TDA9109/SN
LOW-COST DEFLECTION PROCESSOR
FOR MULTISYNC MONITORS
June 1998
PRELIMINARY DATA
SHRINK32
(Plastic Package)
ORDER CODE : TDA9109/SN
HORIZONTAL
.SELF-ADAPTATIVE
.DUALPLL CONCEPT
.150kHz MAXIMUM FREQUENCY
.X-RAYPROTECTION INPUT
.I2C CONTROLS : H-POSITION, FREQUENCY
GENERATORFORBURN-IN MODE
VERTICAL
.VERTICAL RAMPGENERATOR
.50 TO 185HzAGC LOOP
.GEOMETRYTRACKING WITH VPOS&VAMP
.I2C CONTROLS :
VAMP, VPOS, S-CORR, C-CORR
.DC BREATHINGCOMPENSATION
I2C GEOMETRYCORRECTIONS
.VERTICAL PARABOLAGENERATOR
(PinCushion - E/W, Keystone,Corner)
.HORIZONTALDYNAMICPHASE
(SidePin Balance& Parallelogram)
.VERTICAL DYNAMICFOCUS
(Vertical FocusAmplitude)
GENERAL
.SYNCPROCESSOR
.12V SUPPLYVOLTAGE
.8V REFERENCEVOLTAGE
.HOR. & VERT. LOCK/UNLOCK OUTPUTS
.READ/WRITEI2C INTERFACE
.HORIZONTALANDVERTICALMOIRE
.B+REGULATOR
- INTERNAL PWM GENERATOR FOR B+
CURRENT MODE STEP-UP CONVERTER
- SOFTSTART
-I
2
CADJUSTABLEB+REFERENCEVOLTAGE
- OUTPUT PULSES SYNCHRONIZED ON
HORIZONTALFREQUENCY
- INTERNALMAXIMUMCURRENTLIMITATION
.COMPARED WITH THE TDA9109,
THE TDA9109/SNHAS :
- CORNER CORRECTION,
- HORIZONTAL MOIRÉ,
- B+ SOFT START,
- INCREASEDMAX.VERTICALFREQUENCY,
- NOHORIZONTAL FOCUS,
- NOSTEPDOWNOPTIONFORDC/DCCON-
VERTER,
-NOI
2
C FREE RUNNING ADJUSTMENT,
- FIXED HORIZONTAL DUTYCYCLE (48%),
- INCREASED MAXIMUM STORAGE TIME
OF THE HORIZONTAL SCANNING TRAN-
SISTOR.
DESCRIPTION
The TDA9109/SN is a monolithic integrated circuit
assembledin 32-pinshrinkdualin line plasticpack-
age. This IC controlsall the functionsrelated tothe
horizontal and vertical deflection in multimode or
multi-frequencycomputerdisplaymonitors.
Theinternalsyncprocessor,combinedwiththevery
powerful geometry correction block make the
TDA9109/SN suitable for very high performance
monitors, using very few externalcomponents.
Thehorizontaljitter levelisverylow. Itisparticularly
well suited forhigh-end 15” and 17” monitors.
Combined with the ST7275 Microcontroller fam-
ily, TDA9206 (Video preamplifier) and STV942x
(On-Screen Display controller) the TDA9109/SN
allows fully I2C bus controlled computer display
monitors to be built with a reduced number of
externalcomponents.
This is advance information on a new product now in development or undergoingevaluation. Details are subject to change without notice.
1/30
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
22
23
24
25
26
21
20
19
18
17
5V
SDA
SCL
VCC
GND
HOUT
XRAY
EWOUT
VOUT
VCAP
VREF
VAGCCAP
VGND
BREATH
B+GNDISENSE
REGIN
COMP
HREF
HFLY
HGND
FOCUS-OUT
HMOIRE
HPOSITION
PLL1F
R0
C0
PLL2C
HLOCKOUT
H/HVIN
VSYNCIN
32
31
30
29
28
27
BOUT
9109SN01.EPS
PIN CONNECTIONS
TDA9109/SN
2/30
PIN CONNECTIONS
Pin Name Function
1 H/HVIN TTL compatible Horizontal sync Input (separate or composite)
2 VSYNCIN TTL compatible Vertical sync Input (for separated H&V)
3 HLOCKOUT First PLL Lock/Unlock Output (0V unlocked - 5V locked)
4 PLL2C Second PLL Loop Filter
5 C0 Horizontal Oscillator Capacitor
6 R0 Horizontal Oscillator Resistor
7 PLL1F First PLL Loop Filter
8 HPOSITION Horizontal Position Filter (capacitor to be connected to HGND)
9 HMOIRE Horizontal Moiré Output (to be connected to PLL2C through a resistordivider)
10 FOCUSOUT Vertical Dynamic Focus Output
11 HGND Horizontal Section Ground
12 HFLY Horizontal Flyback Input (positive polarity)
13 HREF Horizontal Section ReferenceVoltage (to be filtered)
14 COMP B+ Error Amplifier Output for frequency compensation and gain setting
15 REGIN Regulation Input of B+ control loop
16 ISENSE Sensing ofexternal B+ switching transistor current
17 B+GND Ground (related to B+ reference adjustment)
18 BREATH DC Breathing Input Control (compensation of vertical amplitude against EHV variation)
19 VGND Vertical Section Ground
20 VAGCCAP Memory Capacitor for Automatic Gain Control Loop in Vertical Ramp Generator
21 VREF Vertical Section Reference Voltage (to be filtered)
22 VCAP Vertical Sawtooth Generator Capacitor
23 VOUT Vertical Ramp Output(with frequency independantamplitude andS or CCorrections if any).
It is mixed with vertical position voltage and vertical moiré.
24 EWOUT Pin Cushion- E/W Correction Parabola Output
26 HOUT Horizontal Drive Output (internal transistor, open collector)
25 XRAY X-RAY protection input (with internal latch function)
27 GND General Ground (referenced to VCC)
28 BOUT B+ PWM Regulator Output
29 VCC Supply Voltage (12V typ)
30 SCL I2C Clock Input
31 SDA I2C Data Input
32 5V Supply Voltage (5V typ.)
9109SN01.TBL
TDA9109/SN
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QUICK REFERENCE DATA
Parameter Value Unit
Horizontal Frequency 15 to 150 kHz
Autosynch Frequency (for given R0 and C0) 1 to 4.5 f0
±Horizontal Sync Polarity Input YES
Polarity Detection (on bothHorizontal and Vertical Sections) YES
TTL Composite Sync YES
Lock/Unlock Identification (on both Horizontal 1st PLL and Vertical Section) YES
I2C Controlfor H-Position ±10 %
XRAY Protection YES
I2C Horizontal Duty Fixed 48 %
I2C Free Running Frequency Adjustment NO
Stand-by Function YES
Dual Polarity H-Drive Outputs NO
Supply Voltage Monitoring YES
PLL1 Inhibition Possibility NO
Blanking Outputs NO
Vertical Frequency 35 to 200 Hz
Vertical Autosync (for 150nF on Pin 22 and 470nF on Pin 20) 50 to 185 Hz
Vertical S-Correction YES
Vertical C-Correction YES
Vertical Amplitude Adjustment YES
DC Breathing Control on VerticalAmplitude YES
Vertical Position Adjustment YES
East/West (E/W) Parabola Output (also known as Pin Cushion Output) YES
E/W Correction Amplitude Adjustment YES
Keystone Adjustment YES
Corner Correction YES
Internal Dynamic Horizontal Phase Control YES
Side Pin Balance Amplitude Adjustment YES
Parallelogram Adjustment YES
Tracking of Geometric Corrections with Vertical Amplitude and Position YES
Reference Voltage (both on Horizontal and Vertical) YES
Vertical Dynamic Focus YES
I2C Horizontal Dynamic Focus Amplitude Adjustment NO
I2C Horizontal Dynamic Focus Symmetry Adjustment NO
I2C Vertical Dynamic Focus Amplitude Adjustment YES
Detection of Input Sync Type YES
Vertical Moiré Output YES
Horizontal Moiré Output YES
I2C Controlled Moiré Amplitude YES
Frequency Generator for Burn-in YES
Fast I2C Read/Write 400 kHz
B+ Regulation adjustable by I2C YES
B+ Soft Start YES
9109SN02.TBL
TDA9109/SN
4/30
VREF
4
13
12
11
53
1
67 26
2
HSYNC
HORIZONTAL
MOIRE CANCEL
5 BITS+ON/OFF 9 HMOIRE
HREF
HGND
SYNC
PROCESSOR
SYNC INPUT
SELECT
(1 bit)
B+
CONTROLLER
LOCK/UNLOCK
IDENTIFICATION
PHASE
COMPARATOR PHASE
SHIFTER H-DUTY
(48%) HOUT
BUFFER
VCO
Forced
Frequency
2 bits
VAMP
7 bits
21
22 23
30
19
24
32
31
27
VREF
VGND
5V
SDA
SCL
GND
VREF
S AND C
CORRECTION
VERTICAL
OSCILLATOR
RAMP GENERATOR
GEOMETRY
TRACKING
6 bits 6 bits
Keyst.
6 bits
E/W
7 bits
PLL1F
HLOCKOUT
HPOSITION
R0
C0
HFLY
PLL2C
HOUT
VCAP
VAGCCAP
VOUT
VSYNCIN
H/HVIN
EWOUT
X2
X
25
29
XRAY
VCC
RESET
GENERATOR
I2C INTERFACE
VPOS
7 bits
20
AMPVDF
6 bits
10 FOCUS
Parallelogram
6 bits
Spin Bal
6 bits
X2
X
VSYNC
SAFETY
PROCESSOR XRAY
VCC
17 BGND
16 ISENSE
15 REGIN
28 B+OUT
14 COMP
B+ Adjust
7 bits
18
BREATH
PHASE/FREQUENCY
COMPARATOR
H-PHASE (7 bits)
8
VERTICAL
MOIRE
CANCEL
5 BITS+ON/OFF
5V
Corner
7 bits
X4
TDA9109/SN
9109SN02.EPS
BLOCKDIAGRAM
TDA9109/SN
5/30
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
VCC Supply Voltage (Pin 29) 13.5 V
VDD Supply Voltage (Pin 32) 5.7 V
VIN Max Voltage on Pin 4
Pin 5
Pins 6, 7, 8, 14,15, 16, 20, 22
Pins 9, 10, 18, 23, 24, 25, 26,28
Pins 1, 2, 3, 30,31
4.0
6.4
8.0
VCC
VDD
V
V
V
V
V
VESD ESD susceptibility Human Body Model,100pF Discharge through 1.5kΩ
EIAJ Norm, 200pF Discharge through 0Ω2
300 kV
V
Tstg Storage Temperature -40, +150 oC
TjJunction Temperature +150 oC
Toper Operating Temperature 0, +70 oC
9109SN03.TBL
THERMAL DATA
Symbol Parameter Value Unit
Rth (j-a) Junction-Ambient Thermal Resistance Max. 65 oC/W
9109SN04.TBL
SYNC PROCESSOR
Operating Conditions (VDD =5V,T
amb =25
o
C)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
HsVR Voltage on H/HVIN Input Pin 1 0 5 V
MinD Minimum Horizontal Input Pulses Duration Pin 1 0.7 µs
Mduty Maximum Horizontal Input Signal Duty Cycle Pin 1 25 %
VsVR Voltage on VSYNCIN Pin 2 0 5 V
VSW Minimum Vertical Sync Pulse Width Pin 2 5 µs
VSmD Maximum Vertical SyncInput Duty Cycle Pin 2 15 %
VextM Maximum VerticalSync Widthon TTLH/Vcomposite Pin 1 750 µs
IHLOCKOUT Sink and Source Current Pin3 250 µA
ElectricalCharacteristics(VDD =5V,Tamb =25oC)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
VINTH Horizontal and Vertical Input Logic Level
(Pins 1, 2) Low Level
High Level 2.2 0.8 V
V
RIN Horizontal and Vertical Pull-Up Resistor Pins 1, 2 200 kΩ
TfrOut Fall and Rise Time, Output CMOS Buffer Pin 3, COUT = 20pF 200 ns
VHlock Horizontal1st PLLLock OutputStatus(Pin3) Locked, ILOCKOUT = -250µA
Unlocked,ILOCKOUT = +250µA 4.4 0
50.5 V
V
VoutT Extracted Vsync Integration Time (% of TH)
on H/V Composite (see Note 1) C0 = 820pF 26 35 %
Note 1 : THis the horizontal period.
I2C READ/WRITE (seeNote 2)
ElectricalCharacteristics(VDD =5V,T
amb =25
oC)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I2C PROCESSOR
Fscl Maximum Clock Frequency Pin 30 400 kHz
Tlow Low period of the SCL Clock Pin 30 1.3 µs
Thigh High period of the SCL Clock Pin 30 0.6 µs
Vinth SDA and SCL Input Threshold Pins 30,31 2.2 V
VACK Acknowledge Output Voltage on SDA input with 3mA Pin 31 0.4 V
Note 2 : See also I2C Table Control and I2C Sub Address Control.
9109SN05.TBL
TDA9109/SN
6/30
HORIZONTAL SECTION
Operating Conditions
Symbol Parameter Test Conditions Min. Typ. Max. Unit
VCO
R0(Min.) Minimum Oscillator Resistor Pin 6 6 kΩ
C0(Min.) Minimum Oscillator Capacitor Pin 5 390 pF
F(Max.) Maximum Oscillator Frequency 150 kHz
OUTPUT SECTION
I12m Maximum Input Peak Current Pin 12 5 mA
HOI Horizontal Drive Output Maximum Current Pin 26, Sunk current 30 mA
ElectricalCharacteristics(VCC =12V,Tamb =25
oC)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
SUPPLY AND REFERENCE VOLTAGES
VCC Supply Voltage Pin 29 10.8 12 13.2 V
VDD Supply Voltage Pin 32 4.5 5 5.5 V
ICC Supply Current Pin 29 50 mA
IDD Supply Current Pin 32 5 mA
VREF-H Horizontal Reference Voltage Pin 13, I = -2mA 7.4 8 8.6 V
VREF-V Vertical Reference Voltage Pin 21, I = -2mA 7.4 8 8.6 V
IREF-H Max. Sourced Current on VREF-H Pin 13 5 mA
IREF-V Max. Sourced Current on VREF-V Pin 21 5 mA
1st PLL SECTION
HpolT Delay Time for detecting polarity change
(see Note 3) Pin 1 0.75 ms
VVCO VCO Control Voltage (Pin 7) VREF-H =8V f
0
f
H
(Max.) 1.3
6.2 V
V
Vcog VCO Gain (Pin 7) R0= 6.49kΩ,C
0= 820pF,
dF/dV = 1/11R0C017.1 kHz/V
Hph Horizontal Phase Adjustment(see Note 4) % of Horizontal Period ±10 %
Vbmin
Vbtyp
Vbmax
Horizontal PhaseSettingValue (Pin 8)(seeNote4)
Minimum Value
Typical Value
Maximum Value
Sub-Address 01
Byte x1111111
Byte x1000000
Byte x0000000
2.8
3.4
4.0
V
V
V
IPll1U
IPll1L PLL1 Filter Current Charge PLL1 is Unlocked
PLL1 is Locked ±140
±1µA
mA
f0Free Running Frequency R0= 6.49kΩ,C
0= 820pF,
f0= 0.97/8R0C022.8 kHz
df0/dT Free Running Frequency Thermal Drift
(No drift on external components) (see Note 5) -150 ppm/C
CR PLL1 Capture Range R0= 6.49kΩ,C
0= 820pF,
from f0+0.5kHz to 4.5f0
fH(Min.)
fH(Max.) 90 25 kHz
kHz
FF Forced Frequency FF1 Byte 11xxxxxx
FF2 Byte 10xxxxxx Sub-Address 02 2f0
3f0
Notes : 3. This delay is mandatoryto avoid a wrong detectionof polarity change in the case of a composite sync.
4. See Figure 10 for explanation of reference phase.
5. These parametersare not tested on each unit. They are measured during our internalqualification.
6. This PLLcapture range maybe obtained only if f0 is captured(for instancebu adjustingR0). Ifnot, more margin mustbe provided
between fH (Min.) and f0, to cope with the components spread.
9109SN05.TBL
TDA9109/SN
7/30
HORIZONTAL SECTION (continued)
ElectricalCharacteristics(VCC =12V,Tamb =25
oC) (continued)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
2nd PLL SECTION AND HORIZONTAL OUTPUT SECTION
FBth Flyback Input Threshold Voltage (Pin 12) 0.65 0.75 V
Hjit Horizontal Jitter At 31.4kHz 70 ppm
HD Horizontal Drive Output Duty-Cycle
(Pin 26) (see Note 7) 48 %
XRAYth X-RAY Protection InputThresholdVoltage Pin 25, see Note 8 8 V
Vphi2 Internal Clamping Levels on 2nd PLL
Loop Filter (Pin 4) Low Level
High Level 1.6
4.0 V
V
VSCinh Threshold Voltage to Stop H-Out,V-Out,
B-Out and Reset XRAY
when VCC < VSCinh (see Note 8)
Pin 29 7.5 V
VSDinh Threshold Voltage to Stop H-Out,V-Out,
B-Out and Reset XRAY
when VDD < VSDinh
Pin 32 4.0 V
HDvd Horizontal Drive Output (low level) Pin 26, IOUT = 30mA 0.4 V
VERTICAL DYNAMIC FOCUS FUNCTION (positive parabola)
HDFDC Bottom DC Output Level RLOAD = 10kΩ, Pin10 2 V
TDHDF DC Output VoltageThermal Drift (see
Note 5) 200 ppm/C
AMPVDF Vertical Dynamic Focus Parabola
Amplitude with VAMP and VPOS Typical
Min. Byte 000000
Typ. Byte 100000
Max. Byte 111111
Sub-Address 0F
0
0.5
1
VPP
VPP
VPP
VDFAMP Parabola Amplitude Function of VAMP
(tracking between VAMP and VDF) with
VPOS Typ. (see Figure 1 and Note 9)
Sub-Address 05
Byte 10000000
Byte 11000000
Byte 11111111
0.6
1
1.5
VPP
VPP
VPP
VHDFKeyt Parabola Asymetry Function of VPOS
Control(trackingbetween VPOSandVDF)
with VAMP Max.
Sub-Address 06
Byte x0000000
Byte x1111111 0.52
0.52 VPP
VPP
Notes : 5. These parameters are not tested on each unit.They are measured during our internalqualification.
7. Duty Cycle is the ratio between the output transistor OFF time and the period. The power transistor is controlled OFF when the
output transistor is OFF.
7. Initial Condition for Safe Operation Start Up
8. See Figure 14.
9. S and C correction are inhibited so the output sawtooth has a linear shape.
9109SN05.TBL
TDA9109/SN
8/30
VERTICALSECTION
Operating Conditions
Symbol Parameter Test Conditions Min. Typ. Max. Unit
OUTPUTS SECTION
VEWM Maximum E/W OutputVoltage Pin 24 6.5 V
VEWm Minimum E/W Output Voltage Pin 24 1.8 V
RLOAD Minimum Load for lessthan 1% VerticalAmplitude Drift Pin 20 65 MΩ
ElectricalCharacteristics(VCC =12V,Tamb =25
oC)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
VERTICAL RAMP SECTION
VRB Voltage at Ramp Bottom Point VREF-V = 8V,Pin 22 2 V
VRT Voltage at Ramp Top Point (with Sync) VREF-V = 8V,Pin 22 5 V
VRTF Voltage at Ramp Top Point (without Sync) Pin 22 VRT-0.1 V
VSTD Vertical Sawtooth Discharge Time Pin 22, C22 = 150nF 70 µs
VFRF Vertical Free Running Frequency
(see Note 10) COSC (Pin22) = 150nF
Measured on Pin22 100 Hz
ASFR AUTO-SYNC Frequency (see Note 11) C22 = 150nF ±5% 50 185 Hz
RAFD Ramp Amplitude Drift Versus Frequency at
Maximum VerticalAmplitude (see Note 5) C22 = 150nF
50Hz < f and f < 185Hz 200 ppm/Hz
Rlin Ramp Linearityon Pin 22 (see Note 10) 2.5V < V27 and V27 < 4.5V 0.5 %
VPOS Vertical Position Adjustment Voltage
(Pin 23 - VOUT mean value) Sub Address 06
Byte x0000000
Byte x1000000
Byte x1111111 3.65
3.2
3.5
3.8
3.3 V
V
V
VOR Vertical Output Voltage
(peak-to-peak on Pin 23) Sub Address 05
Byte x0000000
Byte x1000000
Byte x1111111 3.5
2.25
3
3.75
2.5 V
V
V
VOI Vertical Output Maximum Current (Pin 23) ±5mA
dVS Max Vertical S-Correction Amplitude
(see Note 12)
x0xxxxxx inhibitsS-CORR
x1111111 givesmax S-CORR
Sub Address 07
∆V/VPP at TV/4
∆V/VPP at 3TV/4 -4
+4 %
%
Ccorr Vertical C-Corr Amplitude
x0xxxxxx inhibitsC-CORR Sub Address 08
∆V/VPP @ TV/2
Byte x1000000
Byte x1100000
Byte x1111111
-3
0
3
%
%
%
Notes : 5. These parametersare not testedon eachunit. They aremeasured during our internal qualification.
10. With Register 07 at Byte x0xxxxxx (S correctionis inhibited) and withRegister 08at Bytex0xxxxxx (C correction is inhibited),the
sawtooth has a linear shape.
11. This is the frequencyrangefor whichthevertical oscillatorwill automaticallysynchronize,using a single capacitorvalue on Pin22
and with a constant ramp amplitude.
12. TV is the vertical period.
9109SN05.TBL
TDA9109/SN
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VERTICALSECTION(continued)
ElectricalCharacteristics(VCC =12V,Tamb =25
oC) (continued)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
East/West (E/W) FUNCTION
EWDC DC Output Voltage with Typ. VPOS, Keystone and
Corner inhibited Pin 24, see Figure 2 2.5 V
TDEWDC DC Output Voltage Thermal Drift See Note13 100 ppm/C
EWpara Parabola Amplitude with Max. VAMP, Typ. VPOS,
Keystone and Corner inhibited Subaddress 0A
Byte 11111111
Byte 11000000
Byte 10000000
1.7
0.85
0
VPP
VPP
VPP
EWtrack Parabola Amplitude Function of VAMP Control
(tracking between VAMPand E/W) with Typ. VPOS,
Typ. E/W Amplitude,Keystone and Cornerinhibited
(see Note 10)
Subaddress 05
Byte 10000000
Byte 11000000
Byte 11111111
0.30
0.55
0.85
VPP
VPP
VPP
KeyAdj Keystone Adjustment Capability with Typ. VPOS,
Corner and E/W inhibited and Max. Vertical
Amplitude (see Note 10 and Figure 4)
Subaddress 09
Byte 1x000000
Byte 1x111111 0.65
0.65 VPP
VPP
KeyTrack Intrinsic Keystone Function of VPOS Control
(tracking between VPOS and E/W) with Max. E/W
Amplitude,Max. Vertical Amplitude and Corner
inhibited (see Note 13 and Figure 2)
A/B Ratio
B/A Ratio
Subaddress 06
Byte x0000000
Byte x1111111 0.52
0.52
Corner Corner Amplitude with Max. VAMP, Typ. VPOS,
Keystone and E/W inhibited Subaddress 0B
Byte 11111111
Byte 11000000
Byte 10000000
1.7
0
-1.7
VPP
VPP
VPP
INTERNAL DYNAMIC HORIZONTAL PHASE CONTROL
SPBpara Side Pin BalanceParabola Amplitude(Figure 3)with
Max. VAMP, Typ.VPOSandParallelograminhibited
(see Notes 10 & 14)
Subaddress 0D
Byte x1111111
Byte x1000000 +1.4
-1.4 %TH
%TH
SPBtrack Side Pin Balance Parabola Amplitude function of
VAMP Control (tracking between VAMP and SPB)
with Max. SPB, Typ. VPOS and Parallelogram
inhibited (see Notes 10 & 14)
Subaddress 05
Byte 10000000
Byte 11000000
Byte 11111111
0.5
0.9
1.4
%TH
%TH
%TH
ParAdj Parallelogram Adjustment Capability with
Max. VAMP, Typ. VPOS and Max. SPB
(see Notes 10 & 14)
Subaddress 0E
Byte x1111111
Byte x1000000 +1.4
-1.4 %TH
%TH
Partrack Intrinsic Parallelogram Function of VPOS Control
(tracking between VPOS and DHPC) with
Max. VAMP, Max. SPB and Parallelogram inhibited
(see Notes 10 & 14)
A/B Ratio
B/A Ratio
Subaddress 06
Byte x0000000
Byte x1111111 0.52
0.52
VERTICAL MOIRE
VMOIRE Vertical Moiré (measured on VOUT : Pin 23) Subaddress 0C
Byte 01x11111 6 mV
BREATHING COMPENSATION
BRRANG DC Breathing Control Range (see Note 15) V18 112V
BRADj Vertical Output Variation versus DC Breathing
Control (Pin 23) V18 ≥VREF-V
V18 =4V 0
-10 %
%
Notes : 10. With Register 07 at Byte x0xxxxxx (S correctionis inhibited)and withRegister 08at Bytex0xxxxxx (C correction is inhibited),the
sawtooth has a linear shape.
13. These parametersare not testedon each unit. They aremeasured during our internalqualification.
14. THis the horizontal period.
15. When not used the DC breathing control pin must be connected to 12V.
9109SN05.TBL
TDA9109/SN
10/30
B+SECTION
Operating Conditions
Symbol Parameter Test conditions Min. Typ. Max. Unit
FeedRes Minimum Feedback Resistor Resistor between Pins 15 and 14 5 kΩ
ElectricalCharacteristics(VCC =12V,Tamb =25
oC)
Symbol Parameter Test conditions Min. Typ. Max. Unit
OLG Error Amplifier Open Loop Gain At lowfrequency (see Note 16) 85 dB
ICOMP Sunk Current on Error Amplifier
Output when BOUT is in safety
condition
Pin 14 (see Figure14) 0.5 mA
UGBW Unity Gain Bandwidth (see Note 13) 6 MHz
IRI Regulation Input Bias Current Current sourced by Pin 15 (PNP base) 0.2 µA
EAOI Error Amplifier Output Current Current sourced by Pin 14
Current sunk by Pin 14 0.5
2mA
mA
CSG Current Sense InputVoltage Gain Pin 16 3
MCEth Max Current Sense Input Threshold
Voltage Pin 16 1.2 V
ISI Current Sense InputBias Current Current sourced by Pin 16 (PNP base) 1 µA
Tonmax Maximum ON Time of the external
power transistor % of Horizontal period,
f0= 27kHz (see Note 17) 100 %
B+OSV B+ Output Saturation Voltage V28 with I28 = 10mA 0.25 V
IVREF Internal Reference Voltage Onerroramp (+)inputforSubaddress 0B
Byte 1000000 4.8 V
VREFADJ Internal Reference Voltage
Adjustment Range Byte 1111111
Byte 0000000 +20
-20 %
%
tFB+ Fall Time Pin 28 100 ns
Notes : 13. These parametersare not testedon each unit. They aremeasured during our internal qualification.
16. These parameters are not tested on each unit. They are measured during our internal qualification procedure which includes
characterization on batches coming from corners of our processes and also temperature characterization.
17. The externalpower transistor is OFFduring about 400ns.
9109SN05.TBL
HDFDC
A
B
VDFAMP
9109SN03.EPS
Figure 1 : VerticalDynamic Focus Function
DHPCDC
A
B
SPBPARA
9109SN05.EPS
Figure 3 : DynamicHorizontal Phase Control
Output
EWDC
A
B
EWPARA
9109SN04.EPS
Figure 2 : E/WOutput
Keyadj
9109SN06.EPS
Figure 4 : KeystoneEffect on E/W Output
(PCCand Corner Inhibited)
TDA9109/SN
11/30
TYPICALVERTICAL OUTPUT WAVEFORMS
Function Sub
Address Pin Byte Specification Effect on Screen
Vertical Size 05 23
10000000
11111111
Vertical
Position
DC
Control 06 23 x0000000
x1000000
x1111111
VOUTDC = 3.2V
VOUTDC = 3.5V
VOUTDC = 3.8V
Vertical
S
Linearity 07 23
0xxxxxxx
Inhibited
1x111111
Vertical
C
Linearity 08 23
1x000000
1x111111
9109SN06.TBL / 9109SN07.EPS TO 9109SN13.EPS
2.25V
3.75V
VOUTDC
VOUTDC
VPP
∆V
∆V
VPP =4%
V
PP
∆V
∆V
VPP =3%
∆V
V
PP
∆V
VPP =3%
TDA9109/SN
12/30
GEOMETRYOUTPUT WAVEFORMS
Function Sub
Address Pin Byte Specification Effect on Screen
Keystone
(Trapezoid)
Control 09 24
E/W+ Corner
inhibited
1x000000
1x111111
E/W
(Pin Cushion)
Control 0A 24
Keystone +
Corner
inhibited
10000000
11111111
Corner
Control 0B 24
Keystone+
E/W inhibited
11111111
10000000
Parrallelogram
Control 0E Internal
SPB
inhibited
1x000000
1x111111
Side Pin
Balance
Control 0D Internal
Parallelogram
inhibited
1x000000
1x111111
Vertical
Dynamic
Focus 0F 10
9109SN07.TBL / 9109SN14.EPS TO 9109SN24.EPS
1.7V
2.5V
1.7V
1.4% TH
3.7V
3.7V 1.4% TH
1.4% TH
3.7V
1.4% TH
3.7V
2V
TV
2.5V
2.5V
0.65V
0.65V
0V
1.7V
2.5V
TDA9109/SN
13/30
I2C BUSADDRESS TABLE
Slave Address (8C) : WriteMode
SubAddress Definition
D8 D7 D6 D5 D4 D3 D2 D1
0 0 0 0 0 0 0 0 0 Horizontal Drive Selection
1 0 0 0 0 0 0 0 1 Horizontal Position
2 0 0 0 0 0 0 1 0 Forced Frequency
3 0 0 0 0 0 0 1 1 Sync Priority / Horizontal Moiré Amplitude
4 0 0 0 0 0 1 0 0 Refresh / B+ Reference Adjustment
5 0 0 0 0 0 1 0 1 Vertical Ramp Amplitude
6 0 0 0 0 0 1 1 0 Vertical Position Adjustment
7 0 0 0 0 0 1 1 1 S Correction
8 0 0 0 0 1 0 0 0 C Correction
9 0 0 0 0 1 0 0 1 E/W Keystone
A 0 0 0 0 1 0 1 0 E/W Amplitude
B 0 0 0 0 1 0 1 1 E/W Corner Adjustment
C 0 0 0 0 1 1 0 0 Vertical Moiré Amplitude
D 0 0 0 0 1 1 0 1 Side Pin Balance
E 0 0 0 0 1 1 1 0 Parallelogram
F 0 0 0 0 1 1 1 1 Vertical Dynamic Focus Amplitude
Slave Address (8D) : Read Mode
No sub addressneeded.
TDA9109/SN
14/30
D8 D7 D6 D5 D4 D3 D2 D1
WRITE MODE
00 HDrive
0, off
[1], on
01 Xray
1, reset
[0]
Horizontal Phase Adjustment
[1] [0] [0] [0] [0] [0] [0]
02 Forced Frequency
1, on
[0], off 1, f0 x 2
[0], f0 x 3
03 Sync
0, Comp
[1], Sep
HMoiré
1, on
[0]
Horizontal Moiré Amplitude
[0] [0] [0] [0] [0]
04 Detect
Refresh
[0], off
B+ Reference Adjustment
[1] [0] [0] [0] [0] [0] [0]
05 Vramp
0, off
[1], on
Vertical Ramp Amplitude Adjustment
[1] [0] [0] [0] [0] [0] [0]
06 Vertical Position Adjustment
[1] [0] [0] [0] [0] [0] [0]
07 S Select
1, on
[0]
S Correction
[1] [0] [0] [0] [0] [0]
08 C Select
1, on
[0]
C Correction
[1] [0] [0] [0] [0] [0]
09 E/W Key
0, off
[1]
E/W Keystone
[1] [0] [0] [0] [0] [0]
0A E/W Amplitude
[1] [0] [0] [0] [0] [0] [0]
0B E/W Cor
0, off
[1]
E/W Corner Adjustment
[1] [0] [0] [0] [0] [0] [0]
0C Test V
1, on
[0], off
VMoiré
1, on
[0]
Vertical Moiré Amplitude
[0] [0] [0] [0] [0]
0D SPB Sel
0, off
[1]
Side Pin Balance
[1] [0] [0] [0] [0] [0]
0E Parallelo
0, off
[1]
Parallelogram
[1] [0] [0] [0] [0] [0]
0F Test H
1, on
[0], off
Vertical Dynamic Focus Amplitude
[1] [0] [0] [0] [0] [0]
READ MODE
Hlock
0, on
[1], no
Vlock
0, on
[1], no
Xray
1, on
[0], off
Polarity Detection Sync Detection
H/V pol
[1], negative V pol
[1], negative Vext det
[0], no det H/V det
[0], no det V det
[0], no det
[] initial value
Datais transferredwith verticalsawtooth retrace.
Werecommendto set the unspecifiedbit to [0]in orderto assurethe compatibilitywith future devices.
I2C BUSADDRESS TABLE (continued)
TDA9109/SN
15/30
OPERATINGDESCRIPTION
I - GENERALCONSIDERATIONS
I.1 - Power Supply
The typical values of the power supply voltages
VCC and VDD are 12V and 5V respectively. Opti-
mum operation is obtained for VCC between 10.8
and 13.2V and VDD between4.5 and 5.5V.
Inordertoavoiderraticoperationofthecircuitduring
thetransientphaseofVCC andVDD switchingon,or
off,the valueof VCC andVDD aremonitored: ifVCC
islessthan7.5Vtyp.orifVDD islessthan4.0Vtyp.,
theoutputsof the circuit are inhibited.
Similarly,beforeVDD reaches4V,alltheI2Cregister
arereset to theirdefault value.
In order to have very good powersupply rejection,
the circuit is internally supplied by several voltage
references (typ. value : 8V). Two of these voltage
references are externally accessible, one for the
verticalandone forthehorizontalpart.Theycanbe
used to bias external circuitry (if ILOAD is less than
5mA).It isnecessaryto filterthe voltagereferences
byexternalcapacitorsconnectedtoground,inorder
to minimize the noise and consequentlythe ”jitter”
onvertical and horizontaloutputsignals.
I.2 - I2C Control
TDA9109/SNbelongs to the I2C controlleddevice
family. Instead of being controlled by DC voltages
on dedicatedcontrolpins,each adjustmentcanbe
donevia the I2C Interface.
TheI2C busis a serial bus with a clockand a data
input.Thegeneralfunctionandthebusprotocolare
specifiedin the Philips-bus data sheets.
Theinterface(DataandClock)isa comparatorwith
hysteresis;thethresholds(less then2.2V onrising
edge, more than 0.8V on falling edge with 5V
supply)are TTL-compatible. Spikes of up to 50ns
arefilteredby anintegratorandthemaximumclock
speedis limited to 400kHz.
The data line (SDA) can be used bidirectionally.
In read-mode the IC sends reply information
(1 byte) to themicro-processor.
The bus protocol prescribes a full-byte transmis-
sion in all cases. The first byte after the start
condition is used to transmit the IC-address
(hexa 8C for write, 8D for read).
I.3 - Write Mode
In write mode the second byte sent contains the
subaddress of the selected function to adjust (or
controlstoaffect)andthethirdbytethecorrespond-
ing data byte. It is possibleto send more than one
data byte to the IC. If after the thirdbyte no stop or
start condition is detected, the circuit increments
automaticallyby onethemomentarysubaddressin
the subaddress counter (auto-increment mode).
So it is possible totransmitimmediately the follow-
ing data bytes without sending the IC address or
subaddress.This can beusefulto reinitializeallthe
controls very quickly (flash manner). This proce-
dure can be finished by a stop condition.
Thecircuithas14adjustmentcapabilities: 1forthe
horizontal part, 4 for the vertical, 2 for the E/W
correction,2 forthedynamichorizontalphasecon-
trol,1 for the Moiré option, 3 for the horizontal and
the vertical dynamic focus and 1 for the B+ refer-
ence adjustment.
17 bits are also dedicated to several controls
(ON/OFF, Horizontal Forced Frequency,Sync Pri-
ority, Detection Refreshand XRAYreset).
I.4 - Read Mode
During the read mode the second byte transmits
the reply information.
The reply byte contains the horizontal and vertical
lock/unlockstatus,the XRAYactivationstatusand,
the horizontaland verticalpolaritydetection.It also
containsthesyncdetectionstatuswhichisusedby
the MCU toassignthe sync priority.
Astopconditionalwaysstopsalltheactivitiesofthe
bus decoderand switchesto high impedanceboth
the data and clock line (SDAand SCL).
See I2C subaddressand control tables.
I.5 - Sync Processor
The internal sync processor allows the
TDA9109/SNto accept:
- separated horizontal & vertical TTL-compatible
sync signal,
- composite horizontal & vertical TTL-compatible
sync signal.
TDA9109/SN
16/30
I.6 - Sync IdentificationStatus
The MCU can read (address read mode : 8D) the
statusregister via the I2C bus, and then select the
sync priority dependingon this status.
Among other data this register indicatesthe pres-
ence of sync pulses on H/HVIN, VSYNCIN and
(when 12V is supplied) whether a Vext has been
extractedfromH/HVIN.Bothhorizontalandvertical
sync are detectedeven if only 5V is supplied.
In order to choose the right sync priority the MCU
may proceed as follows (see I2C AddressTable):
- refreshthe statusregister,
- wait at least for 20ms (Max.vertical period),
- read this status register.
Sync priority choice shouldbe :
Vext
det H/V
det V
det Sync priority
Subaddress
03 (D8) Comment
Sync type
No Yes Yes 1 Separated H & V
Yes Yes No 0 Composite TTL H&V
Ofcourse,whenthechoiceismade,wecanrefresh
the sync detections and verify that the extracted
Vsyncis presentand thatno synctypechangehas
occured. The sync processor also gives sync po-
larityinformation.
I.7 - IC status
TheICcaninformtheMCUaboutthe 1sthorizontal
PLLand vertical sectionstatus (locked or not) and
aboutthe XRAYprotection(activated or not).
Resetting the XRAY internal latch can be done
either by decreasing the VCC or VDD supply or
directlyresetting it via the I2C interface.
I.8 - Sync Inputs
BothH/HVINandVSYNCINinputsareTTLcom-
patible triggers with hysterisis to avoid erratic
detection. Both inputs include a pull up resistor
connected to VDD.
I.9 - Sync ProcessorOutput
The sync processor indicates on the HLOCKOUT
Pin whether 1st PLL is locked to an incoming
horizontal sync. HLOCKOUT is a TTL compatible
CMOSoutput. Its level goes to high when locked.
Inthe sametime the D8bit of thestatusregisteris
setto 0.
This information is mainly used to trigger safety
procedures(like reducing B+ value) as soon as a
changeis detectedon the incoming sync.
II - HORIZONTAL PART
II.1 - InternalInput Conditions
A digital signal (horizontal sync pulse or TTL
composite) is sent by the sync processor to the
OPERATINGDESCRIPTION (continued)
9109SN25.EPS
Figure 5
dd
C
TRAMEXT
9109SN26.EPS
Figure 6
horizontalinput.Itmaybepositiveornegative(see
Figure5).
Using internal integration, both signals are recog-
nized if Z/T < 25%. Synchronizationoccurs on the
leadingedge of the internal syncsignal.The mini-
mumvalue of Z is 0.7µs.
Another integration is able to extract the vertical
pulsefromcompositesyncifthedutycycleishigher
than25% (typicallyd = 35%) (see Figure 6).
Thelastfeatureperformedistheremovalof equali-
zationpulsestoavoidparasiticpulsesonthephase
comparator(which would be disturbed by missing
or extraneouspulses).
II.2 - PLL1
The PLL1 consists of a phase comparator, an
external filter and a voltage-controlled oscilla-
tor (VCO).
Thephasecomparatorisa ”phasefrequency”type
designedin CMOStechnology.This kind of phase
detectoravoids lockingon wrong frequencies.It is
followed by a ”charge pump”, composed of two
current sources : sunk and sourced (typi-
cally I = 1mA when locked and I = 140µA when
unlocked).This differencebetween lock/unlock al-
lows smooth catching of the horizontal frequency
by PLL1. This effect is reinforced by an internal
original slow down system when PLL1 is locked,
avoiding the horizontal frequency changing too
quickly.
The dynamic behaviour of PLL1 is fixed by an
external filter which integrates the current of the
charge pump. A ”CRC” filter is generally used
(seeFigure 7).
TDA9109/SN
17/30
6
7
PLL1F
(LoopFilter)
R0
1.6V
6.4V
5
C0
6.4V
1.6V0 0.875THTH
RS
FLIPFLOP
(1.3V< V < 6V)
7
I0
2
4I
0
I
0
9109SN29.EPS
Figure 9 : Detailsof VCO
LOCKDET
COMP1
INPUT
INTERFACE
H/HVIN
High CHARGE
PUMP
Low
PLL
INHIBITION VCO
765
PLL1F R0 C0
PHASE
ADJUST
E2
I2C
HPOS
Adj.
OSC
Tramext
Tramext I2C
Forced
Frequency
Lock/Unlock
Status
8
HPOSITION
1
9109SN28.EPS
Figure 8 : Block Diagram
OPERATINGDESCRIPTION (continued)
7
PLL1F
1µF
4.7µF
1.8kΩ
9109SN27.EPS
Figure 7
ThePLL1isinternallyinhibitedduringextractedver-
tical sync (if any) to avoidtakingin accountmissing
pulses or wrong pulses on phase comparator.
Theinhibition is doneby a switchlocated between
the charge pump and the filter (see Figure 8).
The VCO usesan externalRC network. It delivers
a linear sawtooth obtained by the charge and the
discharge of the capacitor, with a current propor-
tional to the current in the resistor. The typical
thresholdsof the sawtoothare 1.6V and 6.4V.
The control voltage of the VCO is between 1.33V
and 6V (see Figure 9). The theorical frequency
range of this VCO is in the ratio of 1 to 4.5. The
effective frequency range has to be smaller
(1 to 4.2) due to clamp intervention on the filter
lowest value.
TDA9109/SN
18/30
OPERATINGDESCRIPTION (continued)
H Osc
Sawtooth
H Drive
1.6V
4.0V
6.4V
7/8TH1/8TH
Ts
Duty Cycle
Internally
Shaped Flyback
Flyback
9109SN31.EPS
The duty cycle of H-drive is fixed (48%).
Figure 11 : PLL2 Timing Diagram
H Osc
Sawtooth
Phase REF1
H Synchro
1.6V
Vb
6.4V
2.8V < Vb < 4.0V
7/8TH1/8TH
Phase REF1is obtainedbycomparisonbetweenthesawtoothand
a DC voltage adjustable between 2.8V and 4.0V. The PLL1 en-
sures the exact coincidence between the signal phase REF and
HSYNC. A ±TH/10 phase adjustment is possible.
9109SN30.EPS
Figure 10 : PLL1 TimingDiagram
Thesyncfrequencymustalwaysbehigherthanthe
free running frequency.For example, when using
a sync range between 24kHz and 100kHz, the
suggestedfree runningfrequencyis 23kHz.
Thiscanbeobtainedonlybyadjustingf0(forinstance,
makingR0adjustable).If no adjustmentis possible,
more margin must be provided to cope with the
componentsspread : ±8% for the IC, ±1% for R0,
±2 or5% forC0,leadingto±11%or 14%on f0.The
same percentage of frequency range will lost at
upper end of the range.
Another feature is the capability for the MCU to
force the horizontal frequencythrough I2C to 2xf0
or 3xf0 (for burn-in mode or safety requirements).
Inthiscase,theinhibitionswitchisopened,leaving
PLL1 free, but the voltage on PLL1 filter is forced
to 2.66V (for 2xf0) or 4.0V (for 3xf0).
PLL1ensuresthecoincidencebetweentheleading
edge of the sync signal and a phase reference
obtained by comparison between the sawtooth of
the VCO and an internal DC voltage which is I2C
adjustablebetween 2.8V and 4.0V (corresponding
to ±10%)(see Figure 10).
The TDA9109/SN also includes a Lock/Unlock
identification block which senses in real time
whether PLL1 is locked or not on the incoming
horizontalsyncsignal. The resultinginformationis
availableon HLOCKOUT(see Sync Processor).
When PLL1 is unlocked, it forces HLOCKOUT to
high level.
The lock/unlock information is also available
through the I2C read.
II.3 - PLL2
PLL2 ensures a constant position of the shaped
flyback signal in comparison with the sawtooth of
theVCO, takinginto accountthe saturationtimeTs
(seeFigure 11).
The phase comparator of PLL2 (phase type com-
parator) is followed by a charge pump (typical
outputcurrent: 0.5mA).
The flyback input consists of an NPN transistor.
This input must be current driven. The maximum
recommended input current is 5mA (see Fig-
ure 12).
The duty cycle is fixed (48%).
The maximum storage time (Ts Max.) is (0.44TH-
TFLY/2). Typically, TFLY/THis around 20% which
means that Ts max is around 34% of TH.
TDA9109/SN
19/30
BOUT
HORIZONTAL
OUTPUT
INHIBITION
VERTICAL
OUTPUT
INHIBITION
S
RQ
Horizontal Flyback
0.7V
XRAY Protection
VCC Checking
VCC
VCC or VDD offor I2C Reset
XRAY
VSCinh
I2C Drive on/off
I2C Ramp on/off
VDD Checking
VDD
VSDinh
9109SN34.EPS
Figure 14 : Safety Functions Block Diagram
OPERATINGDESCRIPTION (continued)
II.4 - Output Section
The H-drive signal is sent to the output through a
shapingstage which also controlsthe H-driveduty
cycle (I2C adjustable) (see Figure 11). In order to
secure the scanning power part operation, the
outputis inhibitedin the followingcases:
- when VCC or VDD are too low,
- when the XRAYprotectionis activated,
- during the Horizontal flyback,
- when the HDrive I2C bit controlis off.
Theoutputstageconsistsof aNPNbipolartransis-
tor.Onlythecollectoris accessible(seeFigure13).
This output stage is intended for ”reverse” base
control, where setting the output NPN in off-state
will control the power scanning transistor in off-
state(see ApplicationDiagram).
The maximum output current is 30mA, and the
corresponding voltage drop of theoutput VCEsat is
0.4VMax.
Obviouslythe powerscanningtransistorcannot be
directlydrivenbytheintegratedcircuit.Aninterface
hasto beadded betweenthe circuitand the power
transistoreither of bipolaror MOS type.
II.5 - X-RAYProtection
The X-Ray protectionis activatedby applicationof
a high level on the X-Ray input (8V on Pin 25).
It inhibits the H-Drive and B+ outputs.
Thisprotectionis latched; itmaybe reseteither by
VCC or VDD switch off or by I2C (seeFigure 14).
20kΩ
Q1
GND 0V
12
HFLY 400Ω
9109SN32.EPS
Figure 12 : Flyback Input Electrical Diagram
H-DRIVE26
VCC
9109SN33.EPS
Figure 13
II.6 - VerticalDynamic Focus
The TDA9109/SN delivers a vertical parabola
waveformon Pin 10.
This vertical dynamic focus is tracked with VPOS
and VAMP.Its amplitudecan be adjusted.It is also
affectedby Sand Ccorrections.Thispositivesignal
once amplified is to be sent to the CRT focusing
grids.
TDA9109/SN
20/30
OPERATINGDESCRIPTION (continued)
III - VERTICAL PART
III.1- Function
23 VOUT
18 BREATH
VERT_AMP
SUB05/7bits
VMOIRE
SUB0C/5bits
VPOSITION
SUB06/7bits
22 20
SYNCHRO OSCILLATOR
2
OSC
CAP
DISCH.
VSYNCIN
POLARITY
SAMPLING SAMPLING
CAPACITANCE
Vlow Sawth.
Disch.
REF
TRANSCONDUCTANCE
AMPLIFIERCHARGE CURRENT
VS_AMP
SUB07/6bits
COR_C
SUB08/6bits
S CORRECTION
C CORRECTION
9109SN35.EPS
Figure 15 : AGC LoopBlockDiagram
When the synchronizationpulse is not present,an
internal current source sets the free running fre-
quency.For an externalcapacitor, COSC = 150nF,
the typical free running frequency is 100Hz.
The typical free running frequency can be calcu-
lated by :
f0(Hz)=1.5 ⋅10−5⋅1
COSC
A negative or positive TTL level pulse applied on
Pin2 (VSYNC)as wellasa TTLcompositesyncon
Pin 1 can synchronize the ramp in the range
[fmin, fmax].Thisfrequencyrangedependson the
external capacitor connected on Pin 22.
A 150nF (±5%) capacitor is recommended for
50Hz to 185Hzapplications.
The typical maximum and minimum frequency,at
25oC and without any correction (S correction or
C correction),can be calculatedby :
f(Max.) = 3.5 x f0and f(Min.) = 0.33 x f0
If S or C correctionsare applied,these values are
slightyaffected.
If a synchronizationpulse isapplied,the internal
oscillator is synchonized immediately but its
amplitude changes. An internal correction then
adjusts it in less than half a second. The top
value of the ramp (Pin 22) is sampled on the
AGC capacitor(Pin 20)at eachclock pulse and
a transconductance amplifier modifies the
charge current of the capacitorin such a way to
make the amplitude again constant.
ThereadstatusregisterprovidestheverticalLock-
Unlockand the vertical sync polarityinformation.
We recommend the use of an AGC capacitorwith
low leakage current. A value lower than 100nAis
mandatory.
A good stability of the internal closed loop is
reached by a 470nF ±5% capacitor value on
Pin 20 (VAGC).
TDA9109/SN
21/30
III.2- I2C Control Adjustments
S and C correction shapes can then be added to
this ramp. These frequency independentS and C
corrections are generated internally. Their ampli-
tudesare adjustableby their respectiveI2C regis-
ters. Theycanalso be inhibitedby theirselect bits.
Finally, the amplitude of this S and C corrected
ramp can be adjusted by the vertical ramp ampli-
tudecontrol register.
Theadjusted ramp is availableon Pin23 (VOUT)to
drive an externalpower stage.
The gain of this stage can be adjusted (±25%)
dependingon its register value.
The mean value of this ramp is driven by its own
I2C register (vertical position). Its value is
VPOS= 7/16 ⋅VREF-V ±300mV.
UsuallyVOUTis sentthrough a resistivedivider to
the inverting input of the booster. Since VPOS
derives from VREF-V, the bias voltage sent to the
non-invertinginput of the booster should also de-
rivefrom VREF-V to optimizethe accuracy(seeAp-
plicationDiagram).
III.3- VerticalMoiré
By using the vertical moiré, VPOS can be modu-
latedfromframeto frame.Thisfunctionis intended
tocancelthefringeswhichappearwhenlineto line
intervalis very close to the CRT vertical pitch.
The amplitude of the modulation is controlled by
register VMOIRE on sub-address 0C and can be
switched-offvia the control bit D7.
III.4- Basic Equations
Infirst approximation,the amplitudeoftherampon
Pin23 (VOUT) is :
VOUT -VPOS= (VOSC -V
DCMID)⋅(1 + 0.25(VAMP))
with:
-V
DCMID = 7/16 ⋅VREF (middle value of the ramp
on Pin22, typically 3.5V)
-V
OSC =V
22 (rampwith fixed amplitude)
-V
AMP = -1for minimumvertical amplituderegister
value and+1 formaximum
- VPOSis calculatedby : VPOS= VDCMID + 0.3VP
with VPequals -1 for minimum vertical position
registervalue and +1 for maximum
Thecurrent available on Pin 22 is :
IOSC =3
8⋅VREF ⋅COSC ⋅f
with: COSC : capacitorconnected on Pin 22 and
f : synchronizationfrequency.
III.5 - Geometric Corrections
The principle is representedin Figure 16.
Startingfromthe verticalramp,a parabola-shaped
currentisgeneratedforE/Wcorrection(alsoknown
as Pin Cushion correction), dynamic horizontal
phase control correction, and vertical dynamicFo-
cus correction.
The parabola generator is made by an analog
multiplier, the output current of which is equal to :
∆I=k⋅(VOUT -V
DCMID)2
where VOUTis thevertical outputramp (typically be-
tween2and5V)andVDCMIDis3.5V(forVREF-V =8V).
Onemoremultiplierprovidesa currentproportional
to (VOUT -V
DCMID)4for corner correction.
The VOUTsawtooth is typically centeredon 3.5V.
By changing the vertical position, the sawtooth
shiftsby ±0.3V.
Inordertohavegoodscreengeometryforany end
user adjustment, the TDA9109/SN has the ”ge-
ometry tracking” feature, which allows generation
of a dissymetric parabola depending on the verti-
cal position.
Due to thelarge output stage voltage range (E/W,
Keystone, Corner), the combination of tracking
function with maximum vertical amplitude, maxi-
mum or minimum vertical position and maximum
gain on the DAC control may lead to the output
stage saturation. This must be avoided by limiting
the output voltage with apropriate I2C registers
values.
FortheE/Wpartand the dynamichorizontalphase
controlpart,asawtooth-shapeddifferentialcurrent
in the followingform is generated:
∆I’ = k’ ⋅(VOUT -V
DCMID)
Then ∆I and ∆I’ are added and converted into
voltage for the E/W part.
Each of the three E/W components, and the two
dynamichorizontalphasecontrolsmaybeinhibited
by their own I2C selectbit.
The E/W parabola is available on Pin 24 via an
emitter follower output stage which has to be bi-
ased by an external resistor (10kΩto ground).
Sincestable in temperature,the devicecanbe DC
coupledwith an externalcircuitry.
The vertical dynamic focus is available on Pin 10.
The dynamic horizontalphase controldrives inter-
nally the H-position, moving the HFLYposition on
the horizontal sawtoothin the range of ±1.4% TH
both for side pin balance and parallelogram.
OPERATINGDESCRIPTION (continued)
TDA9109/SN
22/30
EW Output
EW+ Amp
Keystone
SidepinAmp
Parallelogram
DynamicFocus
Sidepin Balance
OutputCurrent
To Horizontal
Phase
VDCMID (3.5V)
2
Vertical Ramp VOUT
V.Focus
Amp
Parabola
Generator
VDCMID
(3.5V)
VDCMID
(3.5V)
23
24
10
Corner
2
9109SN36.EPS
Figure 16 : GeometricCorrections Principle
OPERATINGDESCRIPTION (continued)
III.6- E/W
EWOUT= 2.5V + K1 (VOUT -V
DCMID)+ K2 (VOUT -V
DCMID)2+K3(V
OUT -V
DCMID)4
K1 is adjustableby the keystoneI2C register,
K2 is adjustableby the E/W amplitude I2C register,
K3 is adjustableby the corner I2C register.
III.7- DynamicHorizontal Phase Control
IOUT =K4(V
OUT -V
DCMID)+ K5 (VOUT -V
DCMID)2
K4is adjustablebythe parallelogramI2C register,
K5 is adjustableby the side pin balance I2C register.
TDA9109/SN
23/30
IV - DC/DC CONVERTER PART
OPERATINGDESCRIPTION (continued)
This unit controls the switch-mode DC/DC con-
verter. It converts a DC constant voltage into the
B+ voltage (roughly proportional to the horizontal
frequency)necessaryfor thehorizontal scanning.
ThisDC/DC converter must be configuredin step-
up mode. It operates very similarly to the well
known UC3842.
IV.1 - Step-up Mode
Operating Description
- The power MOS is switched-on at the middle of
the horizontalflyback.
- The power MOS is switched-offwhen its current
reachesa predeterminedvalue.Forthispurpose,
a sense resistor is inserted in its source. The
voltage on this resistor is sent to Pin16 (ISENSE).
- The feedback (coming either from the EHV or
from the flyback)is divided to a voltage close to
4.8Vandcomparedtothe internal4.8Vreference
(IVREF). The difference is amplified by an error
amplifier, the outputof which controls the power
MOS switch-off current.
Main Features
- Switching synchronized on the horizontal fre-
quency,
- B+ voltagealways higher than the DC source,
- Current limitedon a pulse-by-pulsebasis.
The DC/DC converter is disabled:
- when VCC or VDD are too low,
- when X-Rayprotectionis latched,
- directlythrough I2C bus.
Whendisabled,BOUTisdriventoGNDbya 0.5mA
current source. This feature allows to implement
externallya softstart circuit.
161415
VB+
L
+
C3
C2
1/3
ΣS
RQ
400ns
Inhibit SMPS
28
12V
BOUT
ISENSE
COMPREGIN
95dB
A
±Iadjust
DAC
7bits
I2C
TDA9109/SN
1MΩ
22kΩ
1.2V
1.2V
4.8V ±20%
8V
Inhibit
SMPS Soft
Start
9109SN37.EPS
Figure 17 : DC/DCConverter
TDA9109/SN
24/30
INTERNAL SCHEMATICS
Pins 1 -2
H/HVIN
VSYNCIN
20kΩ
200Ω
5V
9109SN38.EPS
Figure 18
5V
3HLOCKOUT
9109SN39.EPS
Figure 19
4
13
12V
PLL2C
HREF
9109SN40.EPS
Figure 20
5
13
12V
C0
HREF
9109SN41.EPS
Figure 21
6
13 13
12V
HREF HREF
R0
9109SN42.EPS
Figure 22
7PLL1F
9109SN43.EPS
Figure 23
TDA9109/SN
25/30
INTERNAL SCHEMATICS (continued)
8
12V HREF
HPOSITION
9109SN44.EPS
Figure 24
9
12V
HMOIRE
5V
9109SN45.EPS
Figure 25
10
FOCUSOUT
12V
12V
9109SN46.EPS
Figure 26
12
13
12V
HREF
HFLY
9109SN47.EPS
Figure 27
14
COMP
9109SN48.EPS
Figure 28
15REGIN
12V
9109SN49.EPS
Figure 29
TDA9109/SN
26/30
INTERNAL SCHEMATICS (continued)
16
12V
ISENSE
9109SN50.EPS
Figure 30
18BREATH
12V
9109SN51.EPS
Figure 31
20
12V
VAGCCAP
9109SN52.EPS
Figure 32
22VCAP
12V
9109SN53.EPS
Figure 33
23
12V
VOUT
9109SN54.EPS
Figure 34
24EWOUT
12V
9109SN55.EPS
Figure 35
TDA9109/SN
27/30
INTERNAL SCHEMATICS (continued)
25
12V
XRAY
9109SN56.EPS
Figure 36
HOUT-BOUT
Pins 26-28
12V
9109SN57.EPS
Figure 37
12V
Pins 30-31
SDA - SCL
9109SN58.EPS
Figure 38
TDA9109/SN
28/30
APPLICATION DIAGRAMS
TP17 J12
TP13 J11
TP10
TP16
123456789101112
242322212019181716151413
PWM0
PWM1
FBLK
VSYNC
HSYNC
VDD
PXCK
CKOUT
XTALOUT
XTALIN
PWM2
PWM3PWM4
PWM5
PWM6
PWM7
SCL
SDA
RST
GND
R
G
B
TEST
IC3 - STV9422
X1
8MHz C37
33pF
C38
33pF C43
47µF
L2
22µH
+5V
R30
10kΩ
R43
10kΩ
C42
1µF
TILT
J13
C45
10µF
J16 J15
4
3
2
1
J14
+5V
R39
4.7kΩR29
4.7kΩR42
100Ω
R41
100Ω
C39
22pF
C40
22pF
SCL
SDA
12345678
910111216 15 14 13
GND
QA
IA
IA
CDA
TA2
TA1VCC
TB1
TB2
CDB
IB
IB
QB
QB
ICC1
MC14528
QA
CC3
47pF
PC1
47kΩ
+12V
+12V
+12V
CC4
47pF
+12V
PC2
47kΩ
CC1
100nF
CC2
10µF
R35
10kΩ
R10
10kΩC25
33pF
HOUT
R8
10kΩ
C22
33pF
J8
HFLY Q1
BC557 Q2
BC557
R15
1kΩR17
270kΩ
R37
27kΩ
+12V
R31
27kΩ
R19
270kΩ
R38
2.2Ω
3W
C11 220pF
R18
39kΩ
R33
4.7kΩ
R9
470Ω
R34
1kΩJ1
E/W
C36
1µF
Q3
TIP122
E/W POWER STAGE
TP4 TP3
1
7
5
4
6
2
3
IC1
TDA8172
C10
470µFC8
100nF
-12V
C1
220nF R3
1.5Ω
R5
5.6kΩ
R11
220Ω
0.5W
R4
1Ω
0.5W
C4
100nF
R2
5.6kΩ
R40
36kΩ
C10
100µF
35V
D1
1n4001
C14
470µFC9
100nF
TP6
TP7
3
2
1
J18
V YOKE
J6
J3
J2
+12V
-12V
R1
12kΩ
C41
470pF
VERTICAL DEFLECTION STAGE
1
2
3
4
5
6
7
8
9
10
11
12
16
15
14
13
C13 10nF
R36 1.8kΩ
C31
4.7µF
C17 1µF
24
23
22
21
20
19
18
17
26
25
32
31
30
29
28
27
H/HVIN
VSYNCIN
HLOCKOUT SCL
PLL2C
C0 B+OUT
R0 GGND
PLL1F HOUTCOL
HPOSITION XRAYIN
HMOIRE EWOUT
FOCUS VOUT
HGND VCAP
HFLY VREF
HREF VAGCCAP
COMP VGND
REGIN BREATH
ISENSE BGND
IC4
TDA9109/SN
TP1
+12VVCC C5
100µF
C6
100nF
C49
100nF
HOUT
R53
1kΩC48
10µF
C3
47µF
C2
100nF
C12
150nF
C15
470nF
+12V
R52
3.9kΩ
+12V
Q4
BC557
Q5
BC547
R58
10Ω
L3
22µH
C50
10µF
C7 22nF
C28
820pF 5%
R23
6.49kΩ1%
C16
C33
100nF
C27
47µFHREF
L4
47µH
R24
10kΩ
R25
1kΩ
J9
DYN
FOCUS
C47
100pF
R50
1MΩC46
1nF
C51
100nF
R57
82kΩ
JP1
R51
1kΩ
B+OUT
GND
ISENSE
REGIN
3
2
1
J19
4
CON4
R49
22kΩ
+5V
C30
100µFC32
100nF
L1
22µH
+5V
SDA
+5V
R56
560Ω
D2
1N4148
J17
HOUT
C60
100nF
R74
10kΩ
R77
15kΩ
P1
10kΩ
+12V
R73
1MΩ
R76
47kΩ
R75
10kΩTP8
EHT
COMP
R7 10kΩ
R45 33kΩ
TP14
()
*
()
*Optional
2Ω
2kΩ
9109SN59.EPS
The difference with standard TDA9109 Application Diagram is the resistor divider 2kΩ/2Ωon
Pin9 (HMOIRE).
Figure 39 : DemonstrationBoard
TDA9109/SN
29/30
PMSDIP32.EPS
PACKAGE MECHANICAL DATA
32 PINS - PLASTICSHRINK DIP
Dimensions Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 3.556 3.759 5.080 0.140 0.148 0.200
A1 0.508 0.020
A2 3.048 3.556 4.572 0.120 0.140 0.180
B 0.356 0.457 0.584 0.014 0.018 0.023
B1 0.762 1.016 1.397 0.030 0.040 0.055
C 0.203 0.254 0.356 0.008 0.010 0.014
D 27.43 27.94 28.45 1.080 1.100 1.120
E 9.906 10.41 11.05 0.390 0.410 0.435
E1 7.620 8.890 9.398 0.300 0.350 0.370
e 1.778 0.070
eA 10.16 0.400
eB 12.70 0.500
L 2.540 3.048 3.810 0.100 0.120 0.150
SDIP32.TBL
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from
its use. No licence is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications
mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information
previouslysupplied.STMicroelectronicsproducts are notauthorizedfor useascriticalcomp onentsin lifesupport devicesor systems
without express written approval of STMicroelectronics.
The ST logo is a trademark of STMicroelectronics
1998 STMicroelectronics - All Rights Reserved
Purchase of I2C Components of STMicroelectronics, conveys a licenseunder the Philips I2C Patent.
Rights to use these components in a I2C system, is granted provided that the system conforms to
the I2C Standard Specifications as defined by Philips.
STMicroelectronics GROUP OF COMPANIES
Australia - Brazil - Canada- China - France- Germany - Italy - Japan - Korea - Malaysia - Malta - Morocco- The Netherlands
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TDA9109/SN
30/30
