GE
Critical Power
FLTR100V20 Filter Module
75 Vdc Input Maximum,
20 A Maximum
RoHS Compliant
The FLTR100V20 Filter Module is
designed to reduce the
conducted common-mode and
dierential-mode noise on input or
output lines of high-frequency switching
power supplies. The module has a
maximum current rating of 20 A.
It provides high insertion loss throughout
the frequency range regulated by the U.S.
Federal Communications Commission
(FCC) and the International Special
Committee on Radio Interference (CISPR)
for conducted emissions.
The module is 50.8 mm long,
40.6 mm wide, and 12.7 mm high
(2.0 in. x 1.6 in. x 0.50 in.) and mounts
on a PC board in a natural convection
or forced-air environment.
Introduction
High-density power modules are usually
designed to operate at a high switching
frequency to reduce the size of the
internal lter components. The small
EMI lters internal to the modules are
often inadequate to meet stringent
international EMI requirements. Many
high-density electronic packaging
techniques can increase the noise
conducted onto the modules’ input and
output lines. For example, the close
proximity of switching components to
the input pins increases internal noise
coupling; and planar transformers,
designed to handle high-power levels
in low- prole packages, have high
interwinding capacitance that can
increase common-mode current levels.
Also, metal substrates used to facilitate
heat transfer from the power train
components to an external heat sink add
to common-mode noise because of the
large capacitance between switching
components and the metal substrate.
Many international agencies specify
conducted and radiated emissions
limits for electronic products. Included
among these are CISPR, FCC, VCCI,
and the new CE specications. Most
agency-conducted noise limits apply
only to noise currents induced onto
the ac power lines in nished products.
European Telecommunication Standard
Instructions (ETSI) are an exception,
applying CE requirements to dc supplies
with cables over three meters long.
Although not required to do so by agency
standards, some system designers apply
the conducted emissions requirements
to subassemblies within the product to
reduce internal interference between
subsystems and to reduce the diculty
of meeting overall system requirements.
To meet these requirements, external
ltering of the power module is often
required. The lter module is a lter that
has been optimized for use with F and
J series power modules. When used
in conjunction with the recommended
external components and layout, it
will signicantly reduce the conducted
dierential and common-mode
noise returned to the power source.
CISPR and FCC class B requirements
can be met by using the lter as
described in the following sections.
• Common-mode and differential-mode
filtering of power supply dc input and
output lines
• Communication equipment
• Computer equipment
• RoHS compliant to
Directive 2011/65/EU
• Compatible in Pb- free or SnPb reflow
environment
• Small size: 50.8 mm x 40.6 mm x 12.7
mm (2.0 in. x 1.6 in. x 0.50 in.)
• Optimized for use with high-frequency
dc-to-dc power modules
• Printed-circuit board mountable
• Operating case temperature range:
–40 °C to +100 °C
• CAN/CSA C22.2 No. 60950-1-07
/ UL* 60950-1, Second Edition,
dated March 27, 2007; VDE
0805 (EN60950) Licensed
• CE mark meets 73/23/EEC and
93/68/EEC directives‡
2Filter Modules Datasheet | www.gecriticalpower.com
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings
only. Functional operation of the device is not implied at these or any other conditions in excess of those given in the operations
sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely aect device reliability.
PARAMETER SYMBOL MIN MAX UNIT
Input Voltage:
Continuous
Transient (100 ms)
VI
VI, trans
—
—
75
100
Vdc
V
Voltage from GND to Either Input Lead (1 minute) ——2500 Vdc
Operating Case Temperature Tc -40 100 °C
Storage Temperature* Tstg –55 125 °C
PARAMETER SYMBOL MIN TYP MAX UNIT
Resistance per Leg R ——6.6 mΩ
Maximum Average Current
(TA = 48 °C, 2.0 m/s (400 lfm) air)
Natural convection
I max
I max
—
—
—
—
20
13
A
A
Common-mode Insertion Loss
(50 Ω circuit, 500 kHz)
——32 —dB
Dierential-mode Insertion Loss
(50 Ω circuit, 500 kHz)
——36 —dB
Electrical Specications
Unless otherwise indicated, specications apply over all operating input voltage and temperature conditions.
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Filter Modules Datasheet | www.gecriticalpower.com
Characteristics
Figure 1. Typical Case Temperature
Rise vs. Average Current (Case
Temperature Must Be Kept Below 100 °C)
Figure 2. Typical Common-Mode
Insertion Loss in a 50 Ω Circuit
Figure 3. Typical Dierential-Mode
Insertion Loss in a 50 Ω Circuit
4Filter Modules Datasheet | www.gecriticalpower.com
Application
Conducted noise on the input
power lines can occur as either
dierential-mode or common-mode
noise currents. Dierential-mode noise
is measured between the two input lines,
and is found mostly at the low- frequency
end of the spectrum. This noise
shows up as noise at the fundamental
switching frequency and its harmonics.
Common-mode noise is measured
between the input lines and ground
and is mostly broadband noise above
10 MHz. The high-frequency nature of
common-mode noise is mostly due to
the high-speed switching transitions
of power train components. Either or
both types of noise may be covered in a
specication, as well as a combination
of the two. An approved measurement
technique is often described, as well.
Dierential-mode noise is best
attenuated using a lter composed of
line-to-line capacitors (X caps) and series
inductance, provided by either a discrete
inductor or the leakage inductance of
a common-mode choke. In addition to
the dierential ltering provided by the
lter module, it is recommended that
an electrolytic capacitor be located at
the converter side of the lter to provide
additional attenuation of low-frequency
dierential noise and to provide a low
source impedance for the converter.
This prevents input lter oscillations and
load-transient induced input voltage dips.
Common-mode noise is best attenuated
by capacitors from power module input
to power module output, capacitors from
each input line to a shield plane (Y caps),
and common-mode chokes. It is
recommended that ceramic
capacitors be added around each
power module from each input and
output pin to a shield plane under
the module. The shield plane should
be connected to the CASE pin.
The GND pin of the lter module is
attached to Y caps within the module.
This pin should be tied to a quiet chassis
ground point away from the power
modules. GND of the lter module should
not be tied to the CASE pin of the power
module since this is a noisy node and
will inject noise into the lter, increasing
the input common-mode noise.
If no quiet grounding point is available,
it is best to leave the lter module GND
pin unattached. Each power system
design will be dierent, and some
experimentation may be necessary
to arrive at the best conguration.
Figure 5 shows a typical schematic
of a power module with a lter
module and recommended external
components. Figure 6 is a proposed
layout. More than one power module
may be attached to a single lter
module as long as input current does
not exceed 20 A. Figure 7 shows the
recommended schematic for two power
modules attached to a single lter.
In applications where the addition
of input-to-output capacitors is
undesirable, do not use C3 and C4 shown
in Figures 5 and 6, and do not use C3,
C4, C8, and C9 shown in Figure 7.
In –48 V applications where the shield
plane and the power module case
must be tied to a signal, remove C1 in
Figures 5 and 6, remove C1 and C6 in
Figure 7, and connect the shield plane
and CASE pin to the VI(+) plane.
In +48 V applications where the shield
plane and the power module case
must be tied to a signal, remove C2 in
Figures 5 and 6, remove C2 and C7 in
Figure 7, and connect the shield plane
and CASE pin to the VI(–) plane.
Internal Schematics
Figure 4. Internal Schematic
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Filter Modules Datasheet | www.gecriticalpower.com
Application (continued)
Figure 5. Recommended Schematic When Used as the Input Filter to a High-Frequency dc-to-dc Converter
Figure 6. Recommended Layout When Used as the Input Filter to a High-Frequency dc-to-dc Converter
6Filter Modules Datasheet | www.gecriticalpower.com
Application (continued)
Figure 7. Recommended Schematic of Filter Module with Two Power Modules
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Filter Modules Datasheet | www.gecriticalpower.com
Thermal Considerations
The case temperature must be kept
below 100 °C. Therefore for a particular
current and ambient temperature, the
airow at the lter must be adequate.
Example:
Given: IO, max = 18 A; TA, max = 40 °C
Therefore ýT, max allowable = 60 °C
Determine airow required (Figure 1):
v = 1.0 m/s (200 lfm)
Other Considerations
It is essential for good EMI performance
that the input lines not be contaminated
with noise after passing through the lter.
Filtered input traces should therefore
be kept away from noise sources such
as power modules and switching logic
lines. If input voltage sense traces must
be routed past the power modules from
the quiet side of the lter module, they
should be ltered at the point where
they leave the quiet input lines. Input
traces should be kept as far away from
output power traces as possible.
The fundamental switching frequency
noise spike can be somewhat reduced
by adding a high-frequency capacitor
of a few microfarads across the
input lines of the lter module.
Adding additional components to the
input lter to improve performance
usually has very limited payback,
and may actually increase the noise
conducted onto the input lines. Adding
Y caps to the input side of the lter
module couples any noise in the
ground plane directly into the input
lines, usually degrading performance.
Adding additional X and Y caps to the
power module side of the lter module
produces low- impedance loops for
high-frequency currents to ow,
possibly degrading performance.
Adding additional common-mode or
dierential-mode ltering to the power
module output leads decreases the
power module output noise, and also
frequently reduces the input noise by
decreasing the noise coupled from
output leads to input leads.
Common-mode output ltering is
particularly important if the load is
tied to chassis ground.
If common-mode ltering is added to
the power module output, ensure that
remote-sense leads sense the output
voltage before the common-mode lter.
Do not use remote-sense on the load
side of an output common-mode lter.
If input noise performance is
unsatisfactory after applying the lter
module as described previously, the
best remedy is to modify the layout and
grounding scheme. It is often useful
to make a model of the power card,
using copper tape and a vector card,
to experiment with various layout
and grounding approaches prior to
committing to a printed-wiring board.
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Filter Modules Datasheet | www.gecriticalpower.com
Outline Diagram
Dimensions are in millimeters and (inches).
Tolerances: x.x ± 0.5 mm (0.02 in.), x.xx ± 0.25 mm (0.010 in.).
Top View
Side View
Bottom View
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Filter Modules Datasheet | www.gecriticalpower.com
Recommended Hole Pattern
Component-side footprint.
Dimensions are in millimeters and (inches).
Note: Do not route copper paths beneath power module standos.
Post Solder Cleaning and
Drying Considerations
Post solder cleaning is usually the nal circuit-board
assembly process prior to electrical board testing.
The result of inadequate cleaning and drying can aect
both the reliability of a power module and the testability
of the nished circuit-board assembly. For guidance on
appropriate soldering,cleaning and drying procedures,
refer to Lineage Power Board Mounted Power
Modules: Soldering and Cleaning Application Note.
Through-Hole Lead Free
Soldering Information
The RoHS-compliant through-Hole products use the
SAC(Sn/Ag/Cu) Pb-free solder and RoHS- compliant
components. They are designed to be processed through
single or dual wave soldering machines. The pins have an
RoHS-compliant nish that is compatible with both Pb and
Pb-free wave soldering processes. A Maximum preheat rate
30C/s is suggested. The wave preheat process should be such
that the temperature of the power module board is kept below
2100C. For Pb solder, the recommended pot temperature
is 2600C, while the Pb-free solder pot is 2700C max. Not all
RoHS-compliant through-hole products can be processed
with paste-through-hole Pb or Pb-free reow process. If
additional information is needed, please consult with your Tyco
Electronics Power System representative for more details.
DEVICE CODE COMCODE DESCRIPTION
FLTR100V20Z CC109103248 Standard Pin Length RoHS Compliant
Ordering Information
* UL is a registered trademark of Underwriters Laboratories, Inc.
†CSA is a registered trademark of Canadian Standards Assn.
‡This product is intended for integration into end-use equipment. All the required procedures for CE marking of end-use equipment
should be followed. (The CE mark is placed on selected products.)
*Registered trademark of the General Electric Company.
The GE brand, logo, and lumination are trademarks of the General Electric Company. © 2015 General Electric Company.
Information provided is subject to change without notice. All values are design or typical values when measured under
laboratory conditions.
04/2015
GE
Critical Power
601 Shiloh Road
Plano, TX 75074
+1 888 546 3243
www.gecriticalpower.com
