TD62382AFNG
2004-02-18
1
TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic
TD62382AFNG
8ch Low Input Active Darlington Sink Driver
The TD62382AFNG is non-inv erting transistor array which is
comprised of eight Low saturation output stages and PNP input
stages.
This device can be operated by sourc e input voltage and is
suitable for operation with a 5-V general pourposed logic IC such
as TTL, 5-V CMOS and 5-V Microprocessor which have sink
current output drivers.
Applications include relay, hammer, lamp and LED display
drivers.
Please observe the thermal condition for using.
Features
• Low Saturation Output : 0.23 V (max)
@ Iout = 40 mA (max)
• Package type: SSOP18 pin (0.65 mm pitch)
• Output rating: 50 V (min)/50 mA (max)
• Low level active input
• Input compatible with TTL and 5-V CMOS
• Standard supply voltage
Pin Assignment (top view)
Schematics (each driver)
Note: The input and output parasitic diodes cannot be used as clamp diodes.
Weight: 0.09 g (typ.)
1 2 3 4 5 6 7 8
18 17 16 15 14 13 12 11
O1 O2 O3 O4 O5 O6 O7 O8
I1 I2 I3 I4 I5 I6 I7 I8
10
VCC
9
GND
Input 14 kΩ
7 kΩ
VCC
Output
1 kΩ 20 kΩ
TD62382AFNG
2004-02-18
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Maximum Ratings (Ta = 25°C)
Characteristics Symbol Rating Unit
Supply voltageVCC −0.5~7.0 V
Output sustaining voltage VCE (SUS) −0.5~50 V
Output current IOUT 50 mA/ch
Input voltage VIN −22~VCC + 0.5 V
Input current IIN 10 mA
Power dissipation PD (Note) 0.96 W
Operating temperature Topr −40~85 °C
Storage temperature Tstg −55~150 °C
Note: On Glass Epoxy PCB (50 × 50 × 1.6 mm Cu 40%)
Recommended Operating Conditions (Ta = −40~85°C)
Characteristics Symbol Test Condition Min Typ. Max Unit
Supply voltage VCC ⎯ 4.5 5.0 5.5 V
Output sustaining voltage VCE (SUS) ⎯ 0 ⎯ 50 V
DC 1 Circuit 0 ⎯ 40
Output current IOUT 8 Circuits 0 ⎯ 40
mA/ch
V
IN ⎯ −20 ⎯ V
CC
Output on VIN (ON) ⎯ −20 ⎯ VCC −
3.5
Input voltage
Output off VIN (OFF) ⎯ VCC −
0.3 ⎯ VCC +
0.5
V
Power dissipation PD (Note) ⎯ ⎯ ⎯ 0.4 W
Note: On Glass Epoxy PCB (50 × 50 × 1.6 mm Cu 40%)
Electrical Characteristics (Ta = 25°C)
Characteristics Symbol
Test
Circuit Test Condition Min Typ. Max Unit
Output leakage current ICEX 1
VCC = 5.5 V, IIN = 0 A
VOUT = 35 V, Ta = 75°C ⎯ ⎯ 100 µA
Output saturation voltage VCE (sat) 2
VCC = 4.5 V, VIN = 0.8 V
IOUT = 40 mA ⎯ ⎯ 0.23 V
VCC = 5.5 V, VIN = 0.4 V ⎯ −0.32 −0.45
Output on IIN (ON) 3
VCC = 5.5 V, VIN = −20 V ⎯ ⎯ −2.6 mA
Input current
Output off IIN (OFF) 4 ⎯ ⎯ ⎯ −40 µA
Input voltage (Output on) VIN (ON) 5 ⎯ −20 ⎯ VCC −
3.5 V
Output on ICC (ON) V
CC = 5.5 V, VIN = 0 V ⎯ ⎯ 6 mA/ch
Supply current Output off ICC (OFF) 6 VCC = VIN = 5.5 V
Ta = 75°C ⎯ ⎯ 100 µA
Turn-on delay tON VOUT = 50 V
RL = 1 kΩ ⎯ 0.1 ⎯
Turn-off delay tOFF 7 VCC = 5 V
CL = 15 pF VOUT = 50 V
RL = 1 kΩ ⎯ 3.0 ⎯
µs
TD62382AFNG
2004-02-18
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Test Circuit
1. ICEX 2. VCE (sat) 3. IIN (ON)
4. IIN (OFF) 5. VIN (ON) 6. ICC
7. tON, tOFF
Note 1: Pulse width 50 µs, Duty cycle 10%
Output impedance 50 Ω, tr ≤ 10 ns, tf ≤ 5 ns
Note 2: CL includes probe and jig capacitance.
Precautions for Using
This IC does not include built-in protection circuits for excess current or overvoltage.
If this IC is subjected to excess current or overvoltage, it may be destroyed.
Hence, the utmost care must be taken when systems which incorporate this IC are designed.
Utmost care is necessary in the design of the output line, VCC and GND line since IC may be destroyed due to
short-circuit between outputs, air contamination fault, or fault by improper grounding.
Input
CL = 15 pF
(Note 2)
(Note 1)
VOUT
Pulse
generator
RL
VCC = 5 V
Output
10% 10% 50%
tON tOFF
tr
tf
VIH = VCC
0
VOL
Input 50%
90% 90%
50 µs
Output 50% 50%
VCC
VIN (ON)
IOUT
VCC
VIN (OFF)
VCC
VIN
ICC
Open
VIN
VCC
IIN (ON)
VCC
VIN
IOUT
VCE (sat)
VCC ICEX
Open
VOUT
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IOUT – VCE (sat)
VCC – ICC
VIN – VOUT
PD – Ta
IIN – VIN
Output saturation voltage VCE (sat) (V) Supply voltage VCC (V)
Output voltage VOUT (V) Ambient temperature Ta (°C)
Input voltage VIN (V)
Supply current ICC (mA)
Output current IOUT (mA)
Power dissipation PD (W)
Input voltage VIN (V)
Input current IIN (mA)
1
0
40
0.240.08
80
0.04 0.16 0.20 0.12
100
20
60
VCC = 5 V
IIN = 0.3 mA
Ta = 25°C typ.
150 100 50
00
0.5
1.0
1.5 (1) On glass epoxy PCB
(50 × 50 × 1.6 mm Cu 40%)
(1)
0
0
−0.2
5 2
−0.3
1 4 3
−0.4
−0.1
Ta = 25°C typ.
VCC = 4.5 V
5.0
5.5
10
40
4
80
2 6 8
100
20
60
Out-pin open
Ta = 25°C typ.
1 bit ON
2 bit ON
3 bit ON
4 bit ON
5 bit ON
6 bit ON
7 bit ON
8 bit ON
0
0
2
35 10
4
5 20 30 15
5
1
3
VCC = 5 V
IIN = 50 mA
Ta = 25°C typ.
25
TD62382AFNG
2004-02-18
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Package Dimensions
Weight: 0.09 g (typ.)
TD62382AFNG
2004-02-18
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• The information contained herein is subject to change without notice.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of
TOSHIBA or others.
• TO SHIBA is continually working to improve the qu ality and reliabil ity of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your desig ns, please ensure that TOSHIBA products ar e used within specified operating ra nges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc..
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipm ent, office equipment, measuri ng equipment, industrial r obotics, domestic applianc es,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk.
• The products described in this document are subject to the foreign exchange and foreign trade laws.
• TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced
and sold, under any law and regulations.
030619EBA
RESTRICTIONS ON P RODUCT USE
About solderability, following conditions were confirmed
• Solderability
(1) Use of Sn-63Pb solder Bath
· solder bath temperature = 230°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
(2) Use of Sn-3.0Ag-0.5Cu solder Bath
· solder bath temperature = 245°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
