Product Folder Order Now Technical Documents Support & Community Tools & Software LMV931-N LMV932-N, LMV934-N SNOS993P - NOVEMBER 2001 - REVISED APRIL 2017 LMV93x-N Single, Dual, Quad 1.8-V, RRIO Operational Amplifiers 1 Features 3 Description * The LMV93x-N family (LMV931-N single, LMV932-N dual and LMV934-N quad) are low-voltage, lowpower operational amplifiers. The LMV93x-N family operates from 1.8-V to 5.5-V supply voltages and have rail-to-rail input and output. The input commonmode voltage extends 200 mV beyond the supplies which enables user enhanced functionality beyond the supply voltage range. The output can swing railto-rail unloaded and within 105 mV from the rail with 600- load at 1.8-V supply. The LMV93x-N devices are optimized to work at 1.8 V, which make them ideal for portable two-cell, battery-powered systems and single-cell Li-Ion systems. 1 * * * * * * * * * Typical 1.8-V Supply Values; Unless Otherwise Noted Specified at 1.8 V, 2.7 V and 5 V Output Swing - With 600- Load 80 mV from Rail - With 2-k Load 30 mV from Rail VCM 200 mV Beyond Rails Supply Current (per Channel) 100 A Gain Bandwidth Product 1.4 MHz Maximum VOS 4 mV Ultra Tiny Packages Temperature Range -40C to +125C Create a Custom Design Using the LMV93x-N With the WEBENCH(R) Power Designer 2 Applications * * * * * * Phones Tablets Wearables Health Monitoring Portable and Battery-Powered Electronic Equipment Battery Monitoring High-Side Current Sense Amplifier LMV93x-N devices exhibit an excellent speed-power ratio, achieving 1.4-MHz gain bandwidth product at 1.8-V supply voltage with very low supply current. The LMV93x-N devices can drive a 600- load and up to 1000-pF capacitive load with minimal ringing. These devices also have a high DC gain of 101 dB, making them suitable for low-frequency applications. The single LMV93x-N is offered in space-saving 5-pin SC70 and SOT-23 packages. The dual LMV932-N are in 8-pin VSSOP and SOIC packages and the quad LMV934-N are in 14-pin TSSOP and SOIC packages. These small packages are ideal solutions for area constrained PC boards and portable electronics such as mobile phones and tablets. Device Information(1) PART NUMBER LMV931-N LMV932-N LMV934-N PACKAGE BODY SIZE (NOM) SOT-23 (5) 2.90 mm x 1.60 mm SC-70 (5) 2.00 mm x 1.25 mm VSSOP (8) 3.00 mm x 3.00 mm SOIC (8) 4.90 mm x 3.91 mm TSSOP (8) 5.00 mm x 4.40 mm SOIC (14) 8.60 mm x 3.90 mm (1) For all available packages, see the orderable addendum at the end of the datasheet. 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LMV931-N LMV932-N, LMV934-N SNOS993P - NOVEMBER 2001 - REVISED APRIL 2017 www.ti.com Table of Contents 1 2 3 4 5 6 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 6.1 6.2 6.3 6.4 6.5 6.6 6.7 6.8 6.9 6.10 6.11 7 1 1 1 2 3 4 Absolute Maximum Ratings ...................................... 4 ESD Ratings (Commercial) ...................................... 4 Recommended Operating Ratings............................ 4 Thermal Information .................................................. 4 DC Electrical Characteristics 1.8 V .......................... 5 AC Electrical Characteristics 1.8 V ........................... 6 DC Electrical Characteristics 2.7 V .......................... 6 AC Electrical Characteristics 2.7 V ........................... 7 Electrical Characteristics 5 V DC .............................. 9 AC Electrical Characteristics 5 V ......................... 10 Typical Characteristics .......................................... 11 Detailed Description ............................................ 16 7.1 Overview ................................................................. 16 7.2 Functional Block Diagram ....................................... 16 7.3 Feature Description................................................. 16 7.4 Device Functional Modes........................................ 16 8 Application and Implementation ........................ 19 8.1 Application Information............................................ 19 8.2 Typical Applications ............................................... 19 8.3 Dos and Don'ts ....................................................... 23 9 Power Supply Recommendations...................... 23 10 Layout................................................................... 24 10.1 Layout Guidelines ................................................. 24 10.2 Layout Example .................................................... 24 11 Device and Documentation Support ................. 25 11.1 11.2 11.3 11.4 11.5 11.6 11.7 11.8 Device Support .................................................... Documentation Support ....................................... Related Links ........................................................ Receiving Notification of Documentation Updates Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 25 25 25 25 26 26 26 26 12 Mechanical, Packaging, and Orderable Information ........................................................... 26 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision O (December 2014) to Revision P Page * Deleted information specific to automotive grade - created separate automotive data sheet SNOSD49 ............................ 1 * Added links for WEBENCH ................................................................................................................................................... 1 * Moved storage temperature to Abs Max table and changed Handling Ratings tables to ESD Ratings tables per new format...................................................................................................................................................................................... 4 * Changed values in the Thermal Information table to align with JEDEC standards................................................................ 4 * Changed Slew Rate vs Supply Voltage title to reflect LMV931 and LMV934 only .............................................................. 14 * Added Slew Rate vs Supply graph for LMV932 only ........................................................................................................... 14 * Added Receiving Notification of Documentation Updates and Community Resources subsections ................................... 25 Changes from Revision N (June 2014) to Revision O * Page Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout , Device and Documentation Support , and Mechanical, Packaging, and Orderable Information sections ............................................... 1 Changes from Revision M (November 2013) to Revision N Page * Complete rewrite for GDS standard. ...................................................................................................................................... 1 * Added LMV934-N-Q1. The other Q grades were added in previous revision........................................................................ 1 Changes from Revision L (March 2013) to Revision M * 2 Page Added Automotive Q Grade. ................................................................................................................................................. 1 Submit Documentation Feedback Copyright (c) 2001-2017, Texas Instruments Incorporated Product Folder Links: LMV931-N LMV932-N LMV934-N LMV931-N LMV932-N, LMV934-N www.ti.com SNOS993P - NOVEMBER 2001 - REVISED APRIL 2017 5 Pin Configuration and Functions DBV and DCK Package 5-Pin SC-70 and SOT-23 LMV931-N Top View DGK and D Package 8-Pin VSSOP and SOIC LMV932-N Top View 1 8 + V OUT A A - 2 + 7 -IN A OUT B 3 6 +IN A V - -IN B B + - 4 5 +IN B DGK and D Package 14-Pin TSSOP and SOIC LMV934-N Top View Pin Functions: LMV931 PIN I/O DESCRIPTION NAME LMV931 DBV, DCK +IN 1 I Noninverting Input -IN 3 I Inverting Input OUT 4 O Output V- 2 P Negative Supply V+ 5 P Positive Supply Pin Functions: LMV932 and LMV934 PIN I/O DESCRIPTION NAME LMV932 D, DGK LMV934 D, PW +IN A 3 3 I Noninverting input, channel A +IN B 5 5 I Noninverting input, channel B +IN C -- 10 I Noninverting input, channel C +IN D -- 12 I Noninverting input, channel D -IN A 2 2 I Inverting input, channel A -IN B 6 6 I Inverting input, channel B -IN C -- 9 I Inverting input, channel C -IN D -- 13 I Inverting input, channel D OUT A 1 1 O Output, channel A OUT B 7 7 O Output, channel B OUT C -- 8 O Output, channel C OUT D -- 14 O Output, channel D V+ 8 4 P Positive (highest) power supply V- 4 11 P Negative (lowest) power supply Copyright (c) 2001-2017, Texas Instruments Incorporated Product Folder Links: LMV931-N LMV932-N LMV934-N Submit Documentation Feedback 3 LMV931-N LMV932-N, LMV934-N SNOS993P - NOVEMBER 2001 - REVISED APRIL 2017 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings (1) (2) See . Supply voltage ( V+- V- ) MIN MAX UNIT -0.3 6 V - Differential input voltage + V V (V- ) - 0.3 (V+) + 0.3 V Junction temperature (3) -40 150 C Storage temperature, Tstg -65 150 C Voltage at input/output pins (1) (2) (3) V Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Recommended Operating Conditions indicate conditions for which the device is intended to be functional, but specific performance is not specified. For specifications and the test conditions, see the Electrical Characteristics. If Military/Aerospace specified devices are required, contact the TI Sales Office/Distributors for availability and specifications. The maximum power dissipation is a function of TJ(max) , RJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(max)-TA)/RJA. All numbers apply for packages soldered directly into a PC board. 6.2 ESD Ratings (Commercial) VALUE V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) 2000 Charged-device model (CDM), per JEDEC specification JESD22C101 (2) 750 Machine model (MM) (1) (2) (3) (3) UNIT V 200 JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Machine model, 200 in series with 100 pF. 6.3 Recommended Operating Ratings See (1). MIN MAX Supply voltage range ( V+- V- ) 1.8 5.5 V Ambient temperature -40 125 C (1) UNIT Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Recommended Operating Conditions indicate conditions for which the device is intended to be functional, but specific performance is not specified. For specifications and the test conditions, see the Electrical Characteristics. 6.4 Thermal Information LMV931-N THERMAL METRIC (1) LMV932-N LMV934-N DBV (SOT-23) DCK (SC70) D (SOIC) DGK (VSSOP) D (SOIC) PW (TSSOP) UNIT 5 PINS 5 PINS 8 PINS 8 PINS 14 PINS 14 PINS RJA Junction-to-ambient thermal resistance 197.2 285.9 125.9 184.5 94.4 124.8 C/W RJC(top) Junction-to-case (top) thermal resistance 156.7 115.9 70.2 74.3 52.5 51.4 C/W RJB Junction-to-board thermal resistance 55.6 63.7 66.5 105.1 48.9 67.2 C/W JT Junction-to-top characterization parameter 41.4 4.5 19.8 13.1 14.3 6.6 C/W JB Junction-to-board characterization parameter 55 62.9 65.9 103.6 48.6 66.6 C/W RJC(bot) Junction-to-case (bottom) thermal resistance -- -- -- -- -- -- C/W (1) 4 For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. Submit Documentation Feedback Copyright (c) 2001-2017, Texas Instruments Incorporated Product Folder Links: LMV931-N LMV932-N LMV934-N LMV931-N LMV932-N, LMV934-N www.ti.com SNOS993P - NOVEMBER 2001 - REVISED APRIL 2017 6.5 DC Electrical Characteristics 1.8 V Unless otherwise specified, all limits specified for TJ = 25C. V+ = 1.8 V, V - = 0 V, VCM = V+/2, VO = V+/2 and RL > 1 M. PARAMETER TEST CONDITIONS LMV931 (Single) VOS MIN 25C TYP (1) MAX 1 4 Full Range Input Offset Voltage LMV932 (Dual), LMV934 (Quad) 25C 1 5.5 Full Range Full Range 5.5 IB Input Bias Current 25C 15 V/C 35 Full Range 50 25C 13 25 Full Range IS Supply Current (per channel) 40 25C 103 185 Full Range CMRR PSRR CMVR Common-Mode Rejection Ratio Power Supply Rejection Ratio Input Common-Mode Voltage Range 25C 60 Full Range 55 LMV932 and LMV934 0 VCM 0.6 V 1.4 V VCM 1.8 V (2) 25C 55 Full Range 50 -0.2 V VCM 0 V 1.8 V VCM 2.0 V 25C 50 72 + 25C 75 100 Full Range 70 For CMRR Range 50dB 25C AV Large Signal Voltage Gain LMV932-N (Dual) LMV934-N (Quad) VO Output Swing V- - 0.2 - -40C to 85C 125C Large Signal Voltage Gain LMV931-N (Single) 205 LMV931, 0 VCM 0.6 V 1.4 V VCM 1.8 V (2) 1.8 V V 5 V V V + 0.2 25C 77 Full Range 73 RL = 2 k to 0.9 V, VO = 0.2 V to 1.6 V, VCM = 0.5 V 25C 80 Full Range 75 RL = 600 to 0.9 V, VO = 0.2 V to 1.6 V, VCM = 0.5 V 25C 75 Full Range 72 RL = 2 k to 0.9 V, VO = 0.2 V to 1.6 V, VCM = 0.5 V 25C 78 Full Range 75 RL = 600 to 0.9 V VIN = 100 mV 25C (2) 1.65 78 Full Range 1.63 25C 1.75 nA A dB dB -0.2 to 2.1 dB dB V+ + 0.2 V+ V + V - 0.2 101 dB 105 dB 90 dB 100 dB 1.72 0.105 V 0.120 1.77 0.024 1.74 nA 76 0.077 Full Range (1) - RL = 600 to 0.9 V, VO = 0.2 V to 1.6 V, VCM = 0.5 V RL = 2 k to 0.9 V VIN = 100 mV mV 7.5 Input Offset Voltage Average Drift Input Offset Current mV 6 TCVOS IOS UNIT 0.035 V 0.04 Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will also depend on the application and configuration. For specified temperature ranges, see the CMVR parameter in DC Electrical Characteristics 1.8 V for the input common-mode voltage specifications. Copyright (c) 2001-2017, Texas Instruments Incorporated Product Folder Links: LMV931-N LMV932-N LMV934-N Submit Documentation Feedback 5 LMV931-N LMV932-N, LMV934-N SNOS993P - NOVEMBER 2001 - REVISED APRIL 2017 www.ti.com DC Electrical Characteristics 1.8 V (continued) Unless otherwise specified, all limits specified for TJ = 25C. V+ = 1.8 V, V - = 0 V, VCM = V+/2, VO = V+/2 and RL > 1 M. PARAMETER IO (3) Output Short Circuit Current TEST CONDITIONS MIN Sourcing, VO = 0 V VIN = 100 mV 25C Sinking, VO = 1.8 V VIN = -100 mV 25C 7 Full Range 5 (3) TYP 4 Full Range (1) MAX 8 UNIT mA 3.3 9 mA Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150C. Output currents in excess of 45 mA over long term may adversely affect reliability. 6.6 AC Electrical Characteristics 1.8 V Unless otherwise specified, all limits specified for TJ = 25C. V+ = 1.8 V, V - = 0 V, VCM = V+/2, VO = V+/2 and RL > 1 M. PARAMETER SR Slew Rate GBW TEST CONDITIONS (1) MAX UNIT V/s Gain-Bandwidth Product 1.4 MHz m Phase Margin 67 deg Gm Gain Margin en Input-Referred Voltage Noise f = 10 kHz, VCM = 0.5 V in Input-Referred Current Noise f = 10 kHz Total Harmonic Distortion f = 1 kHz, AV = +1 RL = 600 , VIN = 1 VPP Amplifier-to-Amplifier Isolation See (3) (1) (2) (3) . TYP 0.35 THD See MIN (2) 7 dB 60 nV/Hz 0.08 pA/Hz 0.023% 123 dB Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will also depend on the application and configuration. Connected as voltage follower with input step from V- to V+. Number specified is the slower of the positive and negative slew rates. Input referred, RL = 100 k connected to V+/2. Each amplifier excited in turn with 1 kHz to produce VO = 3 VPP (For supply voltages < 3 V, VO = V+). 6.7 DC Electrical Characteristics 2.7 V Unless otherwise specified, all limits specified for TJ = 25C. V+ = 2.7 V, V - = 0 V, VCM = V+/2, VO = V+/2 and RL > 1 M. PARAMETER TEST CONDITIONS LMV931 (Single) VOS Input Offset Voltage MIN 25C TYP (1) MAX 1 4 Full Range LMV932 (Dual) LMV934 (Quad) 6 25C 1 Full Range TCVOS Input Offset Voltage Average Drift Full Range IB Input Bias Current 25C 7.5 5.5 15 Full Range IOS Input Offset Current 25C 8 Supply Current (per channel) 105 Full Range (1) 6 35 25 40 25C mV mV V/C 50 Full Range IS 5.5 UNIT 190 210 nA nA A Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will also depend on the application and configuration. Submit Documentation Feedback Copyright (c) 2001-2017, Texas Instruments Incorporated Product Folder Links: LMV931-N LMV932-N LMV934-N LMV931-N LMV932-N, LMV934-N www.ti.com SNOS993P - NOVEMBER 2001 - REVISED APRIL 2017 DC Electrical Characteristics 2.7 V (continued) Unless otherwise specified, all limits specified for TJ = 25C. V+ = 2.7 V, V - = 0 V, VCM = V+/2, VO = V+/2 and RL > 1 M. PARAMETER CMRR TEST CONDITIONS Common-Mode Rejection Ratio LMV931, 0 VCM 1.5 V 2.3 V VCM 2.7 V (2) 25C 60 Full Range 55 LMV932 and LMV934 0 VCM 1.5 V 2.3 V VCM 2.7 V (2) 25C 55 Full Range 50 -0.2 V VCM 0 V 2.7 V VCM 2.9 V PSRR Power Supply Rejection Ratio VCM Input Common-Mode Voltage Range 25C AV Large Signal Voltage Gain LMV932-N (Dual) LMV934-N (Quad) VO Output Swing 70 For CMRR Range 50 dB 25C IO (2) (3) Output Short Circuit Current V- - 0.2 V- - 25C 87 Full Range 86 RL = 2 k to 1.35 V, VO = 0.2 V to 2.5 V 25C 92 Full Range 91 RL = 600 to 1.35 V, VO = 0.2 V to 2.5 V 25C 78 Full Range 75 RL = 2 k to 1.35 V, VO = 0.2 V to 2.5 V 25C 81 Full Range 78 RL = 600 to 1.35 V VIN = 100 mV 25C 2.55 Full Range 2.53 25C 2.65 Full Range 2.64 20 Full Range 15 Sinking, VO = 2.7 V VIN = -100 mV 25C 18 Full Range 12 (3) -0.2 to 3.0 dB dB V+ + 0.2 V+ V + V - 0.2 104 dB 110 dB 90 dB 100 dB 2.62 0.110 V 0.130 2.675 0.025 25C dB dB 0.083 Sourcing, VO = 0 V VIN = +100 mV UNIT 80 V + 0.2 RL = 600 to 1.35 V, VO = 0.2 V to 2.5 V MAX 81 100 75 Full Range RL = 2 k to 1.35 V VIN = 100 mV (1) 74 25C -40C to 85C TYP 50 1.8 V V+ 5 V VCM = 0.5 V 125C Large Signal Voltage Gain LMV931-N (Single) MIN 0.04 V 0.045 30 mA 25 mA For specified temperature ranges, see the CMVR parameter in DC Electrical Characteristics 1.8 V for the input common-mode voltage specifications. Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150C. Output currents in excess of 45 mA over long term may adversely affect reliability. 6.8 AC Electrical Characteristics 2.7 V Unless otherwise specified, all limits specified for TJ = 25C. V+ = 2.7 V, V - = 0 V, VCM = 1.0 V, VO = 1.35 V and RL > 1 M. PARAMETER SR Slew Rate GBW m TEST CONDITIONS See (2) MIN TYP (1) MAX UNIT 0.4 V/s Gain-Bandwidth Product 1.4 MHz Phase Margin 70 deg Gm Gain Margin 7.5 dB en Input-Referred Voltage Noise f = 10 kHz, VCM = 0.5 V in Input-Referred Current Noise f = 10 kHz (1) (2) 57 nVHz 0.08 pA/Hz Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will also depend on the application and configuration. Connected as voltage follower with input step from V- to V+. Number specified is the slower of the positive and negative slew rates. Copyright (c) 2001-2017, Texas Instruments Incorporated Product Folder Links: LMV931-N LMV932-N LMV934-N Submit Documentation Feedback 7 LMV931-N LMV932-N, LMV934-N SNOS993P - NOVEMBER 2001 - REVISED APRIL 2017 www.ti.com AC Electrical Characteristics 2.7 V (continued) Unless otherwise specified, all limits specified for TJ = 25C. V+ = 2.7 V, V - = 0 V, VCM = 1.0 V, VO = 1.35 V and RL > 1 M. PARAMETER THD Total Harmonic Distortion Amp-to-Amp Isolation (3) 8 TEST CONDITIONS MIN f = 1 kHz, AV = +1 RL = 600 , VIN = 1 VPP See TYP (1) MAX UNIT 0.022% (3) 123 dB Input referred, RL = 100 k connected to V+/2. Each amplifier excited in turn with 1 kHz to produce VO = 3 VPP (For supply voltages < 3 V, VO = V+). Submit Documentation Feedback Copyright (c) 2001-2017, Texas Instruments Incorporated Product Folder Links: LMV931-N LMV932-N LMV934-N LMV931-N LMV932-N, LMV934-N www.ti.com SNOS993P - NOVEMBER 2001 - REVISED APRIL 2017 6.9 Electrical Characteristics 5 V DC Unless otherwise specified, all limits specified for TJ = 25C. V+ = 5 V, V - = 0 V, VCM = V+/2, VO = V+/2 and RL > 1 M. PARAMETER TEST CONDITIONS LMV931 (Single) VOS Input Offset Voltage Average Drift IB Input Bias Current 25C TYP (1) MAX 1 4 Full Range Input Offset Voltage TCVOS MIN LMV932 (Dual) LMV934 (Quad) 25C 1 Full Range 25C 14 9 25C 116 PSRR Power Supply Rejection Ratio CMVR Input Common-Mode Voltage Range 25C 60 Full Range 55 -0.2 V VCM 0 V 5 V VCM 5.2 V 25C + Large Signal Voltage Gain LMV931-N (Single) AV Large Signal Voltage Gain LMV932-N (Dual) LMV934-N (Quad) VO Output Swing 1.8 V V 5 V VCM = 0.5 V For CMRR Range 50 dB 25C 78 25C 75 100 Full Range 70 V- - 0.2 - -40C to 85C V V- + 0.3 RL = 600 to 2.5 V, VO = 0.2 V to 4.8 V 25C 88 Full Range 87 RL = 2 k to 2.5 V, VO = 0.2 V to 4.8 V 25C 94 Full Range 93 RL = 600 to 2.5 V, VO = 0.2 V to 4.8 V 25C 81 Full Range 78 RL = 2 k to 2.5 V, VO = 0.2 V to 4.8 V 25C 85 Full Range 82 RL = 600 to 2.5 V VIN = 100 mV 25C RL = 2 k to 2.5 V VIN = 100 mV (1) (2) (3) Output Short Circuit Current (3) 4.855 -0.2 to 5.3 Full Range 4.835 25C 4.945 80 Full Range 68 Sinking, VO = 5 V VIN = -100 mV 25C 58 Full Range 45 A dB V+ + 0.2 V+ V V+ - 0.3 dB dB 90 dB 100 dB 4.890 0.160 V 0.180 4.967 4.935 25C nA dB 113 0.037 LMV931, Sourcing, VO = 0 V VIN = +100 mV nA dB 102 0.120 Full Range IO 210 86 50 125C 25 230 0 VCM 3.8 V 4.6 V VCM 5 V (2) Common-Mode Rejection Ratio 35 40 Full Range CMRR V/C 50 25C Supply Current (per channel) mV 7.5 Full Range IS 5.5 5.5 Input Offset Current mV 6 Full Range IOS UNIT 0.065 V 0.075 100 mA 65 mA Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will also depend on the application and configuration. For specified temperature ranges, see the CMVR parameter in DC Electrical Characteristics 1.8 V for the input common-mode voltage specifications. Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150C. Output currents in excess of 45 mA over long term may adversely affect reliability. Copyright (c) 2001-2017, Texas Instruments Incorporated Product Folder Links: LMV931-N LMV932-N LMV934-N Submit Documentation Feedback 9 LMV931-N LMV932-N, LMV934-N SNOS993P - NOVEMBER 2001 - REVISED APRIL 2017 www.ti.com 6.10 AC Electrical Characteristics 5 V Unless otherwise specified, all limits specified for TJ = 25C. V+ = 5 V, V - = 0 V, VCM = V+/2, VO = 2.5 V and R L > 1 M. PARAMETER TEST CONDITIONS (2) TYP (1) MAX UNIT SR Slew Rate 0.42 V/s GBW Gain-Bandwidth Product 1.5 MHz m Phase Margin 71 deg Gm Gain Margin 8 dB en Input-Referred Voltage Noise f = 10 kHz, VCM = 1 V 50 nV/Hz in Input-Referred Current Noise f = 10 kHz 0.08 pA/Hz Total Harmonic Distortion f = 1 kHz, AV = 1 RL = 600 , VO = 1 VPP Amplifier-to-Amplifier Isolation See (3) THD (1) (2) (3) 10 See . MIN 0.022% 123 dB Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will also depend on the application and configuration. Connected as voltage follower with input step from V- to V+. Number specified is the slower of the positive and negative slew rates. Input referred, RL = 100 k connected to V+/2. Each amplifier excited in turn with 1 kHz to produce VO = 3 VPP (For supply voltages < 3 V, VO = V+). Submit Documentation Feedback Copyright (c) 2001-2017, Texas Instruments Incorporated Product Folder Links: LMV931-N LMV932-N LMV934-N LMV931-N LMV932-N, LMV934-N www.ti.com SNOS993P - NOVEMBER 2001 - REVISED APRIL 2017 6.11 Typical Characteristics Unless otherwise specified, VS = 5 V, single-supply, TA = 25C. 160 3 125C VS = 1.8V 2.5 120 2 100 1.5 25C VOS (mV) SUPPLY CURRENT (eA) 140 85C 25C 80 -40C -40C 1 60 0.5 40 0 20 -0.5 85C 125C 0 0 1 2 3 4 5 -1 -0.4 6 0 0.4 0.8 1.2 1.6 SUPPLY VOLTAGE (V) Figure 1. Supply Current vs Supply Voltage (LMV931-N) 3 VS = 2.7V VS = 5V 2.5 2.5 2 25C 2 -40C -40C 1.5 VOS (mV) VOS (mV) 2.4 Figure 2. Offset Voltage vs Common-Mode Range 3 1 0.5 85C 1.5 1 0.5 125C 125C 0 0 -0.5 -0.5 -1 -0.4 0.1 0.6 1.1 1.6 2.1 2.6 3.1 -1 -0.4 0.6 1.6 VCM (V) 2.6 85C 5.6 4.6 3.6 Figure 4. Offset Voltage vs Common-Mode Range 100 100 VS = 5V VS = 5V 10 ISINK (mA) 10 VS = 2.7V 1 VS = 1.8V 0.01 0.1 VS = 2.7V 1 VS = 1.8V 0.1 0.1 0.01 0.001 25C VCM (V) Figure 3. Offset Voltage vs Common-Mode Range ISOURCE (mA) 2 VCM (V) 1 10 OUTPUT VOLTAGE REFERENCED TO V+ (V) Figure 5. Sourcing Current vs Output Voltage 0.01 0.001 0.01 0.1 1 10 OUTPUT VOLTAGE REF TO GND (V) Figure 6. Sinking Current vs Output Voltage Copyright (c) 2001-2017, Texas Instruments Incorporated Product Folder Links: LMV931-N LMV932-N LMV934-N Submit Documentation Feedback 11 LMV931-N LMV932-N, LMV934-N SNOS993P - NOVEMBER 2001 - REVISED APRIL 2017 www.ti.com Typical Characteristics (continued) 12 OUTPUT VOLTAGE PROXIMITY TO SUPPLY VOLTAGE (mV ABSOLUTE VALUE) OUTPUT VOLTAGE PROXIMITY TO SUPPLY VOLTAGE (mV ABSOLUTE VALUE) Unless otherwise specified, VS = 5 V, single-supply, TA = 25C. 140 RL = 600: 130 NEGATIVE SWING 120 110 100 90 80 POSITIVE SWING 70 60 0 1 4 2 3 SUPPLY VOLTAGE (V) 5 6 45 RL = 2k: 40 NEGATIVE SWING 35 30 25 POSITIVE SWING 20 0 1 2 3 4 5 6 SUPPLY VOLTAGE (V) Figure 7. Output Voltage Swing vs Supply Voltage Figure 8. Output Voltage Swing vs Supply Voltage Figure 9. Gain and Phase vs Frequency Figure 10. Gain and Phase vs Frequency Figure 11. Gain and Phase vs Frequency Figure 12. Gain and Phase vs Frequency Submit Documentation Feedback Copyright (c) 2001-2017, Texas Instruments Incorporated Product Folder Links: LMV931-N LMV932-N LMV934-N LMV931-N LMV932-N, LMV934-N www.ti.com SNOS993P - NOVEMBER 2001 - REVISED APRIL 2017 Typical Characteristics (continued) Unless otherwise specified, VS = 5 V, single-supply, TA = 25C. 100 90 VS = 5V VS = 5V +PSRR 90 85 80 VS = 2.7V PSRR (dB) CMRR (dB) 80 75 VS = 1.8V 70 -PSRR 60 70 50 65 40 30 10 60 1k 100 FREQUENCY (Hz) 10 10k 100 1k FREQUENCY (Hz) Figure 13. CMRR vs Frequency Figure 14. PSRR vs Frequency 1 INPUT CURRENT NOISE (pA/ Hz) 1000 INPUT VOLTAGE NOISE (nV/ Hz) 10k 100 10 10 100 1k 10k 0.1 0.01 10 100k 100 FREQUENCY (Hz) 1k 10k 100k FREQUENCY (Hz) Figure 15. Input Voltage Noise vs Frequency Figure 16. Input Current Noise vs Frequency 10 10 RL = 600: RL = 600: AV = +1 AV = +10 THD (%) 1 THD (%) 1 5V 1.8V 0.1 0.1 1.8V 2.7V 2.7V 5V 0.01 10 100 1k 10k 100k 0.01 10 100 1k 10k FREQUENCY (Hz) FREQUENCY (Hz) Figure 17. THD vs Frequency Figure 18. THD vs Frequency Copyright (c) 2001-2017, Texas Instruments Incorporated Product Folder Links: LMV931-N LMV932-N LMV934-N 100k Submit Documentation Feedback 13 LMV931-N LMV932-N, LMV934-N SNOS993P - NOVEMBER 2001 - REVISED APRIL 2017 www.ti.com Typical Characteristics (continued) Unless otherwise specified, VS = 5 V, single-supply, TA = 25C. 0.5 0.5 FALLING EDGE 0.4 RISING EDGE 0.35 RL = 2k: 0.3 FALLING EDGE 0.45 SLEW RATE (V/Ps) SLEW RATE (V/Ps) 0.45 0.4 0.35 RISING EDGE RL = 2k: AV = +1 VIN = 1VPP 0.3 AV = +1 VIN = 1VPP 0.25 0 1 2 3 4 5 6 0.25 0 SUPPLY VOLTAGE (V) RL = 2 k: 6 VS = 2.7V RL = 2 k: TIME (2.5 Ps/DIV) Figure 22. Small Signal Noninverting Response VIN VS = 5V (900 mV/div) RL = 2 k: (50 mV/DIV) OUTPUT SIGNAL INPUT SIGNAL TIME (2.5 Ps/DIV) Figure 21. Small Signal Noninverting Response VOUT VS = 1.8V RL = 2k: AV = +1 TIME (10 Ps/div) TIME (2.5 Ps/DIV) Figure 23. Small Signal Noninverting Response 14 5 (50 mV/DIV) INPUT SIGNAL VS = 1.8V 2 3 4 SUPPLY VOLTAGE (V) Figure 20. Slew Rate vs Supply Voltage LMV932 Only OUTPUT SIGNAL INPUT SIGNAL OUTPUT SIGNAL (50 mV/DIV) Figure 19. Slew Rate vs Supply Voltage LMV931 and LMV934 1 Submit Documentation Feedback Figure 24. Large Signal Noninverting Response Copyright (c) 2001-2017, Texas Instruments Incorporated Product Folder Links: LMV931-N LMV932-N LMV934-N LMV931-N LMV932-N, LMV934-N www.ti.com SNOS993P - NOVEMBER 2001 - REVISED APRIL 2017 Typical Characteristics (continued) Unless otherwise specified, VS = 5 V, single-supply, TA = 25C. VIN (2.5 V/div) (1.35V/DIV) VIN VOUT VOUT VS = 2.7V VS = 5.0V RL = 2 k: RL = 2k: AV = +1 AV = +1 TIME (10 Ps/div) TIME (10 Ps/DIV) Figure 25. Large Signal Noninverting Response Figure 26. Large Signal Noninverting Response 90 90 SHORT CIRCUIT CURRENT (mA) SHORT CIRCUIT CURRENT (mA) 5V 80 5V 70 60 50 40 2.7V 30 20 1.8V 10 0 -40 10 60 TEMPERATURE (C) 110 Figure 27. Short Circuit Current vs Temperature (Sinking) 80 70 60 50 40 2.7V 30 20 1.8V 10 0 -40 10 60 TEMPERATURE (C) 110 Figure 28. Short Circuit Current vs Temperature (Sourcing) Copyright (c) 2001-2017, Texas Instruments Incorporated Product Folder Links: LMV931-N LMV932-N LMV934-N Submit Documentation Feedback 15 LMV931-N LMV932-N, LMV934-N SNOS993P - NOVEMBER 2001 - REVISED APRIL 2017 www.ti.com 7 Detailed Description 7.1 Overview The LMV93x-N are low-voltage, low-power operational amplifiers (op-amp) operating from 1.8-V to 5.5-V supply voltages and have rail-to-rail input and output. LMV93x-N input common-mode voltage extends 200 mV beyond the supplies which enables user enhanced functionality beyond the supply voltage range. 7.2 Functional Block Diagram V IN - IN + + _ OUT + V - Copyright (c) 2016, Texas Instruments Incorporated (Each Amplifier) 7.3 Feature Description The differential inputs of the amplifier consist of a noninverting input (+IN) and an inverting input (-IN). The amplifer amplifies only the difference in voltage between the two inputs, which is called the differential input voltage. The output voltage of the op-amp VOUT is given by Equation 1: VOUT = AOL (IN+ - IN-) where * AOL is the open-loop gain of the amplifier, typically around 100 dB (100,000x, or 10 V per volt). (1) 7.4 Device Functional Modes 7.4.1 Input and Output Stage The rail-to-rail input stage of this family provides more flexibility for the designer. The LMV93x-N use a complimentary PNP and NPN input stage in which the PNP stage senses common-mode voltage near V- and the NPN stage senses common-mode voltage near V+. The transition from the PNP stage to NPN stage occurs 1 V below V+. Because both input stages have their own offset voltage, the offset of the amplifier becomes a function of the input common-mode voltage and has a crossover point at 1 V below V+. 16 Submit Documentation Feedback Copyright (c) 2001-2017, Texas Instruments Incorporated Product Folder Links: LMV931-N LMV932-N LMV934-N LMV931-N LMV932-N, LMV934-N www.ti.com SNOS993P - NOVEMBER 2001 - REVISED APRIL 2017 Device Functional Modes (continued) Copyright (c) 2016, Texas Instruments Incorporated Figure 29. Simplified Schematic Diagram This VOS crossover point can create problems for both DC- and AC-coupled signals if proper care is not taken. Large input signals that include the VOS crossover point will cause distortion in the output signal. One way to avoid such distortion is to keep the signal away from the crossover. For example, in a unity gain buffer configuration with VS = 5 V, a 5-V peak-to-peak signal will contain input-crossover distortion while a 3-V peak-topeak signal centered at 1.5 V will not contain input-crossover distortion as it avoids the crossover point. Another way to avoid large signal distortion is to use a gain of -1 circuit which avoids any voltage excursions at the input terminals of the amplifier. In that circuit, the common-mode DC voltage can be set at a level away from the VOS cross-over point. For small signals, this transition in VOS shows up as a VCM dependent spurious signal in series with the input signal and can effectively degrade small signal parameters such as gain and common-mode rejection ratio. To resolve this problem, the small signal should be placed such that it avoids the VOS crossover point. In addition to the rail-to-rail performance, the output stage can provide enough output current to drive 600 loads. Because of the high-current capability, take care not to exceed the 150C maximum junction temperature specification. 7.4.2 Input Bias Current Consideration The LMV93x-N family has a complementary bipolar input stage. The typical input bias current (IB) is 15 nA. The input bias current can develop a significant offset voltage. This offset is primarily due to IB flowing through the negative feedback resistor, RF. For example, if IB is 50 nA and RF is 100 k, then an offset voltage of 5 mV will develop (VOS = IB x RF). Using a compensation resistor (RC), as shown in Figure 30, cancels this effect. But the input offset current (IOS) will still contribute to an offset voltage in the same manner. Copyright (c) 2001-2017, Texas Instruments Incorporated Product Folder Links: LMV931-N LMV932-N LMV934-N Submit Documentation Feedback 17 LMV931-N LMV932-N, LMV934-N SNOS993P - NOVEMBER 2001 - REVISED APRIL 2017 www.ti.com Device Functional Modes (continued) Figure 30. Canceling the Offset Voltage due to Input Bias Current 18 Submit Documentation Feedback Copyright (c) 2001-2017, Texas Instruments Incorporated Product Folder Links: LMV931-N LMV932-N LMV934-N LMV931-N LMV932-N, LMV934-N www.ti.com SNOS993P - NOVEMBER 2001 - REVISED APRIL 2017 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information The LMV93x-N devices bring performance, economy and ease-of-use to low-voltage, low-power systems. They provide rail-to-rail input and rail-to-rail output swings into heavy loads. 8.2 Typical Applications 8.2.1 High-Side Current-Sensing Application Figure 31. High-Side Current Sensing 8.2.1.1 Design Requirements The high-side current-sensing circuit (Figure 31) is commonly used in a battery charger to monitor charging current to prevent overcharging. A sense resistor RSENSE is connected to the battery directly. This system requires an op amp with rail-to-rail input. The LMV93x-N are ideal for this application because its common-mode input range extends up to the positive supply. 8.2.1.1.1 Custom Design With WEBENCH(R) Tools Click here to create a custom design using the LMV93x-N device with the WEBENCH(R) Power Designer. 1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements. 2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial. 3. Compare the generated design with other possible solutions from Texas Instruments. The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time pricing and component availability. In most cases, these actions are available: * Run electrical simulations to see important waveforms and circuit performance * Run thermal simulations to understand board thermal performance * Export customized schematic and layout into popular CAD formats * Print PDF reports for the design, and share the design with colleagues Get more information about WEBENCH tools at www.ti.com/WEBENCH. Copyright (c) 2001-2017, Texas Instruments Incorporated Product Folder Links: LMV931-N LMV932-N LMV934-N Submit Documentation Feedback 19 LMV931-N LMV932-N, LMV934-N SNOS993P - NOVEMBER 2001 - REVISED APRIL 2017 www.ti.com Typical Applications (continued) 8.2.1.2 Detailed Design Procedure As seen in Figure 31, the ICHARGE current flowing through sense resistor RSENSE develops a voltage drop equal to VSENSE. The voltage at the negative sense point will now be less than the positive sense point by an amount proportional to the VSENSE voltage. The low-bias currents of the LMV93x cause little voltage drop through R2, so the negative input of the LMV93x amplifier is at essentially the same potential as the negative sense input. The LMV93x will detect this voltage error between its inputs and servo the transistor base to conduct more current through Q1, increasing the voltage drop across R1 until the LMV93x inverting input matches the noninverting input. At this point, the voltage drop across R1 now matches VSENSE. IG, a current proportional to ICHARGE, will flow according to the following relation: IG = VRSENSE / R1 = ( RSENSE * ICHARGE ) / R1 (2) IG also flows through the gain resistor R3 developing a voltage drop equal to: V3 = IG * R3 = ( VRSENSE / R1 ) * R3 = ( ( RSENSE * ICHARGE ) / R2 ) * R3 20 Submit Documentation Feedback (3) Copyright (c) 2001-2017, Texas Instruments Incorporated Product Folder Links: LMV931-N LMV932-N LMV934-N LMV931-N LMV932-N, LMV934-N www.ti.com SNOS993P - NOVEMBER 2001 - REVISED APRIL 2017 Typical Applications (continued) VOUT = (RSENSE * ICHARGE ) * G where * G = R3 / R1 (4) The other channel of the LMV93x may be used to buffer the voltage across R3 to drive the following stages. 8.2.1.3 Application Curve Figure 32 shows the results of the example current sense circuit. 5 VOUT (V) 4 3 2 1 0 0 1 2 3 4 5 ICHARGE (A) C001 NOTE: the error after 4 V where transistor Q1 runs out of headroom and saturates, limiting the upper output swing. Figure 32. Current Sense Amplifier Results 8.2.2 Half-Wave Rectifier Applications RI VIN VOUT RI VIN VCC 3 VOUT LMV931 4 + 0 t 1 t Figure 33. Half-Wave Rectifier With Rail-To-Ground Output Swing Referenced to Ground VCC VIN VOUT 3 + VCC 4 VIN VCC t VOUT LMV931 RI 1 t RI Figure 34. Half-Wave Rectifier With Negative-Going Output Referenced to VCC Copyright (c) 2001-2017, Texas Instruments Incorporated Product Folder Links: LMV931-N LMV932-N LMV934-N Submit Documentation Feedback 21 LMV931-N LMV932-N, LMV934-N SNOS993P - NOVEMBER 2001 - REVISED APRIL 2017 www.ti.com Typical Applications (continued) 8.2.2.1 Design Requirements Because the LMV931-N, LMV932-N, LMV934-N input common-mode range includes both positive and negative supply rails and the output can also swing to either supply, achieving half-wave rectifier functions in either direction is an easy task. All that is needed are two external resistors; there is no need for diodes or matched resistors. The half-wave rectifier can have either positive or negative going outputs, depending on the way the circuit is arranged. 8.2.2.2 Detailed Design Procedure In Figure 33 the circuit is referenced to ground, while in Figure 34 the circuit is biased to the positive supply. These configurations implement the half-wave rectifier because the LMV93x-N can not respond to one-half of the incoming waveform. It can not respond to one-half of the incoming because the amplifier cannot swing the output beyond either rail therefore the output disengages during this half cycle. During the other half cycle, however, the amplifier achieves a half wave that can have a peak equal to the total supply voltage. RI should be large enough not to load the LMV93x-N. 8.2.2.3 Application Curve Figure 35. Output of Ground-to-Rail Circuit Figure 36. Output of Rail-to-Ground Circuit 8.2.3 Instrumentation Amplifier With Rail-to-Rail Input and Output Application R2 R1 R3 R4 Figure 37. Rail-to-Rail Instrumentation Amplifier 8.2.3.1 Design Requirements Using three of the LMV93x-N amplifiers, an instrumentation amplifier with rail-to-rail inputs and outputs can be made as shown in Figure 37. 8.2.3.2 Detailed Design Procedure In this example, amplifiers on the left side act as buffers to the differential stage. These buffers assure that the input impedance is very high. They also assure that the difference amp is driven from a voltage source. This is necessary to maintain the CMRR set by the matching R1-R2 with R3-R4. The gain is set by the ratio of R2/R1 and R3 should equal R1 and R4 equal R2. With both rail-to-rail input and output ranges, the input and output are only limited by the supply voltages. Remember that even with rail-to-rail outputs, the output can not swing past the supplies so the combined common-mode voltages plus the signal should not be greater that the supplies or limiting will occur. 22 Submit Documentation Feedback Copyright (c) 2001-2017, Texas Instruments Incorporated Product Folder Links: LMV931-N LMV932-N LMV934-N LMV931-N LMV932-N, LMV934-N www.ti.com SNOS993P - NOVEMBER 2001 - REVISED APRIL 2017 Typical Applications (continued) 8.2.3.3 Application Curve Figure 38 shows the results of the instrumentation amplifier with R1 and R3 = 1 K, and R2 and R4 = 100 k, for a gain of 100, running on a single 5-V supply with a input of VCM = VS/2. The combined effects of the individual offset voltages can be seen as a shift in the offset of the curve. 5 VOUT (V) 4 3 2 1 0 0 10 20 30 40 VDIFF (mV) 50 C001 Figure 38. Instrumentation Amplifier Output Results 8.3 Dos and Don'ts Do properly bypass the power supplies. Do add series resistence to the output when driving capacitive loads, particularly cables, Muxes and ADC inputs. Do add series current limiting resistors and external schottky clamp diodes if input voltage is expected to exceed the supplies. Limit the current to 1 mA or less (1 k per volt). 9 Power Supply Recommendations For proper operation, the power supplies must be properly decoupled. For decoupling the supply lines, TI recommends that 10-nF capacitors be placed as close as possible to the op amp power supply pins. For singlesupply, place a capacitor between V+ and V- supply leads. For dual supplies, place one capacitor between V+ and ground, and one capacitor between V- and ground. Copyright (c) 2001-2017, Texas Instruments Incorporated Product Folder Links: LMV931-N LMV932-N LMV934-N Submit Documentation Feedback 23 LMV931-N LMV932-N, LMV934-N SNOS993P - NOVEMBER 2001 - REVISED APRIL 2017 www.ti.com 10 Layout 10.1 Layout Guidelines The V+ pin must be bypassed to ground with a low-ESR capacitor. The optimum placement is closest to the V+ and ground pins. Take care to minimize the loop area formed by the bypass capacitor connection between V+ and ground. The ground pin must be connected to the PCB ground plane at the pin of the device. The feedback components should be placed as close as possible to the device minimizing strays. 10.2 Layout Example Figure 39. SOT-23 Layout Example 24 Submit Documentation Feedback Copyright (c) 2001-2017, Texas Instruments Incorporated Product Folder Links: LMV931-N LMV932-N LMV934-N LMV931-N LMV932-N, LMV934-N www.ti.com SNOS993P - NOVEMBER 2001 - REVISED APRIL 2017 11 Device and Documentation Support 11.1 Device Support 11.1.1 Custom Design With WEBENCH(R) Tools Click here to create a custom design using the LMV93x-N device with the WEBENCH(R) Power Designer. 1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements. 2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial. 3. Compare the generated design with other possible solutions from Texas Instruments. The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time pricing and component availability. In most cases, these actions are available: * Run electrical simulations to see important waveforms and circuit performance * Run thermal simulations to understand board thermal performance * Export customized schematic and layout into popular CAD formats * Print PDF reports for the design, and share the design with colleagues Get more information about WEBENCH tools at www.ti.com/WEBENCH. 11.1.2 Development Support LMV931 PSPICE Model (also applicable to the LMV932 and LMV934), http://www.ti.com/lit/zip/snom028 TINA-TI SPICE-Based Analog Simulation Program, http://www.ti.com/tool/tina-ti DIP Adapter Evaluation Module, http://www.ti.com/tool/dip-adapter-evm TI Universal Operational Amplifier Evaluation Module, http://www.ti.com/tool/opampevm TI Filterpro Software, http://www.ti.com/tool/filterpro 11.2 Documentation Support 11.2.1 Related Documentation For additional applications, see AN-31 Op Amp Circuit Collection 11.3 Related Links Table 1 lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to order now. Table 1. Related Links PARTS PRODUCT FOLDER ORDER NOW TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY LMV931-N Click here Click here Click here Click here Click here LMV932-N Click here Click here Click here Click here Click here LMV934-N Click here Click here Click here Click here Click here 11.4 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. Copyright (c) 2001-2017, Texas Instruments Incorporated Product Folder Links: LMV931-N LMV932-N LMV934-N Submit Documentation Feedback 25 LMV931-N LMV932-N, LMV934-N SNOS993P - NOVEMBER 2001 - REVISED APRIL 2017 www.ti.com 11.5 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2ETM Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 11.6 Trademarks E2E is a trademark of Texas Instruments. WEBENCH is a registered trademark of Texas Instruments. All other trademarks are the property of their respective owners. 11.7 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 11.8 Glossary SLYZ022 -- TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 26 Submit Documentation Feedback Copyright (c) 2001-2017, Texas Instruments Incorporated Product Folder Links: LMV931-N LMV932-N LMV934-N PACKAGE OPTION ADDENDUM www.ti.com 9-May-2017 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) LMV931MF NRND SOT-23 DBV 5 1000 TBD Call TI Call TI -40 to 125 A79A LMV931MF/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 A79A LMV931MFX NRND SOT-23 DBV 5 3000 TBD Call TI Call TI -40 to 125 A79A LMV931MFX/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 A79A LMV931MG NRND SC70 DCK 5 1000 TBD Call TI Call TI -40 to 125 A74 LMV931MG/NOPB ACTIVE SC70 DCK 5 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 A74 LMV931MGX/NOPB ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 A74 LMV932MA NRND SOIC D 8 95 TBD Call TI Call TI -40 to 125 LMV9 32MA LMV932MA/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LMV9 32MA LMV932MAX NRND SOIC D 8 2500 TBD Call TI Call TI -40 to 125 LMV9 32MA LMV932MAX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LMV9 32MA LMV932MM NRND VSSOP DGK 8 1000 TBD Call TI Call TI -40 to 125 A86A LMV932MM/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS CU NIPDAUAG | CU SN Level-1-260C-UNLIM & no Sb/Br) -40 to 125 A86A LMV932MMX/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS CU NIPDAUAG | CU SN Level-1-260C-UNLIM & no Sb/Br) -40 to 125 A86A LMV934MA NRND SOIC D 14 55 TBD Call TI Call TI -40 to 125 LMV934MA LMV934MA/NOPB ACTIVE SOIC D 14 55 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LMV934MA LMV934MAX/NOPB ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LMV934MA LMV934MT/NOPB ACTIVE TSSOP PW 14 94 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 LMV93 4MT LMV934MTX NRND TSSOP PW 14 2500 TBD Call TI Call TI -40 to 125 LMV93 4MT Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 9-May-2017 Status (1) LMV934MTX/NOPB ACTIVE Package Type Package Pins Package Drawing Qty TSSOP PW 14 2500 Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM Op Temp (C) Device Marking (4/5) -40 to 125 LMV93 4MT (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF LMV931-N, LMV932-N, LMV934-N : * Automotive: LMV931-N-Q1, LMV932-N-Q1, LMV934-N-Q1 Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 9-May-2017 NOTE: Qualified Version Definitions: * Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 6-Jun-2018 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) LMV931MF SOT-23 DBV 5 1000 178.0 8.4 LMV931MF/NOPB SOT-23 DBV 5 1000 178.0 LMV931MFX SOT-23 DBV 5 3000 178.0 LMV931MFX/NOPB SOT-23 DBV 5 3000 LMV931MG SC70 DCK 5 W Pin1 (mm) Quadrant 3.2 3.2 1.4 4.0 8.0 Q3 8.4 3.2 3.2 1.4 4.0 8.0 Q3 8.4 3.2 3.2 1.4 4.0 8.0 Q3 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 1000 178.0 8.4 2.25 2.45 1.2 4.0 8.0 Q3 LMV931MG/NOPB SC70 DCK 5 1000 178.0 8.4 2.25 2.45 1.2 4.0 8.0 Q3 LMV931MGX/NOPB SC70 DCK 5 3000 178.0 8.4 2.25 2.45 1.2 4.0 8.0 Q3 LMV932MAX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LMV932MAX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LMV932MM VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LMV932MM/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LMV932MMX/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LMV934MAX/NOPB SOIC D 14 2500 330.0 16.4 6.5 9.35 2.3 8.0 16.0 Q1 LMV934MTX TSSOP PW 14 2500 330.0 12.4 6.95 5.6 1.6 8.0 12.0 Q1 LMV934MTX/NOPB TSSOP PW 14 2500 330.0 12.4 6.95 5.6 1.6 8.0 12.0 Q1 LMV934MTX/NOPB TSSOP PW 14 2500 330.0 12.4 6.95 5.6 1.6 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 6-Jun-2018 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LMV931MF SOT-23 DBV 5 1000 210.0 185.0 35.0 LMV931MF/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LMV931MFX SOT-23 DBV 5 3000 210.0 185.0 35.0 LMV931MFX/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LMV931MG SC70 DCK 5 1000 210.0 185.0 35.0 LMV931MG/NOPB SC70 DCK 5 1000 210.0 185.0 35.0 LMV931MGX/NOPB SC70 DCK 5 3000 210.0 185.0 35.0 LMV932MAX SOIC D 8 2500 367.0 367.0 35.0 LMV932MAX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LMV932MM VSSOP DGK 8 1000 210.0 185.0 35.0 LMV932MM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0 LMV932MMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0 LMV934MAX/NOPB SOIC D 14 2500 367.0 367.0 35.0 LMV934MTX TSSOP PW 14 2500 367.0 367.0 35.0 LMV934MTX/NOPB TSSOP PW 14 2500 367.0 367.0 35.0 LMV934MTX/NOPB TSSOP PW 14 2500 367.0 367.0 35.0 Pack Materials-Page 2 PACKAGE OUTLINE DBV0005A SOT-23 - 1.45 mm max height SCALE 4.000 SMALL OUTLINE TRANSISTOR C 3.0 2.6 1.75 1.45 PIN 1 INDEX AREA 1 0.1 C B A 5 2X 0.95 1.9 1.45 MAX 3.05 2.75 1.9 2 4 0.5 5X 0.3 0.2 3 (1.1) C A B 0.15 TYP 0.00 0.25 GAGE PLANE 8 TYP 0 0.22 TYP 0.08 0.6 TYP 0.3 SEATING PLANE 4214839/C 04/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Refernce JEDEC MO-178. www.ti.com EXAMPLE BOARD LAYOUT DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM (1.9) 2 2X (0.95) 3 4 (R0.05) TYP (2.6) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X SOLDER MASK OPENING METAL SOLDER MASK OPENING METAL UNDER SOLDER MASK EXPOSED METAL EXPOSED METAL 0.07 MIN ARROUND 0.07 MAX ARROUND NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED SOLDER MASK DETAILS 4214839/C 04/2017 NOTES: (continued) 4. Publication IPC-7351 may have alternate designs. 5. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM (1.9) 2 2X(0.95) 4 3 (R0.05) TYP (2.6) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X 4214839/C 04/2017 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 7. Board assembly site may have different recommendations for stencil design. www.ti.com PACKAGE OUTLINE DBV0005A SOT-23 - 1.45 mm max height SCALE 4.000 SMALL OUTLINE TRANSISTOR C 3.0 2.6 1.75 1.45 PIN 1 INDEX AREA 1 0.1 C B A 5 2X 0.95 1.9 1.45 MAX 3.05 2.75 1.9 2 4 0.5 5X 0.3 0.2 3 (1.1) C A B 0.15 TYP 0.00 0.25 GAGE PLANE 8 TYP 0 0.22 TYP 0.08 0.6 TYP 0.3 SEATING PLANE 4214839/C 04/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Refernce JEDEC MO-178. www.ti.com EXAMPLE BOARD LAYOUT DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM (1.9) 2 2X (0.95) 3 4 (R0.05) TYP (2.6) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X SOLDER MASK OPENING METAL SOLDER MASK OPENING METAL UNDER SOLDER MASK EXPOSED METAL EXPOSED METAL 0.07 MIN ARROUND 0.07 MAX ARROUND NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED SOLDER MASK DETAILS 4214839/C 04/2017 NOTES: (continued) 4. Publication IPC-7351 may have alternate designs. 5. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM (1.9) 2 2X(0.95) 4 3 (R0.05) TYP (2.6) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X 4214839/C 04/2017 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 7. Board assembly site may have different recommendations for stencil design. www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. TI's published terms of sale for semiconductor products (http://www.ti.com/sc/docs/stdterms.htm) apply to the sale of packaged integrated circuit products that TI has qualified and released to market. Additional terms may apply to the use or sale of other types of TI products and services. Reproduction of significant portions of TI information in TI data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such reproduced documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyers and others who are developing systems that incorporate TI products (collectively, "Designers") understand and agree that Designers remain responsible for using their independent analysis, evaluation and judgment in designing their applications and that Designers have full and exclusive responsibility to assure the safety of Designers' applications and compliance of their applications (and of all TI products used in or for Designers' applications) with all applicable regulations, laws and other applicable requirements. Designer represents that, with respect to their applications, Designer has all the necessary expertise to create and implement safeguards that (1) anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and take appropriate actions. Designer agrees that prior to using or distributing any applications that include TI products, Designer will thoroughly test such applications and the functionality of such TI products as used in such applications. TI's provision of technical, application or other design advice, quality characterization, reliability data or other services or information, including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, "TI Resources") are intended to assist designers who are developing applications that incorporate TI products; by downloading, accessing or using TI Resources in any way, Designer (individually or, if Designer is acting on behalf of a company, Designer's company) agrees to use any particular TI Resource solely for this purpose and subject to the terms of this Notice. TI's provision of TI Resources does not expand or otherwise alter TI's applicable published warranties or warranty disclaimers for TI products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections, enhancements, improvements and other changes to its TI Resources. TI has not conducted any testing other than that specifically described in the published documentation for a particular TI Resource. Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. TI RESOURCES ARE PROVIDED "AS IS" AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM, INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949 and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements. Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use. Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S. TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product). Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications and that proper product selection is at Designers' own risk. Designers are solely responsible for compliance with all legal and regulatory requirements in connection with such selection. Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer's noncompliance with the terms and provisions of this Notice. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2018, Texas Instruments Incorporated Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Texas Instruments: LMV931MF LMV931MF/NOPB LMV931MFX LMV931MFX/NOPB LMV931MG LMV931MG/NOPB LMV931MGX/NOPB