PACKAGE INFORMATION Page Index 1694 DIP LQFP QFP SDIP SO SSOP TSSOP VSO 1696 1706 1710 1712 1713 1721 1725 1726 Soldering 1728 Philips Semiconductors Package information Package outlines INDEX NAME DESCRIPTION VERSION PAGE DIP (dual in-line package) DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1 1696 DIP14 plastic dual in-line package; 14 leads (300 mil) SOT27-1 1697 DIP16 plastic dual in-line package; 16 leads (300 mil); long body SOT38-1 1698 DIP16 plastic dual in-line package; 16 leads (300 mil) SOT38-4 1699 DIP16 plastic dual in-line package; 16 leads (300 mil) SOT38-9 1700 DIP18 plastic dual in-line package; 18 leads (300 mil) SOT102-1 1701 DIP20 plastic dual in-line package; 20 leads (300 mil) SOT146-1 1702 DIP24 plastic dual in-line package; 24 leads (600 mil) SOT101-1 1703 DIP28 plastic dual in-line package; 28 leads (600 mil) SOT117-1 1704 DIP40 plastic dual in-line package; 40 leads (600 mil) SOT129-1 1705 LQFP (low profile quad flat package) LQFP32 plastic low profile quad flat package; 32 leads; body 7 x 7 x 1.4 mm SOT358-1 1706 LQFP64 plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm SOT314-2 1707 LQFP100 plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm SOT407-1 1708 LQFP128 plastic low profile quad flat package; 128 leads; body 14 x 20 x 1.4 mm SOT425-1 1709 QFP (quad flat package) QFP44 plastic quad flat package; 44 leads (lead length 2.35 mm); body 14 x 14 x 2.2 mm SOT205-1 1710 QFP44 plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm SOT307-2 1711 SOT270-1 1712 SDIP (shrink dual in-line package) SDIP42 plastic shrink dual in-line package; 42 leads (600 mil) SO (small outline package) SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 1713 SO8 plastic small outline package; 8 leads; body width 7.5 mm SOT176-1 1714 SO14 plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 1715 SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 1716 SO16 plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 1717 SO20 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 1718 SO24 plastic small outline package; 24 leads; body width 7.5 mm SOT137-1 1719 SO28 plastic small outline package; 28 leads; body width 7.5 mm SOT136-1 1720 SSOP (shrink small outline package) SSOP16 plastic shrink small outline package; 16 leads; body width 4.4 mm SOT369-1 1721 SSOP20 plastic shrink small outline package; 20 leads; body width 4.4 mm SOT266-1 1722 SSOP24 plastic shrink small outline package; 24 leads; body width 5.3 mm SOT340-1 1723 SSOP28 plastic shrink small outline package; 28 leads; body width 5.3 mm SOT341-1 1724 1999 Oct 27 1694 Philips Semiconductors Package information NAME Package outlines DESCRIPTION VERSION PAGE TSSOP (thin shrink small outline package) TSSOP8 plastic thin shrink small outline package; 8 leads; body width 3 mm SOT505-1 1725 VSO (very small outline package) VSO40 plastic very small outline package; 40 leads SOT158-1 1726 VSO56 plastic very small outline package; 56 leads SOT190-1 1727 1999 Oct 27 1695 Philips Semiconductors Package information Package outlines DIP DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1 ME seating plane D A2 A A1 L c Z w M b1 e (e 1) b MH b2 5 8 pin 1 index E 1 4 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.2 0.51 3.2 1.73 1.14 0.53 0.38 1.07 0.89 0.36 0.23 9.8 9.2 6.48 6.20 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 1.15 inches 0.17 0.020 0.13 0.068 0.045 0.021 0.015 0.042 0.035 0.014 0.009 0.39 0.36 0.26 0.24 0.10 0.30 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.045 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT97-1 050G01 MO-001AN 1999 Oct 27 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-02-04 1696 Philips Semiconductors Package information Package outlines DIP14: plastic dual in-line package; 14 leads (300 mil) SOT27-1 ME seating plane D A2 A A1 L c e Z w M b1 (e 1) b MH 8 14 pin 1 index E 1 7 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.2 0.51 3.2 1.73 1.13 0.53 0.38 0.36 0.23 19.50 18.55 6.48 6.20 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 2.2 inches 0.17 0.020 0.13 0.068 0.044 0.021 0.015 0.014 0.009 0.77 0.73 0.26 0.24 0.10 0.30 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.087 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT27-1 050G04 MO-001AA 1999 Oct 27 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-03-11 1697 Philips Semiconductors Package information Package outlines DIP16: plastic dual in-line package; 16 leads (300 mil); long body SOT38-1 ME seating plane D A2 A A1 L c e Z b1 w M (e 1) b MH 9 16 pin 1 index E 1 8 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.7 0.51 3.7 1.40 1.14 0.53 0.38 0.32 0.23 21.8 21.4 6.48 6.20 2.54 7.62 3.9 3.4 8.25 7.80 9.5 8.3 0.254 2.2 inches 0.19 0.020 0.15 0.055 0.045 0.021 0.015 0.013 0.009 0.86 0.84 0.26 0.24 0.10 0.30 0.15 0.13 0.32 0.31 0.37 0.33 0.01 0.087 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT38-1 050G09 MO-001AE 1999 Oct 27 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-10-02 95-01-19 1698 Philips Semiconductors Package information Package outlines DIP16: plastic dual in-line package; 16 leads (300 mil) SOT38-4 ME seating plane D A2 A A1 L c e Z w M b1 (e 1) b b2 MH 9 16 pin 1 index E 1 8 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.2 0.51 3.2 1.73 1.30 0.53 0.38 1.25 0.85 0.36 0.23 19.50 18.55 6.48 6.20 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 0.76 inches 0.17 0.020 0.13 0.068 0.051 0.021 0.015 0.049 0.033 0.014 0.009 0.77 0.73 0.26 0.24 0.10 0.30 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.030 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 92-11-17 95-01-14 SOT38-4 1999 Oct 27 EUROPEAN PROJECTION 1699 Philips Semiconductors Package information Package outlines DIP16: plastic dual in-line package; 16 leads (300 mil) SOT38-9 ME seating plane D A2 A A1 L b1 e Z c w M (e1) b MH b2 9 16 pin 1 index E 1 8 0 5 10 mm scale DIMENSIONS (mm dimensions are derived from the original inch dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.32 0.38 3.56 1.65 1.40 0.51 0.41 1.14 0.76 0.36 0.20 19.30 18.80 6.45 6.24 2.54 7.62 3.81 2.92 8.23 7.62 9.40 8.38 0.254 0.76 inches 0.17 0.015 0.14 0.065 0.055 0.020 0.016 0.045 0.030 0.014 0.008 0.76 0.74 0.254 0.246 0.10 0.30 0.150 0.115 0.324 0.300 0.37 0.33 0.01 0.030 Note 1. Plastic or metal protrusions of 0.01 inches maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 97-07-24 SOT38-9 1999 Oct 27 EUROPEAN PROJECTION 1700 Philips Semiconductors Package information Package outlines DIP18: plastic dual in-line package; 18 leads (300 mil) SOT102-1 ME seating plane D A2 A A1 L c e Z w M b1 (e 1) b b2 MH 10 18 pin 1 index E 1 9 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.7 0.51 3.7 1.40 1.14 0.53 0.38 1.40 1.14 0.32 0.23 21.8 21.4 6.48 6.20 2.54 7.62 3.9 3.4 8.25 7.80 9.5 8.3 0.254 0.85 inches 0.19 0.020 0.15 0.055 0.044 0.021 0.015 0.055 0.044 0.013 0.009 0.86 0.84 0.26 0.24 0.10 0.30 0.15 0.13 0.32 0.31 0.37 0.33 0.01 0.033 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 93-10-14 95-01-23 SOT102-1 1999 Oct 27 EUROPEAN PROJECTION 1701 Philips Semiconductors Package information Package outlines DIP20: plastic dual in-line package; 20 leads (300 mil) SOT146-1 ME seating plane D A2 A A1 L c e Z b1 w M (e 1) b MH 11 20 pin 1 index E 1 10 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c mm 4.2 0.51 3.2 1.73 1.30 0.53 0.38 0.36 0.23 26.92 26.54 inches 0.17 0.020 0.13 0.068 0.051 0.021 0.015 0.014 0.009 1.060 1.045 D e e1 L ME MH w Z (1) max. 6.40 6.22 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 2.0 0.25 0.24 0.10 0.30 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.078 (1) E (1) Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT146-1 1999 Oct 27 REFERENCES IEC JEDEC EIAJ SC603 1702 EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-05-24 Philips Semiconductors Package information Package outlines seating plane DIP24: plastic dual in-line package; 24 leads (600 mil) SOT101-1 ME D A2 L A A1 c e Z b1 w M (e 1) b MH 13 24 pin 1 index E 1 12 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 5.1 0.51 4.0 1.7 1.3 0.53 0.38 0.32 0.23 32.0 31.4 14.1 13.7 2.54 15.24 3.9 3.4 15.80 15.24 17.15 15.90 0.25 2.2 inches 0.20 0.020 0.16 0.066 0.051 0.021 0.015 0.013 0.009 1.26 1.24 0.56 0.54 0.10 0.60 0.15 0.13 0.62 0.60 0.68 0.63 0.01 0.087 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT101-1 051G02 MO-015AD 1999 Oct 27 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-01-23 1703 Philips Semiconductors Package information Package outlines seating plane handbook, full pagewidthdual in-line package; 28 leads (600 mil) DIP28: plastic SOT117-1 ME D A2 L A A1 c e Z w M b1 (e 1) b MH 15 28 pin 1 index E 1 14 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 5.1 0.51 4.0 1.7 1.3 0.53 0.38 0.32 0.23 36.0 35.0 14.1 13.7 2.54 15.24 3.9 3.4 15.80 15.24 17.15 15.90 0.25 1.7 inches 0.20 0.020 0.16 0.066 0.051 0.020 0.014 0.013 0.009 1.41 1.34 0.56 0.54 0.10 0.60 0.15 0.13 0.62 0.60 0.68 0.63 0.01 0.067 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT117-1 051G05 MO-015AH 1999 Oct 27 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-01-14 1704 Philips Semiconductors Package information Package outlines seating plane DIP40: plastic dual in-line package; 40 leads (600 mil) SOT129-1 ME D A2 L A A1 c e Z w M b1 (e 1) b MH 21 40 pin 1 index E 1 20 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c mm 4.7 0.51 4.0 1.70 1.14 0.53 0.38 0.36 0.23 52.50 51.50 inches 0.19 0.020 0.16 0.067 0.045 0.021 0.015 0.014 0.009 2.067 2.028 D e e1 L ME MH w Z (1) max. 14.1 13.7 2.54 15.24 3.60 3.05 15.80 15.24 17.42 15.90 0.254 2.25 0.56 0.54 0.10 0.60 0.14 0.12 0.62 0.60 0.69 0.63 0.01 0.089 (1) E (1) Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT129-1 051G08 MO-015AJ 1999 Oct 27 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-01-14 1705 Philips Semiconductors Package information Package outlines LQFP LQFP32: plastic low profile quad flat package; 32 leads; body 7 x 7 x 1.4 mm SOT358-1 c y X 24 A 17 25 16 ZE e E HE A A2 A 1 (A 3) wM bp Lp L pin 1 index 32 9 detail X 1 8 e ZD v M A wM bp D B HD v M B 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HD HE L Lp v w y mm 1.60 0.20 0.05 1.45 1.35 0.25 0.4 0.3 0.18 0.12 7.1 6.9 7.1 6.9 0.8 9.15 8.85 9.15 8.85 1.0 0.75 0.45 0.2 0.25 0.1 Z D (1) Z E (1) 0.9 0.5 0.9 0.5 o 7 0o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 95-12-19 97-08-04 SOT358 -1 1999 Oct 27 EUROPEAN PROJECTION 1706 Philips Semiconductors Package information Package outlines LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm SOT314-2 c y X A 48 33 49 32 ZE e E HE A A2 (A 3) A1 wM bp pin 1 index 64 Lp L 17 1 detail X 16 ZD e v M A wM bp D B HD v M B 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e mm 1.60 0.20 0.05 1.45 1.35 0.25 0.27 0.17 0.18 0.12 10.1 9.9 10.1 9.9 0.5 HD HE 12.15 12.15 11.85 11.85 L Lp v w y 1.0 0.75 0.45 0.2 0.12 0.1 Z D (1) Z E (1) 1.45 1.05 1.45 1.05 7o 0o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 95-12-19 97-08-01 SOT314-2 1999 Oct 27 EUROPEAN PROJECTION 1707 Philips Semiconductors Package information Package outlines LQFP100: plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm SOT407-1 c y X A 51 75 50 76 ZE e E HE A A2 (A 3) A1 w M bp Lp L pin 1 index 100 detail X 26 25 1 ZD e v M A w M bp D B HD v M B 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e mm 1.6 0.20 0.05 1.5 1.3 0.25 0.28 0.16 0.18 0.12 14.1 13.9 14.1 13.9 0.5 HD HE 16.25 16.25 15.75 15.75 L Lp v w y 1.0 0.75 0.45 0.2 0.12 0.1 Z D (1) Z E (1) 1.15 0.85 7 0o 1.15 0.85 o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 95-12-19 97-08-04 SOT407-1 1999 Oct 27 EUROPEAN PROJECTION 1708 Philips Semiconductors Package information Package outlines LQFP128: plastic low profile quad flat package; 128 leads; body 14 x 20 x 1.4 mm SOT425-1 c y X A 65 102 64 103 ZE e E HE A A2 A 1 (A 3) wM Lp bp pin 1 index L detail X 39 128 1 38 v M A ZD wM bp e D B HD v M B 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e mm 1.6 0.15 0.05 1.45 1.35 0.25 0.27 0.17 0.20 0.09 20.1 19.9 14.1 13.9 0.5 HD HE 22.15 16.15 21.85 15.85 L Lp v w y 1.0 0.75 0.45 0.2 0.12 0.1 Z D(1) Z E(1) 0.81 0.59 7 0o 0.81 0.59 o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 96-04-02 97-08-04 SOT425-1 1999 Oct 27 EUROPEAN PROJECTION 1709 Philips Semiconductors Package information Package outlines QFP QFP44: plastic quad flat package; 44 leads (lead length 2.35 mm); body 14 x 14 x 2.2 mm SOT205-1 c y X 33 A 23 34 22 ZE e E HE A A2 (A 3) A1 wM bp Lp pin 1 index 44 L 12 detail X 1 11 ZD e v M A wM bp D B HD v M B 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HD HE L Lp v w y mm 2.60 0.25 0.05 2.3 2.1 0.25 0.50 0.35 0.25 0.14 14.1 13.9 14.1 13.9 1 19.2 18.2 19.2 18.2 2.35 2.0 1.2 0.3 0.15 0.1 Z D (1) Z E (1) 2.4 1.8 2.4 1.8 o 7 0o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC SOT205-1 133E01A 1999 Oct 27 JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 95-02-04 97-08-01 1710 Philips Semiconductors Package information Package outlines QFP44: plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm SOT307-2 c y X A 33 23 34 22 ZE e E HE A A2 wM (A 3) A1 bp Lp pin 1 index L 12 44 1 detail X 11 wM bp e ZD v M A D B HD v M B 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HD HE L Lp v w y mm 2.10 0.25 0.05 1.85 1.65 0.25 0.40 0.20 0.25 0.14 10.1 9.9 10.1 9.9 0.8 12.9 12.3 12.9 12.3 1.3 0.95 0.55 0.15 0.15 0.1 Z D (1) Z E (1) 1.2 0.8 1.2 0.8 o 10 0o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 95-02-04 97-08-01 SOT307-2 1999 Oct 27 EUROPEAN PROJECTION 1711 Philips Semiconductors Package information Package outlines SDIP seating plane SDIP42: plastic shrink dual in-line package; 42 leads (600 mil) SOT270-1 ME D A2 L A A1 c e Z b1 (e 1) w M MH b 22 42 pin 1 index E 1 21 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 5.08 0.51 4.0 1.3 0.8 0.53 0.40 0.32 0.23 38.9 38.4 14.0 13.7 1.778 15.24 3.2 2.9 15.80 15.24 17.15 15.90 0.18 1.73 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 90-02-13 95-02-04 SOT270-1 1999 Oct 27 EUROPEAN PROJECTION 1712 Philips Semiconductors Package information Package outlines SO SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE v M A Z 5 8 Q A2 A (A 3) A1 pin 1 index Lp L 4 1 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.014 0.0075 0.20 0.19 0.16 0.15 0.244 0.039 0.028 0.050 0.041 0.228 0.016 0.024 inches 0.010 0.057 0.069 0.004 0.049 0.01 0.01 0.028 0.004 0.012 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT96-1 076E03S MS-012AA 1999 Oct 27 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-02-04 97-05-22 1713 o 8 0o Philips Semiconductors Package information Package outlines SO8: plastic small outline package; 8 leads; body width 7.5 mm SOT176-1 D E A X c y HE v M A Z 8 5 Q A2 A (A 3) A1 pin 1 index Lp L 1 4 e detail X w M bp 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 2.65 0.3 0.1 2.45 2.25 0.25 0.49 0.36 0.32 0.23 7.65 7.45 7.6 7.4 1.27 10.65 10.00 1.45 1.1 0.45 1.1 1.0 0.25 0.25 0.1 2.0 1.8 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.30 0.29 0.30 0.29 0.050 0.419 0.057 0.394 0.043 0.018 0.043 0.039 0.01 0.01 0.004 0.079 0.071 inches 0.10 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 95-02-25 97-05-22 SOT176-1 1999 Oct 27 EUROPEAN PROJECTION 1714 o 8 0o Philips Semiconductors Package information Package outlines SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 D E A X c y HE v M A Z 8 14 Q A2 A (A 3) A1 pin 1 index Lp 1 L 7 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 8.75 8.55 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.010 0.057 0.004 0.049 0.01 0.019 0.0100 0.35 0.014 0.0075 0.34 0.16 0.15 0.050 0.028 0.024 0.01 0.01 0.004 0.028 0.012 inches 0.069 0.244 0.039 0.041 0.228 0.016 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT108-1 076E06S MS-012AB 1999 Oct 27 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-23 97-05-22 1715 o 8 0o Philips Semiconductors Package information Package outlines SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 D E A X c y HE v M A Z 16 9 Q A2 A (A 3) A1 pin 1 index Lp 1 L 8 e 0 detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.069 0.010 0.057 0.004 0.049 0.01 0.019 0.0100 0.39 0.014 0.0075 0.38 0.16 0.15 0.050 0.039 0.016 0.028 0.020 0.01 0.01 0.004 0.028 0.012 inches 0.244 0.041 0.228 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT109-1 076E07S MS-012AC 1999 Oct 27 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-23 97-05-22 1716 o 8 0o Philips Semiconductors Package information Package outlines SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 D E A X c HE y v M A Z 16 9 Q A2 A (A 3) A1 pin 1 index Lp L 8 1 e detail X w M bp 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 10.5 10.1 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.9 0.4 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.41 0.40 0.30 0.29 0.050 0.419 0.043 0.055 0.394 0.016 0.043 0.039 0.01 0.01 0.004 0.035 0.016 inches 0.10 Z (1) Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT162-1 075E03 MS-013AA 1999 Oct 27 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-24 97-05-22 1717 o 8 0o Philips Semiconductors Package information Package outlines SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 D E A X c HE y v M A Z 11 20 Q A2 A (A 3) A1 pin 1 index Lp L 1 10 e bp detail X w M 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 13.0 12.6 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.9 0.4 inches 0.10 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.51 0.49 0.30 0.29 0.050 0.419 0.043 0.055 0.394 0.016 0.043 0.039 0.01 0.01 0.004 0.035 0.016 Z (1) 8o 0o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT163-1 075E04 MS-013AC 1999 Oct 27 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-24 97-05-22 1718 Philips Semiconductors Package information Package outlines SO24: plastic small outline package; 24 leads; body width 7.5 mm SOT137-1 D E A X c HE y v M A Z 13 24 Q A2 A (A 3) A1 pin 1 index Lp L 1 12 e detail X w M bp 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 15.6 15.2 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.9 0.4 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.61 0.60 0.30 0.29 0.050 0.419 0.043 0.055 0.394 0.016 0.043 0.039 0.01 0.01 0.004 0.035 0.016 inches 0.10 Z (1) Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT137-1 075E05 MS-013AD 1999 Oct 27 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-24 97-05-22 1719 o 8 0o Philips Semiconductors Package information Package outlines SO28: plastic small outline package; 28 leads; body width 7.5 mm SOT136-1 D E A X c y HE v M A Z 28 15 Q A2 A (A 3) A1 pin 1 index Lp L 14 1 e w M bp 0 detail X 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 18.1 17.7 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.9 0.4 inches 0.10 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.71 0.69 0.30 0.29 0.050 0.419 0.043 0.055 0.394 0.016 0.043 0.039 0.01 0.01 0.004 0.035 0.016 Z (1) 8o 0o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT136-1 075E06 MS-013AE 1999 Oct 27 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-24 97-05-22 1720 Philips Semiconductors Package information Package outlines SSOP SSOP16: plastic shrink small outline package; 16 leads; body width 4.4 mm D SOT369-1 E A X c y HE v M A Z 9 16 Q A2 A (A 3) A1 pin 1 index Lp L 1 8 detail X w M bp e 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.5 0.15 0.00 1.4 1.2 0.25 0.32 0.20 0.25 0.13 5.30 5.10 4.5 4.3 0.65 6.6 6.2 1.0 0.75 0.45 0.65 0.45 0.2 0.13 0.1 0.48 0.18 10 0o Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 94-04-20 95-02-04 SOT369-1 1999 Oct 27 EUROPEAN PROJECTION 1721 o Philips Semiconductors Package information Package outlines SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm D SOT266-1 E A X c y HE v M A Z 11 20 Q A2 A (A 3) A1 pin 1 index Lp L 1 10 detail X w M bp e 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.5 0.15 0 1.4 1.2 0.25 0.32 0.20 0.20 0.13 6.6 6.4 4.5 4.3 0.65 6.6 6.2 1.0 0.75 0.45 0.65 0.45 0.2 0.13 0.1 0.48 0.18 10 0o Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 90-04-05 95-02-25 SOT266-1 1999 Oct 27 EUROPEAN PROJECTION 1722 o Philips Semiconductors Package information Package outlines SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm D SOT340-1 E A X c HE y v M A Z 24 13 Q A2 A (A 3) A1 pin 1 index Lp L 1 12 bp e detail X w M 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 2.0 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 8.4 8.0 5.4 5.2 0.65 7.9 7.6 1.25 1.03 0.63 0.9 0.7 0.2 0.13 0.1 0.8 0.4 8 0o Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION SOT340-1 1999 Oct 27 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 93-09-08 95-02-04 MO-150AG 1723 o Philips Semiconductors Package information Package outlines SSOP28: plastic shrink small outline package; 28 leads; body width 5.3 mm D SOT341-1 E A X c HE y v M A Z 28 15 Q A2 A (A 3) A1 pin 1 index Lp L 1 14 bp e detail X w M 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 2.0 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 10.4 10.0 5.4 5.2 0.65 7.9 7.6 1.25 1.03 0.63 0.9 0.7 0.2 0.13 0.1 1.1 0.7 8 0o Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION SOT341-1 1999 Oct 27 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 93-09-08 95-02-04 MO-150AH 1724 o Philips Semiconductors Package information Package outlines TSSOP TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm D E SOT505-1 A X c y HE v M A Z 5 8 A2 pin 1 index (A3) A1 A Lp L 1 4 detail X e w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D(1) E(2) e HE L Lp v w y Z(1) mm 1.10 0.15 0.05 0.95 0.80 0.25 0.45 0.25 0.28 0.15 3.10 2.90 3.10 2.90 0.65 5.10 4.70 0.94 0.70 0.40 0.1 0.1 0.1 0.70 0.35 6 0 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 99-04-09 SOT505-1 1999 Oct 27 EUROPEAN PROJECTION 1725 Philips Semiconductors Package information Package outlines VSO VSO40: plastic very small outline package; 40 leads SOT158-1 D E A X c y HE v M A Z 40 21 Q A2 A (A 3) A1 pin 1 index Lp L 1 detail X 20 w M bp e 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 2.70 0.3 0.1 2.45 2.25 0.25 0.42 0.30 0.22 0.14 15.6 15.2 7.6 7.5 0.762 12.3 11.8 2.25 1.7 1.5 1.15 1.05 0.2 0.1 0.1 0.6 0.3 0.012 0.096 0.017 0.0087 0.61 0.010 0.004 0.089 0.012 0.0055 0.60 0.30 0.29 0.03 0.48 0.46 0.067 0.089 0.059 inches 0.11 0.045 0.024 0.008 0.004 0.004 0.041 0.012 Notes 1. Plastic or metal protrusions of 0.4 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 92-11-17 95-01-24 SOT158-1 1999 Oct 27 EUROPEAN PROJECTION 1726 o 7 0o Philips Semiconductors Package information Package outlines VSO56: plastic very small outline package; 56 leads SOT190-1 D E A X c y HE v M A Z 56 29 Q A2 A (A 3) A1 pin 1 index Lp L 1 detail X 28 w M bp e 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 3.3 0.3 0.1 3.0 2.8 0.25 0.42 0.30 0.22 0.14 21.65 21.35 11.1 11.0 0.75 15.8 15.2 2.25 1.6 1.4 1.45 1.30 0.2 0.1 0.1 0.90 0.55 0.13 0.012 0.004 0.12 0.11 0.01 0.017 0.0087 0.85 0.012 0.0055 0.84 inches 0.44 0.62 0.0295 0.43 0.60 0.063 0.089 0.055 0.057 0.035 0.008 0.004 0.004 0.051 0.022 Note 1. Plastic or metal protrusions of 0.3 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 96-04-02 97-08-11 SOT190-1 1999 Oct 27 EUROPEAN PROJECTION 1727 o 7 0o