MPU-9250 CA-SDK - InvenSense

I nvenSense Inc.

1745 Technology Drive, San Jose, CA 95110 U.S.A.

Tel: +1 (408) 988-7339 F ax: +1 (408) 988-8104

Website: w ww.invensense.com

Document Number: PS-MPU-9250A-01

Revision: 1.0

Release Date: 01/17/2014

MPU-9250

Product Specification

Revision 1.0

MPU-9250 Product Specification Doc ument Nu mber : PS-MPU-9250A-01

Revision: 1.0

Release Date: 01/17/2014

CONTENTS

1 DOCUME NT INFORMATION ............................................................................................................ 4

1.1 REVISION HISTORY .................................................................................................................... 4

1.2 PURPOSE AND SCOPE................................................................................................................ 5

1.3 PRODUCT OVERVIEW ................................................................................................................. 5

1.4 APPLICATIONS .......................................................................................................................... 5

2 FEATURES ...................................................................................................................................... 6

2.1 GYROSCOPE FEATURES ............................................................................................................. 6

2.2 ACCELEROMETER FEATURES ...................................................................................................... 6

2.3 MAGNETOMETER FEATURES ....................................................................................................... 6

2.4 ADDITIONAL FEATURES .............................................................................................................. 6

2.5 MOTIONPROCESSING................................................................................................................. 7

3 EL ECTRI CAL CH ARA CT ERISTICS .................................................................................................. 8

3.1 GYROSCOPE SPECIFICATIONS ..................................................................................................... 8

3.2 ACCELEROMETER SPECIFICATIONS .............................................................................................. 9

3.3 MAGNETOMETER SPECIFICATIONS ............................................................................................. 10

3.4 ELECTRICAL SPECIFICATIONS .................................................................................................... 11

3.5 I2C TIMING CHARACTERIZATION ................................................................................................ 15

3.6 SPI TIMING CHARACTERIZATION ................................................................................................ 16

3.7 ABSOLUTE MAXIMUM RATINGS .................................................................................................. 18

4 AP PL ICAT IO NS INF ORMATION ..................................................................................................... 19

4.1 PIN OUT AND SIGNAL DESCRIPTION............................................................................................ 19

4.2 TYPICAL OPERATING CIRCUIT.................................................................................................... 20

4.3 BILL OF MATERIALS FOR EXTERNAL COMPONENTS ....................................................................... 20

4.4 BLOCK DIAGRAM ..................................................................................................................... 21

4.5 OVERVIEW ............................................................................................................................. 22

4.6 THREE-AXIS MEMS GYROSCOPE WITH 16-BIT ADCS AND SIGNAL CONDITIONING............................. 22

4.7 THREE-AXIS MEMS ACCELEROMETER WITH 16-BIT ADCS AND SIGNAL CONDITIONING ...................... 22

4.8 THREE-AXIS MEMS MAGNE TOMETER WITH 16-BIT ADCS AND SIGNAL CONDITIONING ....................... 22

4.9 DIGITAL MOTION PROCESSOR ................................................................................................... 22

4.10 PRIMARY I2C AND SPI SERIAL COMMUNICATIONS INTERFACES ...................................................... 23

4.11 AUXILIARY I2C SERIAL INTERFACE ............................................................................................. 23

4.12 SELF-TEST............................................................................................................................. 24

4.13 MPU-9250 SOLUTION USING I2C INTERFACE.............................................................................. 25

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MPU-9250 Product Specification Doc ument Nu mber : PS-MPU-9250A-01

Revision: 1.0

Release Date: 01/17/2014

4.14 MPU-9250 SOLUTION USING SPI INTERFACE.............................................................................. 26

4.15 CLOCKING.............................................................................................................................. 26

4.16 SENSOR DATA REGISTERS ....................................................................................................... 27

4.17 FIFO..................................................................................................................................... 27

4.18 INTERRUPTS ........................................................................................................................... 27

4.19 DIGITAL-OUTPUT TEMPERATURE SENSOR ................................................................................... 27

4.20 BIAS AND LDO........................................................................................................................ 28

4.21 CHARGE PUMP ....................................................................................................................... 28

4.22 STANDARD POWER MODE ........................................................................................................ 28

4.23 POWER SEQUENCING REQUIREMENTS AND POWER ON RESET ....................................................... 28

5 ADVANCED HARDWARE FEATURES............................................................................................ 29

6 P RO GRAM MABLE INTERRUPTS................................................................................................... 30

6.1 WAKE-ON-MOTION INTERRUPT .................................................................................................. 30

7 DI G IT AL INT ERFACE ..................................................................................................................... 32

7.1 I2C AND SPI SERIAL INTERFACES .............................................................................................. 32

7.2 I2C INTERFACE ....................................................................................................................... 32

7.3 I2C COMMUNICATIONS PROTOCOL............................................................................................. 32

7.4 I2C TERMS ............................................................................................................................ 35

7.5 SPI INTERFACE....................................................................................................................... 36

8 S ERIAL INTE RF ACE CO NSIDE RAT IONS ....................................................................................... 37

8.1 MPU-9250 SUPPORTED INTERFACES......................................................................................... 37

9 ASSEMBLY.................................................................................................................................... 38

9.1 ORIENTATION OF AXES............................................................................................................. 38

9.2 PACKAGE DIMENSIONS............................................................................................................. 38

10 PART NUMBER PACKAGE M ARKING ........................................................................................... 40

11 RELIABILITY.................................................................................................................................. 41

11.1 QUALIFICATION TEST POLICY .................................................................................................... 41

11.2 QUALIFICATION TEST PLAN ....................................................................................................... 41

12 REFERENCE.................................................................................................................................. 42

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MPU-9250 Product Specification Doc ument Nu mber : PS-MPU-9250A-01

Revision: 1.0

Release Date: 01/17/2014

1 Docum ent Inf or m ati on

1.1 Revision History

Revision

Date Revision Description

01/17/14 1.0 Initial Release

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MPU-9250 Product Specification Doc ument Nu mber : PS-MPU-9250A-01

Revision: 1.0

Release Date: 01/17/2014

1.2 Purpose and Scope

This document is a preliminary product specification, providing a description, specifications, and design

relate d in fo rmation o n the MPU-9250™ Motion Tr acking de vice. The device is h oused in a sm all 3x3x1mm

QFN package.

Specifications are subject to change without notice. Final specifications will be updated based upon

characte rization of production silicon. For references to register map and descriptions of in divi dual registers,

pl eas e refer to the MPU-9250 Register Map and Register Descriptions document.

1.3 Product Overvie w

MPU-9250 is a multi-chip mo dule ( MCM ) consisting of two dies integrated into a single QFN packag e. One

die houses the 3-Axis gyroscope and the 3-Axis accelerometer. The other die houses the AK8963 3-Axis

magnetometer from Asahi Kasei Microdevices Corporation. Hence, the MPU-9250 is a 9-axis

Motion Tracking device that combines a 3-axis gyroscope, 3-axis accelerometer, 3-axis magnetom eter an d a

Digital Motion Processor™ (DMP) all in a small 3x3x1mm package available as a pin-compatible upgrade

from the MPU-6515. With its dedicated I2C sensor bus, the MPU-9250 directly provides complete 9-axis

MotionFusion™ output. The MPU-9250 MotionTracking device, with its 9-axis integration, on-chip

MotionFusion™, and run-time calibration firmware, enables manufacturers to eliminate the costly and

complex selection, qualification, and system level integration of discrete devices, guaranteeing optimal

motion pe rform ance for consumers. MPU-9250 is also designed to inter face with multiple no n-i nertial digital

sensors, such as pres sure sensors , on i t s auxiliary I2C port.

MPU-9250 features three 16-bit analog-to-digital converters (ADCs) for digitizing the gyroscope outputs,

three 16-bit ADCs for digitizing the accelerometer outputs, and three 16-bit ADCs for digitizing the

magnetometer outputs. For precision tracking of both fast and slow motions, the parts feature a user-

programmable gyroscope full-scale range of ±250, ±500, ±1000, and ±2000°/sec (dps), a user-

programmable accelerometer full-scale range of ±2g, ±4g, ±8g, and ±16g, and a magnetometer full-scale

range of ±4800µT.

Other industry-leading features include programmable digital filters, a precision clock with 1% drift from -

40°C t o 85°C, an embedded temper ature sensor, and pr ogram m able int errupts. The devic e features I2C and

SPI serial interfac es, a VDD operatin g range o f 2.4V to 3.6V, and a separ ate digital IO supply, VDDIO from

1.71V to VDD.

Comm unication with all registers of the de vice is performe d using eithe r I2C at 400kHz or SPI at 1M Hz. For

applications requiring faster communications, the sensor and interrupt registers may be read using SPI at

20MHz.

By leveraging its patented and volume-proven CMOS-MEMS fabrication platform, which integrates MEMS

wafers with compani on CM OS electro nics through wafer-level b onding, In venSe nse has dri ve n the packag e

size down to a footpri nt and thickness of 3x3x1mm, to pro vi de a very small yet high per formance low cost

package. The device provides high robustness by supporting 10,000g shock reliability.

1.4 Applications

• TouchAnywhere™ technology (for “no touch” UI Application Control/Navigation)

• MotionCommand™ technology (for Gesture Short-cuts)

• Motion-enabled game and application framework

• Location based services, points of interest, and dead reckoning

• Handset and portable gaming

• Motion-based game controllers

• 3D remote controls for Internet connected DTVs and set top boxes, 3D mice

• Wearable sensors for health, fitness and sports

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MPU-9250 Product Specification Doc ument Nu mber : PS-MPU-9250A-01

Revision: 1.0

Release Date: 01/17/2014

2 Features

2.1 Gyroscope Features

The triple-ax i s M E MS gyroscope i n t he MPU-9250 includes a wide range of features:

• Digital-output X-, Y-, and Z-Axis angul ar rate senso rs (gy roscopes) with a user-programmable full-

scale range of ±250, ±500, ±1000, and ±2000°/sec and integrated 16-bit ADCs

• Digitally-programmable low-pass filter

• Gyroscope operating current: 3.2mA

• Sleep mode current: 8µA

• Fact ory cal i brat ed sensitivity s cal e fact or

• Self-test

2.2 Ac celero meter F eatu r es

The triple-ax i s M E MS accel erom eter i n MPU-9250 includes a wide range of features:

• Digital-output triple-axis accelerometer with a programmable full scale range of ±2g, ±4g, ±8g and

±16g and integrated 16-bit ADCs

• Accelerometer normal operating current: 450µA

• Low power accelerometer mode current: 8.4µA at 0.98Hz, 19.8µA at 31.25Hz

• Sleep mode current: 8µA

• User-programmable interrupts

• Wake-on-motion interrupt for low power operation of applications processor

• Self-test

2.3 M ag n eto meter F eatu r es

The triple-ax i s M E MS m agnetom et er i n M P U-9250 includes a wide range of features:

• 3-axi s si l i con m onol i t hi c Hal l-effec t m agneti c sensor wi t h m agneti c concentrat or

• Wi de dy nami c m easurem ent range and hi gh res ol uti on wi t h l ower current c onsum pti on.

• Output data resol uti on of 14 bi t (0.6µT/ LSB ) or 16 bi t (15µT/LSB)

• Full scal e m easurem ent range i s ±4800µT

• Magnetometer normal operating current: 280µA at 8Hz repet i ti on rat e

• Self-test function with internal magnetic source to confirm magnetic sensor operation on end

products

2.4 Additional Features

The MPU-9250 includes the following additional features:

• Auxiliary master I2C bus for reading data from external sensors (e.g. pressure sensor)

• 3.5mA operat i ng current when all 9 m oti on sensi ng axes and the DM P are enabl ed

• V DD suppl y vol t age range of 2.4 – 3.6V

• VDDIO reference voltage for auxiliary I2C devices

• S m al l est and thi nnes t QFN package for portable devices: 3x3x1mm

• Minimal cross-axis sensitivity between the accelerometer, gyroscope and magnetom eter axes

• 512 byte FIFO buffer enables the appl i cati ons proc essor to read t he data i n burs ts

• Digital-output temperature sensor

• User-program m able digi t al fil ters for gy roscope, accelerometer, and tem p sensor

• 10,000 g shock tolerant

• 400kHz Fast Mode I2C for communicating with all registers

• 1M Hz SPI s eri al interface for com m uni cati ng wi t h al l regi s ters

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MPU-9250 Product Specification Doc ument Nu mber : PS-MPU-9250A-01

Revision: 1.0

Release Date: 01/17/2014

• 20M Hz SPI s eri al interface for reading sensor and interrupt registers

• M E M S struct ure herm et i cal l y seal ed and bonded at wafer l evel

• RoHS and Green compliant

2.5 MotionProcessing

• Internal Digital Motion Processing™ (DMP™ ) engine suppo rts ad vance d MotionP rocessing and low

power functions such as gesture recognition using programmable interrupts

• Low-power p edometer fu nctionality allo ws the host processor to sleep while th e DMP maintai ns the

step count.

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MPU-9250 Product Specification Doc ument Nu mber : PS-MPU-9250A-01

Revision: 1.0

Release Date: 01/17/2014

3 Electrical Characteristics

3.1 Gyroscope Specifications

Typical Operating Circuit of section 4.2, VDD = 2.5V, VDDIO = 2.5V, TA=25°C, unless otherwise noted.

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

Full-Scale Range

FS_SEL=0

±250

º/s

FS_SEL=1

±500

º/s

FS_SEL=2

±1000

º/s

FS_SEL=3

±2000

º/s

Gyroscope AD C Word Length

bits

Sensitivity Scale Factor

FS_SEL=0

131

LSB/(º/s)

FS_SEL=1

65.5

LSB/(º/s)

FS_SEL=2

32.8

LSB/(º/s)

FS_SEL=3

16.4

LSB/(º/s)

Sensitivity Scale Factor Tolerance

25°C

±3

Sensitivity Scale Factor Variation Over

Temperature

-40°C to +85°C

±4

Nonlinearity

Best fit straight line; 25°C

±0.1

Cross-Axis Sensitivity

±2

Initi al ZRO Tolerance

25°C

±5

º/s

ZRO Variation Over Temperature

-40°C to +85°C

±30

º/s

Total RMS Nois e

D LP FCFG=2 (92 H z)

0.1

º/s-rms

R ate N oise Spectral Density

0.01

º/s/√Hz

Gyroscope M echanical Frequencies

KHz

Low P ass Filter Response

Programmable Range

250

Gyroscope Startup T im e From Sleep mode

35 ms

Output Data Rate

Pr ogrammable, Normal mode

8000

Table 1 Gyroscope Specifications

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MPU-9250 Product Specification Doc ument Nu mber : PS-MPU-9250A-01

Revision: 1.0

Release Date: 01/17/2014

3.2 Accelerometer Specifications

Typical Operating Circuit of section 4.2, VDD = 2.5V, V DDIO = 2.5V, TA=25°C, unless otherwise noted.

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

Full-Scale Range

AFS_SEL=0

±2

AFS_SEL=1

±4

AFS_SEL=2

±8

AFS_SEL=3

±16

ADC Word Length

Output in tw o’ s complement format

bits

Sensitivity Scale Factor

AFS_SEL=0

16,384

LSB/g

AFS_SEL=1

8,192

LSB/g

AFS_SEL=2

4,096

LSB/g

AFS_SEL=3

2,048

LSB/g

Initial Tolerance

Component-Level

±3

Sensitivity C hange vs. Tem perature

-40°C to +85°C AFS_SEL=0

Component-level ±0.026 %/°C

Nonlinearity

Best F it Straight Line

±0.5

Cross-Axis Sensitivity

±2

Zero-G Initial Calibration Tolerance

Component-lev el, X,Y

±60

Component-lev el, Z

±80

Zero-G Level Change vs. Temperature

-40°C to +85°C

±1.5

mg/°C

Noise P ower Spectral D ensity

Low noise m ode

300

µg/√ Hz

Total RMS Nois e

DLPFCFG=2 (94Hz)

mg-rms

Low P ass Filter Response

Programmable Range

260

Intell igence Function Increment

mg/LSB

Accelerom eter Startup Tim e

From Sleep mode

From Cold Star t, 1ms V DD ramp

Output Data Rate

Low power (duty-cycled) 0.24

500 Hz

Duty-cycled, over temp

±15

Low noise (active) 4

4000 Hz

Table 2 Accelerometer Specifications

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MPU-9250 Product Specification Doc ument Nu mber : PS-MPU-9250A-01

Revision: 1.0

Release Date: 01/17/2014

3.3 Magneto meter Specificat ions

Typical Operating Circuit of section 4.2, V DD = 2.5V, VDDIO = 2.5V, TA=25°C, unless otherwise noted.

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

M AGNETOM ET ER SENSIT IV IT Y

Full-Scale Range

±4800

µT

ADC Word Length

bits

Sensitivity Scale Factor

0.6

µT / LSB

ZERO-FIELD OUTPUT

Initial Calibration Tolerance

±500

LSB

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MPU-9250 Product Specification Doc ument Nu mber : PS-MPU-9250A-01

Revision: 1.0

Release Date: 01/17/2014

3.4 Electrical Specifications

3.4.1 D.C. Ele ctrica l Characteristics

Typical Operating Circuit of section 4.2, VDD = 2.5V, VDDIO = 2.5V, TA=25°C, unless otherwise noted.

PARAMETER

CONDITIONS

MIN

TYP

MAX

Units

Notes

SUPPL Y V OL TAGES

VDD

2.4

2.5

3.6

VDDIO 1.71 1.8 VDD V

SUPPLY CURRENTS

Nor mal Mode 9-axis (no DMP), 1 kHz gyro ODR, 4 kHz

accel OD R, 8 H z mag. repetition rate 3.7 mA

6-axis (accel + gyro, no DM P ), 1 k Hz gyro

ODR, 4 kHz accel ODR 3.4 mA

3-axis Gyroscope only (no DM P ), 1 kHz ODR 3.2 mA

6-axis (accel + m agnetom eter, no DM P ), 4

k Hz accel ODR, mag. repetition rate = 8 Hz 730 µA

3-Axis Accelerom eter, 4kHz ODR (no DMP) 450 µA

3-axis M agnetom eter only (no D M P ), 8 Hz

repetition rate 280 µA

Accelerom eter Low P ower M ode

(DMP, Gyroscope, M agnetom eter

disabled)

0.98 H z update rate 8.4 µA 1

31.25 H z update rate 19.8 µA 1

Full Chip Idle Mode Supply Current

8 µA

TEMPERATURE RANGE

Specified Tem perature Range

P erform ance param eters are not applicable

beyond Specified Temperature Range -40 +85 °C

Table 3 D.C. Ele ctrical Characte ristics

Notes:

1. Accelerometer Low Powe r Mod e supports the follo wing outp ut data rates (O DRs): 0.24, 0.49, 0.9 8,

1.95, 3.91, 7.8 1, 15.63, 31.2 5, 62.50, 125, 2 50, 500Hz. Supply current for any update rat e can be

calculated as:

S uppl y Current i n µA = Sl eep Current + Update Rat e * 0.376

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MPU-9250 Product Specification Doc ument Nu mber : PS-MPU-9250A-01

Revision: 1.0

Release Date: 01/17/2014

3.4.2 A.C. Ele ctrica l Cha ra cte ristics

Typical Operating Circuit of section 4.2, VDD = 2.5V, VDDIO = 2.5V, TA=25°C, unless otherwise noted.

Parameter

Conditions

MIN

TYP

MAX

Units

Supply Ramp T ime

Monotonic ramp. Ramp rate

is 10% to 90% of the final

value 0.1 100 ms

Operating Range

Ambient

-40

85 °C

Sensitivity

Untrimmed

333.87

LSB/°C

Room Temp Offset

21°C

LSB

Supply Ramp T ime (T

RAMP

)

Valid pow er-on RESET

0.01

100

Start-up tim e for register read/write

From power -up

11 100 ms

I2C ADDRESS

AD0 = 0

AD0 = 1

1101000

1101001

, H igh Level I nput Voltage

0.7*VDDIO

, Low Level I nput Voltage

0.3*VDDIO

, Input Capacitance

< 10

, H igh Level Output Voltage

LOAD

=1MΩ;

0.9*VDDIO

OL1

, LOW-Level Output Voltage

LOAD

=1MΩ;

0.1*VDDIO

OL.INT1

, I NT Low -Level Output Voltage

OPEN=1, 0.3mA sink

Current

0.1

Output Leakage Current

OPEN=1

100

INT

, I NT P ulse Width

LATCH_INT_EN=0

µs

, LOW Level Input Voltage

-0.5V

0.3*VDDIO

, HIGH-Level Input Voltage

0.7*VDDIO

VDDIO +

0.5V

hys

, Hystere sis

0.1*VDDIO

, L OW-Level Output Volt age

3mA s ink c u rre nt

0.4

, LOW-Level Output Current

=0.4V

VOL=0.6V

Output Leakage Current

100

, Output Fall Time from V

IHmax

to V

ILmax

b u s capacitance in pf

20+0.1C

250

, LOW-Level Input Voltage

-0.5V

0.3*VDDIO

, HIGH-Lev el Input V oltage

0.7* VDDIO

VDDIO +

0.5V

hys

, H yst ere sis

0.1* VDDIO

OL1

, LOW-Level Output Voltage

VDDIO > 2V; 1mA sink

current

0.4

OL3

, LOW-Level Output Voltage

VDDIO < 2V; 1mA sink

current

0.2* VDDIO

, LOW-Level Output C urrent

= 0.4V

VOL = 0.6V

Output Leakage Current

100

, Output Fall Time from V

IHmax

to V

ILmax

bus capacitance in pF

20+0.1C

250

Sample Rate

Fchoice=0,1,2

SMPLRT_DIV=0

32 kHz

Fchoice=3;

DLPFCFG=0 or 7

SMPLRT_DIV=0

8 kHz

Fchoice=3;

DLPFCFG=1,2,3,4,5,6;

SMPLRT_DIV=0

1 kHz

C lock F requency I nitial Tolerance

CLK_SEL=0, 6; 25°C

-2

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MPU-9250 Product Specification Doc ument Nu mber : PS-MPU-9250A-01

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Release Date: 01/17/2014

CLK_SEL=1,2,3,4,5; 25°C

-1

Frequency Variation over Tem perature

CLK_SEL=0,6

-10

+10

CLK_SEL=1,2,3,4,5

±1

Table 4 A.C. Ele ctrical Characte ristics

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MPU-9250 Product Specification Doc ument Nu mber : PS-MPU-9250A-01

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Release Date: 01/17/2014

3.4.3 Othe r Ele ctrica l Specifications

Typical Operating Circuit of section 4.2, VDD = 2.5V, VDDIO = 2.5V, TA=25°C, unless otherwise noted.

PARAMETER

CONDITIONS

MIN

TYP

MAX

Units

SPI Operating Frequency, All

R egisters R ead/Write Low Speed C haracterization

100

±10% kHz

High Speed Characteri zation

1 ±10%

MHz

SPI Operating Frequency, Sensor

and Interrupt Registers Read Only

20 ±10% MHz

I2C Operating Frequency

All registers, F ast-mode

400

kHz

All registers, Standard-mode

100

kHz

Table 5 Other Ele ctrica l Specifica tions

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MPU-9250 Product Specification Doc ument Nu mber : PS-MPU-9250A-01

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Release Date: 01/17/2014

3.5 I2C Tim i ng Chara cteriz ati on

Typical Operating Circuit of section 4.2, VDD = 2.4V to 3.6V, VDDIO = 1.71 to VDD, TA=25°C, unless

otherwise noted.

Parameters

Conditions

Min

Typical

Max

Units

Notes

I2C TIMIN G

I2C F AST-MODE

SCL

, SCL Clock Frequency

400

kHz

HD.STA

, (R epeated) START Condition Hold

Time

0.6

µs

LOW

, SC L Low P eriod

1.3

µs

HIGH

, SCL High Period

0.6

µs

SU.STA

, R epeated START Condition Setup

Time

0.6

µs

HD.DAT

, SD A Data Hold Tim e

µs

SU.DAT

, SD A Data Setup Tim e

100

, SDA and SCL Rise Time

bus cap. from 10 to 400pF

20+0.1C

300

, SDA and SCL Fall Time

bus cap. from 10 to 400pF

20+0.1C

300

SU.STO

, STOP Condition Setup Time

0.6

µs

BUF

, Bus Free Tim e Betw een ST OP and

STA RT Condition

1.3

µs

, Capacitive Load for each Bus Line

< 400

tVD.DAT, Data Valid Tim e

0.9

µs

VD.ACK

, D ata Valid Acknowledge T im e

0.9

µs

Table 6 I2C Tim i ng Chara cteri stics

Notes:

• T iming Charac te ristics apply to both P rimary and Auxiliary I2C Bus

• Bas ed on ch aract erization of 5 parts ov er temp erature and voltage as mounted on evaluation board or in

sockets

I2C Bus Tim i ng Diagra m

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MPU-9250 Product Specification Doc ument Nu mber : PS-MPU-9250A-01

Revision: 1.0

Release Date: 01/17/2014

3.6 SPI Timing Charac terizat ion

Typical Operating Circuit of section 4.2, VDD = 2.4V to 3.6V, VDDI O = 1.71V to VDD, TA=25°C, unless

otherwise noted.

Parameters

Conditions

Min

Typical

Max

Units

Notes

SPI TIMING

fSCLK, SCLK C lock Frequency

1 MHz

tLOW, SC LK Low P eriod

400

HIGH

, SCLK High Period

400

SU.CS

, CS S etup Time

HD.CS

, CS Hold Time

500

SU.SDI

, SD I Setup Tim e

HD.SDI

, S DI Ho ld Ti me

tVD.SDO, SDO Valid Time Cload = 20pF

100 ns

tHD.SDO, SDO Hold Time Cload = 20pF 4

DIS.SDO

, SDO Output Disable Time

Table 7 SPI Timing Characte ristics

Notes:

1. Based on char acterization of 5 parts over temperature and vol tage as mounte d on eva luat ion board or in soc kets

SP I Bus Ti m i ng Diagram

3.6.1 fSCLK = 20 MHz

Parameters

Conditions

Min

Typical

Max

Units

SPI TIMING

SCLK

, SC LK C lock Frequency

0.9

MHz

tLOW, SC LK Low P eriod - - ns

tHIGH, SCLK High Period - - ns

SU.CS

, CS S etup Time

tHD.CS, CS Hold Time 1 ns

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MPU-9250 Product Specification Doc ument Nu mber : PS-MPU-9250A-01

Revision: 1.0

Release Date: 01/17/2014

tSU.SDI, SDI Setup Tim e 0 ns

tHD.SDI, S DI Hold Time 1 ns

VD.SDO

, SDO Valid Tim e

load

= 20pF

tDIS.SDO, SDO Output Disable Time 25 ns

Table 8 fCL K = 2 0M Hz

Note:

1. Based on char acterization of 5 parts over temperature and vol tage as mounte d on evaluat ion board or in sockets

Page 17 of 42

MPU-9250 Product Specification Doc ument Nu mber : PS-MPU-9250A-01

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3.7 A bsolut e Maximum Rat ings

Stress above those listed as “Absolute Maximum Ratings” may cause permanent damage to the device.

These are stress ratings only and functional operation of the device at these conditions is not implied.

Exposure to the absolute max imum ratings conditions for extended periods may affect device reliability.

Specification Symbol Conditions MIN MAX Units

Supply Voltage VDD -0.5 4.0 V

VDDIO -0.5 4.0 V

Acceleration Any axis, unpowered,

0.2ms duration

10,000 g

Temperature Operating -40 105 °C

Storage -40 125 °C

ESD Tolerance HBM 2 KV

MM 250 V

Page 18 of 42

MPU-9250 Product Specification Doc ument Nu mber : PS-MPU-9250A-01

Revision: 1.0

Release Date: 01/17/2014

4 Applications Information

4.1 Pin Out and Signal D escription

Pin Number

Pin Nam e

Pin Description

RESV

R eserved. Connect to VDD IO.

AUX_CL

I2C M aster serial clock, for connecting to external sensors

VDDIO

D igital I /O supply voltage

AD0 / SDO

I2C Slave Address LSB (AD 0); SP I serial data output (SD O)

REGOUT

R egulator filter capacitor connection

FSYNC

Fram e synchronization digital input. Connect to GN D if unused.

INT

I nterrupt digital output (totem pole or open-drain)

VDD

P ower supply voltage and D igital I /O supply voltage

GND

Pow er supply ground

RESV

Reserved. Do not connect.

RESV

R eserved. Connect to GN D .

AUX_DA

I2C m aster serial data, for connecting to external sensors

nCS

Chip selec t ( SPI mode only)

SCL / SCLK

I2C serial cl ock (SCL); SPI serial cl ock (SCLK)

SDA / SDI

I2C serial data (S DA); SPI serial data i nput (SDI)

2 – 6, 14 - 17

N ot internally connected. M ay be used for P C B trace routing.

Table 9 Si gnal De scriptions

AUX_CL

VDDIO

AD0/SDO

REGOUT

FSYNC

INT

GND

SCL / SCLK

nCS

RESV

VDD

SDA / SDI

AUX_DA

RESV

MPU-9250

613

Figure 1 P i n Out Dia gram for MPU-9250 3.0x3.0x1.0mm QFN

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MPU-9250 Product Specification Doc ument Nu mber : PS-MPU-9250A-01

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4.2 Typical Operating Circ uit

AUX_CL

VDDIO

AD0/SDO

REGOUT

FSYNC

INT

GND

SCL / SCLK

nCS

RESV

VDD

SDA / SDI

2.4 – 3.3VDC

C2, 0.1 µF

C3, 10 nF

1.8 – 3.3VDC

SCL VDDIO

SDA

AUX_DA

AD0

C1, 0.1 µF

RESV

MPU-9250

613

AUX_CL

VDDIO

AD0/SDO

REGOUT

FSYNC

INT

GND

SCL / SCLK

nCS

RESV

VDD

SDA / SDI

2.4 – 3.3VDC

C2, 0.1 µF

C3, 10 nF

1.8 – 3.3VDC

SCLK

SDI

AUX_DA

SD0

C1, 0.1 µF

RESV

MPU-9250

613

nCS

(a) (b)

Figure 2 MPU-9250 QFN Appli ca tion Sche m atic: (a) I2C ope ration, (b) SP I operation

Note that the IN T pin shoul d be connecte d to a GPIO pin on the system processor that is capable of wakin g

the system processor from suspend mode.

4.3 B ill o f Mater ials for External Components

Component

Label

Specification

Quantity

Regulator Fi l ter Capac i tor C1 Ceramic, X7R, 0.1µF ±10%, 2V 1

VDD Bypass Capacitor C2 Ceramic, X7R, 0.1µF ±10%, 4V 1

VDDIO Bypass Capacitor C3 Ceramic, X7R, 10nF ±10%, 4V 1

Table 10 Bill of Ma te ria ls

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MPU-9250 Product Specification Doc ument Nu mber : PS-MPU-9250A-01

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4.4 Block Dia gra m

MPU-9250

Charge

Pump

nCS

AD0 / SDO

SCL / SCLK

SDA / SDI

Temp Sensor ADC

ADC

Z Gyro

ADC

Y Gyro

Digital Motion

Processor

(DMP)

FSYNC

Slave I2C and

SPI Serial

Interface

Master I2C

Serial

Interface

Serial

Interface

Bypass

Mux

AUX_CL

AUX_DA

INT

Interrupt

Status

VDD

Bias & LDOs

GND REGOUT

Z Accel

Y Accel

X Accel ADC

ADC

X Gyro

Signal Conditioning

FIFO

User & Config

Registers

Sensor

Registers

VDDIO

Self

test

Self

test

Self

test

Self

test

Self

test

Self

test

Compass Y

Compass Z

Compass

ADC ADC ADC

Signal Conditioning

Page 21 of 42

MPU-9250 Product Specification Doc ument Nu mber : PS-MPU-9250A-01

Revision: 1.0

Release Date: 01/17/2014

4.5 Overview

The MPU-9250 is com pri sed of the foll owi ng key bl ocks and functions:

• Three-axis MEMS rate gyroscope sensor with 16-bit ADCs and signal conditioning

• Three-axis MEMS accelerometer s ensor with 16-bit ADCs and signal conditioning

• Three-axis MEMS magnet om eter s ensor with 16-bit ADCs and signal conditioning

• Digital Motion Processor (DMP) engine

• Primary I2C and SPI serial communications interfaces

• Auxiliary I2C seri al i nterfac e for 3rd party sensors

• Clocking

• Sensor Data Registers

• FIFO

• Interrupts

• Digital-Output Temperature Sensor

• Gyroscope, Accelerometer and Magnetometer Self-test

• B i as and LDO

• Charge Pump

4.6 Three-A xis ME MS Gyro scope wit h 16 -bit A D Cs and Signal C ondit ioning

The MPU-9250 consists of three indepe ndent vibratory MEMS rate gyroscop es, which detect rotation abo ut

the X-, Y-, and Z - Axes. When the gyros are rotated about any of the sense axes, the Coriol i s Eff ect causes

a vi brati on that i s det ect ed by a capaci tive pi c koff. The resul ti ng si gnal i s am pl i fied, dem odul at ed, and fi ltered

t o produce a voltage that i s proport i onal to the angul ar rate. T hi s vol t age i s di giti z ed usi ng i ndividual on-chip

16-bit Analog-to-Digital Converters (ADCs) to sample each axis. The full-scale range of the gyro sensors

may be digitally pro grammed to ±25 0, ±500, ±1 000, or ±2 000 deg rees per secon d (dps). The ADC sampl e

rat e i s program mable from 8, 000 sam pl es per second, down to 3.9 sam pl es per s econd, and user-selectable

low-pass filters enable a wide range of cut-off frequencies.

4.7 Three-Axis MEMS Accelerometer with 16-bit A D Cs and Signal C ondit ioning

The MPU-9250’s 3-Axis accelerometer uses separate proof masses for each axis. Acceleration along a

particular axis induces displacement on the corresponding proof mass, and capacitive sensors detect the

displacement differentially. The MPU-9250’s architecture reduces the accelerometers’ susceptibility to

fa brication variatio ns as well as to thermal dri ft. When the device is placed on a flat surface, it will measure

0g on the X- and Y-axes and +1g on the Z-axis. The accelerometers’ scale factor is calibrated at the factory

and i s nom i nal l y i ndependent of s uppl y volt age. E ach sensor has a dedi cat ed si gm a-del t a ADC f or providi ng

digital outputs. The full scale range of the digital output can be adjusted to ±2g, ±4g, ±8g, or ± 16g.

4.8 Three-Axis MEMS Magnetometer with 16-bit AD C s and Signal C onditioning

The 3-axis magnetom eter uses highly sensiti ve Hall sensor technology. The magnetometer portion of the IC

i nc orporates m agneti c sensors for detect i ng terrestrial m agneti sm i n t he X-, Y-, and Z- Axes, a sensor driving

circuit, a signal amplifier chain, and an arithmetic circuit for processing the signal from each sensor. Each

A DC has a 16-bit resolution and a full scale range of ±4800 µT.

4.9 D igital Mot ion Processor

The emb edded Di gital Motion Processor (DMP) is located within the MPU-9250 and o ffl oads comput ation of

motion processing algorithms from the host processor. The DMP acquires data from accelerometers,

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MPU-9250 Product Specification Doc ument Nu mber : PS-MPU-9250A-01

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Release Date: 01/17/2014

gyroscopes, magnetometers and addi ti onal 3rd party sensors, and processes the data. The resul t i ng data can

be read from the DMP’s registers, or can b e buffered in a FIF O. The DMP has ac cess to one of the MPU’s

external pi ns, whi ch can be used for generati ng interrupts. Thi s pi n (pin 12) s houl d be c onnected to a pin on

t he host processor that can wak e the hos t from suspend m ode.

The purpose of the DMP is to offload both timing requirements and processing power from the host

proc essor. Typi cal l y , moti on processi ng al gori t hm s shoul d be run at a high rate, often around 200Hz, i n order

to provi de accurat e results with low latency. This is requir ed even if the application upd ates at a much lower

rat e; for exampl e, a l ow power user i nterfac e may updat e as sl owly as 5Hz, but the mot i on proc essi ng should

still run at 200Hz. Th e DMP ca n be used as a tool in order t o minimize power, simplify timing, simplify the

software architecture, and save valuable MIPS on the host processor for use in the application.

4.10 Primary I2C and SPI Serial C ommunicat ions Interf aces

The MPU-9250 com municates to a system processor usi ng ei t her a SPI or an I2C serial i nt erface. The MPU-

9250 always acts as a slave when communicating to the system processor. The LSB of the o f the I2C sla ve

addres s i s set by pi n 9 (A D0).

4.11 Auxiliary I2C Serial Interface

The MPU-9250 has an auxiliary I2C bus for communicating to off-chip sensors. This bus has two o perating

modes:

• I2C Master Mode: The MPU-9250 acts as a master to any external sensors connected to the

auxiliary I2C bus

• Pass-Thr ough Mode: The MPU-9250 directly connects the primary and auxiliary I2C buses togethe r,

allowing the syst em proc essor to di rectl y com m uni cate wi t h any external sensors.

• Note: AUX_DA and AUX_CL should be left unconnected if the Auxiliary I2C mode is not used.

Auxiliary I2C Bus Mode s of Opera tion:

• I2C Master Mode: Allows the MPU-9250 to directly access the data registers of external digital

sensors, such as a mag netom eter. In this mod e, the MPU-9250 directly obtains data from auxiliary

sensors without intervention from the system applications processor.

For example, In I2C Mast er mode, the MPU-9250 can be configured t o perform burs t reads, returni ng

t he foll owi ng dat a from a m agnetom eter:

 X magnetometer data (2 bytes)

 Y magnetometer data (2 bytes)

 Z magnetometer data (2 byt es)

The I2C Master can be configured to read up to 24 byt es from up t o 4 aux i l i ary sensors. A fift h sensor

can be configured t o work si ngl e byt e read/write m ode.

• Pass-Through Mode: Allows an external system processor to act as master and directly

communicate to the external sensors connected to the auxiliary I2C bus pins (AUX_DA and

AUX_CL). In this mode, the auxiliary I2C bus control logic (3rd party sensor interface block) of the

MPU-9250 is disabled, and the auxiliary I2C pi ns AUX_DA and AUX_CL are conn ected to the main

I2C bus through analog switches internally.

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MPU-9250 Product Specification Doc ument Nu mber : PS-MPU-9250A-01

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Pass-Through mode i s usef ul for configuri ng the external sensors, or for keeping t he MPU-9250 i n a

low-power mode when only the external senso rs are used. In this mode, the system processor can

sti ll a ccess MPU-9250 data through the I2C interface.

Pass-Through m ode i s al so used t o access t he AK8963 m agnet ometer directl y from the hos t. In t hi s

configurat i on t he sl ave address for the AK8963 is 0X0C or 12 decimal.

Auxiliary I2C Bus I O Logic Le ve l s

For MPU-9250, the logic level of the auxiliary I2C bus is VDDIO. For fu rthe r inform ation rega rdi ng the MPU-

9250 logic levels, please refer to Section 10.2.

4.12 Self-Test

P l ease refer to the register map document for more details on self-test.

Self-test al l ows for t he test i ng of t he mechani cal and elect ri cal port i ons of the sensors. The s elf-t est for each

measurement axis can be activated by means of the gyroscope and accelerometer self-test registers

(registers 13 to 16).

When the self-test is activated, the electronics cause the sensors to be actuated and produce an output

signal. The output si gnal i s used to observe t he sel f-test response.

The self-test response is defined as follows:

Self-tes t response = Sensor output with self-test enabl ed – Sensor output without self-test enabled

When t he value of t he self-test response i s wi thi n the appropri ate l i m i t s, the part has passed self-tes t. When

the self-test response exceeds the appropriate values, the part is deemed to have failed self-test. It is

recomm ended to use InvenSense MotionApps softwa re for executing self-test. Further det ails, including the

self-t est l i m i ts are i ncl uded i n t he M PU-9250 Self-Test applications note available from InvenSense.

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MPU-9250 Product Specification Doc ument Nu mber : PS-MPU-9250A-01

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4.13 MPU-9250 Solution Using I2C Inte rfa ce

In the figure bel ow, the system processor i s an I2C master t o the MPU-9250. In addi t i on, the MPU-9250 i s an

I2C master t o the opt i onal external 3rd party sensor. The MPU-9250 has l i m i t ed capabi l iti es as an I2C Master,

and depends on the syst em processor to m anage t he i ni ti al confi gurati on of any auxi l i ary sensors. The MPU-

9250 has an interface bypass multiplexer, which connects the system processor I2C bus (SDA and SCL)

directl y to the auxi l i ary sensor I2C bus (AUX_DA and AUX_CL).

Once the auxiliary sensors have been con figured by the system processor, the interface bypass multiplexer

should be disabled so that the MPU-9250 auxiliary I2C master can take control of the sensor I2C bus and

gat her data from the auxi l i ary sensors. The I NT pi n shoul d be connected to a G PIO on t he syst em processor

t hat can wak e the syst em from suspend m ode.

MPU-9250 AD0

SCL

SDA/SDI

Digital

Motion

Processor

(DMP)

Sensor

Master I2C

Serial

Interface

AUX_CL

AUX_DA

Interrupt

Status

INT

VDD

Bias & LDOs

GND REGOUT

FIFO

User & Config

Registers

Sensor

Factory

Calibration

Slave I2C

or SPI

Serial

Interface

3rd party

sensor

SCL

SDA

System

Processor

Interface

Bypass

Mux

SCL

SDA

VDD or GND

I2C Processor Bus: for reading all

sensor data from MPU and for

configuring external sensors (i.e.

compass in this example)

Interface bypass mux allows

direct configuration of

compass by system processor

Optional

Sensor I2C Bus: for

configuring and reading

from external sensors

VDDIO

Page 25 of 42

MPU-9250 Product Specification Doc ument Nu mber : PS-MPU-9250A-01

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4.14 MPU-9250 Solution Using SPI Interface

In the fi gu re bel ow, the system processor is a SPI master to the MPU-9250. The CS, SDO, SCLK, and SDI

signals are used for SPI communications. Beca use these SPI pins a re s hared with th e I2C slave pins, the

system processor cannot access the auxiliary I2C bus through the interface bypass multiplexer, which

connects the processor I2C interf ace pins to the sensor I2C interface pins.

Since the MPU-9250 has limited capabilities as an I2C Master, and depends on the system processor to

m anage the ini ti al configurati on of any auxi l i ary sensors, anot her m ethod must be used for program m i ng the

sensors on the auxiliary sensor I2C bus (AUX_DA and AUX_CL).

When using SPI communications between the MPU-9250 and the system processor, configuration of

devices on the auxiliary I2C se nsor bus c an be achi eved by using I2C Sla ves 0-4 to perform r ead an d writ e

transactions o n any de vice a nd register on the a uxiliary I2C bus. The I2C Sl a ve 4 int er face can be used t o

perform only s i ngl e byte read and writ e t ransact i ons.

Once the external sensors have been configured, the MPU-9250 can perform single or multi-byte reads

using the sensor I2C bus. T he read results from the Slave 0-3 controllers c an be wri t ten t o the FIFO buf fer as

well as to the external s ensor regi sters.

The INT pin should be con nected to a GPIO on the system processor capable of waking the processo r from

suspend

For further information regarding the control of the MPU-9250’s auxiliary I2C interface, please refer to the

MPU-9250 Register Map and Register Descriptions document.

MPU-9250 SDO

SCLK

SDI

Digital

Motion

Processor

(DMP)

Sensor

Master I2C

Serial

Interface

Interrupt

Status

FIFO

Config

Sensor

Factory

Calibration

nCS

Slave I2C

or SPI

Serial

Interface

System

Processor

Interface

Bypass

Mux

SDI

SCLK

SDO

nCS

Processor SPI Bus: for reading all

data from MPU and for configuring

MPU and external sensors

AUX_CL

AUX_DA 3rd party

sensor

SCL

SDA

Optional

I2C Master performs

read and write

transactions on

Sensor I2C bus.

Sensor I2C Bus: for

configuring and

reading data from

external sensors

VDD

Bias & LDOs

GND REGOUT VDDIO

4.15 Clocking

The MPU-9250 has a flexi ble cl ocki ng s chem e, al lowing a vari ety of i nternal cl ock sources to be us ed for t he

internal synchronous circuitry. This synchronous circuitry includes the signal conditioning and ADCs, the

DMP, and vari ous control ci rcui ts and regi sters. An on-c hi p P LL provi des fl exi bi li ty i n t he al lowable i nputs fo r

generating this clock.

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MPU-9250 Product Specification Doc ument Nu mber : PS-MPU-9250A-01

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Allowable internal sources for generating the internal clock are:

• A n i nternal relaxati on osci l l at or

• Any of the X, Y, or Z gyros (MEMS oscillators with a variation of ±1% over tem perat ure)

S el ecti on of t he sourc e for generati ng the i nternal synchronous cl ock depends on t he requi rem ents for power

consumption and clock accuracy. These requirements will most likely vary by mode of operation. For

example, in on e mod e, wh ere th e bigg est concern is power consu mption, the user may wish to operate the

Digi tal M otion Processor of t he MPU-9250 to process accel erom eter d ata, whi l e keeping the gyros off. In this

case, the internal relaxation oscillator is a goo d clock choice. Howe ver, in anot her m od e, where the gyr os

are act i ve, sel ec ti ng t he gyros as t he cl ock source provi des for a more accurate clock source.

Clock accuracy i s i m port ant, si nce ti m i ng errors di rectl y affect the di stance and angle cal cul ations performed

by the Di gital M ot i on Processor (and by extensi on, by any processor).

There are also start-up conditions to consider. When the MPU-9250 first starts up, the device uses its

internal clock until programme d to oper ate from anot her so urce. This allo ws the use r, for exam ple, to w ait

for the M E M S osci l l at ors t o st abi l i ze before t hey are sel ect ed as the cl ock source.

4.16 Sensor Data Registers

The sensor data registers contain the latest gyroscope, accelerometer, magnetometer, auxiliary sensor, an d

temperature measurement data. They are read-only registers, and are accessed via the serial interface.

Data from these registers m ay be read anyt i m e.

4.17 FIFO

The MPU-9250 contains a 512-byte FIFO register that is accessible via the Serial Interface. The FIFO

configuration register determines which data is written into the FIFO. Possible choices include gyro data,

accelerometer data, temperature readings, auxiliary sensor readings, and FSYNC input. A FIFO counter

keeps track of how many bytes of valid data are contained in the FIFO. The FIFO register supports burst

reads . The i nt errupt functi on m ay be used t o determ i ne when new data is available.

For further information regarding the FIFO, please refer to the MPU-9250 Register Map and Register

Descriptions document.

4.18 Interrupts

Interrupt functi onal i t y i s configured vi a t he Interrupt Configurati on regi ster. It em s that are configurabl e incl ude

t he INT pin confi gurat ion, the i nterr upt l at chi ng and cl eari ng m ethod, and triggers for the interrupt. Item s that

can tri gger an i nt errupt are (1) Clock generator l ocked t o new reference os ci l l at or (used w hen swi t chi ng cl ock

sources); ( 2) new data is avail abl e to be read ( from the FIF O a nd Data r egisters); (3) acceleromet er event

i nt errupt s; and (4) the MPU-9250 di d not recei ve an ackno wledge from an auxiliary se nsor on the seco ndary

I2C bus. The i nt errupt s tatus can be read from the Int errupt Status regi s ter.

The INT pin should be connected to a pin on the host processor capable of waking that processor from

suspend.

For further information regarding interrupts, please refer to the MPU-9250 Register Map and Register

Descriptions document.

4.19 Digital-Outpu t Temperatu re Sensor

A n on-c hip tem perature sensor and ADC are used to m easure t he MPU-9250 die tem perature. The readi ngs

from the ADC can be read from the FIFO or the Sensor Data registers.

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4.20 B ias and LD O

The bias and LDO sect i on generat es t he i nternal suppl y and t he reference vol tages and current s required by

the MPU-9250. Its two inputs are an unregulated VDD and a VDDIO logic reference supply voltage. The

LDO output is bypassed by a capacitor at REGOUT. For fu rther details on the capacito r, please re fer to the

Bill of Materials for External Components.

4.21 Cha rge P ump

A n on-chip c harge pum p generat es the hi gh vol t age requi red for t he M EM S osci l l at ors.

4.22 St andard Power Mode

The following table lists the user-accessible power modes for MPU-9250.

Mode

Name

Gyro

Accel

Magnetometer

DMP

Sleep Mode

Off

Standby Mode

Drive On

Off

Low-Power Accelerometer Mode

Off

Duty-Cycled

Off

On or Off

Low-Noise Accelerometer Mode

Off

On or Off

Gyroscope Mode

Off

On or Off

Magnetometer Mode

Off

On or Off

A ccel + G y ro M ode

Off

On or Off

Accel + Magnetometer Mode

Off

On or Off

9-A xi s M ode

On or Off

Notes:

1. Power consumption for individual modes can be found in Electrical Characteristics section.

4.23 Power Sequencing R equirements and Power on R eset

During power up and i n norm al operati on, VDD IO mus t not exceed VDD. Duri ng power up, VDD an d VDDIO

m ust be m onotoni c ramps. As stated i n T able 4, the m i ni mum VDD rise ti m e is 0.1m s and t he m axi m um ri se

t i m e i s 100 m s. Val i d gyroscope data i s avail abl e 35 m s (typical) after V DD has ri sen to i ts final vol t age from

a cold start and vali d acceleromete r data is availabl e 30 ms (typical) aft er VDD has risen to its final voltag e

assuming a 1ms VDD ramp from cold start. Magnetometer data is vali d 7.3ms (typical) after VDD has risen

t o i ts final vol t age val ue from a col d start.

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5 Advanced Hardware Features

The MPU-9250 includes advanced hardware features that can be enabled and disabled through simple

hardware regi ster set ti ngs. The advanced hardware feat ures are not initially enabled after device power up.

These features must be individually enabled and configured. These advanced hardware features enable the

following motion-based functions without using an external microprocessor:

• Low Power Quaternion (3-Axis Gyro & 6-Axis Gyro + Accel)

• Android Orientation (A low-power implementation of Android’s screen rotation algorithm)

• Tap (det ect s t he tap gest ure)

• Pedometer

• Significant Motion Detection

To ensure significant motion detection can operate properly, the INT pin should be connected to a GPIO pin

on t he host processor that can wak e that processor from suspend m ode.

Note: Android Orientation is compliant to the Ice Cream Sandwich definition of the function.

For further details on advanced hardware features please refer to the M PU-9250 Register Map.

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MPU-9250 Product Specification Doc ument Nu mber : PS-MPU-9250A-01

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6 Programmable Interrupts

The MPU-9250 has a prog ramm abl e interrupt system which can generate an interru pt signal on the IN T pin.

S tatus fl ags i ndi cate the sourc e of an i nt errupt . Int errupt sources m ay be enabl ed and di sabl ed indi vi duall y.

Ta bl e of Inte rrupt Source s

Interrup t N ame

Module

Motion Detec tion

Motion

FIFO Overf low

FIFO

Data Ready

Sensor Registers

I2C M aster errors: Lost Arbitration, N ACKs

I2C Mas ter

C Slave 4

I2C Mas ter

For info rmation regarding the i nterrupt enable/disable registers a nd fl ag registe rs , please r efer to the MPU-

9250 Register Map and Register Descriptions document. S om e i nterrupt sources are expl ained below.

6.1 Wake-on-Motion Interrupt

The MPU-9250 provides motion detection capability. A qualifying motion sample is one where the high

passed sample from any axis has an absolute value exceeding a user-programmable threshold. The

follo wing fl owch art expl ains how to configure the W ake-on-Motion Inte rrupt. For furth er details on indi vi du al

registers, please refer to the MPU-9250 Registers Map and Registers Description document.

In order to properly enable motion interrupts, the INT pin should be connected to a GPIO on the system

processor that is capable of waking up the s ystem processor.

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Figure 3. Wake-on-M oti on I nte rrupt Configuration

Configuration Wake-on-Motion Interrupt using low power Accel mode

Make Sure Accel is running:

•In PWR_MGMT_1 (0x6B) make CYCLE =0, SLEEP = 0 and STANDBY = 0

•In PWR_MGMT_2 (0x6C) set DIS_XA, DIS_YA, DIS_ZA = 0 and DIS_XG, DIS_YG, DIS_ZG = 1

Set Accel LPF setting to 184 Hz Bandwidth:

•In ACCEL_CONFIG 2 (0x1D) set ACCEL_FCHOICE_B = 0 and A_DLPFCFG[2:0]=1(b001)

Enable Motion Interrupt:

•In INT_ENABLE (0x38), set the whole register to 0x40 to enable motion interrupt only.

Enable Accel Hardware Intelligence:

•In MOT_DETECT_CTRL (0x69), set ACCEL_INTEL_EN = 1 and ACCEL_INTEL_MODE = 1

Set Motion Threshold:

•In WOM_THR (0x1F), set the WOM_Threshold [7:0] to 1~255 LSBs (0~1020mg)

Set Frequency of Wake-up:

•In LP_ACCEL_ODR (0x1E), set Lposc_clksel [3:0] = 0.24Hz ~ 500Hz

Enable Cycle Mode (Accel Low Power Mode):

•In PWR_MGMT_1 (0x6B) make CYCLE =1

Motion Interrupt Configuration Completed

Set Ac c el LPF s et t ing t o 184 H z Bandwidth:

 In ACCEL_CONFIG 2 (0x1D) set ACC EL_F C HOI C E_B = 1 and A_D LPF C F G[ 2: ] =1(b001)

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7 Digital Interface

7.1 I2C a nd S PI Serial I n ter fac es

The internal registers and memo ry of the MPU-9250 can be accessed using either I2C at 400 kHz or SPI at

1MHz. SPI operat es in four-wire mode.

S er i al I n ter fac e

Pin Number

Pin Nam e

Pin Description

VDDIO

D igital I /O supply voltage.

AD0 / SDO

I2C Slave Address LSB (AD 0); SP I serial data output (SD O)

SCL / SCLK

I2C serial clock (S CL); SPI serial clock (S CLK)

SDA / SDI

I2C serial data (S DA); SPI serial data i nput (SDI)

Note:

To prevent switching into I2C mode when using SPI, the I2C interface should be disabled by setting the

I2C_IF_DIS configuration bit. Setting this bit should be performed immediately after waiting for the time

speci fied by t he “Start-Up Time for Regi s ter Read/Wri t e” i n Secti on 6.3.

For further information regarding the I2C_IF_DIS bit, please refer to the MPU-9250 Register Map and

7.2 I2C In ter face

I2C is a two-wi re inte rface comprise d of the sign als serial data (SDA ) and seri al clock (SCL). In general, the

lines ar e open-dr ain and bi -di rectional. In a generalized I2C interface im plementation, attach ed de vic es can

be a master or a sla ve. The master device puts the slave address on the bus, and the slave device with the

matching address acknowledges the master.

The MPU-9250 al ways operat es as a sl ave devi c e when comm uni cati ng to the syst em processor, whi ch thus

acts as the master. SDA and SCL lines typically need pull-up resistors to VDD. The maxim um bus speed is

400 kHz.

The slave address o f th e MPU-9250 is b110100X which is 7 bits long. The LSB bit o f th e 7 bit address is

determined by the logic level on pin AD0. This allows two MPU-9250s to be connected to the same I2C bus.

When used i n thi s configurati on, the addres s of the one of t he devices should be b1101000 (pi n AD0 is logic

low) and the address of the other should be b1101001 (pin AD0 is logic high).

7.3 I2C Com m unications P rotocol

S T A RT (S ) and S T OP (P ) Condi t i ons

Comm unication o n the I2C b us starts when t he master puts the S TART co ndition (S) on the bus, which is

defined as a HIGH -to-LOW transition of the SDA line while SCL line is HIG H (see figu re below). The bus is

considered to be busy until the master puts a STOP condition (P) on the bus, which is defined as a LOW to

HIGH transition on the SDA line while SCL is HIGH (see figure below).

Additionally, the bus remains busy if a repeated START (Sr) is generated instead of a STOP condition.

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SDA

SCL S

START condition STOP condition

START and S TOP Conditi ons

Data Format / Acknowledge

I2C data bytes ar e defi ned to be 8 -bits long. There is no restriction to the numbe r o f bytes transmitted pe r

data transfer. Each byte transferred must be foll owed by an acknowle dge (ACK ) signal. The c lock for the

acknowl edg e signal is gene rate d by the master, while the recei ver g enerates the actual ackno wledge signal

by pulling down SDA and holding it low during the HIGH portion of the acknowledge cloc k pulse.

If a slave is busy and cannot transmit or receive another byte of data until some other task has been

performe d, it can h old S CL L OW, thus forcing the maste r into a wait state. Normal data transfer resum es

when t he sl ave i s ready , and releases the cl ock li ne (refer t o the fol l owi ng figure).

DATA OUTPUT BY

TRANSMITTER (SDA)

DATA OUTPUT BY

RECEIVER (SDA)

SCL FROM

MASTER

START

condition

clock pulse for

acknowledgement

acknowledge

not acknowledge

1 2 8 9

Acknowl edge on the I 2C Bu s

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Communications

After beginning communications with the START condition (S), the master sends a 7-bit slave address

fol l owed by an 8th bi t, the read/wri t e bi t. T he read/write bi t i ndi cates whether t he mast er i s receivi ng data from

or is writing to the slave device. Then, the master releases the SDA line and waits for the acknowledge

signal (ACK) from the slave device. Each byte transferred must be followed by an acknowledge bit. To

acknowledge, the sl ave devi ce pul l s t he SDA l i ne LO W and keeps i t LO W for the high peri od of t he SCL l i ne.

Data transmission is always terminated by the master with a STOP condition (P), thus freeing the

communications line. However, the master can generate a repeated START condition (Sr), and address

anot her sl ave wi t hout first generati ng a S T OP condi ti on (P). A LO W t o HIGH t ransi t i on on t he SDA l i ne whi le

SCL is HIGH defines the stop condition. All SDA changes should take place when SCL is low, with the

exception of start and stop conditions.

SDA

START

condition

SCL

ADDRESS R/W ACK DATA ACK DATA ACK STOP

condition

S P

1 – 7 8 9 1 – 7 8 9 1 – 7 8 9

Com pl ete I 2C Data Transfer

To write the internal MPU-9250 registers, the master transmits the start condition (S), followed by the I2C

addres s and the wri t e bi t (0). At the 9th c l ock cy cl e (when t he cl ock i s hi gh), the MPU-9250 acknowl edges the

transfer. The n the master puts the register address (RA ) on the bus. After the MPU-9250 acknowl ed ges the

rec epti on of the regi st er address, the m aster puts the regi ster data onto t he bus. Thi s i s followed by t he ACK

signal, an d data tra nsfer m ay be co nclud ed by th e stop condition (P). To writ e multipl e bytes a fter th e last

ACK signal, the master can continue outputting data rathe r than transmitting a stop signal. In this case, the

MPU-9250 automatically increm ents the register address and loads the data to the appropri ate registe r. Th e

following figures show single and two-byte write sequences.

Single-Byt e Wri t e Sequence

B urst Wri te S equence

Master

AD+W

DATA

Slave

ACK

Master

AD+W

DATA

Slave

ACK

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To read the internal MPU-9250 regi st ers, the master sends a start condi t i on, foll owed by t he I2C address and

a writ e bit, an d then t he register address that is goi ng to be r ead. Upon recei vin g the A CK signal from the

MPU-9250, the m aster tra nsmits a start signal follo we d by the sl a ve ad dress and read bit. As a result, the

MPU-9250 sends an ACK signal and the data. The communication ends with a not acknowledge (NACK)

si gnal and a stop bi t from mast er. The NACK condi t i on i s defi ned s uch that t he SDA li ne rem ains hi gh at the

9th cl o ck cycle. The following figures show single and two-byte read sequences.

Single-Byte Read Sequence

B urst Read S equence

7.4 I2C T er ms

Signal

Description

S tart Condi ti on: SDA goes from hi gh to l ow whi le S CL i s hi gh

Slave I2C address

Write bi t (0)

Read bit (1)

ACK

Acknowledge: SDA line is low while th e S CL li ne is hi gh at the

clock cycl e

NACK

Not-Acknowl edge: S DA l i ne st ays hi gh at the 9 th clock cycle

MPU-9250 internal register address

DATA

Trans m i t or recei ved data

Stop condition: SDA going from low to high while SCL is high

Master

AD+W

AD+R

NACK

Slave

ACK

DATA

Master

AD+W

AD+R

ACK

NACK

Slave

ACK

DATA

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7.5 SPI Interface

SPI is a 4-wire synchronous serial i nterface th at us es two control lines a nd two d ata lines. Th e MPU-9250

always operates as a Slave device during standard Master-S l ave S PI operat ion.

With respect to the Master, the Serial Clock output (SCLK), the Serial Data Output (SDO) and the Serial

Data Input (SDI) are shared am ong the Slave devices. Each SPI slave de vice r equires its own Chi p Select

(CS) line from the master.

CS goes low (active) at the start of transmission and goes back high (inactive) at the end. Only one CS line

is active at a time, ensuring that only one slave is selected at any given time. The CS lines of the non-

selected slave devices are hel d high, causing their SDO lines to r emai n in a hi gh-i mpe dance (hi gh -z) state

so that they do not i nterfere with any act i ve devi ces.

SPI O perational Features

1. Dat a i s deli vered M S B first and LSB l ast

2. Data is latched on the ri si ng edge of SCLK

3. Data should be transitioned on the falling edge of SCLK

4. The maximum frequency of SCLK is 1MHz

5. S PI re ad and wri te operati ons are c ompl eted in 16 or m ore cl ock cycl es (two or more byt es). The

first byte contains the SPI Address, and the follo wing byte(s) co ntain (s) the SPI d ata. The first

bit of the first byte contains the Read/Write bit and indicates the Read (1) or Write (0) ope ration.

The followin g 7 bit s contai n the Regi st er A ddres s. In cases of multi pl e-by te Read/Wri tes, data i s

two or more bytes: SPI Address format

MSB

LSB

R/W

SPI Data format

MSB

LSB

6. S upports Si ngl e or B urst Read/Wri t es.

Typical SPI Master / Slave Configuration

SPI Master SPI Slave 1

SPI Slave 2

/CS1

/CS2

SCLK

SDI

SDO

/CS

SCLK

SDI

SDO

/CS

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8 Serial Interface Considerations

8.1 MPU-9250 Supported Interfaces

The MPU-9250 supports I2C communications on both its primary (microprocessor) serial interface and its

auxiliary interface.

The MPU-9250’s I/ O l ogi c l evel s are set to be VDDIO.

The fi gure bel ow depi ct s a sam ple ci rc ui t of MPU-9250 wi t h a thi rd party sensor at tached t o the auxiliary I2C

bus. It shows the rel evant l ogi c l evel s and vol tage connecti ons .

Note: Actual conf iguration will depend on the aux i l i ary sensors used.

I/ O Leve l s and Connections

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9 Assembly

This section provides general guidelines for assembling InvenSense Micro Electro-Mechanical Systems

(MEMS) devices packaged in quad flat no-lead package (QFN) surface mount integrated circuits.

9.1 Orienta tion of Axes

The diagram below shows the ori entation of the axes of sensi tivi ty and the pol ari t y of rot ati on. Not e the pin 1

identifier (•) i n the figure.

MPU-9250

Figure 4. Orienta tion of Ax es of Sensi ti vity and P olarity of Rota ti on for Acce leromete r a nd Gyroscope

MPU-9250

Figure 5. Orienta ti on of Axes o f Sen si tivity for Com pa ss

9.2 Package Dimensions

24 Lead QFN (3x3x1) mm NiPdAu Lead-frame finish

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DIMENSIONS IN

MILLIMETERS

SYMBOLS

DESCRIPTION

MIN

NOM

MAX

Package thickness

0.95

1.00

1.05

Lead finger (pad) seating height

0.00

0.02

0.05

Lead f inger ( pad) width

0.15

0.20

0.25

Lead frame (pad) height

---

0.15 REF

---

Package width

2.90

3.00

3.10

Exposed pad width

1.65

1.70

1.75

Package length

2.90

3.00

3.10

Exposed pad length

1.49

1.54

1.59

Lead finger-finger (pad-pad) pitch

---

0.40

---

f (e-b)

Lead-lead (Pad-Pad) space

0.15

0.20

0.25

Lead (pad) t o Exposed P ad Space

---

0.35 REF

---

Lead (pad) length

0.25

0.30

0.35

Lead (pad) corner radius

0.075

REF

---

Corne r lead (pa d) oute r radi us to corner

lead outer radius

---

0.25 REF

---

0.00

---

0.075

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10 Part Num ber Package Marking

The part number package marking for MPU-9250 devices is summarized below:

Part Number

Part Number Package Marking

MPU-9250

MP92

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11 Reliability

11.1 Q ualif ic at io n T est Polic y

InvenSense’s products complete a Qualification Test Plan before being released to production. The

Qualification Test Plan for the MPU-9250 followed the JEDEC JESD 47I Standard, “Stress-Test-Driven

Qual i fi c ati on of Int egrat ed Circui ts, ” wi t h the i ndi vi dual tests described below.

11.2 Q ualif ic at io n T est Plan

Accelerated Life Tests

TEST

Method/Condition

Lot

Quantity

Sample

/ Lot

Acc /

Reject

Criteria

(HTOL/LFR)

High Temperature Operating Life

JEDEC JESD22-A108D

Dy namic, 3.63V biased, Tj>125°C

[read-points: 168, 500, 1000 hours]

(0/1)

(HAST)

Highly A ccelerated Stress Test (1)

JEDEC JESD22-A118A

Condition A , 130°C, 85%RH, 33.3 psia., unbiased

[read-point: 96 hours]

(0/1)

(HTS)

High Temperature Storage Life

JEDEC JESD22-A103D

Condition A , 125°C Non-Bias Bake

[read-points: 168, 500, 1000 hours]

(0/1)

Device Com ponent Le vel Tests

TEST

Method/Condition

Lot

Quantity

Sample

/ Lot

Acc /

Reject

Criteria

(ESD-HBM)

ESD-Human Body M odel

JEDEC JS-001-2012

(2KV)

(0/1)

(ESD-MM)

ESD-Machine M odel

JEDEC JESD22-A115C

(250V)

(0/1)

(ESD-CDM)

ESD-Charged Dev ice Model

JEDEC JESD22-C101E

(500V)

(0/1)

(LU)

Lat c h Up

JEDEC JESD-78D

Class II (2), 125°C; ±100mA

1.5X Vdd Over-voltage

(0/1)

(MS)

M echanical Shock

JEDEC JESD22-B104C, Mil-Std-883, Method

2002.5 Cond. E, 10,000g’s, 0.2ms,

±X, Y, Z – 6 directions, 5 times/direction

(0/1)

(VIB)

Vibration

JEDEC JESD22-B103B

V ariable Frequency (random), Cond. B, 5-500Hz,

X, Y, Z – 4 times/ dir ec tion

(0/1)

(TC)

Temperature Cy cling (1)

JEDEC JESD22-A104D

Condition G [-40°C t o +125°C], Soak Mode 2 [ 5’]

[read-Point: 1000 cy cles]

(0/1)

(1) Tests are preceded by M SL3 Preconditioning in accordance with JE D E C JE SD22-A113F

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12 Reference

Please refer to “InvenSense MEMS Handling Application Note (AN-IVS-0002A-00)” for the following

information:

• Manufacturing Recommendations

o Assembly Guidelines and Recommendations

o PCB Design Guidelines and Recommendations

o M E M S Handl ing Instruc ti ons

o E SD Cons i derat i ons

o Reflow Specification

o Storage Specifications

o Package Marking Specification

o Tape & Reel S peci fi c ati on

o Reel & Pi zza Box Label

o Packaging

o Representative Shipping Carton Label

• Compliance

o Environmental Compliance

o DRC Compliance

o Compliance Declaration Disclaimer

This information furnished by InvenSense is bel ieved to be accurate and reliabl e. How ever, no responsibili ty is assumed by InvenSense

f or its us e, or for any infr ingements of patents or other rights of thir d parties that may r es ult f rom its us e. Specific ations ar e s ubjec t to

c hange without notice. Inv enSens e res er ves the r ight to make c hanges to this product, inc luding its circ uits and s of tw are, in or der to

improve its design and/or performance, without pri or notice. InvenSense makes no warranties, nei ther expressed nor impli ed, regarding

the information and specifications contained i n this document. InvenSense assumes no responsibility for any claims or damages arising

f rom information contained in this doc ument, or fr om the us e of pr oduc ts and s erv ices detailed ther ein. This inc ludes , but is not limited

to, claim s or dam ages based on the infringem ent of patents, copyrights, m ask work and/or other intellectual property rights.

Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by

implication or otherwise under any patent or patent rights of InvenSense. This publication supersedes and replaces all information

previously supplied. Tr ademarks that are regis tered trademar ks are the property of their res pec tiv e companies. Inv enSens e s ensors

should not be used or sold in the development, storage, production or utilization of any conventi onal or mass-de stru ctive weapon s or fo r

any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment,

transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime

prevention equipm ent.

MotionApps, DMP, and the InvenSense logo are trademarks of InvenSense, Inc. Other company and product names may be

tradem arks of the respective com panies with which they are associated.

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