TD62382AFNG TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic TD62382AFNG 8ch Low Input Active Darlington Sink Driver The TD62382AFNG is non-inverting transistor array which is comprised of eight Low saturation output stages and PNP input stages. This device can be operated by source input voltage and is suitable for operation with a 5-V general pourposed logic IC such as TTL, 5-V CMOS and 5-V Microprocessor which have sink current output drivers. Applications include relay, hammer, lamp and LED display drivers. Please observe the thermal condition for using. Weight: 0.09 g (typ.) Features * Low Saturation Output: 0.23 V (max) @ Iout = 40 mA (max) * Package type: SSOP18 pin (0.65 mm pitch) * Output rating: 50 V (min)/50 mA (max) * Low level active input * Input compatible with TTL and 5-V CMOS * Standard supply voltage Pin Assignment (top view) O1 O2 O3 O4 O5 O6 O7 18 17 16 15 14 13 12 O8 VCC 11 10 1 I1 2 I2 3 I3 4 I4 5 I5 6 I6 7 I7 8 9 I8 GND Schematics (each driver) 7 k 14 k VCC 20 k 1 k Input Output Note: The input and output parasitic diodes cannot be used as clamp diodes. 1 2004-02-18 TD62382AFNG Maximum Ratings (Ta = 25C) Characteristics Symbol Rating Unit VCC -0.5~7.0 V VCE (SUS) -0.5~50 V Output current IOUT 50 mA/ch Input voltage VIN -22~VCC + 0.5 V Input current IIN 10 mA 0.96 W Supply voltage Output sustaining voltage Power dissipation PD (Note) Operating temperature Topr -40~85 C Storage temperature Tstg -55~150 C Note: On Glass Epoxy PCB (50 x 50 x 1.6 mm Cu 40%) Recommended Operating Conditions (Ta = -40~85C) Characteristics Supply voltage Output sustaining voltage Output current Input voltage Symbol Test Condition Min Typ. Max Unit VCC 4.5 5.0 5.5 V VCE (SUS) 0 50 V DC 1 Circuit 0 40 8 Circuits 0 40 IOUT mA/ch VIN -20 VCC Output on VIN (ON) -20 VCC - 3.5 Output off VIN (OFF) VCC - 0.3 VCC + 0.5 0.4 W Min Typ. Max Unit Power dissipation PD (Note) V Note: On Glass Epoxy PCB (50 x 50 x 1.6 mm Cu 40%) Electrical Characteristics (Ta = 25C) Symbol Test Circuit ICEX 1 VCC = 5.5 V, IIN = 0 A VOUT = 35 V, Ta = 75C 100 A VCE (sat) 2 VCC = 4.5 V, VIN = 0.8 V IOUT = 40 mA 0.23 V -0.32 -0.45 IIN (ON) 3 VCC = 5.5 V, VIN = 0.4 V Output on VCC = 5.5 V, VIN = -20 V -2.6 Output off IIN (OFF) 4 -40 A VIN (ON) 5 -20 VCC - 3.5 V VCC = 5.5 V, VIN = 0 V 6 mA/ch VCC = VIN = 5.5 V Ta = 75C 100 A VOUT = 50 V RL = 1 k 0.1 VOUT = 50 V RL = 1 k 3.0 Characteristics Output leakage current Output saturation voltage Input current Input voltage (Output on) Output on ICC (ON) 6 Supply current Output off Turn-on delay ICC (OFF) tON 7 Turn-off delay tOFF Test Condition VCC = 5 V CL = 15 pF 2 mA s 2004-02-18 TD62382AFNG Test Circuit 1. ICEX 2. VCE (sat) VCC 3. IIN (ON) VCC VCC ICEX IOUT IIN (ON) Open VOUT VIN 4. IIN (OFF) VCE (sat) VIN 5. VIN (ON) VCC 6. ICC VCC VCC ICC IOUT VIN (OFF) Open VIN (ON) VIN 7. tON, tOFF Input VCC = 5 V VOUT RL Pulse generator Output CL = 15 pF (Note 2) (Note 1) tf tr 90% Input VIH = VCC 90% 50% 50% 10% 10% 0 50 s tON tOFF VOL Output 50% 50% Note 1: Pulse width 50 s, Duty cycle 10% Output impedance 50 , tr 10 ns, tf 5 ns Note 2: CL includes probe and jig capacitance. Precautions for Using This IC does not include built-in protection circuits for excess current or overvoltage. If this IC is subjected to excess current or overvoltage, it may be destroyed. Hence, the utmost care must be taken when systems which incorporate this IC are designed. Utmost care is necessary in the design of the output line, VCC and GND line since IC may be destroyed due to short-circuit between outputs, air contamination fault, or fault by improper grounding. 3 2004-02-18 TD62382AFNG IOUT - VCE (sat) VCC - ICC 100 VCC = 5 V IIN = 0.3 mA Ta = 25C typ. Out-pin open (mA) 80 Supply current ICC Output current IOUT (mA) 100 60 40 20 Ta = 25C typ. 80 8 bit ON 60 7 bit ON 6 bit ON 40 5 bit ON 4 bit ON 3 bit ON 20 2 bit ON 1 bit ON 1 0 0.04 0.08 0.12 0.16 0.20 Output saturation voltage VCE (sat) 1 0 0.24 2 (V) 4 Supply voltage VIN - VOUT VCC = 5 V IIN = 50 mA Ta = 25C typ. (50 x 50 x 1.6 mm Cu 40%) (W) Power dissipation PD (V) VIN Input voltage 3 2 1 10 15 (V) (1) On glass epoxy PCB 1.5 4 5 VCC 8 PD - Ta 5 0 0 6 20 25 Output voltage VOUT 30 1.0 (1) 0.5 0 0 35 (V) 50 100 Ambient temperature 150 Ta (C) IIN - VIN -0.4 -0.3 Input current IIN (mA) Ta = 25C typ. VCC = 4.5 V -0.2 5.0 -0.1 5.5 0 0 1 2 3 Input voltage VIN 4 5 (V) 4 2004-02-18 TD62382AFNG Package Dimensions Weight: 0.09 g (typ.) 5 2004-02-18 TD62382AFNG About solderability, following conditions were confirmed * Solderability (1) Use of Sn-63Pb solder Bath * solder bath temperature = 230C * dipping time = 5 seconds * the number of times = once * use of R-type flux (2) Use of Sn-3.0Ag-0.5Cu solder Bath * solder bath temperature = 245C * dipping time = 5 seconds * the number of times = once * use of R-type flux RESTRICTIONS ON PRODUCT USE 030619EBA * The information contained herein is subject to change without notice. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. * TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc.. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. * The products described in this document are subject to the foreign exchange and foreign trade laws. * TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced and sold, under any law and regulations. 6 2004-02-18