Thermal Data
MULTIWATT Family
8,11,15 leads (JEDEC MO-048 )
item # material thickness thermal
conductivity
leadframe copper 0.5 mm 3.9 W/cm°C
slug high thermal
conductivity Cu
1.5 mm 3.9 W/cm°C
die attach soft solder
( tin / lead )
15-50 µm 0.2 W/cm°C
molding
compound
epoxy resin 3 mm 0.0063W/cm°C
PACKAGE MATERIAL LIST
Typical assembly configuration before molding :
Charts enclosed :
1) Rth(j-c) vs. die size and dissipating area
2) Rth(j-a) vs on board heat sink area
3) Zth(j-a) vs time width and die size
8 leads 11 leads 15 leads
February 1998 1/2
®
123456
0
1
2
3
4
5
Dissipating area on die ( mm )
Rth(j-c) (ºC/W)
Thermal Data MULTIWATT Family
2/2
1)
2)
3)
die thickness = 375 µm
solder thickness = 25 µm
diss. area silicon
Tcase = 150 ºC
012345
0
10
20
30
40
50
Dissipated Power ( Watt )
Rth(j-a) (ºC/W)
die size = 20.000 sq.mils
dissipating area = 2000 sq.mils
floating in air
mounted on PC board
mounted on TH17023 heat sink
0.001 0.01 0.1 1 10 100 1,000
0.03
0.1
0.3
1
3
10
30
100
Time or pulse width ( s )
Transient Thermal Resistance (ºC/W)
SINGLE PULSE
Pd = 2 Watt, mounted on board
die size = 35.000 sq.mils
dissipating area = 2.000 sq.mils
Pd = 2 Watt, mounted on board
die size = 175x195 sq.mils
dissipating area =16.000 sq.mils
