CLA, CLB Vishay Electro-Films Thin Film Eight Resistor Array FEATURES Product may not be to scale * Wire bondable * Eight equal value resistors on a 0.060 x 0.090 inch chip * Resistance range: 20 to 1 M The CLA and CLB resistor arrays are the hybrid equivalent to the eight resistor common connection and isolated networks available in sips or dips. The resistors are spaced on 0.010 inches centers resulting in minimal space requirements. These chips are manufactured using Vishay Electro-Films (EFI) sophisticated Thin Film equipment and manufacturing technology. The CLA and CLBs are 100 % electrically tested and visually inspected to MIL-STD-883. * Excellent TCR tracking * Resistor material: Tantalum nitride, self-passivating * Oxidized silicon substrate for good power dissipation * Custom values available * Moisture resistant APPLICATIONS The CLA and CLB thin film resistor arrays are designed for hybrid packages requiring up to eight resistors of the same resistance value and tolerance, as well as excellent TCR tracking. For such hybrids, they afford great savings in cost and space. CHIP RESISTOR ARRAYS TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES Tightest Standard Tolerance Available 0.5 % 0.1 % PROCESS CODE CLASS H* CLASS K* 25 ppm/C 026 054 50 ppm/C 017 049 100 ppm/C 008 045 *MIL-PRF-38534 inspection criteria 20 300 300 k 500 k 1 M STANDARD ELECTRICAL SPECIFICATIONS PARAMETER TCR Tracking Spread 5 ppm/C Noise, MIL-STD-202, Method 308 100 - 250 k < 100 or > 251 k - 35 dB typ. - 20 dB typ. Moisture Resistance, MIL-STD-202, Method 106 0.5 % max. R/R Stability, 1000 h, + 125 C, 25 mW Absolute Ratio 0.25 % max. R/R 0.05 % max. R/R Operating Temperature Range - 55 C to + 125 C Thermal Shock, MIL-STD-202 Method 107, Test Condition F 0.1 % max. R/R High Temperature Exposure, 150 C, 100 h 0.2 % max. R/R Dielectric Voltage Breakdown 200 V 1012 min. Insulation Resistance Operating Voltage 100 V DC Power Rating at + 70 C (Derated to Zero at 175 C) 50 mW per resistor 5 x Rated Power Short-Time Overload, + 25 C, 5 s 0.1 % max. R/R www.vishay.com 112 For technical questions, contact: efi@vishay.com Document Number: 61009 Revision: 17-Mar-08 CLA, CLB Thin Film Eight Resistor Array Vishay Electro-Films DIMENSIONS in inches CLA CLB 0.090 0.007 0.090 0.004 0.004 0.060 0.054 0.054 0.060 0.004 0.004 0.0775 0.007 MECHANICAL SPECIFICATIONS in inches PARAMETER Chip Size 0.060 x 0.090 0.002 (1.50 x 2.26 0.05 mm) Chip Thickness 0.010 0.002 (0.254 0.05 mm) Chip Substrate Material Oxidized silicon, 10 kA minimum SiO2 Tantalum nitride, self-passivating Bonding Pads 0.004 x 0.007 (0.10 x 0.178 mm) CLA - 16 CLB - 9 Number of Top Pads Pad Material 10 kA minimum aluminum Backing Options: CHIP RESISTOR ARRAYS Resistor Material None, lapped semiconductor silicon Gold backing for eutectic die attach For custom configurations, consult Applications Engineer ORDERING INFORMATION Example: 100 % visualled, 10 k, 1 %, 100 ppm/C TCR, CLA format, aluminum pads, class H visual inspection P/N: W INSPECTION /PACKAGING W = 100 % visually inspected parts per MIL-STD-883 in matrix trays X = Sample, visually inspected loaded in matrix trays (4 % AQL) Document Number: 61009 Revision: 17-Mar-08 CLA PRODUCT FAMILY 008 PROCESS CODE See Process Code table 1000 RESISTANCE VALUE Use first 4 significant digits of the resistance For technical questions, contact: efi@vishay.com 1 MULTIPLIER CODE D = 0.0001 C = 0.001 B = 0.01 A = 0.1 0=1 1 = 10 2 = 100 3 = 1000 4 = 10000 F TOLERANCE CODE B = 0.1 % C = 0.2 % D = 0.5 % F = 1.0 % G = 2.0 % H = 2.5 % J = 5.0 % K = 10 % www.vishay.com 113 Legal Disclaimer Notice Vishay Disclaimer All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, "Vishay"), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners. Document Number: 91000 Revision: 18-Jul-08 www.vishay.com 1