TDA7313N
DIGITAL CONTROLLED STEREO AUDIO PROCESSOR
WITH LOUDNESS
INPUT MULTIPLEXER:
- 3 STEREO INPUTS
- SELECTABLE INPUT GAIN FOR OPTIMAL
ADAPTION TO DIFFERENT SOURCES
LOUDNESS FUNCTION
VOLUME CONTROL IN 1.25dB STEPS
TREBLE AND BAS S CONTRO L
FOUR SPEAKER ATTENUATORS:
- 4 INDEPE NDEN T SPE AKE RS CONT ROL
IN 1.25dB STEPS FOR BALANCE AND
FADER FACILITIES
- INDEPENDENT MUTE FUNCTION
ALL FUNCTIONS PROGRAMMABLE VIA SE-
RIAL I2C BUS
DESCRIPTION
The TDA7313N is a volume, tone (bass and treble)
balance (Left/Right) and fader (front/rear) processor
for quality audio applications in car radio and Hi-Fi
systems.
Selectable input gain and external loudness function
are provided. Control is accomplished by serial
I2C bus micropr ocess or interfac e.
The AC signal s etting is o btained by r esisto r networks
and sw itches c ombin ed with opera tional ampl ifier s.
Thanks to the used BIPOLAR/CMOS Tecnology,
Low Distortion, Low Noise and Low DC stepping are
obtained.
November 1999
®
DIP28 SO28
ORDERING NUMBERS:
TDA7313N TDA7313ND
PIN C ONNECTION (Top view)
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THERMAL DATA
Symbol Description SO28 DIP28 Unit
Rth j-pins Thermal Resistance Junction-pins max 85 65 °C/W
QUICK REFERENCE DATA
Symbol Parameter Min. Typ. Max. Unit
VSSupply Voltage 6 9 10 V
VCL Max. input signal handling 2 Vrms
THD Total Harmonic Distortion V = 1Vrms f = 1KHz 0.01 0.1 %
S/N Signal to Noise Ratio 106 dB
SCChannel Separation f = 1KHz 103 dB
Volume Control 1.25dB step -78.75 0 dB
Bass and Treble Control 2db step -14 +14 dB
Fader and Balance Control 1.25dB step -38.75 0 dB
Input Gain 3.75dB step 0 11.25 dB
Mute Attenuation 100 dB
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
VSOperating Supply Voltage 10.2 V
Tamb Operating Ambient Temperature -40 to 85 °C
Tstg Storage Temperature Range -55 to +150 °C
TEST CIRCUIT
TDA7313N
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L1 15 L1
L2 14 L2
L3 13 L3
INPUT
SELECTOR
+ GAIN
C1
C2
C3
LEFT
INPUTS
3x
2.2µF
SUPPLY
R3 9 R3
R2 10 R2
R1 11 R1
C4
C5
C6
3x
2.2µF
RIGHT
INPUTS
231
V
S
AGND CREF
C9 2.2µF
OUT(L) IN(L)
17 16
VOL
+ LOUD
LOUD(L)
12
100nF
C14
BASS
19
5.6K R2
BOUT(L)
18
BIN(L)
100nF
C15
RB
TREBLE
C17
2.7nF
TREBLE(L)
4
MUTE
D98AU888
SERIAL BUS DECODER + LATCHES
SPKR
ATT 25
VOL
+ LOUD BASS TREBLE
OUT(R) IN(R)
C8 2.2µF
76
100nF
C12 100nF
C13
5.6K R1
BOUT(R) BIN(R)
21 20
RB
2.7nF
C16
TREBLE(R)
MUTE
SPKR
ATT
28
27
26
22
SCL
SDA
DIGGND
BUS
OUT RIGHT
REAR
OUT LEFT
FRONT
5
22µFC7
8
LOUD(R)
C11
100nF
100nF
C10
MUTE
SPKR
ATT OUT LEFT
REAR
23
MUTE
SPKR
ATT OUT RIGHT
FRONT
24
BLOCK DIAGRAM
TDA7313N
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ELECTRICA L CHARACTERI STICS (refer to the test circ uit Tamb = 25°C, VS = 9V, RL = 10K ,
RG = 600, all controls flat (G = 0), f = 1KHz unless otherwise specified)
Symbol Parameter Test Condition Min. Typ. Max. Unit
SUPPLY
VSSupply Voltage 6 9 10 V
ISSupply Current 8 11 mA
SVR Ripple Rejection 60 80 dB
I NPUT SELECTOR S
RII Input Resistance Input 1, 2, 3 35 50 70 K
VCL Clipping Level 2 2.5 Vrms
SIN Input Separation (2) 80 100 dB
RLOutput Load resistance pin 7, 17 2 K
GINmin Min. Input Gain -1 0 1 dB
GINmax Max. Input Gain 11.25 dB
GSTEP Step Resolution 3.75 dB
eIN Input Noise G = 11.25dB 2 µV
VDC DC Steps adjacent gain steps 4 20 mV
G = 18.75 to Mute 4 mV
VOLUME CONTRO L
RIV Input Resistance 20 33 50 k
CRANGE Control Range 70 75 80 dB
AVMIN Min. Attenuation -1 0 1 dB
AVMAX Max. Attenuation 70 75 80 dB
ASTEP Step Resolution 0.5 1.25 1.75 dB
EAAttenuation Set Error Av = 0 to -20dB
Av = -20 to -60dB -1.25
-3 0 1.25
2dB
dB
ETTracking Error 2dB
V
DC DC Steps adjacent attenuation steps
From 0dB to Av max 0
0.5 3
7.5 mV
mV
SPEAKER ATTENUATORS
Crange Control Range 35 37.5 40 dB
SSTEP Step Resolution 0.5 1.25 1.75 dB
EAAttenuation set error 1.5 dB
AMUTE Output Mute Attenuation 80 100 dB
VDC DC Steps adjacent att. steps
from 0 to mute 0
13
10 mV
mV
BASS CONT ROL (1)
Gb Control Range Max. Boost/cut +12 +14 +16 dB
BSTEP Step Resolution 1 2 3 dB
RBInternal Feedback Resistance 34 44 58 K
TREBLE CONTRO L (1)
Gt Control Range Max. Boost/cut +13 +14 +15 dB
TSTEP Step Resolution 1 2 3 dB
TDA7313N
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ELECTRICA L CHARACTERI STICS (continued)
Symbol Parameter Test Condition Min. Typ. Max. Unit
AUD IO OUTPUTS
VOCL Clipping Level d = 0.3% 2 2.5 Vrms
RLOutput Load Resistance 2 K
CLOutput Load Capacitance 10 nF
ROUT Output resistance 30 75 120
VOUT DC Voltage Level 4.2 4.5 4.8 V
GENERAL
eNO Output Noise BW = 20-20KHz, flat
output muted
all gains = 0dB 2.5
515
µV
µV
A curve all gains = 0dB 3 µV
S/N Signal to Noise Ratio all gains = 0dB; VO = 1Vrms 106 dB
d Distortion AV = 0, VIN = 1Vrms
AV = -20dB VIN = 1Vrms
VIN = 0.3Vrms
0.01
0.09
0.04
0.1
0.3 %
%
%
Sc Channel Separation left/right 80 103 dB
Total Tracking error AV = 0 to -20dB
-20 to -60 dB 0
01
2dB
dB
BUS INPUTS
VIL Input Low Voltage 1 V
VIH Input High Voltage 3 V
IIN Input Current -5 +5 µA
VOOutput Voltage SDA
Acknowledge IO = 1.6mA 0.4 V
Notes:
(1) Bass and Treble response see attached diagram (fig.16). The center frequency and quality of the resonance behaviour can be choosen by
the external circuitry. A standard first order bass response can be realized by a standard feedback network
(2) The selected input is grounded thru the 2.2µF capacitor.
Figure 2: Loudness vs. Frequency (CLOUD =
100nF) vs. Volume A ttenuation
Figure 1: Loudness vs. Volume Attenuation
TDA7313N
5/14
Figure 6: Distortion & Noise vs. Frequency
Figure 7: Distortion & Noise vs. Frequency Figure 8: Distortion vs. Load Resistance
Figure 4: Noise vs . Volume/Gain Settings
Figure 5: Signal to Noise Ratio vs. Volume
Setting
Figure 3: Loudness vs. External Capacitors
TDA7313N
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Figure 12: Output Clipping Level vs . Supply
Voltage
Figure 14: Supply Current vs. Temperature
Figure 13: Quiescent Current vs. Supply Voltage
Figure 10: Input Separation (L1 L2, L3, L4) vs.
Frequency
Figure 9: C hannel Separation (L R) vs.
Frequency
Figure 11: Supply Voltage Rejection vs.
Frequency
TDA7313N
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I2C BUS INT E RFACE
Data transmission from microprocessor to the
TDA7313N and viceversa takes place thru the 2
wires I2C BUS interface, consisting of the two
lines SDA and SCL (pull-up resistors to positive
supply voltage must be connected).
Data Validity
As shown in fig. 17, the data on the SDA line
must be stable during the high period of the clock.
The HIGH and LOW state of the data line can
only change when the clock signal on the SCL
line is LOW.
Start and Stop Conditions
As shown in fig.18 a start condition is a HIGH to
LOW transition of the SDA line while SCL is
HIGH. The stop condition is a LOW to HIGH tran-
sition of the SDA line while SCL is HIGH.
Byte Format
Every byte transferred on the S DA line must con-
tain 8 bits. Each byte must be followed by an ac-
knowledge bit. The MS B is transferred first.
Acknowledge
The master (µP) puts a resi stive HIGH level on the
SDA line during the acknowledge clock pulse (see
fig. 19). The peripheral (audioprocessor) that ac-
knowledges has to pull-down (LOW) the SDA line
during the acknowledge clock pulse, so that the
SD A line is s table LOW du r ing t hi s c l ock pu lse.
The audioprocessor which has been addressed
has to generate an acknowledge after the recep-
tion of each byte, other wise the SDA line remains
at the HIGH level during the ninth clock pulse
time. In this case the master transmitter can gen-
erate the STOP information in order to abort the
transfer.
Transm is s ion without Ack nowledge
Avoiding to detect the acknowledge of the audio-
processor, the µP can use a simplier transmis-
sion: simply it waits one clock without checking
the slave acknowledging, and sends the new
data.
This approach of course is less protected from
misworking and decreases the noise immunity.
Figure 17: Data Validity on the I2CBUS
Figure 16: Typical Tone Respons e (with the ext.
components indicated in the test
circuit)
Figure 15: Bass Resistance v s. Temperature
TDA7313N
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SOFTWAR E SPECIFICATION
Interface Protocol
The interface protocol compr is es:
A start condition (s)
A chip address byte, containing the TDA7313N
address (the 8th bit of the byte must be 0). The
TDA7313N must always acknowledge at the
end of each transmitted byte.
A sequence of data (N-bytes + acknowledge)
A stop condition (P)
TDA7313N ADDRESS
MSB first byte LSB MSB LSB MSB LSB
S10001000
ACK DATA ACK DATA ACK P
Data Transferred (N-bytes + Acknowledge)
ACK = Acknowledge
S = Start
P = Stop
MAX CLOCK SPEED 100kbits/s
SOFTWAR E SPECIFICATION
Chip address
1
MSB 0001000
LSB
DATA BYTES
MSB LSB FUNCTION
0
1
1
1
1
0
0
0
0
1
1
0
0
1
1
1
B2
0
1
0
1
0
1
1
B1
B1
B1
B1
B1
G1
0
1
B0
B0
B0
B0
B0
G0
C3
C3
A2
A2
A2
A2
A2
S2
C2
C2
A1
A1
A1
A1
A1
S1
C1
C1
A0
A0
A0
A0
A0
S0
C0
C0
Volume control
Speaker ATT LR
Speaker ATT RR
Speaker ATT LF
Speaker ATT RF
Audio switch
Bass control
Treble control
Ax = 1.25dB steps; Bx = 10dB steps; Cx = 2dB steps; Gx = 3.75dB steps
Figure 18: Timing Diagram of I2CBUS
Figure 19: Acknowledge on the I2CBUS
TDA7313N
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SOFTWAR E SPECIFICATION (continued)
DATA BYTES (detailed description)
Volume
MSB LSB FUNCTION
0 0 B2 B1 B0 A2 A1 A0 Volume 1.25dB steps
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
-1.25
-2.5
-3.75
-5
-6.25
-7.5
-8.75
0 0 B2 B1 B0 A2 A1 A0 Volume 10dB steps
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
-10
-20
-30
-40
-50
-60
-70
For example a v olume of -45dB is given by:
0 0 1 0 0 1 0 0
Speaker Attenuators
MSB LSB FUNCTION
1
1
1
1
0
0
1
1
0
1
0
1
B1
B1
B1
B1
B0
B0
B0
B0
A2
A2
A2
A2
A1
A1
A1
A1
A0
A0
A0
A0
Speaker LF
Speaker RF
Speaker LR
Speaker RR
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
-1.25
-2.5
-3.75
-5
-6.25
-7.5
-8.75
0
0
1
1
0
1
0
1
0
-10
-20
-30
11111 Mute
For ex ample attenuation of 25dB on speaker RF is given by:
1 0 1 1 0 1 0 0
TDA7313N
10/14
Audio Switch
MSB LSB FUNCTION
0 1 0 G1 G0 S2 S1 S0 Audio Switch
0
1
0
0
1
1
0
1
0
1
Stereo 1
Stereo 2
Stereo 3
Stereo 4 (*)
LOUDNESS ON
LOUDNESS OFF
0
0
1
1
0
1
0
1
+11.25dB
+7.5dB
+3.75dB
0dB
For example to select the stereo 2 input with a gain of +7.5dB LOUDNESS ON the 8bit stri ng is:
0 1 0 0 1 0 0 1
(*) Stereo 4 is connected internally, but not available on pins.
Bass and Treble
0
01
11
10
1C3
C3 C2
C2 C1
C1 C0
C0 Bass
Treble
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
1
1
0
0
1
1
1
1
0
0
1
1
0
0
0
1
0
1
0
1
0
1
1
0
1
0
1
0
1
0
-14
-12
-10
-8
-6
-4
-2
0
0
2
4
6
8
10
12
14
C3 = Sign
For ex ample Bass at -10dB is obtained by the following 8 bit string:
0 1 1 0 0 0 1 0
TDA7313N
11/14
SO28
DIM. mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A 2.65 0.104
a1 0.1 0.3 0.004 0.012
b 0.35 0.49 0.014 0.019
b1 0.23 0.32 0.009 0.013
C 0.5 0.020
c1 45° (typ.)
D 17.7 18.1 0.697 0.713
E 10 10.65 0.394 0.419
e 1.27 0.050
e3 16.51 0.65
F 7.4 7.6 0.291 0.299
L 0.4 1.27 0.016 0.050
S8° (max.)
OUTLINE AND
MECHANICAL DATA
TDA7313N
12/14
DIM. mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
a1 0.63 0.025
b 0.45 0.018
b1 0.23 0.31 0.009 0.012
b2 1.27 0.050
D 37.34 1.470
E 15.2 16.68 0.598 0.657
e 2.54 0.100
e3 33.02 1.300
F 14.1 0.555
I 4.445 0.175
L 3.3 0.130
DIP28
OUTLINE AND
MECHANICAL DATA
TDA7313N
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grante d by implication o r otherwise under any patent or patent rights of STMicroelectronic s. Specification mentione d in t his publication are
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are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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Purchase of I2C Components of STMicroelectronics, conveys a license under the Philips I2C Patent
Rights to use these components in an I2C system, provided that the system conforms to the I2C
Standard Spec ifications as defined by Philips .
TDA7313N
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