage and overvoltage shutdown
■
Overvoltage clamp
■
Thermal shutdown
■
Current limitation
■
Very low standby power consumption
■
Protection against loss of ground and loss of
V
CC
■
Reverse battery protected
■
In compliance with the 2002/95/EC european
directive
Description
The VN610SP-E is a monolithic device made
using STMicroelectronics™ VIPower™ M0-3
technology. It is intended for driving resistive or
inductive loads with one side connected to
ground.
Active V
CC
pin voltage clamp protects the device
against low energy spikes (see ISO7637 transient
compatibility table). This device integrates an
analog current sense which delivers a current
proportional to the load current (according to a
known ratio ).
Active current limitation combined with thermal
shutdown and automatic restart protect the device
against overload. Device automatically turns off in
case of ground pin disconnection.
Type R
DS(on)
I
OUT
V
CC
VN610SP-E 10mΩ45 A 36V
PowerSO-10
1
10
Table 1. Device summary
Package Order codes
Tube Tape and reel
PowerSO-10™ VN610SP-E VN610SPTR-E
www.st.com
Contents VN610SP-E
2/27 Doc ID 10889 Rev 5
Contents
1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.3 Elect rical char acteristi c s . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.4 Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.1 GND protection network against reverse battery . . . . . . . . . . . . . . . . . . . 17
3.1.1 Solution 1: a resistor in the ground line (R
GND
only) . . . . . . . . . . . . . . . 17
3.1.2 Solution 2: a diode (D
GND
) in the ground line . . . . . . . . . . . . . . . . . . . . 18
3.2 Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.3 MCU I/O protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.4 Maximum demagnetization energy (V
CC
= 13.5 V) . . . . . . . . . . . . . . . . . 19
4 Package and PCB thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.1 PowerSO-10 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
5 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.1 ECOPACK
®
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.2 PowerSO-10 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.3 PowerSO-10 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
VN610SP-E List of tables
Doc ID 10889 Rev 5 3/27
List of tables
Table 1. Device summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table 2. Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 5
Table 3. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 4. Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 5. Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 6. Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 7. V
CC
- output diode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 8. Current sense (9 V ≤ V
CC
≤ 16 V). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 9. Switching (V
CC
= 13 V). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 10. Logic inputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 11. Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 12. Electrical transient requirements on V
CC
pin (part 1/3). . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 13. Electrical transient requirements on V
CC
pin (part 2/3). . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 14. Electrical transient requirements on V
CC
pin (part 3/3). . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 15. Thermal parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 16. PowerSO-10 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Table 17. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
List of figures VN610SP-E
4/27 Doc ID 10889 Rev 5
List of figures
Figure 1. Block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 2. Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 3. Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 4. I
OUT
/I
SENSE
versus I
OUT
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 5. Switching characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 6. Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 7. Off-state output current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 8. High level input current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 9. Input low level. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 10. Input high level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 11. Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 12. Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 13. Overvoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 14. I
LIM
vs T
case
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 15. Turn-on voltage slope. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 16. Turn-off voltage slope. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 17. On-state resistance vs T
case
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 18. On-state resistance vs V
CC
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 19. Application schematic. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 20. Maximum turn-off current versus load inductance
(1)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 21. PowerSO-10 PC board
(1)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 22. R
thj-amb
vs PCB copper area in open box free air condition . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 23. Thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 24. Thermal fitting model of a single channel in PowerSO-10 . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 25. PowerSO-10 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 26. PowerSO-10 suggested pad layout and tube shipment (no suffix). . . . . . . . . . . . . . . . . . . 25
Figure 27. PowerSO-10 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
VN610SP-E Block diagram and pin description
Doc ID 10889 Rev 5 5/27
1 Block diagram and pin description
Figure 1. Block diagram
Figure 2. Configuration diagram (top view)
Table 2. Suggested connections for unused and not connected pins
Connection / pin Current sense N.C. Output Input
Floating X X X
To ground Through 1 KΩ
resistor XT hrou gh 10 KΩ
resistor
LOGIC
UNDERVOLTAGE
OVERVOLTAGE
OVERTEMP.
ILIM
PwCLAMP
K
IOUT
GND
INPUT
VCC
OUTPUT
CURRENT
SENSE
DRIVER
VCC
CLAMP
VDSLIM
1
2
3
4
5
6
7
8
9
10
11
OUTPUT
OUTPUT
OUTPUT
OUTPUT
OUTPUT
GROUND
INPUT
C. SENSE
N.C.
N.C.
V
CC
Electrical specifications VN610SP-E
6/27 Doc ID 10889 Rev 5
2 Electrical specifications
Figure 3. Current and voltage conventions
2.1 Absolute maximum ratings
Stressing the device above the rating listed in the “Absolute maximum ratings” table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the Operating sections of
this specification is not implied. Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
Program and other relevant quality document.
I
S
I
GND
V
CC
V
CC
V
SENSE
OUTPUT I
OUT
CURRENT SENSE I
SENSE
INPUT
I
IN
V
IN
V
OUT
GND
V
F
Table 3. Absolute maximum ratings
Symbol Parameter Value Unit
V
CC
DC supply voltage 41 V
-V
CC
Reverse DC supply voltage - 0.3 V
-I
GND
DC reverse ground pin current - 200 mA
I
OUT
DC output current Internally limited A
-I
OUT
Reverse DC output current - 50 A
I
IN
DC input current +/- 10 mA
V
CSENSE
Current sense maximum voltage - 3
+ 15 V
V
V
ESD
Electrostatic discharge (human body model: R = 1.5KΩ;
C = 100pF)
– INPUT
– CURRENT SENSE
– OUTPUT
–V
CC
4000
2000
5000
5000
V
V
V
V
VN610SP-E Electrical specifications
Doc ID 10889 Rev 5 7/27
2.2 Thermal data
Symbol Parameter Value Unit
E
MAX
Maximum switching energy
(L = 0.05mH; R
L
= 0Ω; V
bat
= 13.5V; T
jstart
= 150ºC; I
L
= 75A) 193 mJ
P
tot
Power dissipation at T
c
≤ 25°C 139 W
T
j
Junction operating temperature Internally limited °C
T
c
Case operating temperature -40 to 150 °C
T
STG
Storage temperature -55 to 150 °C
Table 3. Absolute maximum ratings (continued)
Table 4. Thermal data
Symbol Parameter Max. value Unit
R
thj-case
Thermal resistance junction-case (max) 0.9 °C/W
R
thj-amb
Thermal resistance junction-ambient (max) 50.9
(1)
1. When mounted on a standard single-sided FR-4 board with 0.5 cm
2
of Cu (at least 35 µm thick).
36
(2)
2. When mounted on a standard single-sided FR-4 board with 6 cm
2
of Cu (at least 35 µm thick).
°C/W
Electrical specifications VN610SP-E
8/27 Doc ID 10889 Rev 5
2.3 Electrical characteristics
Values specified in this section are for 8V < V
CC
< 36V; -40°C < T
j
< 150°C, unless
otherwise stated. Per each channel.
Table 5. Power
Symbol Parameter Test condit ions Mi n. Typ. Max . Unit
V
CC
Operati ng supply
voltage 5.5 13 36 V
V
USD
Undervoltage shutdown 3 4 5.5 V
V
OV
Overvoltage shutdown See
(1)
36 V
R
ON
On-state resistance I
OUT
= 15A; T
j
= 25°C
I
OUT
= 15A; T
j
= 150°C
I
OUT
= 9A; V
CC
= 6V
10
20
35
mΩ
mΩ
mΩ
V
clamp
Clamp voltage I
CC
= 20mA
(1)
1. V
clamp
and V
OV
are correlated. Typical difference is 5V.
41 48 55 V
I
S
Supply current
Off-state; V
CC
=13V; V
IN
=V
OUT
=0V
Off-state; V
CC
=13V; V
IN
=V
OUT
=0V;
T
j
=25°C
On-state; V
IN
= 5V; V
CC
= 13V;
I
OUT
= 0A; R
SENSE
= 3.9kΩ
10
10
25
20
5
µA
µA
mA
I
L(off1)
Off - state output current V
IN
= V
OUT
= 0V 0 50 µA
I
L(off2)
Off - state output current V
IN
= 0V; V
OUT
= 3.5V -75 0 µA
I
L(off3)
Off - state output current V
IN
= V
OUT
=0V; V
CC
=13V;
T
j
=125°C 5µA
I
L(off4)
Off - state output current V
IN
=V
OUT
= 0V; V
CC
= 13V;
T
j
= 25°C 3µA
Table 6. Protections
(1)
Symbol Parame ter Test co ndit ions Min. Typ. Max. Unit
I
lim
DC short circuit current V
CC
= 13V;
5.5V < V
CC
< 36V 45 75 120
120 A
A
T
TSD
Thermal shutdown
temperature 150 175 200 °C
T
R
Thermal reset
temperature 135 °C
T
HYST
Thermal hysteresis 7 15 °C
VN610SP-E Electrical specifications
Doc ID 10889 Rev 5 9/27
V
demag
Turn-off output voltage
clamp I
OUT
= 2A; V
IN
= 0V; L = 6mH V
CC
-41 V
CC
-48 V
CC
-55 V
V
ON
Output vo ltage drop
limitation I
OUT
= 1.5A
T
j
= -40°C...+150°C 50 mV
1. To ensure long term reliability under heavy over-load or short circuit conditions, protection and related
diagnostic signals must be used together with a proper software strategy. If the device is subjected to
abnormal conditions, this software must limit the duration and number of activation cycles.
Table 7. V
CC
- output diode
Symbol Parameter Test conditions Min. Typ. Max. Unit
V
F
Forward on vol t ag e - I
OUT
= 8A; T
j
= 150°C - - 0.6 V
Table 8. Current sense (9 V ≤ V
CC
≤ 16 V )
(1)
Symbol Parameter Test conditions Min. Typ. Max. U nit
K
1
I
OUT
/I
SENSE
I
OUT
= 1.5A; V
SENSE
= 0.5V;
T
j
= -40°C...15 0°C 3300 4400 6000
dK
1
/K
1
Current sen se ra tio drift I
OUT
= 1.5A; V
SENSE
= 0.5V;
T
j
= - 40°C...150°C -10 +10 %
K
2
I
OUT
/I
SENSE
I
OUT
= 15A; V
SENSE
= 4V;
T
j
= - 40°C
T
j
= 25°C...150°C 4200
4400 4900
4900 6000
5750
dK
2
/K
2
Current sen se ra tio drift I
OUT
= 15A; V
SENSE
= 4V;
T
j
= 25°C...150 °C -6 +6 %
K
3
I
OUT
/I
SENSE
I
OUT
= 45A; V
SENSE
= 4V;
T
j
= -40°C
T
j
= 25°C...150 °C 4200
4400 4900
4900 5500
5250
dK
3
/K
3
Current sen se ra tio drift I
OUT
= 45A; V
SENSE
= 4V;
T
j
= 25°C...150 °C -6 +6 %
I
SENSE0
Analog sense current
V
CC
= 6...16V; I
OUT
= 0A;
V
SENSE
= 0V;
T
j
= -40°C...15 0°C
Off-state; V
IN
= 0V
On-state; V
IN
= 5V 0
05
10 µA
µA
V
SENSE
Max analog sense
output voltage
V
CC
= 5.5V; I
OUT
= 7.5A;
R
SENSE
= 10kΩ
V
CC
> 8V, I
OUT
= 15A;
R
SENSE
= 10kΩ
3.5
5
V
V
V
SENSEH
Analog sense output
voltage in
overtemperature
condition
V
CC
= 13V; R
SENSE
= 3.9kΩ5.5 V
Table 6. Protections
(1)
(continued)
Symbol Parame ter Test co ndit ions Min. Typ. Max. Unit
Electrical specifications VN610SP-E
10/27 Doc ID 10889 Rev 5
R
VSENSEH
Analog sense output
impedance in
overtemperature
condition
V
CC
= 13V; T
j
> T
TSD
; Output
open 400 Ω
t
DSENSE
Current sense delay
response To 90% I
SENSE(2)
500 µs
1. See Figure 4.
2. Current sense signal delay after positive input slope.
Table 9. Switching (V
CC
= 13 V)
Symbol Parameter Test conditions Min. Typ. Max. Unit
t
d(on)
Turn-on del ay time R
L
= 0.87Ω-50-µs
t
d(off)
Turn-on del ay time R
L
= 0.87Ω -50-µs
(dV
OUT
/dt)
on
Turn-on vol t ag e slo pe R
L
= 0.87Ω-See
Figure 15 -V/µs
(dV
OUT
/dt)
off
Turn-off voltage slope R
L
= 0.87Ω-See
Figure 16 -V/µs
Table 10. Logic inputs
Symbol Parameter Test conditions Min. Typ. Max. Unit
V
IL
Input low level voltage 1.25 V
I
IL
Low level input current V
IN
= 1.25V 1 µA
V
IH
Input high level voltage 3.25 V
I
IH
High level input current V
IN
= 3.25V 10 µA
V
I(hyst)
Input hysteresis voltage 0.5 V
V
ICL
Input clamp voltage I
IN
= 1mA
I
IN
= - 1mA 66.8
- 0.7 8V
V
Table 8. Current sense (9 V ≤ V
CC
≤ 16 V )
(1)
(continued)
Symbol Parameter Test condition s Min. Typ. M ax . Unit
VN610SP-E Electrical specifications
Doc ID 10889 Rev 5 11/27
Figure 4. I
OUT
/I
SENSE
versus I
OUT
Table 11. Truth table
Conditions Input Output Sense
Normal operati on L
HL
H0
Nominal
Overtemperature L
HL
L0
V
SENSEH
Under-voltage L
HL
L0
0
Overvoltage L
HL
L0
0
Short circuit to GND L
H
H
L
L
L
0
(T
j
<T
TSD
) 0
(T
j
>T
TSD
) V
SENSEH
Short circuit to V
CC
L
HH
H0
< Nominal
Negative output voltage clamp L L 0
0246810121416
3000
3500
4000
4500
5000
5500
6000
6500
min.Tj=-40°C
max.Tj=-40°C
min.Tj=25...150°C
max.Tj=25...150°C
typica l va lue
I
OUT
/I
SENSE
I
OUT
(A)
Electrical specifications VN610SP-E
12/27 Doc ID 10889 Rev 5
Figure 5. Switching characteristics
\
V
OUT
dV
OUT
/dt
(on)
t
r
80%
10% t
f
dV
OUT
/dt
(off)
I
SENSE
t
t
90%
t
d(off)
INPUT
t
90%
t
d(on)
t
DSENSE
VN610SP-E Electrical specifications
Doc ID 10889 Rev 5 13/27
Table 12. Electrical transient requirements on V
CC
pin (part 1/3)
ISO T/R 7637/1
test pulse
Test levels
I II III IV Delays and
impedance
1 -25 V -50 V -75 V -100 V 2 ms 10 Ω
2 +25 V +50 V +75 V +100 V 0.2 ms 10 Ω
3a -25 V -50 V -100 V -150 V 0.1 µs 50 Ω
3b +25 V +50 V +75 V +100 V 0.1 µs 50 Ω
4 -4 V -5 V -6 V -7 V 100 ms, 0.01
Ω
5 +26.5 V +46.5 V +66.5 V +86.5 V 400 ms, 2
Ω
Table 13. Electrical transient requirements on V
CC
pin (part 2/3)
ISO T/R 7637/1
test pulse
Test levels results
I II III IV
1CCCC
2CCCC
3aCCCC
3bCCCC
4CCCC
5CEEE
Table 14. Electrical transient requirements on V
CC
pin (part 3/3)
Class Contents
C All functions of the device are performed as designed after exposure to disturbance.
EOne or more functions of the device is not performed as designed after exposure to
disturbance and cannot be returned to proper operation without replacing the device.
Electrical specifications VN610SP-E
14/27 Doc ID 10889 Rev 5
Figure 6. Waveforms
SENSE CURRENT
INPUT NORMAL OPERATION
UNDERVOLTAGE
V
CC
V
USD
V
USDhyst
INPUT
OVERVOLTAGE
V
CC
SENSE CURRENT
INPUT
SENSE
LOAD CURRENT
LOAD CURRENT
LOAD CURRENT
OVERTEMPERATURE
INPUT
SENSE CURRENT
T
TSD
T
R
T
j
LOAD CURRENT
V
OV
V
OVhyst
V
CC
> V
USD
SHORT TO GROUND
INPUT
LOAD CURRENT
SENSE CURRENT
LOAD VOLTAGE
INPUT
LOAD VOLTAGE
SENSE CURRENT
LOAD CURRENT
<Nominal <Nominal
SHORT TO V
CC
I
SENSE
=V
SENSEH
/(R
SENSE
+R
SENSEH
)
VN610SP-E Electrical specifications
Doc ID 10889 Rev 5 15/27
2.4 Electrical characteristics curves
Figure 7. Off-state output current Figure 8. High level input current
Figure 9. Input low level Figure 10. Input high level
Figure 11. Input clamp voltage Figure 12. Input hysteresis voltage
Electrical specifications VN610SP-E
16/27 Doc ID 10889 Rev 5
Figure 13. Overvoltage shutdown Figure 14. I
LIM
vs T
case
Figure 15. Turn-on voltage slope Figure 16. Turn-off voltage slope
Figure 17. On-state resistance vs T
case
Figure 18. On-state resistance vs V
CC
VN610SP-E Application information
Doc ID 10889 Rev 5 17/27
3 Application information
Figure 19. Application schematic
3.1 GND protection network against reverse battery
This section provides two solutions for implementing a ground protection network against
reverse battery.
3.1.1 Solution 1: a resistor in the ground line (R
GND
only)
This can be used with any type of load.
The following show how to dimension the R
GND
resistor:
1. R
GND
≤ 600mV / (I
S(on)max
)
2. R
GND
≥ ( - V
CC
) / (- I
GND
)
where - I
GND
is the DC reverse ground pin current and can be found in the absolute
maximum rating section of the device datasheet.
Power dissipation in R
GND
(when V
CC
< 0 during reverse battery situations) is:
P
D
= (- V
CC
)
2
/ R
GND
This resistor can be shared amongst several different HSDs. Please note that the value of
this resistor should be calculated with formula (1) where I
S(on)max
becomes the sum of the
maximum on-state currents of the different devices.
Please note that, if the microprocessor ground is not shared by the device ground, then the
R
GND
produces a shift (I
S(on)max
* R
GND
) in the input thresholds and the status output
values. This shift varies depending on how many devices are ON in the case of several high-
side drivers sharing the same R
GND
.
V
CC
GND
OUTPUT
D
GND
R
GND
D
ld
μ
C
+5V
R
prot
V
GND
INPUT
CURRENT SENSE
R
SENSE
R
prot
Application information VN610SP-E
18/27 Doc ID 10889 Rev 5
If the calculated power dissipation requires the use of a large resistor, or several devices
have to share the same resistor, then ST suggests using solution 2 below.
3.1.2 Solution 2: a diode (D
GND
) in the ground line
A resistor (R
GND
= 1kΩ) should be inserted in parallel to D
GND
if the device is driving an
inductive load. This small signal diode can be safely shared amongst several different HSD.
Also in this case, the presence of the ground network produces a shift (j600mV) in the input
threshold and the status output values if the microprocessor ground is not common with the
device ground. This shift not varies if more than one HSD shares the same diode/resistor
network. Series resistor in INPUT and STATUS lines are also required to prevent that,
during battery voltage transient, the current exceeds the Absolute Maximum Rating. Safest
configuration for unused INPUT pin is to leave them unconnected, while unused SENSE pin
has to be connected to ground pin.
3.2 Load dump protection
D
ld
is necessary (voltage transient suppressor) if the load dump peak voltage exceeds the
V
CC
maximum DC rating. The same applies if the device is subject to transients on the V
CC
line that are greate r than those shown in the ISO T/R 7637/1 table.
3.3 MCU I/O protection
If a ground protection network is used and negative transients are present on the V
CC
line,
the control pins is pulled negative. ST suggests to insert a resistor (R
prot
) in line to prevent
the µC I/O pins from latching up.
The value of these resistors is a compromise between the leakage current of µC and the
current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of µC
I/Os:- V
CCpeak
/ I
latchup
≤ R
prot
≤ (V
OHμC
- V
IH
- V
GND
) / I
IHmax
Example
For the following conditions:
V
CCpeak
= - 100V
I
latchup
≥ 20mA
V
OHμC
≥ 4.5V
5kΩ ≤ R
prot
≤ 65kΩ.
Recommended values are:
R
prot
= 10kΩ
VN610SP-E Application information
Doc ID 10889 Rev 5 19/27
3.4 Maximum demagnetization energy (V
CC
= 13.5 V )
Figure 20. Maximum turn-off current versus load inductance
(1)
1. Values are generated with R
L
= 0Ω.
In case of repetitive pulses, T
jstart
(at beginning of each demagnetization) of every pulse must not exceed
the temperature specified above for curves B and C.
V
IN
, I
L
t
Demagnetization Demagnetization Demagnetization
A = single pulse at T
Jstart
= 150ºC
B= repetitive pulse at T
Jstart
= 100ºC
C= repetitive pulse at T
Jstart
= 125ºC
1
10
100
1000
0,01 0,1 1 10 100
L(mH)
ILMAX (A)
A
B
C
Package and PCB thermal data VN610SP-E
20/27 Doc ID 10889 Rev 5
4 Package and PCB thermal data
4.1 PowerSO-10 thermal data
Figure 21. PowerSO-10 PC board
(1)
1. Layout condition of R
th
and Z
th
measurements (PC B FR4 area = 58mm x 58mm, PCB thickness = 2mm,
Cu thickness = 35µm, Copper areas: from minimum pad-lay- out to 8cm
2
).
Figure 22. R
thj-amb
vs PCB copper area in open box free air condition
30
35
40
45
50
55
0246810
PCB Cu he at sink area (cm^ 2)
RTHj_amb (°C/W)
Tj-Tamb=50°C
VN610SP-E Package and PCB thermal data
Doc ID 10889 Rev 5 21/27
Figure 23. Thermal impedance junction ambient single pulse
Equation 1
:
pulse calculation formula
Figure 24. Thermal fitting model of a single channel in PowerSO-10
Z
THδ
R
TH
δZ
THtp
1δ–()+⋅=
where
δt
p
T⁄=
T_amb
C1
R1 R2
C2
R3
C3
R4
C4
R5
C5
R6
C6
Pd
Tj
Package and PCB thermal data VN610SP-E
22/27 Doc ID 10889 Rev 5
Table 15. Thermal parameters
Area / island (cm
2
)Footprint6
R1 (°C/W) 0.016
R2 (°C/W) 0.06
R3 (°C/W) 0.08
R4 (°C/W) 0.8
R5 (°C/W) 12
R6 (°C/W) 37 22
C1 (W.s/°C) 0.002
C2 (W.s/°C) 1E-02
C3 (W.s/°C) 0.04
C4 (W.s/°C) 0.3
C5 (W.s/°C) 0.75
C6 (W.s/°C) 3 5
VN610SP-E Package and packing information
Doc ID 10889 Rev 5 23/27
5 Package and packing information
5.1 ECOPACK
®
packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
is an ST trademark.
5.2 PowerSO-10 mechanical data
Figure 25. PowerSO-10 package dimensions
DETAIL "A"
PLANE
SEATING
α
L
A1
F
A1
h
A
D
D1
= =
= =
E4
0.10 A
E
C
A
B
B
DETAIL "A"
SEATING
PLANE
E2
10
1
eB
HE
0.25
Package and packing information VN610SP-E
24/27 Doc ID 10889 Rev 5
Table 16. PowerSO-10 mechanical data
Symbol millimeters
Min Typ Max
A 3.35 3.65
A
(1)
1. Muar only POA P013P.
3.4 3.6
A1 0.00 0.10
B 0.40 0.60
B
(1)
0.37 0.53
C 0.35 0.55
C
(1)
0.23 0.32
D 9.40 9.60
D1 7.40 7.60
E 9.30 9.50
E2 7.20 7.60
E2
(1)
7.30 7.50
E4 5.90 6.10
E4
(1)
5.90 6.30
e 1.27
F 1.25 1.35
F
(1)
1.20 1.40
H 13.80 14.40
H
(1)
13.85 14.35
h 0.50
L 1.20 1.80
L
(1)
0.80 1.10
a 0° 8°
α
(1)
2° 8°
VN610SP-E Package and packing information
Doc ID 10889 Rev 5 25/27
5.3 PowerSO-10 packing information
Figure 27. PowerSO-10 tape and reel shipment (suffix “TR”)
Figure 26. PowerSO-10 suggested pad layout and tube shipment (no suffix)
6.30
1 0.8 - 1 1
14.6 - 14.9
9.5
1
2
3
4
51.27
0.67 - 0.73
0.54 - 0.6
10
9
8
7
6
B
A
C
All dimensions are in mm.
Base Q.ty Bulk Q.ty Tube length (± 0.5) A B C (± 0.1)
Casablanca 50 1000 532 10.4 16.4 0.8
Muar 50 1000 532 4.9 17.2 0.8
C
A
B
MUARCASABLANCA
Base Q.ty 600
Bulk Q.ty 600
A (max) 330
B (min) 1.5
C (± 0.2) 13
F20.2
G (+ 2 / -0) 24.4
N (min) 60
T (max ) 30.4
Tape dimensions
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb. 1986
All dimensions are in mm.
Tape width W 24
Tape Hole Spacing P0 (± 0.1) 4
Component Spacing P 24
Hole Diameter D (± 0.1/-0) 1.5
Hole Diam et er D1 (min) 1.5
Hole Position F (± 0.05) 11.5
Compartment Depth K (max) 6.5
Hole Spacing P1 (± 0.1) 2
Top
cover
tape
End
Start
No componentsNo components Components
500mm min
500mm min
Empty components pockets
saled with cover tape .
User direction of feed
Reel dimensions
Revision history VN610SP-E
26/27 Doc ID 10889 Rev 5
6 Revision history
Table 17. Document revision history
Date Revision Changes
01-Oct-2004 1 Initial release.
23-Jun-2008 2 Changed template.
Not changed document content.
11-Dec-2009 3 Formatted entire document.
Updated features list.
29-Jun-2010 4
Updated following tables:
–Table 9: Switching (V
CC
= 13 V)
–Table 15: Thermal parameters
– Updated Figure 24: Thermal fitting model of a single channel in
PowerSO-10
19-S ep-2013 5 Updated Disclaimer.
VN610SP-E
Doc ID 10889 Rev 5 27/27
Please Read Carefully:
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All ST produ cts are sold purs uant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating t o the choice, sele ction or use of the ST products and se rvices described herein.
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