Thermal Data (R) MULTIWATT Family 8,11,15 leads (JEDEC MO-048 ) 8 leads 11 leads 15 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cmC slug high thermal conductivity Cu 1.5 mm 3.9 W/cmC die attach soft solder ( tin / lead ) 15-50 m 0.2 W/cmC molding compound epoxy resin 3 mm 0.0063W/cmC Typical assembly configuration before molding : Charts enclosed : 1) Rth(j-c) vs. die size and dissipating area 2) Rth(j-a) vs on board heat sink area 3) Zth(j-a) vs time width and die size February 1998 1/2 Thermal Data MULTIWATT Family Tcase = 150 C Rth(j-c) (C/W) 5 4 silicon diss. area 3 1) 2 die thickness = 375 m solder thickness = 25 m 1 0 1 2 3 4 5 6 Dissipating area on die ( mm ) Rth(j-a) (C/W) 50 die size = 20.000 sq.mils dissipating area = 2000 sq.mils 40 floating in air mounted on PC board 30 2) 20 mounted on TH17023 heat sink 10 0 0 1 2 3 Dissipated Power ( Watt ) 4 5 Transient Thermal Resistance (C/W) 100 SINGLE PULSE 30 10 Pd = 2 Watt, mounted on board die size = 35.000 sq.mils dissipating area = 2.000 sq.mils 3 3) 1 Pd = 2 Watt, mounted on board die size = 175x195 sq.mils dissipating area =16.000 sq.mils 0.3 0.1 0.03 0.001 2/2 0.01 0.1 1 Time or pulse width ( s ) 10 100 1,000