G•SiC® Technology
XBright® Plus LEDs
Cxxx-XB290-S0100-A-Plus
Maximum Ratings at TA = 25°C Notes 1&3 Cxxx-XB290-S0100-A-Plus
DC Forward Current 30mA
Peak Forward Current (1/10 duty cycle @ 1kHz) 100mA
LED Junction Temperature 125°C
Reverse Voltage 5 V
Operating Temperature Range -20°C to +80°C
Storage Temperature Range -30°C to +100°C
Electrostatic Discharge Threshold (HBM) Note 2 1000V
Electrostatic Discharge Classification (MIL-STD-883E) Note 2 Class 2
Typical Electrical/Optical Characteristics at TA = 25°C, If = 20mA Note 3
Sorted Kit
Part number
Forward Voltage
(Vf, V)
Reverse Current
[I(Vr=5V), µA]
Full Width
Half Max
(λD, nm)
Dominant
Wavelength
Radiant Flux
Optical Rise Time
(τ, ns)
Typ Max Max Typ Typ
C460-XB290-S0100-A 3.6 4.0 10 25 See Bin Table See Bin Table 30
C470-XB290-S0100-A 3.6 4.0 10 25 See Bin Table See Bin Table 30
Mechanical Specifications Note 4 Cxxx-XB290-S0100-A-Plus
Description Dimension Tolerance
P-N Junction Area (µm) 248 x 248 ± 25
Top Area (µm) 200 x 200 ± 25
Bottom Area (Substrate) (µm) 300 x 300 ± 25
Chip Thickness (µm) 250 ± 25
Au Bond Pad Diameter (µm) 96 -5, +15
Au Bond Pad Thickness (µm) 1.2 ± 0.5
Au/Sn Back Contact Metal Area (µm) 210 x 210 ± 25
Au/Sn Back Contact Metal Thickness (µm) 1.7 ± 0.3
Notes:
1) Maximum ratings are package dependent. The above ra tings were determined using a T-1 3/4 package (with Hysol OS4000 epoxy) for
characterization. Seller makes no representations regarding ratings for packages other than the T-1 3/4 package used by Seller. The forward currents
(DC and Peak) are not limited by the G •SiC die but by the effect of the LED junction temperature on the package. The junction temperature lim it of
125°C is a limit of the T-1 3/4 package; junction temperature should be char acterized in a specific package to determine limitations. Assembly
processing temperature must not exceed 325°C (< 5 seconds). See Cree XBright® Applications Note for more assembly process information.
2) Product resistance to electrostatic discharge (ESD) is measured by simulating ESD using a rapid avalanche energy test (RAET). The RAET procedures
are designed to approximate the maximum ESD ratings shown. Seller gives no other assurances regarding the ability of Products to withstand ESD.
3) All Products conform to the listed minimum and maximum specifications for electrical and optical characteristics, when assembled and operated at 20
mA within the maxim um ratings shown above. Efficiency decreases at higher currents. Typical values given are the average values expected by Seller
in large quantities and are provided for information only. Seller gives no assurances Products shipped will exhibit such typical ratings. All
measurements were made using lamps in T-1 3/4 packages with Hysol OS4000 epoxy. Optical characteristics were measured in a Pho toresearch
Spectrascan Integrating Sphere. Illuminance E.
4) All Products conform to the listed mechanical specifications within the tolerances shown.
CPR3BT Rev. A
© Cree, Inc. 2003 All Rights Reserved.