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LM4834 1.75W Audio Power Amplifier with DC Volume
Control and Microphone Preamp
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1FEATURES DESCRIPTION
The LM4834 is a monolithic integrated circuit that
23• PC98 Compliant provides DC volume control, and a bridged audio
• “Click and Pop” Suppression Circuitry power amplifier capable of producing 1.75W into 4Ω
• Stereo Line Level Outputs with Mono Input with less than 1.0% (THD). In addition, the
Capability for System Beeps headphone/lineout amplifier is capable of driving 70
mW into 32Ωwith less than 0.1%(THD). The LM4834
• Microphone Preamp with Buffered Power incorporates a volume control and an input
Supply microphone preamp stage capable of driving a 1 kΩ
• DC Volume Control Interface load impedance.
• Thermal Shutdown Protection Circuitry Boomer®audio integrated circuits were designed
specifically to provide high quality audio while
APPLICATIONS requiring a minimum amount of external components
in surface mount packaging. The LM4834
• Multimedia Monitors incorporates a DC volume control, a bridged audio
• Desktop and Portable Computers power amplifier and a microphone preamp stage,
making it optimally suited for multimedia monitors and
APPLICATIONS desktop computer applications.
• THD at 1.1W Continuous Average Output The LM4834 features an externally controlled, low-
Power into 8Ωat 1kHz 0.5% (max) power consumption shutdown mode, and both a
• Output Power into 4Ωat 1.0% THD+N 1.75W power amplifier and headphone mute for maximum
(typ) system flexibility and performance.
• THD at 70mW Continuous Average Output
Power into 32Ωat 1kHz 0.1% (typ)
• Shutdown Current 1.0μA (max)
• Supply Current 17.5mA (typ)
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2Boomer is a registered trademark of Rockford Corporation.
3All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2004, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Connection Diagram
Block Diagram
Figure 2. SSOP Package
Top View
See Package Number DB for SSOP
Figure 1. LM4834 Block Diagram
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Absolute Maximum Ratings(1)(2)
Supply Voltage 6.0V
Storage Temperature -65°C to +150°C
Input Voltage −0.3V to VDD+0.3V
Power Dissipation(3) Internally limited
ESD Susceptibility(4) 2000V
Pin 5 1500V
ESD Susceptibility(5) 200V
Junction Temperature 150°C
Soldering Information Vapor Phase (60 sec.) 215°C
Small Outline Package Infrared (15 sec.) 220°C
θJC (typ)—DB 29°C/W
θJA (typ)—DB 95°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditionsfor
which the device is functional, but do not ensure specific performance limits. Electrical Characteristicsstate DC and AC electrical
specifications under particular test conditions which ensure specific performance limits. This assumes that the deviceis within the
Operating Ratings. Specifications are not specified for parameters where no limit is given, however, the typical value is a good indication
of device performance.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX,θJA, and the ambient temperature
TA. The maximum allowable power dissipation is PDMAX = (TJMAX −TA)/θJA.For the LM4834MS, TJMAX = 150°C, and the typical junction-
to-ambient thermal resistance, when board mounted, is 95°C/W assuming the DB package.
(4) Human body model, 100 pF discharged through a 1.5 kΩresistor.
(5) Machine Model, 220 pF–240 pF discharged through all pins.
Operating Ratings
Temperature Range
TMIN ≤TA≤TMAX −40°C ≤TA ≤85°C
Supply Voltage 4.5 ≤VDD ≤5.5V
Electrical Characteristics for Entire IC(1)
The following specifications apply for VDD = 5V unless otherwise noted. Limits apply for TA= 25°C. LM4834 Units
Symbol Parameter Conditions (Limits)
Typical(2) Limit(3)
VDD Supply Voltage 4.5 V (min)
5.5 V (max)
IDD Quiescent Power Supply Current VIN = 0V, IO= 0A 17.5 26 mA (max)
ISD Shutdown Current V pin13 = VDD 0.6 2.0 μA (max)
(1) All voltages are measured with respect to the ground pins, unlessotherwise specified. All specifications are tested using the typical
application as shown in Figure 3.
(2) Typicals are measured at 25°C and represent the parametric norm.
(3) Limits are guaranteed to National's AOQL (Average Outgoing Quality Level).
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Electrical Characteristics for Volume Attenuators(1)
The following specifications apply for VDD = 5V. Limits apply for TA= 25°C. LM4834 Units
Symbol Parameter Conditions (Limits)
Typical(2) Limit(3)
CRANGE Attenuator Range Gain with Vpin 22 = 5V 2.6 3.65 dB (max)
Attenuation with Vpin 22 = 0V -75 -88 dB (min)
AMMute Attenuation Vpin 15 = 5V, Sum Out -92 -105 dB (max)
Vpin 15 = 5V, Line Out/Headphone Amp -92 -105 dB (max)
(1) All voltages are measured with respect to the ground pins, unlessotherwise specified. All specifications are tested using the typical
application as shown in Figure 3.
(2) Typicals are measured at 25°C and represent the parametric norm.
(3) Limits are guaranteed to National's AOQL (Average Outgoing Quality Level).
Electrical Characteristics for Microphone Preamp and Power Supply(1)
The following specifications apply forVDD = 5V unless otherwise noted. Limits apply for TA= 25°C. LM4834 Units
Symbol Parameter Conditions (Limits)
Typical(2) Limit(3)
VOS Offset Voltage VIN = 0V 0.9 mV
SNR Signal to Noise Ratio VDD = 5V, RL= 1k, f = 1 kHz, VOUT = 4.7V 123 dB
, A-Wtd Filter
VSWING Output Voltage Swing f = 1 kHz, THD < 1.0%, RL= 1 kΩ4.72 V
ENO Input Referred Noise A-Weighted Filter 1.2 μV
PSRR Power Supply Rejection Ratio f = 120 Hz, VRIPPLE= 200 mVrms, CB= 28 dB
1μF
VSMic Power Supply RL= 1 kΩ, Bias In = 2.5V 2.5 2.5 V (min)
(1) All voltages are measured with respect to the ground pins, unlessotherwise specified. All specifications are tested using the typical
application as shown in Figure 3.
(2) Typicals are measured at 25°C and represent the parametric norm.
(3) Limits are guaranteed to National's AOQL (Average Outgoing Quality Level).
Electrical Characteristics for Line/Headphone Amplifier(1)
The following specifications apply for VDD = 5V. Limits apply for TA= 25°C. LM4834 Units
Symbol Parameter Conditions (Limits)
Typical(2) Limit(3)
POOutput Power THD = 0.1%; f = 1kHz; RL= 32Ω70 mW
THD = 10%; f = 1 kHz; RL= 32Ω95 mW
THD+N Total Harmonic Distortion+Noise VOUT = 4VP-P, 20 Hz <f < 20 kHz, RL= 0.05 %
10kΩ, AVD =−1
PSRR Power Supply Rejection Ratio CB= 1.0 μF, f =120 Hz, VRIPPLE = 200 30 dB
mVrms
SNR Signal to Noise Ratio VDD=5V, POUT=75mW, RL= 32Ω, A- 102 dB
Wtd Filter
(1) All voltages are measured with respect to the ground pins, unlessotherwise specified. All specifications are tested using the typical
application as shown in Figure 3.
(2) Typicals are measured at 25°C and represent the parametric norm.
(3) Limits are guaranteed to National's AOQL (Average Outgoing Quality Level).
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Electrical Characteristics for Bridged Speaker Amplifer(1)(2)
The following specifications apply for VDD = 5V, unless otherwise noted. Limits apply for TA= 25°C.
LM4834 Units
Symbol Parameter Conditions (Limits)
Typical(3) Limit(4)
VOS Output Offset Voltage VIN = 0V 5 30 mV (max)
POOutput Power THD = 0.5% (max);f = 1 kHz; 1.1 1.0 W (min)
RL= 8Ω
THD+N = 10%;f = 1 kHz; RL= 8Ω1.5 W
THD+N Total Harmonic Distortion+Noise PO= 1W, 20 Hz< f < 20 kHz, 0.3 %
RL= 8Ω, AVD = 2
PO= 340 mW, RL= 32Ω1.0 %
PSRR Power Supply Rejection Ratio CB= 1.0 µF, f = 120 Hz,VRIPPLE = 200 58 dB
mVmrs
SNR Signal to Noise Ratio VDD = 5V, POUT = 1.1W, RL= 8Ω, A- 93 dB
Wtd Filter
(1) All voltages are measured with respect to the ground pins, unlessotherwise specified. All specifications are tested using the typical
application as shown in Figure 3.
(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditionsfor
which the device is functional, but do not ensure specific performance limits. Electrical Characteristicsstate DC and AC electrical
specifications under particular test conditions which ensure specific performance limits. This assumes that the deviceis within the
Operating Ratings. Specifications are not specified for parameters where no limit is given, however, the typical value is a good indication
of device performance.
(3) Typicals are measured at 25°C and represent the parametric norm.
(4) Limits are guaranteed to National's AOQL (Average Outgoing Quality Level).
Typical Application
Figure 3. Typical Application Circuit
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Truth Table for Logic Inputs
Mode Mute HP Sense DC Vol. Control Line/HP Left Line/HP Right Speaker Out
0 0 0 Adjustable Fixed Level Fixed Level Vol. Changes
0 0 1 Adjustable Fixed Level Fixed Level Muted
0 1 X _ Fixed Level Fixed Level Muted
1 0 0 Adjustable Vol. Changes Vol. Changes Vol. Changes
1 0 1 Adjustable Vol. Changes Vol. Changes Muted
1 1 X _ Muted Muted Muted
External Components Description
Figure 3
Components. Functional Description
1. CiInput coupling capacitor which blocks the DC voltage at the amplifier's input terminals. Also creates a high pass
filter with Riat fc= 1/(2πRiCi). Refer to the section, PROPER SELECTION OF EXTERNAL COMPONENTS, for an
explanation of how to determine the value of Ci.
2. CSSupply bypass capacitor which provides power supply filtering. Refer to the POWER SUPPLY BYPASSING
section for information concerning proper placement and selection of the supply bypass capacitor.
3. CBBypass pin capacitor which provides half-supply filtering. Refer to the section, PROPER SELECTION OF
EXTERNAL COMPONENTS, for information concerning proper placement and selection of CB.
4. COOutput coupling capacitor which blocks the DC voltage at the amplifiers output. Forms a high pass filter with RLat
fo= 1/(2πRLCO).
5. RSSumming resistor that combines the right and left line level outputs into the mono input of the bridged amplifier.
The two summing resistors in parallel determine the value of the input resistance of the bridged amplifier.
6. RLFE Resistor for the bridged power amplifier in series with RFat high frequencies. Used in conjunction with CLFE to
increase closed-loop gain at low frequencies.
7. RFFeedback resistor which sets the closed-loop gain in conjunction with the equivalent RSfor the bridged power
amplifier.
8. RM1 Resistor in series with Microphone supply pin and the microphone for biasing differential input microphones.
9. RM2 Resistor in series with reference ground and the microphone used for biasing differential input microphones.
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Typical Performance Characteristics
THD+N THD+N
vs vs
Frequency Frequency
Bridged Power Amp Bridged Power Amp
Figure 4. Figure 5.
THD+N THD+N
vs vs
Frequency Frequency
Bridge Power Amp Line Out/HP Amplifiers
Figure 6. Figure 7.
THD+N THD+N
vs vs
Frequency Frequency
Line Out/HP Amplifiers Line Out/HP Amplifiers
Figure 8. Figure 9.
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Typical Performance Characteristics (continued)
THD+N THD+N
vs vs
Output Power Output Power
Bridged Power Amp Bridged Power Amp
Figure 10. Figure 11.
THD+N THD+N
vs vs
Output Power Output Power
Bridged Power Amp Line Out/HP Amplifiers
Figure 12. Figure 13.
THD+N THD+N
vs vs
Output Power Output Power
Line Out/HP Amplifiers Line Out/HP Amplifiers
Figure 14. Figure 15.
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Typical Performance Characteristics (continued)
Output Power vs Output Power vs
Load Resistance Load Resistance
Bridged Power Amp Line Out/HP Amplifiers
Figure 16. Figure 17.
Volume Control Noise Floor
Characteristics Bridged Power Amp
Figure 18. Figure 19.
Noise Floor Noise Floor
Line Out/HP Amp Mic Preamp
Figure 20. Figure 21.
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Typical Performance Characteristics (continued)
Power Supply Power Supply
Rejection Ratio Rejection Ratio
Bridged Power Amp Line Out/HP Amplifiers
Figure 22. Figure 23.
Power Dissipation
Power Supply vs
Rejection Ratio Output Power
Mic Preamp Bridged Power Amp
Figure 24. Figure 25.
Power Dissipation vs Low Frequency Enhancement
Output Power Characteristics
Line Out/HP Amplifiers Bridged Power Amp
Figure 26. Figure 27.
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Typical Performance Characteristics (continued)
Open Loop
Frequency Response
Power Derating Curve Bridged Power Amp
Figure 28. Figure 29.
Crosstalk
Line Out/HP Amplifiers
Figure 30.
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APPLICATION INFORMATION
BEEP IN FUNCTION
The Beep In pin (pin 14) is a mono input, for system beeps, that is mixed into the left and right input. This Beep
In pin will allow an input signal to pass through to the Sum Out and Line/HP output pins. The minimum potential
for the input of the Beep In signal is 300mV. Beep in signals less than 300mVP-P will not pass through to the
output. The beep in circuitry provides left-right signal isolation to prevent crosstalk at the summed input. As
shown in the Figure 3, it is required that a resistor and capacitor is placed in series with the Beep In pin and the
node tied to VDD through a 100kΩresistor. The recommended value for the input resistor is between 120kΩto
10kΩand the input capacitor is between .22Fµ and .47µF. The input resistor can be changed to vary the
amplitude of the beep in signal. Higher values of the input resistor will reduce the amplifier gain and attenuate the
beep in signal. In cases where system beeps are required when the system is in a suspended mode, the
LM4834 must be brought out of shutdown before the beep in signal is input.
SHUTDOWN FUNCTION
In order to reduce power consumption while not in use, the LM4834 contains a shutdown pin to externally turn off
the bias circuitry. The LM4834 will shutdown when a logic high is placed on the shutdown pin. The trigger point
between a logic low and logic high level is typically half supply. It is best to switch between ground and the
supply VDD to provide maximum device performance. By switching the shutdown pin to VDD, the LM4834 supply
current draw will be minimized. While the device will be disabled with shutdown pin voltages less than VDD, the
idle current may be greater than the typical value of 0.6 µA.The shutdown pin should not be floated, since this
may result in an unwanted shutdown condition.
In many applications, a microcontroller or microprocessor output is used to control the shutdown circuitry which
provides a quick, smooth transition into shutdown. Another solution is to use a single-pole, single-throw switch in
conjuction with an external pull-up resistor. When the switch is closed,the shutdown pin is connected to ground
and enables the amplifier. If the switch is open, then the external pull-up resistor will shutdown the LM4834. This
scheme prevents the shutdown pin from floating.
MODE FUNCTION
The LM4834 was designed to operate in two modes. In mode 0 (lineout mode),where the mode pin (pin 17) is
given a logic level low, the attenuation at the Line/HP outputs are fixed at a gain of 1.4. In mode 1 (headphone
mode), where the mode pin is given a logic level high, the attenuation of the Line/HP outputs is controlled
through the DC voltage at pin 22. The signal levels of the Left and Right Sum Out pins are always controlled by
the DC potential at pin 22 regardless of the mode of the IC. In mode 0, pin 5 and pin 24 are line out drivers. In
mode 1, pin 5 and pin 24 are headphone drivers.
MUTE FUNCTION
By placing a logic level high on the mute pin (pin 15), the Right and Left Sum Out pins will be muted. If the
LM4834 is in the headphone mode, the HP/Line out pins as well as the Sum Out pins are muted. The mute pin
must not be floated.
HP SENSE FUNCTION
The LM4834 possesses a headphone sense pin (pin 16) that mutes the bridged amplifier, when given a logic
high, so that headphone or line out operation can occur while the bridged connected load will be muted.
Figure 31 shows the implementation of the LM4834's headphone control function using a single-supply.The
voltage divider of R1, R2, R4, and R5 sets the voltage at the HP sense pin (pin 16) to be approximately 50 mV
when there are no headphones plugged into the system. This logic-low voltage at the HP sense pin enables
bridged power amplifier. Resistor R4 limits the amount of current flowing out of the HP sense pin when the
voltage at that pin goes below ground resulting from the music coming from the headphone amplifier. Resistor
R1, R4, and R5 form a resistor divider that prevents false triggering of the HP sense pin when the voltage at the
output swings near the rail, since VIH is about 2.5V.
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When a set of headphones are plugged into the system, the contact pin of the headphone jack is disconnected
from the signal pin, interrupting the voltage divider set up by resistors R1, R2, R4, and R5. Resistor R1 then pulls
up the HP sense pin, enabling the headphone function and disabling the bridged amplifier. The headphone
amplifier then drives the headphones, whoseimpedance is in parallel with resistor R2 and R3. Also shown in
Figure 31 are the electrical connections for the headphone jack and plug. A 3-wire plug consists of a Tip, Ring
and Sleeve, where the Tip and Ring are signal carrying conductors and the Sleeve is the common ground return.
One control pin contact for each headphone jack is sufficient to indicate that the user has inserted a plug into a
jack and that another mode of operation is desired.
The LM4834 can be used to drive both a bridged 8Ωinternal speaker and a pair of 32Ωspeakers without using
the HP sense pin. In this case the HP sense is controlled by a microprocessor or a switch.
Figure 31. Headphone Input Circuit
DC VOLUME CONTROL
The DC voltage at the DC Volume Control pin (pin 22) determines the attenuation of the Sum Out and Line/HP
amplifiers. If the DC potential of pin 22 is at 4V the internal amplifiers are set at a gain of 1.4 (2.9dB). The
attenuation of the amplifiers increase until 0V is reached. The attenuator range is from 2.9dB (pin22 = 4V) to -
75dB (pin22 = 0V). Any DC voltage greater than 4V will result in a gain of 2.9dB. When the mode pin is given a
logic low, the Line/HP amplifier will be fixed at a gain of 2.9dB regardless of the voltage of pin 22. Refer to the
Typical Performance Characteristics for detailed information of the attenuation characteristics of the DC Volume
Control pin.
MICROPHONE PREAMPLIFIER
The microphone preamplifier is intended to amplify low-level signals. The mic input can be directly connected to
a microphone network or to low level signal inputs. The mic amplifier has enough output capability to drive a 1kΩ
load. A power supply buffer is included for microphones which require external biasing.
POWER DISSIPATION
Power dissipation is a major concern when using any power amplifier and must be thoroughly understood to
ensure a successful design. Equation 1 states the maximum power dissipation point for a bridged amplifier
operating at a given supply voltage and driving a specified load.
PDMAX = 4(VDD)2/(2π2RL) (1)
Along with the bridged amplifier, the LM4834 also incorporates two single-ended amplifiers. Equation 2 states the
maximum power dissipation point for a single-ended amplifier operating at a given supply voltage and driving a
specified load.
PDMAX = (VDD)2/(2π2RL) (2)
Even with the power dissipation of the bridged amplifier andthe two single-ended amplifiers, the LM4834 does
not require heatsinking. The power dissipation from the three amplifiers, must not be greater than the package
power dissipation that results from Equation 3:
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PDMAX = (TJMAX −TA)/ θJA) (3)
For the LM4834 SSOP package, θJA = 95°C/W and TJMAX = 150°C. Depending on the ambient temperature, TA,
of the system surroundings, Equation 3 can be used to find the maximum internal power dissipation supported by
the IC packaging. If the result of Equation 1 and Equation 2 is greater than that of Equation 3, then either the
supply voltage must be decreased, the load impedance increased, or the ambient temperature reduced. For the
typical application of a 5V power supply, with an 8Ωbridged load and 32Ωsingle ended loads, the maximum
ambient temperature possible without violating the maximum junction temperature is approximately 82°C
provided that device operation is around the maximum power dissipation points. Power dissipation is a function
of output power and thus, if typical operation is not around the maximum power dissipation point, the ambient
temperature can be increased. Refer to the Typical Performance Characteristics curves for power dissipation
information for different output powers.
GROUNDING
In order to achieve the best possible performance, there are certain grounding techniques to be followed. All
input reference grounds should be tied with their respective source grounds and brought back to the power
supply ground separately from the output load ground returns. Bringing the ground returns for the output loads
back to the supply separately will keep large signal currents from interfering with the stable AC input ground
references.
LAYOUT
As stated in the GROUNDING section, placement of ground return lines is imperative in maintaining the highest
level of system performance. It is not only important to route the correct ground return lines together, but also to
be aware of where the ground return lines are routed with respect to each other. The output load ground returns
should be physically located as far as possible from low signal level lines and their ground return lines. Critical
signal lines are those relating to the microphone amplifier section, since these lines generally work at very low
signal levels.
POWER SUPPLY BYPASSING
As with any power amplifier, proper supply bypassing is critical for low noise performance and high power supply
rejection. The capacitor location on both the bypass and power supply pins should be as close to the device as
possible. The effect of a larger half supply bypass capacitor is improved PSRR due to increased half-supply
stability. Typical applications employ a 5 volt regulator with 10 µF and a 0.1 µF bypass capacitors which aid in
supply stability, but do not eliminate the need for bypassing the supply nodes of the LM4834. The selection of
bypass capacitors, especially CB, is thus dependant upon desired PSRR requirements, click and pop
performance as explained in the section, PROPER SELECTION OF EXTERNAL COMPONENTS system cost,
and size constraints. It is also recommended to decouple each of the VDD pins with a 0.1µF capacitor to ground.
PROPER SELECTION OF EXTERNAL COMPONENTS
Proper selection of external components in applications using integrated power amplifiers is critical to optimize
device and system performance. While the LM4834 is tolerant of external component combinations,
consideration to component values must be used to maximize overall system quality.
The LM4834 bridged amplifier should be used in low gain configurations to minimize THD+N values, and
maximize the signal to noise ratio. Low gain configurations require large input signals to obtain a given output
power. Input signals equal to or greater than 1Vrms are available from sources such as audio codecs.
Besides gain, one of the major considerations is the closed-loop bandwidth of the amplifier. To a large extent, the
bandwidth is dictated by the choice of external components shown in Figure 1. Both the input coupling capacitor,
CI, and the output coupling capacitor form first order high pass filters which limit low frequency response given in
Equation 4 and Equation 5.
fIC = 1/(2πRiCi) (4)
fOC = 1/(2πRLCO) (5)
These values should be chosen based on required frequency response.
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Selection of Input and Output Capacitor Size
Large input and output capacitors are both expensive and space hungry for portable designs. Clearly, a certain
sized capacitor is needed to couple in low frequencies without severe attenuation. In many cases the speakers
used in portable systems, whether internal or external, have little ability to reproduce signals below 100 Hz–150
Hz. In this case, usinga large input or output capacitor may not increase system performance.
In addition to system cost and size, click and pop performance is effected by the size of the input coupling
capacitor, Ci. A larger input coupling capacitor requires more charge to reach its quiescent DC voltage (nominally
1/2 VDD.) This charge comes from the output through the feedback and is apt to create pops once the device is
enabled. By minimizing the capacitor size based on necessary low frequency response, turn-on pops can be
minimized.
CLICK AND POP CIRCUITRY
The LM4834 contains circuitry to minimize turn-on transients or “click and pops”. In this case, turn-on refers to
either power supply turn-on or the device coming out of shutdown mode. When the device is turning on, the
amplifiers are internally configured as unity gain buffers. An internal current source ramps up the voltage of the
bypass pin. Both the inputs and outputs ideally track the voltage at the bypass pin. The device will remain in
buffer mode until the bypass pin has reached its half supply voltage, 1/2 VDD. As soon as the bypass node is
stable, the device will become fully operational.
Although the bypass pin current source cannot be modified, the size of the bypass capacitor, CB, can be
changed to alter the device turn-on time and the amount of “click and pop”. By increasing CB, the amount of turn-
on pop can be reduced. However, the trade-off for using a larger bypass capacitor is an increase in the turn-on
time for the device. Reducing CBwill decrease turn-on time and increase “click and pop”.
There is a linear relationship between the size of CBand the turn-on time. Here are some typical turn-on times
for different values of CB:
CBTON
0.01 µF 20 ms
0.1 µF 200 ms
0.22 µF 420 ms
0.47 µF 840 ms
1.0 µF 2 sec
In order to eliminate “click and pop”, all capacitors must be discharged before turn-on. Rapid on/off switching of
the device or shutdown function may cause the “click and pop” circuitry to not operate fully, resulting in increased
“click and pop” noise.
In systems where the line out and headphone jack are the same, the output coupling cap, CO, is of particular
concern. COis chosen for a desired cutoff frequency with a headphone load. This desired cutoff frequency will
change when the headphone load is replaced by a high impedance line out load(powered speakers). The input
impedance of headphones are typically between 32Ωand 64Ω. Whereas, the input impedance of powered
speakers can vary from 1kΩtop 100kΩ. As the RC time constant of the load and the output coupling capacitor
increases, the turn off transients are increased.
To improve click and pop performance in this situation, external resistors R6 and R7 should be added. The
recommended value for R6 is between 150Ωto 1kΩ. The recommended value for R7 is between 100Ωto 500Ω.
To achieve virtually clickless and popless performance R6 = 150Ω, R7 = 100Ω, CO= 220µF, and CB= 0.47µF
should be used. Lower values of R6 will result in better click and pop performance. However, it should be
understood that lower resistance values of R6 will increase quiescent current.
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Figure 32. Resistors for Varying Output Loads
LOW FREQUENCY ENHANCEMENT
In some cases, a designer may want to improve the low frequency response of the bridged amplifier. This low
frequency boost can be useful in systems where speakers are housed in small enclosures. A resistor, RLFE, and
a capacitor, CLFE, in parallel, can be placed in series with the feedback resistor of the bridged amplifier as seen
in Figure 33.
Figure 33. Low Frequency Enhancement
At low frequencies the capacitor will be virtually an open circuit. At high frequencies the capacitor will be virtually
a short circuit. As a result of this, the gain of the bridge amplifier is increased at low frequencies. A first order
pole is formed with a corner frequency at:
fc= 1/(2πRLFECLFE) (6)
The resulting low frequency differential gain of this bridged amplifier becomes:
2(Rf+ RLFE) / Ri= Avd (7)
With RF= 20kΩ, RLFE = 20kΩ, and CLFE = 0.068 µF, a first order pole is formed with a corner frequency of 120
Hz. At low frequencies the differential gain will be 4, assuming RS= 20k. The low frequency boost formulas
assume that CO, Ci, fIC, fOC allow the appropriate low frequency response.
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