PACKAGE INFORMATION
Page
Index 1694
DIP 1696
LQFP 1706
QFP 1710
SDIP 1712
SO 1713
SSOP 1721
TSSOP 1725
VSO 1726
Soldering 1728
1999 Oct 27 1694
Philips Semiconductors
Package information Package outlines
INDEX
NAME DESCRIPTION VERSION PAGE
DIP (dual in-line package)
DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1 1696
DIP14 plastic dual in-line package; 14 leads (300 mil) SOT27-1 1697
DIP16 plastic dual in-line package; 16 leads (300 mil); long body SOT38-1 1698
DIP16 plastic dual in-line package; 16 leads (300 mil) SOT38-4 1699
DIP16 plastic dual in-line package; 16 leads (300 mil) SOT38-9 1700
DIP18 plastic dual in-line package; 18 leads (300 mil) SOT102-1 1701
DIP20 plastic dual in-line package; 20 leads (300 mil) SOT146-1 1702
DIP24 plastic dual in-line package; 24 leads (600 mil) SOT101-1 1703
DIP28 plastic dual in-line package; 28 leads (600 mil) SOT117-1 1704
DIP40 plastic dual in-line package; 40 leads (600 mil) SOT129-1 1705
LQFP (low profile quad flat package)
LQFP32 plastic low profile quad flat package; 32 leads; body 7 ×7×1.4 mm SOT358-1 1706
LQFP64 plastic low profile quad flat package; 64 leads; body 10 ×10 ×1.4 mm SOT314-2 1707
LQFP100 plastic low profile quad flat package; 100 leads; body 14 ×14 ×1.4 mm SOT407-1 1708
LQFP128 plastic low profile quad flat package; 128 leads; body 14 ×20 ×1.4 mm SOT425-1 1709
QFP (quad flat package)
QFP44 plastic quad flat package; 44 leads (lead length 2.35 mm); body
14 ×14 ×2.2 mm SOT205-1 1710
QFP44 plastic quad flat package; 44 leads (lead length 1.3 mm); body
10 ×10 ×1.75 mm SOT307-2 1711
SDIP (shrink dual in-line package)
SDIP42 plastic shrink dual in-line package; 42 leads (600 mil) SOT270-1 1712
SO (small outline package)
SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 1713
SO8 plastic small outline package; 8 leads; body width 7.5 mm SOT176-1 1714
SO14 plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 1715
SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 1716
SO16 plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 1717
SO20 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 1718
SO24 plastic small outline package; 24 leads; body width 7.5 mm SOT137-1 1719
SO28 plastic small outline package; 28 leads; body width 7.5 mm SOT136-1 1720
SSOP (shrink small outline package)
SSOP16 plastic shrink small outline package; 16 leads; body width 4.4 mm SOT369-1 1721
SSOP20 plastic shrink small outline package; 20 leads; body width 4.4 mm SOT266-1 1722
SSOP24 plastic shrink small outline package; 24 leads; body width 5.3 mm SOT340-1 1723
SSOP28 plastic shrink small outline package; 28 leads; body width 5.3 mm SOT341-1 1724
1999 Oct 27 1695
Philips Semiconductors
Package information Package outlines
TSSOP (thin shrink small outline package)
TSSOP8 plastic thin shrink small outline package; 8 leads; body width 3 mm SOT505-1 1725
VSO (very small outline package)
VSO40 plastic very small outline package; 40 leads SOT158-1 1726
VSO56 plastic very small outline package; 56 leads SOT190-1 1727
NAME DESCRIPTION VERSION PAGE
1999 Oct 27 1696
Philips Semiconductors
Package information Package outlines
DIP
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT97-1 92-11-17
95-02-04
UNIT A
max. 12 b1(1) (1) (1)
b2cD E e M Z
H
L
mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
min. A
max. bmax.
w
ME
e1
1.73
1.14 0.53
0.38 0.36
0.23 9.8
9.2 6.48
6.20 3.60
3.05 0.2542.54 7.62 8.25
7.80 10.0
8.3 1.154.2 0.51 3.2
inches 0.068
0.045 0.021
0.015 0.014
0.009
1.07
0.89
0.042
0.035 0.39
0.36 0.26
0.24 0.14
0.12 0.010.10 0.30 0.32
0.31 0.39
0.33 0.0450.17 0.020 0.13
b2
050G01 MO-001AN
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
8
1
5
4
b
E
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
pin 1 index
DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1
1999 Oct 27 1697
Philips Semiconductors
Package information Package outlines
UNIT A
max. 1 2 (1) (1)
b1cD (1)
Z
Ee M
H
L
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
SOT27-1 92-11-17
95-03-11
A
min. A
max. bmax.
w
ME
e1
1.73
1.13 0.53
0.38 0.36
0.23 19.50
18.55 6.48
6.20 3.60
3.05 0.2542.54 7.62 8.25
7.80 10.0
8.3 2.24.2 0.51 3.2
0.068
0.044 0.021
0.015 0.77
0.73
0.014
0.009 0.26
0.24 0.14
0.12 0.010.10 0.30 0.32
0.31 0.39
0.33 0.0870.17 0.020 0.13
050G04 MO-001AA
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
14
1
8
7
b
E
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
DIP14: plastic dual in-line package; 14 leads (300 mil) SOT27-1
1999 Oct 27 1698
Philips Semiconductors
Package information Package outlines
UNIT A
max. 1 2 b1cEe M
H
L
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
SOT38-1 92-10-02
95-01-19
A
min. A
max. bmax.
w
ME
e1
1.40
1.14
0.055
0.045
0.53
0.38 0.32
0.23 21.8
21.4
0.86
0.84
6.48
6.20
0.26
0.24
3.9
3.4
0.15
0.13
0.2542.54 7.62
0.30
8.25
7.80
0.32
0.31
9.5
8.3
0.37
0.33
2.2
0.087
4.7 0.51 3.7
0.15 0.021
0.015 0.013
0.009 0.010.100.0200.19
050G09 MO-001AE
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
16
1
9
8
b
E
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
(1) (1)
D(1)
Z
DIP16: plastic dual in-line package; 16 leads (300 mil); long body SOT38-1
1999 Oct 27 1699
Philips Semiconductors
Package information Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT38-4 92-11-17
95-01-14
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
b2
e
D
A2
Z
16
1
9
8
E
pin 1 index
b
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
UNIT A
max. 12 b1(1) (1) (1)
b2cD E e M Z
H
L
mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
min. A
max. bmax.
w
ME
e1
1.73
1.30 0.53
0.38 0.36
0.23 19.50
18.55 6.48
6.20 3.60
3.05 0.2542.54 7.62 8.25
7.80 10.0
8.3 0.764.2 0.51 3.2
inches 0.068
0.051 0.021
0.015 0.014
0.009
1.25
0.85
0.049
0.033 0.77
0.73 0.26
0.24 0.14
0.12 0.010.10 0.30 0.32
0.31 0.39
0.33 0.0300.17 0.020 0.13
DIP16: plastic dual in-line package; 16 leads (300 mil) SOT38-4
1999 Oct 27 1700
Philips Semiconductors
Package information Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT38-9 97-07-24
MH
c
ME
A
L
seating plane
wM
e
D
A2
A1
b1
b2
Z
16
1
9
8
E
pin 1 index
b
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.01 inches maximum per side are not included.
UNIT A
max. b1(1) (1) (1)
b2cD E e M
HZ
L
mm
DIMENSIONS (mm dimensions are derived from the original inch dimensions)
A1
min. A2
max. bmax.
w
ME
e1
1.65
1.40 0.51
0.41 0.36
0.20 19.30
18.80 6.45
6.24 3.81
2.92 0.2542.54 7.62 8.23
7.62 9.40
8.38 0.764.32 0.38 3.56
inches 0.065
0.055 0.020
0.016 0.014
0.008
1.14
0.76
0.045
0.030 0.76
0.74 0.254
0.246 0.150
0.115 0.010.10 0.30 0.324
0.300 0.37
0.33 0.0300.17 0.015 0.14
DIP16: plastic dual in-line package; 16 leads (300 mil) SOT38-9
(e1)
1999 Oct 27 1701
Philips Semiconductors
Package information Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT102-1 93-10-14
95-01-23
UNIT A
max. 12 b1(1) (1) (1)
b2cD E e M Z
H
L
mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
min. A
max. bmax.
w
ME
e1
1.40
1.14 0.53
0.38 0.32
0.23 21.8
21.4 6.48
6.20 3.9
3.4 0.2542.54 7.62 8.25
7.80 9.5
8.3 0.854.7 0.51 3.7
inches 0.055
0.044 0.021
0.015 0.013
0.009
1.40
1.14
0.055
0.044 0.86
0.84 0.26
0.24 0.15
0.13 0.010.10 0.30 0.32
0.31 0.37
0.33 0.0330.19 0.020 0.15
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
b2
e
D
A2
Z
18
1
10
9
b
E
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
DIP18: plastic dual in-line package; 18 leads (300 mil) SOT102-1
1999 Oct 27 1702
Philips Semiconductors
Package information Package outlines
UNIT A
max. 1 2 b1cD E e M
H
L
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
SOT146-1 92-11-17
95-05-24
A
min. A
max. bZ
max.
w
ME
e1
1.73
1.30 0.53
0.38 0.36
0.23 26.92
26.54 6.40
6.22 3.60
3.05 0.2542.54 7.62 8.25
7.80 10.0
8.3 2.04.2 0.51 3.2
0.068
0.051 0.021
0.015 0.014
0.009 1.060
1.045 0.25
0.24 0.14
0.12 0.010.10 0.30 0.32
0.31 0.39
0.33 0.0780.17 0.020 0.13
SC603
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
20
1
11
10
b
E
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
(1)
(1) (1)
DIP20: plastic dual in-line package; 20 leads (300 mil) SOT146-1
1999 Oct 27 1703
Philips Semiconductors
Package information Package outlines
UNIT A
max. 1 2 b1cD E e M
H
L
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
SOT101-1 92-11-17
95-01-23
A
min. A
max. bw
ME
e1
1.7
1.3 0.53
0.38 0.32
0.23 32.0
31.4 14.1
13.7 3.9
3.4 0.252.54 15.24 15.80
15.24 17.15
15.90 2.25.1 0.51 4.0
0.066
0.051 0.021
0.015 0.013
0.009 1.26
1.24 0.56
0.54 0.15
0.13 0.010.10 0.60 0.62
0.60 0.68
0.63 0.0870.20 0.020 0.16
051G02 MO-015AD
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
24
1
13
12
b
E
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
Z
max.
(1)
(1)(1)
DIP24: plastic dual in-line package; 24 leads (600 mil) SOT101-1
1999 Oct 27 1704
Philips Semiconductors
Package information Package outlines
UNIT A
max. 1 2 b1(1)
(1) (1)
cD E weM
H
L
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
SOT117-1 92-11-17
95-01-14
A
min. A
max. bZ
max.
ME
e1
1.7
1.3 0.53
0.38 0.32
0.23 36.0
35.0 14.1
13.7 3.9
3.4 0.252.54 15.24 15.80
15.24 17.15
15.90 1.75.1 0.51 4.0
0.066
0.051 0.020
0.014 0.013
0.009 1.41
1.34 0.56
0.54 0.15
0.13 0.010.10 0.60 0.62
0.60 0.68
0.63 0.0670.20 0.020 0.16
051G05 MO-015AH
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
28
1
15
14
b
E
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
handbook, full pagewidth
DIP28: plastic dual in-line package; 28 leads (600 mil) SOT117-1
1999 Oct 27 1705
Philips Semiconductors
Package information Package outlines
UNIT A
max. 1 2 b1cD E e M
H
L
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
SOT129-1 92-11-17
95-01-14
A
min. A
max. bZ
max.
w
ME
e1
1.70
1.14 0.53
0.38 0.36
0.23 52.50
51.50 14.1
13.7 3.60
3.05 0.2542.54 15.24 15.80
15.24 17.42
15.90 2.254.7 0.51 4.0
0.067
0.045 0.021
0.015 0.014
0.009 2.067
2.028 0.56
0.54 0.14
0.12 0.010.10 0.60 0.62
0.60 0.69
0.63 0.089 0.19 0.020 0.16
051G08 MO-015AJ
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
40
1
21
20
b
E
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
(1)
(1)(1)
DIP40: plastic dual in-line package; 40 leads (600 mil) SOT129-1
1999 Oct 27 1706
Philips Semiconductors
Package information Package outlines
LQFP
UNIT A
max. A1A2A3bpcE
(1) eH
ELL
pZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 1.60 0.20
0.05 1.45
1.35 0.25 0.4
0.3 0.18
0.12 7.1
6.9 0.8 9.15
8.85 0.9
0.5 7
0
o
o
0.25 0.11.0 0.2
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.75
0.45
SOT358 -1 95-12-19
97-08-04
D(1) (1)(1)
7.1
6.9
HD
9.15
8.85
E
Z
0.9
0.5
D
bp
e
θ
EA1
A
Lp
detail X
L
(A )
3
B
8
c
D
H
bp
E
HA2
vMB
D
ZD
A
ZE
e
vMA
X
1
32
25
24 17
16
9
y
pin 1 index
wM
wM
0 2.5 5 mm
scale
LQFP32: plastic low profile quad flat package; 32 leads; body 7 x 7 x 1.4 mm SOT358-1
1999 Oct 27 1707
Philips Semiconductors
Package information Package outlines
UNIT A
max. A1A2A3bpcE
(1) eH
ELL
pZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 1.60 0.20
0.05 1.45
1.35 0.25 0.27
0.17 0.18
0.12 10.1
9.9 0.5 12.15
11.85 1.45
1.05 7
0
o
o
0.12 0.11.0 0.2
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.75
0.45
SOT314-2 95-12-19
97-08-01
D(1) (1)(1)
10.1
9.9
HD
12.15
11.85
E
Z
1.45
1.05
D
bp
e
θ
EA1
A
Lp
detail X
L
(A )
3
B
16
c
D
H
bp
E
HA2
vMB
D
ZD
A
ZE
e
vMA
X
1
64
49
48 33
32
17
y
pin 1 index
wM
wM
0 2.5 5 mm
scale
LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm SOT314-2
1999 Oct 27 1708
Philips Semiconductors
Package information Package outlines
UNIT A
max. A1A2A3bpcE
(1) eH
ELL
pZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 1.6 0.20
0.05 1.5
1.3 0.25 0.28
0.16 0.18
0.12 14.1
13.9 0.5 16.25
15.75 1.15
0.85 7
0
o
o
0.12 0.10.21.0
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.75
0.45
SOT407-1 95-12-19
97-08-04
D(1) (1)(1)
14.1
13.9
HD
16.25
15.75
E
Z
1.15
0.85
D
bp
e
θ
EA1
A
Lp
detail X
L
(A )
3
B
25
c
D
H
bp
E
HA2
vMB
D
ZD
A
ZE
e
vMA
X
1
100
7675 5150
26
y
pin 1 index
wM
wM
0 5 10 mm
scale
LQFP100: plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm SOT407-1
1999 Oct 27 1709
Philips Semiconductors
Package information Package outlines
UNIT A1A2A3bpcE
(1) eH
ELL
pZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 0.15
0.05 1.45
1.35 0.25 0.27
0.17 0.20
0.09 14.1
13.9 0.5 16.15
15.85 0.81
0.59 7
0
o
o
0.120.2 0.11.0
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.75
0.45
SOT425-1 96-04-02
97-08-04
D(1) (1)(1)
20.1
19.9
HD
22.15
21.85
E
Z
0.81
0.59
D
0 5 10 mm
scale
bp
e
θ
EA1
A
Lp
detail X
L
(A )
3
B
c
bp
E
HA2
D
HvMB
D
ZD
A
ZE
e
vMA
X
102
103
y
wM
wM
A
max.
1.6
LQFP128: plastic low profile quad flat package; 128 leads; body 14 x 20 x 1.4 mm SOT425-1
6564
38
39
1
128
pin 1 index
1999 Oct 27 1710
Philips Semiconductors
Package information Package outlines
QFP
UNIT A1A2A3bpcE
(1) eH
ELL
pZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 0.25
0.05 2.3
2.1 0.25 0.50
0.35 0.25
0.14 14.1
13.9 119.2
18.2 2.4
1.8 7
0
o
o
0.152.35 0.10.3
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
2.0
1.2
SOT205-1 95-02-04
97-08-01
D(1) (1)(1)
14.1
13.9
HD
19.2
18.2
E
Z
2.4
1.8
D
bp
e
θ
EA1
A
Lp
detail X
L
(A )
3
B
11
y
c
D
H
bp
E
HA2
vMB
D
ZD
A
ZE
e
vMA
X
1
44
34
33 23
22
12
133E01A
pin 1 index
wM
wM
0 5 10 mm
scale
QFP44: plastic quad flat package; 44 leads (lead length 2.35 mm); body 14 x 14 x 2.2 mm SOT205-1
A
max.
2.60
1999 Oct 27 1711
Philips Semiconductors
Package information Package outlines
UNIT A1A2A3bpcE
(1) eH
ELL
pZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 0.25
0.05 1.85
1.65 0.25 0.40
0.20 0.25
0.14 10.1
9.9 0.8 1.3
12.9
12.3 1.2
0.8 10
0
o
o
0.15 0.10.15
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.95
0.55
SOT307-2 95-02-04
97-08-01
D(1) (1)(1)
10.1
9.9
HD
12.9
12.3
E
Z
1.2
0.8
D
e
E
B
11
c
E
H
D
ZD
A
ZE
e
vMA
X
1
44
34 33 23 22
12
y
θ
A1
A
Lp
detail X
L
(A )
3
A2
pin 1 index
D
HvMB
bp
bp
wM
wM
0 2.5 5 mm
scale
QFP44: plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm SOT307-2
A
max.
2.10
1999 Oct 27 1712
Philips Semiconductors
Package information Package outlines
SDIP
UNIT b1cEe M
H
L
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
DIMENSIONS (mm are the original dimensions)
SOT270-1 90-02-13
95-02-04
bmax.
w
ME
e1
1.3
0.8 0.53
0.40 0.32
0.23 38.9
38.4 14.0
13.7 3.2
2.9 0.181.778 15.24 15.80
15.24 17.15
15.90 1.73
5.08 0.51 4.0
MH
c(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
42
1
22
21
b
E
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
(1) (1)
D(1)
Z
A
max. 12
A
min. A
max.
SDIP42: plastic shrink dual in-line package; 42 leads (600 mil) SOT270-1
1999 Oct 27 1713
Philips Semiconductors
Package information Package outlines
SO
UNIT A
max. A1A2A3bpcD
(1) E(2) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
1.75 0.25
0.10 1.45
1.25 0.25 0.49
0.36 0.25
0.19 5.0
4.8 4.0
3.8 1.27 6.2
5.8 1.05 0.7
0.6 0.7
0.3 8
0
o
o
0.25 0.10.25
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
1.0
0.4
SOT96-1
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
4
5
pin 1 index
1
8
y
076E03S MS-012AA
0.069 0.010
0.004 0.057
0.049 0.01 0.019
0.014 0.0100
0.0075 0.20
0.19 0.16
0.15 0.050 0.244
0.228 0.028
0.024 0.028
0.012
0.010.010.041 0.004
0.039
0.016
0 2.5 5 mm
scale
SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
95-02-04
97-05-22
1999 Oct 27 1714
Philips Semiconductors
Package information Package outlines
UNIT A
max. A1A2A3bpcD
(1) E(1) Z(1)
eH
ELL
pQywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
2.65 0.3
0.1 2.45
2.25 0.49
0.36 0.32
0.23 7.65
7.45 7.6
7.4 1.27 10.65
10.00 1.1
1.0 2.0
1.8 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.1
0.45
SOT176-1 95-02-25
97-05-22
X
4
8
θ
A
A1
A2
wM
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
5
1
(A )
3
A
y
0.25
0.10 0.012
0.004 0.096
0.089 0.019
0.014 0.013
0.009 0.30
0.29 0.30
0.29 0.050
1.45
0.057
0.25
0.01
0.419
0.394 0.043
0.039 0.079
0.071
0.01 0.004
0.043
0.018
0.01
0 5 10 mm
scale
pin 1 index
SO8: plastic small outline package; 8 leads; body width 7.5 mm SOT176-1
1999 Oct 27 1715
Philips Semiconductors
Package information Package outlines
UNIT A
max. A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
1.75 0.25
0.10 1.45
1.25 0.25 0.49
0.36 0.25
0.19 8.75
8.55 4.0
3.8 1.27 6.2
5.8 0.7
0.6 0.7
0.3 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.0
0.4
SOT108-1
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
7
8
1
14
y
076E06S MS-012AB
pin 1 index
0.069 0.010
0.004 0.057
0.049 0.01 0.019
0.014 0.0100
0.0075 0.35
0.34 0.16
0.15 0.050
1.05
0.041
0.244
0.228 0.028
0.024 0.028
0.012
0.01
0.25
0.01 0.004
0.039
0.016
95-01-23
97-05-22
0 2.5 5 mm
scale
SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1
1999 Oct 27 1716
Philips Semiconductors
Package information Package outlines
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
8
9
1
16
y
pin 1 index
UNIT A
max. A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
1.75 0.25
0.10 1.45
1.25 0.25 0.49
0.36 0.25
0.19 10.0
9.8 4.0
3.8 1.27 6.2
5.8 0.7
0.6 0.7
0.3 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.0
0.4
SOT109-1 95-01-23
97-05-22
076E07S MS-012AC
0.069 0.010
0.004 0.057
0.049 0.01 0.019
0.014 0.0100
0.0075 0.39
0.38 0.16
0.15 0.050
1.05
0.041
0.244
0.228 0.028
0.020 0.028
0.012
0.01
0.25
0.01 0.004
0.039
0.016
0 2.5 5 mm
scale
SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1
1999 Oct 27 1717
Philips Semiconductors
Package information Package outlines
UNIT A
max. A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZ
ywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
2.65 0.30
0.10 2.45
2.25 0.49
0.36 0.32
0.23 10.5
10.1 7.6
7.4 1.27 10.65
10.00 1.1
1.0 0.9
0.4 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.1
0.4
SOT162-1
8
16
wM
bp
D
detail X
Z
e
9
1
y
0.25
075E03 MS-013AA
pin 1 index
0.10 0.012
0.004 0.096
0.089 0.019
0.014 0.013
0.009 0.41
0.40 0.30
0.29 0.050
1.4
0.055
0.419
0.394 0.043
0.039 0.035
0.016
0.01
0.25
0.01 0.004
0.043
0.016
0.01
X
θ
A
A1
A2
HE
Lp
Q
E
c
L
vMA
(A )
3
A
0 5 10 mm
scale
SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1
95-01-24
97-05-22
1999 Oct 27 1718
Philips Semiconductors
Package information Package outlines
UNIT A
max. A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZ
ywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
2.65 0.30
0.10 2.45
2.25 0.49
0.36 0.32
0.23 13.0
12.6 7.6
7.4 1.27 10.65
10.00 1.1
1.0 0.9
0.4 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.1
0.4
SOT163-1
10
20
wM
bp
detail X
Z
e
11
1
D
y
0.25
075E04 MS-013AC
pin 1 index
0.10 0.012
0.004 0.096
0.089 0.019
0.014 0.013
0.009 0.51
0.49 0.30
0.29 0.050
1.4
0.055
0.419
0.394 0.043
0.039 0.035
0.016
0.01
0.25
0.01 0.004
0.043
0.016
0.01
0 5 10 mm
scale
X
θ
A
A1
A2
HE
Lp
Q
E
c
L
vMA
(A )
3
A
SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1
95-01-24
97-05-22
1999 Oct 27 1719
Philips Semiconductors
Package information Package outlines
UNIT A
max. A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZ
ywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
2.65 0.30
0.10 2.45
2.25 0.49
0.36 0.32
0.23 15.6
15.2 7.6
7.4 1.27 10.65
10.00 1.1
1.0 0.9
0.4 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.1
0.4
SOT137-1
X
12
24
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
c
L
vMA
13
(A )
3
A
y
0.25
075E05 MS-013AD
pin 1 index
0.10 0.012
0.004 0.096
0.089 0.019
0.014 0.013
0.009 0.61
0.60 0.30
0.29 0.050
1.4
0.055
0.419
0.394 0.043
0.039 0.035
0.016
0.01
0.25
0.01 0.004
0.043
0.016
0.01
e
1
0 5 10 mm
scale
SO24: plastic small outline package; 24 leads; body width 7.5 mm SOT137-1
95-01-24
97-05-22
1999 Oct 27 1720
Philips Semiconductors
Package information Package outlines
UNIT A
max. A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZ
ywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
2.65 0.30
0.10 2.45
2.25 0.49
0.36 0.32
0.23 18.1
17.7 7.6
7.4 1.27 10.65
10.00 1.1
1.0 0.9
0.4 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.1
0.4
SOT136-1
X
14
28
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
c
L
vMA
e
15
1
(A )
3
A
y
0.25
075E06 MS-013AE
pin 1 index
0.10 0.012
0.004 0.096
0.089 0.019
0.014 0.013
0.009 0.71
0.69 0.30
0.29 0.050
1.4
0.055
0.419
0.394 0.043
0.039 0.035
0.016
0.01
0.25
0.01 0.004
0.043
0.016
0.01
0 5 10 mm
scale
SO28: plastic small outline package; 28 leads; body width 7.5 mm SOT136-1
95-01-24
97-05-22
1999 Oct 27 1721
Philips Semiconductors
Package information Package outlines
SSOP
UNIT A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 0.15
0.00 1.4
1.2 0.32
0.20 0.25
0.13 5.30
5.10 4.5
4.3 0.65 6.6
6.2 0.65
0.45 0.48
0.18 10
0
o
o
0.130.2 0.1
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
0.75
0.45
1.0
SOT369-1 94-04-20
95-02-04
wM
θ
A
A1
A2
bp
D
yHE
Lp
Q
detail X
E
Z
e
c
L
vMA
X
(A )
3
A
0.25
18
16 9
pin 1 index
0 2.5 5 mm
scale
SSOP16: plastic shrink small outline package; 16 leads; body width 4.4 mm SOT369-1
A
max.
1.5
1999 Oct 27 1722
Philips Semiconductors
Package information Package outlines
UNIT A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 0.15
01.4
1.2 0.32
0.20 0.20
0.13 6.6
6.4 4.5
4.3 0.65 1.0 0.2
6.6
6.2 0.65
0.45 0.48
0.18 10
0
o
o
0.13 0.1
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
0.75
0.45
SOT266-1 90-04-05
95-02-25
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
X
(A )
3
A
y
0.25
110
20 11
pin 1 index
0 2.5 5 mm
scale
SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm SOT266-1
A
max.
1.5
1999 Oct 27 1723
Philips Semiconductors
Package information Package outlines
UNIT A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 0.21
0.05 1.80
1.65 0.38
0.25 0.20
0.09 8.4
8.0 5.4
5.2 0.65 1.25
7.9
7.6 0.9
0.7 0.8
0.4 8
0
o
o
0.13 0.10.2
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
1.03
0.63
SOT340-1 MO-150AG 93-09-08
95-02-04
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
112
24 13
0.25
y
pin 1 index
0 2.5 5 mm
scale
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm SOT340-1
A
max.
2.0
1999 Oct 27 1724
Philips Semiconductors
Package information Package outlines
UNIT A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 0.21
0.05 1.80
1.65 0.38
0.25 0.20
0.09 10.4
10.0 5.4
5.2 0.65 1.25
7.9
7.6 0.9
0.7 1.1
0.7 8
0
o
o
0.13 0.10.2
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
1.03
0.63
SOT341-1 MO-150AH 93-09-08
95-02-04
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
114
28 15
0.25
y
pin 1 index
0 2.5 5 mm
scale
SSOP28: plastic shrink small outline package; 28 leads; body width 5.3 mm SOT341-1
A
max.
2.0
1999 Oct 27 1725
Philips Semiconductors
Package information Package outlines
TSSOP
UNIT A1
A
max. A2A3bpLHELpwyv
ceD(1) E(2) Z(1) θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 0.15
0.05 0.95
0.80 0.45
0.25 0.28
0.15 3.10
2.90 3.10
2.90 0.65 5.10
4.70 0.70
0.35 6°
0°
0.1 0.10.10.94
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.70
0.40
SOT505-1 99-04-09
wM
bp
D
Z
e
0.25
14
85
θ
A
A2A1
Lp
(A3)
detail X
L
HE
E
c
vMA
X
A
y
2.5 5 mm0
scale
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm SOT505-1
1.10
pin 1 index
1999 Oct 27 1726
Philips Semiconductors
Package information Package outlines
VSO
UNIT A1A2A3bpcD
(1) E(2) Z(1)
eH
ELL
pQywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
0.3
0.1 2.45
2.25 0.25 0.42
0.30 0.22
0.14 15.6
15.2 7.6
7.5 0.762 2.25
12.3
11.8 1.15
1.05 0.6
0.3 7
0
o
o
0.1 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Notes
1. Plastic or metal protrusions of 0.4 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
1.7
1.5
SOT158-1 92-11-17
95-01-24
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
y
40
20
21
1
pin 1 index
0.012
0.004 0.096
0.089 0.017
0.012 0.0087
0.0055 0.61
0.60 0.30
0.29 0.03 0.089
0.48
0.46 0.045
0.041 0.024
0.012
0.004
0.2
0.008 0.004
0.067
0.059
0.010
0 5 10 mm
scale
VSO40: plastic very small outline package; 40 leads SOT158-1
A
max.
2.70
0.11
1999 Oct 27 1727
Philips Semiconductors
Package information Package outlines
UNIT A1A2A3bpcD
(1) E(2) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
0.3
0.1 3.0
2.8 0.25 0.42
0.30 0.22
0.14 21.65
21.35 11.1
11.0 0.75 15.8
15.2 1.45
1.30 0.90
0.55 7
0
o
o
0.1 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
1.6
1.4
SOT190-1 96-04-02
97-08-11
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
X
(A )
3
A
y
56 29
281
pin 1 index
0.012
0.004 0.12
0.11 0.017
0.012 0.0087
0.0055 0.85
0.84 0.44
0.43 0.0295
2.25
0.089
0.62
0.60 0.057
0.051 0.035
0.022
0.004
0.2
0.008 0.004
0.063
0.055
0.01
0 5 10 mm
scale
VSO56: plastic very small outline package; 56 leads SOT190-1
A
max.
3.3
0.13
Note
1. Plastic or metal protrusions of 0.3 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
