NL17SZ02XV5T2G - ON Semiconductor

April, 2012 − Rev. 5

1Publication Order Number:

NL17SZ02/D

NL17SZ02

2-Input NOR Gate

The NL17SZ02 is a single 2−input NOR Gate in two tiny footprint

packages. The device performs much as LCX multi−gate products in

speed and drive.

Features

•Tiny SOT−353 and SOT−553 Packages

•2.4 ns TPD at 5 V (typ)

•Source/Sink 24 mA at 3.0 V

•Over−Voltage Tolerant Inputs

•Pin For Pin with NC7SZ02P5X, TC7SZ02FU and TC7SZ02AFE

•Chip Complexity: FETs = 20

•Designed for 1.65 V to 5.5 V VCC Operation

•These Devices are Pb−Free and are RoHS Compliant

•NLV Prefix for Automotive and Other Applications Requiring

Unique Site and Control Change Requirements; AEC−Q100

Qualified and PPAP Capable

Figure 1. Pinout (Top View)

Figure 2. Logic Symbol

w1Y

VCC

GND Y

See detailed ordering and shipping information in the package

dimensions section on page 4 of this data sheet.

ORDERING INFORMATION

MARKING

DIAGRAMS

SOT−553

XV5 SUFFIX

CASE 463B

SOT−353/SC70−5/SC−88A

DF SUFFIX

CASE 419A

PIN ASSIGNMENT

Function

GND

VCC

Input

FUNCTION TABLE

Output

Y = A ) B

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L3 MG

L3 = Specific Device Marking

M = Date Code

L3 M

L3 = Specific Device Marking

M = Date Code

G= Pb−Free Package

(Note: Microdot may be in either location)

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MAXIMUM RATINGS

Symbol Parameter Value Unit

VCC DC Supply Voltage *0.5 to )7.0 V

VIN DC Input Voltage *0.5 to )7.0 V

VOUT DC Output Voltage *0.5 to VCC + 0.5 V

IIK DC Input Diode Current *50 mA

IOK DC Output Diode Current *50 mA

IOUT DC Output Sink Current $50 mA

ICC DC Supply Current per Supply Pin $100 mA

TSTG Storage Temperature Range *65 to )150 °C

TLLead Temperature, 1 mm from Case for 10 Seconds 260 °C

TJJunction Temperature Under Bias )150 °C

qJA Thermal Resistance SOT−353 (Note 1)

SOT−553

350

496

°C/W

PDPower Dissipation in Still Air at 85°CSOT−353

SOT−553

186

135

MSL Moisture Sensitivity Level 1

FRFlammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in

ESD ESD Classification Human Body Model (Note 2)

Machine Model (Note 3)

Charged Device Model (Note 4)

Class Z

Class A

N/A

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.

2. Tested to EIA/JESD22−A114−A, rated to EIA/JESD22−A114−B.

3. Tested to EIA/JESD22−A115−A, rated to EIA/JESD22−A115−A.

4. Tested to JESD22−C101−A.

RECOMMENDED OPERATING CONDITIONS

Symbol Parameter Min Max Unit

VCC DC Supply Voltage 1.65 5.5 V

VIN DC Input Voltage 0 5.5 V

VOUT DC Output Voltage 0 5.5 V

TAOperating Temperature Range −55 +125 °C

tr, tfInput Rise and Fall Time VCC = 3.0 V $0.3 V

VCC = 5.0 V $0.5 V

100

ns/V

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DC ELECTRICAL CHARACTERISTICS

Symbol Parameter Condition

VCC

(V)

TA = 255C−555C v TA v 1255C

Unit

Min Typ Max Min Max

VIH High−Level Input

Voltage

1.65 to 1.95

2.3 to 5.5

0.75 VCC

0.7 VCC

0.75 VCC

0.7 VCC

VIL Low−Level Input

Voltage

1.65 to 1.95

2.3 to 5.5

0.25 VCC

0.3 VCC

0.25 VCC

0.3 VCC

VOH High−Level Output

Voltage

VIN = VIL or VIH

IOH = 100 mA

IOH = −3 mA

IOH = −8 mA

IOH = −12 mA

IOH = −16 mA

IOH = −24 mA

IOH = −32 mA

1.65 to 5.5

1.65

2.3

2.7

3.0

4.5

VCC − 0.1

1.29

1.9

2.2

2.4

2.3

3.8

VCC

1.52

2.1

2.4

2.7

2.5

4.0

VCC − 0.1

1.29

1.9

2.2

2.4

2.3

3.8

VOL Low−Level Output

Voltage

VIN = VIH or VOH

IOL = 100 mA

IOL = 3 mA

IOL = 8 mA

IOL = 12 mA

IOL = 16 mA

IOL = 24 mA

IOL = 32 mA

1.65 to 5.5

1.65

2.3

2.7

3.0

4.5

0.08

0.20

0.22

0.28

0.38

0.42

0.1

0.24

0.3

0.4

0.55

0.1

0.24

0.3

0.4

0.55

IIN Input Leakage Current VIN = 5.5 V or GND 0 to 5.5 $0.1 $1.0 mA

IOFF Power Off Leakage

Current

VIN = 5.5 V or

VOUT = 5.5 V

0 1 10 mA

ICC Quiescent Supply

Current

VIN = 5.5 V or GND 5.5 1 10 mA

AC ELECTRICAL CHARACTERISTICS tR = tF = 3.0 ns

Symbol Parameter Condition

VCC TA = 255C−555C v TA v 1255C

Unit

(V) Min Typ Max Min Max

tPLH

tPHL

Propagation Delay

(Figure 3 and 4)

RL = 1 MW, CL = 15 pF 1.65 2.0 5.3 11.5 2.0 12.0 ns

RL = 1 MW, CL = 15 pF 1.8 2.0 4.4 9.5 2.0 10.0

RL = 1 MW, CL = 15 pF 2.5 $0.2 0.8 2.9 6.5 0.8 7.0

RL = 1 MW, CL = 15 pF 3.3 $0.3 0.5 2.3 4.5 0.5 4.7

RL = 500 W, CL = 50 pF 1.5 2.9 5.0 1.5 5.2

RL = 1 MW, CL = 15 pF 5.0 $0.5 0.5 1.9 3.9 0.5 4.1

RL = 500 W, CL = 50 pF 0.8 2.4 4.3 0.8 4.5

CAPACITIVE CHARACTERISTICS

Symbol Parameter Condition Typical Unit

CIN Input Capacitance VCC = 5.5 V, VI = 0 V or VCC u4 pF

CPD Power Dissipation Capacitance

(Note 5)

10 MHz, VCC = 3.3 V, VI = 0 V or VCC 25 pF

10 MHz, VCC = 5.5 V, VI = 0 V or VCC 30

5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.

Average operating current can be obtained by the equation: ICC(OPR) = CPD  VCC  fin + ICC. CPD is used to determine the no−load dynamic

power consumption; PD = CPD  VCC2  fin + ICC  VCC.

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Figure 3. Switching Waveform

RLCL

A 1−MHz square input wave is recommended for

propagation delay tests.

Figure 4. Test Circuit

tf = 3 ns

VCC

GND

VOH

VOL

90%

50%

10%

50%

tPLH

tPHL

OUTPUT Y

INPUT

A and B

tf = 3 ns

90%

50%

10%

50%

OUTPUT

INPUT

ORDERING INFORMATION

Device Package Shipping†

NL17SZ02DFT2G SC−88A/SOT−353/SC−70−5

(Pb−Free)

3000 / Tape & Reel

NLV17SZ02DFT2G* SC−88A/SOT−353/SC−70−5

(Pb−Free)

3000 / Tape & Reel

NL17SZ02XV5T2G SOT−553

(Pb−Free)

4000 / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP

Capable.

NL17SZ02

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PACKAGE DIMENSIONS

SOT−353

(SC−88A, SC−70)

DF SUFFIX

CASE 419A−02

ISSUE J

ǒmm

inchesǓ

SCALE 20:1

0.65

0.025

0.65

0.025

0.50

0.0197

0.40

0.0157

1.9

0.0748

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

NOTES:

1. DIMENSIONING AND TOLERANCING

PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. 419A−01 OBSOLETE. NEW STANDARD

419A−02.

4. DIMENSIONS A AND B DO NOT INCLUDE

MOLD FLASH, PROTRUSIONS, OR GATE

BURRS.

DIM

MIN MAX MIN MAX

MILLIMETERS

1.80 2.200.071 0.087

INCHES

B1.15 1.350.045 0.053

C0.80 1.100.031 0.043

D0.10 0.300.004 0.012

G0.65 BSC0.026 BSC

H--- 0.10---0.004

J0.10 0.250.004 0.010

K0.10 0.300.004 0.012

N0.20 REF0.008 REF

S2.00 2.200.079 0.087

B0.2 (0.008) MM

12 3

D 5 PL

−B−

NL17SZ02

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PACKAGE DIMENSIONS

SOT−553

XV5 SUFFIX

CASE 463B

ISSUE B

1.35

0.0531

0.5

0.0197

ǒmm

inchesǓ

SCALE 20:1

0.5

0.0197

1.0

0.0394

0.45

0.0177

0.3

0.0118

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

0.08 (0.003) X

b5 PL

−X−

−Y−

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETERS

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH

THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM

THICKNESS OF BASE MATERIAL.

12 3

HEDIM

MIN NOM MAX MIN

MILLIMETERS

0.50 0.55 0.60 0.020

INCHES

b0.17 0.22 0.27 0.007

D1.50 1.60 1.70 0.059

E1.10 1.20 1.30 0.043

e0.50 BSC

L0.10 0.20 0.30 0.004

0.022 0.024

0.009 0.011

0.063 0.067

0.047 0.051

0.008 0.012

NOM MAX

1.50 1.60 1.70 0.059 0.063 0.067

0.08 0.13 0.18 0.003 0.005 0.007

0.020 BSC

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications

intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should

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and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death

associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal

Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

NL17SZ02/D

PUBLICATION ORDERING INFORMATION

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USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

Japan Customer Focus Center

Phone: 81−3−5817−1050

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Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada

Email: orderlit@onsemi.com

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Order Literature: http://www.onsemi.com/orderlit

For additional information, please contact your local

Sales Representative