1CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
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Application Note 1386
ISL8201M, ISL8204M, ISL8206M EVAL1Z
Evaluation Board User’s Guide
Table of Contents
General Description.................. .. ... .............. ... .............. ... .............. ... .............. .. ... .............. ............................................................ 2
Installation..................................................................................................................................................................................... 2
Typical Application Schematic....................................................................................................................................................... 3
Efficiency and Output Ripple/Noise Measurement........................................................................................................................ 4
Schematic ..................................................................................................................................................................................... 5
Bill of Materials.............................................................................................................................................................................. 6
Printed Circuit Board Layer........................................................................................................................................................... 7
List of Figures
Evaluation Board of POL Module.................................................................................................................................................. 2
Quick Start................. ... ................................................... ... .. .......................... .. ... .......................................................................... 3
Quick Start Schematic......................... ............................ ............................ .................................................................................. 3
Wide Input Range Schematic........................................................................................................................................................ 3
Efficiency Measurement Schematic.............................................................................................................................................. 4
Equipment Setup for Efficiency Measurement.............................................................................................................................. 4
Output Ripple/Noise Measurement Method.................................................................................................................................. 4
Schematic ..................................................................................................................................................................................... 5
Top-Over Layer (Component Location)................ .. ....................................................................................................................... 7
Top Layer (Component Side) ........................................................................................................................................................ 7
Middle-1 Layer............................................................................................................................................................................... 8
Middle-2 Layer............................................................................................................................................................................... 8
Bottom Layer (Component Side)................................................................................................................................................... 9
Bottom-Over Layer (Component Location)................................................................................................................................... 9
List of Tables
Test Equipment List.................... ............................ ............................ ............................ ............................................................... 2
Recommended Operating Specifications...................................................................................................................................... 2
Typical Output Voltage Setting for each Resistance ..................................................................................................................... 2
Bill of Materials.............................................................................................................................................................................. 6
December 23, 2009
AN1386.1
2AN1386.1
December 23, 2009
General Description
This app note covers the ISL8201MEV AL1Z,
ISL8204MEVAL1Z, ISL8206MEVAL1Z evaluation boards.
Since the modules are a pin for pin drop in with all
necessary unique circuitry integrated in the module, the
only difference in the BOM is the ISL8201M, ISL8206M,
or ISL8204M POL modules. W e will refer to a generic
eval board, ISL820xMEV AL1Z to cov er all three power
modules.
The ISL820xMEVAL1Z POL module evaluation board is
shown in Figure 1. The user can use it to evaluate the
performance of the Intersil ISL8201M, ISL8206M, or
ISL8204M POL modules. This board consists of power
and load connectors for source and load side, switches
for PVCC bias selection and On/Off option, and other
passive components.
The input voltage r ange is from 1V to 20V, and the
output voltage range is from 0.6V to 5V 5V for the
ISL8201M or 0.6V to 6V for the ISL8204M and
ISL8206M. Additional PVCC bias source is not required
when using an inpu t v olt age of 5V or 12V. It can
connect to the input side directly. However, in wider
input ranges, which are above 14V or below 5V, the
PVCC bias needs to add an external source, which
provides operation bias of the module. The output
voltag e is initia lly set at 1 .5V for typic al ev aluati on. The
user can easily se t the o utput v o ltage b y chang ing the
value of R1 (refer to Figure 8).
Installation
Recommended Operating Specification
The recommended operating specification for
input/output and PVCC bias range is shown as Table 2.
Table 3 lists the typical application’ s various output
voltages and its corresponding resistance.
FIGURE 1. EVALUATION BOARD OF POL MODULE
TABLE 1. TEST EQUIPM ENT LIST
EQUIPMENT PART NUMBER
An adjustable DC P ower Supply 30V, 15A,
with current limit GW GPC–3060D
An electron ic load, capable of sink ing 20A Chroma 63 030/63010
Four ch ann e l osci ll osc ope and probes Tektronix TDS3014
Tektronix P 3010
High Precision Digital Voltage Meter ESCORT 3136A
High Precision Digital Current Meter ESCORT 3136A
TABLE 2. RECO MMENDED OPERATING SPECIFICATIONS
PARAMETER TEST
CONDITIONS MIN TYP MAX UNIT
Input Voltage
Range (VIN)1-20V
Supply Voltage
Range (PVCC) Fixed +5V
Supply 4.5 5.0 5.5 V
Fixed +12V
Supply 9.6 12.0 14.4 V
Wide Range
Supply 6.5 - 14.4 V
Output Voltage
Range (VOUT)ISL8201M 0.6 - 5 V
ISL8204M and
ISL8206M 0.6 - 6 V
Current Setting for
VOUT
R1 = 6.49kΩ-1.5- V
Output Current
(Load Current) ISL8201M - - 10 A
ISL8206M - - 6 A
ISL8204M - - 4 A
Current Limit
(PVCC = 12V) ISL8201M
RSEN-IN = 3.57kΩ
-17- A
ISL8206M
RSEN-IN = 4.12kΩ
-8.8- A
ISL8204M
RSEN-IN = 2.87kΩ
-6.6- A
TABLE 3. TYPICAL OUTPUT VOLTAGE SETTING FOR
EACH RESISTANCE
VOUT 0.6V 1.05V 1.2V 1.5V 1.8V 2.5V 3.3V 5V
R1 Open 13k 9.76k 6.49k 4.87k 3.09k 2.16k 1.33k
Application Note 1386
3AN1386.1
December 23, 2009
Selecting Switches
Switch S1 selects PVCC bias supply from VIN or an
additional supply source. When S1 is pushed up, the
PVCC bias connects to the input power side. When S1 is
pushed down, the PVCC bias connects to the additional
power supply. For typical applications, the PVCC bias
voltage is +5V (+10%) or +12V (+20%). It can also
supply a wider range from +6.5V to +14.4V.
Switch S2 selects module Enable (On) or Disable (Off).
When S2 is pushed up, the COMP/EN pin of the module is
enabled and the module starts initialization and
operation. When S2 is pushed down, the COMP/EN pin of
the module connects to ground and the module will be
shut down.
Quick Start
The evaluation board can be ev aluated simply, as shown
in Figure 2. The power connection of the ev aluation
board supplies the input voltage from the DC P ower
Supply, and the load connection of the evaluation board
delivers power to the Electronic Load. If the input voltage
is +5V or +12V, the PVCC bias does not require
additional supply and it can connect to the input side
directly by pushing switch S1 to the up state.
Figure 3 shows the ISL820xMEVAL1Z application
schematic for +5V or +12V input voltage. The PVCC pin
can connect to the input supply directly.
Typical Application Schematic
Typical Application with Separated Power
Supply
Figure 4 shows the ISL820xMEVAL1Z application
schematic for a wide input voltage from +1V to +20V.
The PVCC supply can source +5V/+12V or +6.5V to
+14.4V.
SWITCH UP DOWN
S1 VIN +5V/+12V or +6.5V to +14.4V
SWITCH UP DOWN
S2 EN Disable
VIN
S1
+5V/+12V
OR
+6.5V TO +14.4V
VIN
S1
+5V/+12V
OR
+6.5V TO +14.4V
EN
S2
ENABLE
EN
S2
DISABLE
FIGURE 2. QUICK START FOR EVALUATION BOARD
FIGURE 3. QUICK START SCHEMATIC
CPVCC
VIN (+5V/+12V)
CIN
COUT
RSEN-EX
RFB VOUT
COMP/EN
FB
ISET PGND VOUT
PHASE
VIN
PVCC
FIGURE 4. W IDE INPUT RANGE SCHEM ATIC
CPVCC
VIN
CIN
COUT
RSEN-EX
RFB VOUT
COMP/EN
FB
ISET PGND VOUT
PHASE
VIN
PVCC
(+1V TO +20V)
PVCC(+5V/+12V OR +6.5V TO +14.4V)
Application Note 1386
4AN1386.1
December 23, 2009
Efficiency and Output
Ripple/Noise Measurement
Figure 5 shows the efficiency measurement schematic for
the ISL820xMEVAL1Z POL module. The voltage and
current meter can be used to measure input/output
voltage and current. In order to obtain an accur ate
measurement and prevent the voltage drop of PCB or
wire trace, the v oltage meter must be close to the
input/output pin of the POL module.
The efficiency equation is shown in Equation 1:
The equipment setup for the efficiency measurement on
the evaluation board is shown in Figure 6. The measuring
point for the input voltage meter is at the C 3 term inal,
and the measuring point for the output v oltage meter is
at the C8 terminal (refer to Figure 9).
Output Ripple/Noise Measurement Method
The total noise is equal to the sum of the ripple and
noise components. Si mp le steps should be taken to
assure that there is minimum pickup noise due to the
high fre que ncy ev en ts, w hic h can be magnified by the
large ground loop formed by the oscillosco pe prob e
ground. This means that ev en a few inch es of gro und
wire on the oscilloscope probe may result in hundreds of
millivolts of noise spikes when improperly routed or
terminated. This effect can be overcome by using the
short loop measurement method to minimize the
measurement loop area for reducing the pickup noise.
The short loop measurement method is shown in
Figure 7. For ISL820xMEV AL1Z evaluation board, the
output ripple/noise measurement point is located at the
C8 term ina l (refer to Figure 9).
Efficiency Output Power
Input Power
------------------------------------ POUT
PIN
----------------VOUT IOUT
•()
VIN IIN
•()
----------------------------------------
=== (EQ. 1)
FIGURE 5. EFFICIENCY MEASUREMENT SCHEMATIC
PVCC
VIN
VOUT
Cin
Cout
RFB RSEN-EX
CPVCC
+
-DC Source
DC Load
Vi
Ai
Vo
+
-DC Source
Iin
Vin
Vout
Iout
PGND
FB
COMP/EN VIN
VOUT
PHASE
ISET
PVCC
ELECTRONIC LOAD
Vin
DC POWER SUPPLY
PVCC
DC POWER SUPPLY
Current
Meter
Voltage
Meter
Voltage
Meter
+
-
+
-
FIGURE 6. EQUIPMENT SETUP FOR EFFICIENCY
MEASUREMENT
SHORT LOOP
MEASUREMENT
METHOD
FIGURE 7. OUTPUT RIPPLE/NOISE
MEASUREMENT METHOD
Application Note 1386
5AN1386.1
December 23, 2009
NOTES:
1. R1 is used to set the output voltage of ISL820xMEVAL1Z. Initial setting is 6.49kΩ for 1.5V output voltage.
2. R2 and R3, paralleling with R1, are used to adjust the output voltage of ISL820xMEVAL1Z.
3. R4 is used to se t the ov er current trip l ev el of ISL820xMEVAL1Z. The ISL8201ME VAL1Z has integr ate d 3. 57k Ω, ISL8206MEVAL1Z has i ntegr ate d 4.12k Ω, and
ISL8204MEVAL1Z has integrated 2.87kΩ
4. R18, C18 and C19 are the snubber network, which can reduce the stress for internal semiconductor.
5. R13, R14, C12, C13, C14 and C15 are the external compensation network. The ISL820xMEVAL1Z has integrated the type 3 compensation network inside the module
for typical applications.
6. R15, R16, R17, R20, R21, C17, Q2 and Q3 are the power-up sequence circuit. In case of PVCC bias, power-up first, then input voltage. This circuit has to be implemented.
FIGURE 8. SCHEMATIC
Application Note 1386
6AN1386.1
December 23, 2009
TABLE 4. BILL OF MATERIALS
SYMBOL COMPONENTS DESCRIPTION SUPPLIER
R1 Resistor Chip Resistor 6.49kΩ Generic
R2 Resistor Not installed -
R3 Resistor Not installed -
R4 Resistor Not installed -
R8 Resistor Chip Resistor 10ΩGeneric
R13 Resistor Not installed -
R14 Resistor Not installed -
R15 Resistor Not installed -
R16 Resistor Not installed -
R17 Resistor Not installed -
R18 Resistor Not installed -
R20 Resistor Not installed -
R21 Resistor Not installed -
C1 Capacitor AL Capacitor 220µF/35V SANYO
C1A Capacitor Not installed -
C2 Capacitor Ceramic Capacitor 10µF/25V MURATA/TDK
C3 Capacitor Ceramic Capacitor 10µF/25V MURATA/TDK
C5 Capacitor POS Capacitor 330µF/6.3V SANYO
C5A Capacitor Not installed -
C6 Capacitor Not installed -
C6A Capacitor Ceramic Capacitor 22µF/10V MURATA/TDK
C7 Capacitor Ceramic Capacitor 22µF/10V MURATA/TDK
C7A Capacitor Not installed MURATA/TDK
C8 Capacitor Ceramic Capacitor 22µF/10V MURATA/TDK
C8A Capacitor Not installed -
C9 Capacitor Not installed -
C10 Capacitor Ceramic Capacitor 1µF/25V YAGEO
C11 Capacitor Ceramic Capacitor 1µF/25V YAGEO
C12 Capacitor Not installed -
C13 Capacitor Not installed -
C14 Capacitor Not installed -
C15 Capacitor Not installed -
C17 Capacitor Not installed -
C18 Capacitor Not installed -
C19 Capacitor Not installed -
S1 Switch UT Switch SH
S2 Switch UT Switch SH
Q2 MOSFET Not installed -
Q3 MOSFET Not installed -
U1 Module ISL8201M, ISL8206M, or ISL8204M Intersil
Application Note 1386
7AN1386.1
December 23, 2009
Printed Circuit Board Layers
FIGURE 9. TOP-OVER LAYER (COMPONENT LOCATION)
FIGURE 10. TOP LAYER (COMPONENT SIDE)
Application Note 1386
8AN1386.1
December 23, 2009
FIGURE 11. M IDDLE-1 LAYER
FIGURE 12. ISL820xMEVAL1Z, MIDDLE-2 LAYER
Printed Circuit Board Layers (Continued)
Application Note 1386
9
Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Ac cordingly, the
reader is caution ed t o v eri fy tha t th e Appl ica tio n No te or Tec hnical Brief is current before proceeding.
For information regarding Intersil Corporation and its products, see www.intersil.com
AN1386.1
December 23, 2009
FIGURE 13. BOTTOM LAYER (COMPONENT SIDE MIRRORED)
FIGURE 14. BOTTOM-OVER LAYER (COMPONENT LOCATION MIRRORED)
Printed Circuit Board Layers (Continued)
Application Note 1386
