LMX5252
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Bluetooth™ Radio
Check for Samples: LMX5252
1FEATURES • The baseband interface is completely digital
and compatible with 8-pin bi-directional
2• The LMX5252 provides a very compact radio BlueRF using the RXMODE2 configuration. It
solution for Bluetooth™ applications that put can automatically adapt to the voltage levels
extra strong requirements on low cost and used by different baseband controllers,
small form factors. In addition, the application independently of the supply voltage.
benefits from very low signal loss between the
antenna and the radio. APPLICATIONS
• The radio completely integrates the receiver • The LMX5252 is primarily targeting cost-
and transmitter baluns, the antenna switch, sensitive consumer applications that require
and filter together with the voltage-controlled fast design-in, low power consumption and
oscillator (VCO) tank on one single die. The small designs. It is ideal for applications such
fractional-N delta-sigma synthesizer and the as:
crystal offer support for a wide range of
external reference frequency clocks or – 2G, 2.5G, and 3G handsets
crystals. The digital Received Signal Strength – PDAs
Indicator (RSSI) allows for efficient power – Notebook PCs
control and communication with Bluetooth – Computer peripherals
Class 2 devices. Several current saving modes – Office network equipment
are available. – Home applications
FUNCTIONAL BLOCK DIAGRAM
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2Bluetooth is a trademark of Bluetooth SIG, Inc.
PRODUCTION DATA information is current as of publication date. Copyright © 2004–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LMX5252
SNOSCW4A –DECEMBER 2004–REVISED APRIL 2013
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
CONTENTS
FEATURES....................................................................................... ....................................................................................... 1
APPLICATIONS.................................................................................... .................................................................................... 1
DESCRIPTION .................................................................................... .................................................................................... 2
ELECTRICAL SPECIFICATIONS...................................................................... ...................................................................... 4
ABSOLUTE MAXIMUM RATINGS ..................................................................... ..................................................................... 4
RECOMMENDED OPERATING CONDITIONS........................................................... ........................................................... 5
DC ELECTRICAL CHARACTERISTICS, VCC = 2.75 V...................................................... ...................................................... 5
RF PERFORMANCE CHARACTERISTICS.............................................................. .............................................................. 6
RECEIVER PERFORMANCE CHARACTERISTICS ....................................................... ....................................................... 6
TRANSMITTER PERFORMANCE CHARACTERISTICS.................................................... .................................................... 7
SYNTHESIZER PERFORMANCE CHARACTERISTICS.................................................... .................................................... 7
CRYSTAL REQUIREMENTS ......................................................................... ......................................................................... 7
TYPICAL PERFORMANCE CHARACTERISTICS........................................................ ........................................................ 13
FUNCTIONAL DESCRIPTION ....................................................................... ....................................................................... 17
APPLICATION INFORMATION....................................................................... ....................................................................... 20
PROGRAMMING DESCRIPTION..................................................................... ..................................................................... 21
Revision History................................................................................... ................................................................................... 35
DESCRIPTION
The Texas Instruments LMX5252 Bluetooth Radio is a part of the third generation Bluetooth solution designed for
use with short-range wireless applications.
The radio integrates a complete Bluetooth Class 2 transceiver, operating in the ISM frequency band (2.4-2.5
GHz). The modulation is Gaussian Frequency Shift Keying (GF- SK) with a Bluetooth product of 0.5 and a
modulation index ranging from 0.28 to 0.35. Fast frequency hopping (1600 hops/s) is used over a total of 79
channels between 2.402 GHz up to 2.480 GHz. The channel bandwidth is 1 MHz.
The LMX5252 is designed in 0.18 µm RF CMOS technology for small die size and low power consumption. The
LMX5252 is available in a 6.0 mm x 6.0 mm 36 pin thin quad flatpack no lead (WQFN) package.
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VCC
GND
GND
PLL_OUT
GND
VCC
TP6
TP5
VCC
GND
TE
BXTLEN
RESET#
VCC
GND
BPOR
BPKTCTL
TP1/DIV2#
TP2
TP4
GND
ANT
GND
LMX5252
VTUNE
XO_P
XO_N
BDEN#
BDATA
BDCLK
BRCLK
B3k2
32kIN
GND
VREF_DIG
BDATA_1
10 11 12 13 14 15 16 17 18 19
20
21
22
23
24
25
26
27
28293334
9
8
7
6
5
4
3
2
1
TP3
36 35 32 31 30
LMX5252
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CONNECTION DIAGRAM
36 PINS WQFN
NOTE: Ground pad layout under ground slug of LMX5252 is required and must be soldered to the PCB ground.
PIN FUNCTIONS
PIN DEFAULT
TYPE DESCRIPTION
LAYOUT
NAME NO.
VCC 1 I VCC Power connection.
GND 2 GND Ground connection.
TE 3 NC Scan test enable. Leave unconnected for normal operation.
BXTLEN 4 I Baseband BRCLK enable. System clock enable signal (active high).
RESET# 5 I Reset External reset (active low).
VCC 6 I VCC Power connection.
GND 7 GND Ground connection.
BPOR 8 O NC Reset signal to baseband controller.
BPKTCTL 9 I Baseband Access code indication from baseband controller. In transmit mode this controls the
transmitter state, high = TX ON. In receive mode this controls the filter bandwidth, high =
narrow, low = wide.
BDEN# 10 I Baseband DBUS enable (active low). Latch enable, data latched from low to high.
BDDATA 11 I/O Baseband DBUS data.
BDCLK 12 I Baseband DBUS clock. Maximum 4 MHz.
BDATA_1 13 I/O Baseband Transmit/receive Bluetooth data and sync signal for transmit.
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PIN FUNCTIONS (continued)
PIN DEFAULT
TYPE DESCRIPTION
LAYOUT
NAME NO.
BRCLK 14 O Baseband Buffered system clock output. Pin36 = high then same as crystal. Pin 36 = low then divide
by 2 output.
B3k2 15 O NC 3.2 kHz clock output. Connect to ground for normal operation.
32kIN 16 I 32kHz Crystal Optional 32.0 or 32.768 kHz Input frequency for generating 3.2KHz clk. Connect to ground
for normal operation.
GND 17 GND Ground connection.
VREF_DI 18 I IO Voltage Reference voltage for digital I/O. Control signals to baseband are level shifted depending on
G this input voltage.
XO_N 19 I/O Crystal Crystal negative input.
XO_P 20 I/O Crystal Crystal positive input or external clock input.
VCC 21 I VCC Power connection.
GND 22 GND Ground connection.
PLL_OUT 23 O Loop Filter Charge pump output to loop filter.
Input
GND 24 GND Ground connection.
VTUNE 25 I Loop Filter VCO tune input from loop filter.
Output
GND 26 GND Ground connection.
VCC 27 I VCC Power connection.
TP6 28 I PLL_OUT Test point 6. Vtune calibration input. Pin with 0 ohm resistor for VTune.
TP5 29 NC Test point 5. Do not connect.
GND 30 GND Ground connection.
ANT 31 I/O Antenna Antenna I/O.
GND 32 GND Ground connection.
TP4 33 NC Test point 4. Do not connect.
TP3 34 GND Test point 3. Connect to ground.
TP2 35 GND Test point 2. Connect to ground.
TP1/DIV2# 36 NC Not supported.
ELECTRICAL SPECIFICATIONS
ABSOLUTE MAXIMUM RATINGS indicate limits beyond which damage to the device may occur.
RECOMMENDED OPERATING CONDITIONS indicate conditions for which the device is intended to be
functional, but do not specify specific performance limits.
This device is a high performance RF integrated circuit and is ESD sensitive. Handling and assembly of this
device should be performed at ESD free workstations. A 2 kV ESD rating applies to all pins.
ABSOLUTE MAXIMUM RATINGS MIN MAX UNIT
VCC Supply voltage –0.3 3.3 V
VANT Applied voltage to ANT pin –0.3 1.95 V
VIApplied voltage to all other pins –0.3 VCC + 0.3 V
ILATCH Latchup current 100 mA
ESDMM ESD Machine model(1) 200 V
ESDHBM ESD Human Body 2000 V
PIN RF Input power 4 dBm
TLLead temperature (soldering) 260 °C
TSStorage temperature –65 150 °C
(1) A 200V ESD rating applies to all pins except antenna pin (pin 31) = 150V.
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RECOMMENDED OPERATING CONDITIONS MIN TYP MAX UNIT
VCC Supply Voltage (VCC) 2.5 2.75 3 V
TATemperature, Ambient. Fully functional Blue- tooth Mode –40 25 85 °C
HUMOP Humidity across operating temperature range 8%5
DC ELECTRICAL CHARACTERISTICS, VCC = 2.75 V
PARAMETER MIN TYP MAX UNIT
VREF_DIG Reference voltage 1.5 VCC V
VIH Logical high input voltage 0.75×VCC 1.1×VCC V
VIL Logical low input voltage –0.15×VCC 0.36×VCC V
VOH Logical high output voltage 0.8×VCC 2.75 V
VOL Logical low output voltage 0 0.2×VCC V
CINP Input capacitance, digital pins 10 pF
CL-DIG Load capacitance, digital pins 10 pF
CL-AN Load capacitance, analog pins 25 pF
ICC-L Input leakage current 5 µA
TRISE Rise/Fall time, digital inputs 20 ns
TFALL Rise/Fall time, digital outputs 5 10 ns
ICC-PWDN Supply current in standby mode, XO Inactive 28 50 µA
ICC-XO Supply current in standby mode, XO Active 271 µA
ICC-RX Supply current in static RX mode 39 47 mA
ICC-TX Supply current in static TX mode 44 55 mA
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RF PERFORMANCE CHARACTERISTICS
In the performance characteristics tables the following applies:
• VCC = 2.75V unless otherwise specified.
• Temperature range from –40°C to +85°C unless otherwise specified.
• RF system performance specifications are specified on TI reference design platforms.“
• All tests performed based on Bluetooth Test Specification rev 0.92.
RECEIVER PERFORMANCE CHARACTERISTICS
PARAMETER CONDITION MIN TYP(1) MAX UNIT
2.402 GHz –80 –75
RXsense(2) Receive sensitivity BER < 0.001 2.441 GHz –80 –75 dBm
2.480 GHz –80 –75
PinRF Maximum input level –10 0 dBm
F1= + 3 MHz, F2= + 6 MHz,
IMP(3) Intermodulation performance –38 –36 dBm
PinRF = –64 dBm
RSSI Dynamic range at LNA
RSSI –72 –52 dBm
input
Input impedance of RF port
ZRFIN(4) Single input impedance Fin = 2.4 GHz 32 Ω
(RF_inout)
Return Loss Return loss(3)(5) –8 dB
PinRF = –10 dBm, –10
30 MHz < FCWI < 2 GHz, BER < 0.001
PinRF = –27 dBm, –27
2000 MHz < FCWI < 2399 MHz, BER < 0.001
Out of band blocking
OOB(3) dBm
performance PinRF =–27 dBm, –27
2498 MHz < FCWI < 3000 MHz, BER < 0.001
PinRF =–0 dBm, –10
3000 MHz < FCWI < 12.75 GHz, BER < 0.001
(1) Typical operating conditions are at 2.85V operating voltage and 25°C ambient temperature.
(2) The receiver sensitivity is measured at the device interface.
(3) The f0= –64 dBm Bluetooth modulated signal, f1= –39dbm sine wave, f2= –39 dBm Bluetooth modulated signal,
f0= 2f1– f2, and |f2- f1| = n × 1MHz, where n is 3, 4, or 5. For the typical case, n = 3.ƒ
(4) Reference Table 2
(5) Reference Table 3
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TRANSMITTER PERFORMANCE CHARACTERISTICS
PARAMETER CONDITION MIN TYP(1) MAX UNIT
2.402 GHz –3 +1 +3 dBm
POUTRF(2) Transmit output power 2.441 GHz –3 +1 +3 dBm
2.480 GHz –3 +1 +3 dBm
Power Density(3) Power density –4 1 2 dBm
MOD ∆F1AVG Data = 00001111 140 165 175 kHz
MOD ∆F2MAX(4) Modulation characteristics Data = 10101010 115 125 kHz
∆F2AVG/∆F1AVG(5) 0.8
20 dB Bandwidth 1000 kHz
| M - N | = 2 –48 –20 dBm
ACP(3) Adjacent channel power (In-band spurious) | M - N | ≥3 –51 –40 dBm
Maximum gain setting:
POUT2×fo(6) PA 2nd Harmonic suppression f0= 2402 MHz, –30 dBm
Pout = 4804 MHz
Maximum gain setting:
POUT3×fo(3) PA 3rd Harmonic suppression f0= 2402 MHz, –30 dBm
Pout = 7206 MHz
RF Output/Input Impedance of RF Port
ZRFOUT(7) Pout at 2.4 GHz 47 Ω
(RF_inout)
Return Loss(3)(8) Return Loss –14 dB
(1) Typical operating conditions are at VCC = 2.75V.
(2) The output power is measure at the device interface.
(3) Not tested in production.
(4) ΔF2max > 115 kHz for at least 99.9% of all ΔF2max.
(5) Modulation index set between 0.28 and 0.35.
(6) Out-of-Band spurs only exist at 2nd and 3rd harmonics of the CW frequency for each channel.
(7) Reference Table 1.
(8) Reference Table 4.
SYNTHESIZER PERFORMANCE CHARACTERISTICS
PARAMETER CONDITION MIN TYP MAX UNIT
fVCO VCO Frequency range 5000 MHz
tLOCK Lock time f0± 50 kHz 120 µs
∆f0offset(1)(2) Initial carrier frequency tolerance During preamble –75 0 75 kHz
∆f0drift(1)(2) Initial carrier frequency drift DH1 data packet –25 0 25 kHz
DH3 data packet –40 0 40 kHz
DH5 data packet –40 0 40 kHz
Drift Rate –20 0 20 kHz/50µs
tD-Tx Transmitter delay time From Tx data to antenna 4 µs
(1) Frequency accuracy is dependent on crystal oscillator chosen. The crystal must have a cumulative accuracy of < ±20ppm to meet
Bluetooth specifications.
(2) Not tested in production.
CRYSTAL REQUIREMENTS
The LMX5252 contains a crystal driver circuit. This circuit operates with an external crystal and capacitors to
form an oscillator. Figure 1 shows the recommended crystal circuit. Figure 3 specifies system clock
requirements.
The RF local oscillator and internal digital clocks for the LMX5252 is derived from the reference clock at the
CLK+ input. This reference may either come from an external clock or a dedicated crystal oscillator. The crystal
oscillator connections require an Xtal and two grounded capacitors.Ÿ
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It is also important to consider board and design dependant capacitance in tuning crystal circuit. Equations that
follow allow a close approximation of crystal tuning capacitance required, but actual values on board will vary
with capacitive properties of the board. As a result, there is some fine tuning of crystal circuit that has to be done
that can not be calculated, must be tuned by testing different values of load capacitance.
Many different crystals can be used with the LMX5252. Key requirements from Bluetooth specification is
±20ppm. Additionally, ESR (Equivalent Series Resistance) must be carefully considered. LMX5252 can support
maximum of 230ΩESR, but it is recommended to stay <100ΩESR for best performance over voltage and
temperature. See Figure 2 for ESR as part of crystal circuit for more information. ESR of the crystal also has
impact on the startup time of the crystal oscillator circuit of the LMX5252. TRANSMIT MODE STATE MACHINE,
for system start up timing and Table 7.
CRYSTAL
The crystal appears inductive near its resonant frequency. It forms a resonant circuit with its load capacitors. The
resonant frequency may be trimmed with the crystal load capacitance.
Load Capacitance
For resonance at the correct frequency, the crystal should be loaded with its specified load capacitance, which is
the value of capacitance used in conjunction with the crystal unit. Load capacitance is a parameter specified by
the crystal, typically expressed in pF. The crystal circuit shown in Figure 2 is composed of:
• C1 (motional capacitance
• R1 (motional resistance)
• L1 (motional inductance)
• C0 (static or shunt capacitance)
The LMX5252 provides some of the load with internal capacitors Cint. The remainder must come from the
external capacitors and tuning capacitors labeled Ct1 and Ct2 as shown in Figure 1. Ct1 and Ct2 should have
the same the value for best noise performance.
The LMX5252 has XOCTUNE which can be changed in register 2. There are 7 bits of tuning for XOCTUNE. Default
value of 0028h, which results in an additional 2.6pF internal capacitance. This register can be used in production
testing for additional tuning, if necessary. (See Table 4 for range of XOCTUNE).
Crystal load capacitance (CL) is calculated as the following:
CL= Cint + XOCTUNE + Ct1//Ct2T
The CLabove does not include the crystal internal self-capacitance C0 as shown in Figure 2, so the total
capacitance is:
Ctotal = CL+ C0
Based on crystal spec and equation:
CL=Cint + XOCTUNE + Ct1//Ct2m
CL= 8pF + 2.6pF + 6pF = 16.6pF
16.6pF is very close to the TEW crystal requirement of 16pF load capacitance. With the internal shunt
capacitance Ctotal:
Ctotal = 16.6pF + 5pF = 21.6pF
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R1 C1 L1
C0
CLK+ CLK-
Ct1 Ct2
Crystal
LMX5252
Cint
XOCTUNE
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Figure 1. LMX5252 Crystal Recommended Circuit•
Figure 2. Crystal Equivalent Circuit
Crystal Pullability
Pullability is another important parameter for a crystal, which is the change in frequency of a crystal with units of
ppm/pF, either from the natural resonant frequency to a load resonant frequency, or from one load resonant
frequency to another. The frequency can be pulled in a parallel resonant circuit by changing the value of load
capacitance. A decrease in load capacitance causes an increase in frequency, and an increase in load
capacitance causes a decrease in frequency.
Frequency Tuning
Frequency Tuning is achieved by adjusting the crystal load capacitance with external capacitors. It is a Bluetooth
requirement that the frequency is always within ±20 ppm. Crystal/oscillator must have cumulative accuracy
specifications of ±15 ppm to provide margin for frequency drift with aging and temperature.
TEW Crystal
The LMX5252 has been tested with the TEW TAS-4025A crystal, reference Table 1 for specification. Since the
internal capacitance of the crystal circuit is 8 pF and the load capacitance is 16 pF, 12 pF is a good starting point
for both Ct1 and Ct2. The 2480 MHz RF frequency offset is then tested. Figure 3 shows the RF frequency offset
test results.
Figure 3 shows the results are –20 kHz off the center frequency, which is –1 ppm. The pullability of the crystal is
2 ppm/pF, so the load capacitance must be decreased by about 1.0 pF. By changing Ct1 or Ct2 to 10 pF, the
total load capacitance is decreased by 1.0 pF. Figure 4 shows the frequency offset test resuts. The frequency
offset is now zero with Ct1 = 10 pF, Ct2 = 10 pF.
Reference Table 2 for crystal tuning values used on Phoenix Development Board with TEW crystal.
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Table 1. TEW TAS-4025A
SPECIFICATION VALUE
Package 4.0x2.5x0.65 mm - 4 pads
Frequency 13.000 MHz
Mode Fundamental
Stability > ±15ppm at –40 to +85C
CL Load Capacitance 16pF
ESR 80 Ωmax.
C0 Shunt Capacitance 5pF
Drive Level 50 ±10uV
Pullability 2 ppm/pF min
Storage Temperature –40 to +85C
Table 2. TEW on Tucson Board
REFERENCE LMX5252
Ct1 10pF
Ct2 10pF
Figure 3. Frequency Offset with 12pF //12 pF Capacitors
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Figure 4. Frequency Offset with 10 pF//10 pF Capacitors
Table 3. System Clock Requirements
PARAMETER MIN TYP MAX UNIT
CREF External reference clock frequency 10 13 20 MHz
CTOL Frequency tolerance (over full operating temperature and aging) –20 ±15 +20 ppm
XOCTUNE Digital crystal tuning load range 8 pF
COSC Crystal oscillator 10 13 20 MHz
CESR Crystal serial resistance 230 Ω
CREF-PS External reference clock power swing, pk to pk 100 200 400 mV
Cint Internal load capacitance 8 pF
CAGE Aging ±1 ppm/year
Table 4. Register 2: XOCTUNE Tuning Load Range
BINARY VALUE HEX VALUE VALUE UNIT
000 0000 0 0 pF
010 1000 28(1) 2.6 pF
111 1111 7F 8 pF
(1) Default value for RF initialization register 2.
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FUNCTIONAL DESCRIPTION
The circuitry of the LMX5252 (see FUNCTIONAL BLOCK DIAGRAM) utilizes a heterodyne receiver architecture
with a low intermediate frequency (2 MHz) such that the intermediate frequency filters can be integrated on chip.
The receiver consists of a low-noise amplifier (LNA) followed by two mixers. The intermediate frequency signal
processing blocks consist of a poly-phase bandpass filter (BPF), two hard-limiters (LIM), a frequency
discriminator (DET), and a post-detection filter (PDF). The received signal level is detected by a received signal
strength indicator (RSSI).
The received frequency equals the local oscillator frequency (fLO) plus the intermediate frequency (fIF):
fRF = fLO + fIF (supradyne).
The LMX5252 is able to operate with multiple reference frequencies between 10 and 20 MHz. Simulations to
ensure performance are done with 13.0 MHz, 26.0 MHz (used by GSM and WCDMA platforms in Europe), and
19.2 MHz. To operate with multiple reference frequencies, the LMX5252 contains a fractional-N delta-sigma
synthesizer. The synthesizer consists of a phase detector, a charge pump, an (off-chip) loop-filter, an RF-
frequency divider, and a voltage controlled oscillator (VCO).
The transmitter utilizes IQ-modulation with bit-stream data that is gaussian filtered. Other blocks included in the
transmitter are a VCO buffer and a power amplifier (PA).
SYSTEM INTERACTION
For complete operation, the LMX5252 must be connected with a Bluetooth baseband controller (e.g., LMX5100)
or to a device that can emulate the baseband functionality. The baseband function is to read and write to the
internal registers in the radio chip. These registers are used for setting the frequency, tuning, and control. The
communication between the baseband controller and the radio chip is performed via the serial interface. The
LMX5252 also requires an external antenna. The antenna must be connected through a 50 ohm interface. The
power supply is divided externally into four parts: two for the RF blocks (RF and VCO), one for the IF blocks, and
one for the low frequency and digital blocks. Each of the supplies must be low frequency decoupled for maximum
performance.
RECEIVER FRONT-END
The receiver front-end consists of a low-noise amplifier (LNA) followed by two mixers and two low-pass filters for
the I- and Q-channels.
The intermediate frequency (IF) part of the receiver front end consists of two IF amplifiers that receive input
signals from the mixers, delivering balanced I- and Q-signals to the poly-phase bandpass filter. The poly-phase
bandpass filter is directly followed by two hard-limiters that together generate an AD-converted RSSI signal.
Poly-Phase Bandpass Filter
The purpose of the IF bandpass filter is to reject noise and spurious (mainly adjacent channel) interference that
would otherwise enter the hard limiting stage. In addition, it takes care of the image rejection.
The bandpass filter uses both the I- and Q-signals from the mixers. The out-of-band suppression should be
higher than 40 dB (f<1 MHz, F>3 MHz). The bandpass filter is tuned over process spread and temperature
variations by the autotuner circuitry. A 5th order Butterworth filter is used
Hard-Limiter and RSSI
The I- and Q-outputs of the bandpass filter are each followed by a hard-limiter. The hard-limiter has its own
reference current. The RSSI (Received Signal Strength Indicator) measures the level of the RF input signal.
The RSSI is generated by piece-wise linear approximation of the level of the RF signal. The RSSI has a mV/dB
scale, and an analog-to-digital converter for processing by the baseband circuit. The input RF power is converted
to a 5- bit value. The RSSI value is then proportional to the input power (in dBm).
The digital output from the ADC is sampled on the BPKTCTL signal low-to-high transition.
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RECEIVER BACK-END
The hard-limiters are followed by a two frequency discriminators. The I-frequency discriminator uses the 90×
phase shifted signal from the Q-path, while the Q-discriminator uses the 90× phase-shifted signal from the I-path.
A polyphase bandpass filter performs the required phase shifting. The output signals of the I- and Q-discriminator
are substracted and filtered by a low-pass filter. An equalizer is added to improve the eye-pattern for 101010
patterns.
After equalization, a dynamic AFC (automatic frequency offset compensation) circuit and slicer extract the
RX_DATA from the analog data pattern. It is expected that the Eb/No of the demodulator is approximately 17 dB.
Frequency Discriminator
The frequency discriminator gets its input signals from the limiter. A defined signal level (independent of the
power supply voltage) is needed to obtain the input signal. Both inputs of the frequency discriminator have
limiting circuits to optimize performance. The bandpass filter in the frequency discriminator is tuned by the
autotuning circuitry.
Post-Detection Filter and Equalizers
The output signals of the FM discriminator first go through a post-detection filter and then through an equalizer.
Both the post-detection filter and equalizer are tuned to the proper frequency by the autotuning circuitry. The
post-detection filter is a low-pass filter intended to suppress all remaining spurious signals, such as the second
harmonic (4 MHz) from the FM detector and noise generated after the limiter.
The post-detection filter also helps for attenuating the first adjacent channel signal. The equalizer improves the
eye opening for 101010 patterns. The post-detection filter is a third order Butterworth filter.
AUTOTUNING CIRCUITRY
The autotuning circuitry is used for tuning the bandpass filter, the detector, the post-detection filter, the equalizer,
and the transmit filters for process and temperature variations. The circuit also includes an offset compensation
for the FM detector.
SYNTHESIZER
The LMX5252 features a fractional-N delta-sigma (DS) synthesizer that operates using an external reference
frequency in the range of 10 to 20 MHz or, alternatively, up to 40 MHz.
The synthesizer consists of a phase-frequency detector, a charge pump, a low-pass loop filter, a programmable
frequency divider, a voltage-controlled oscillator (VCO), a delta-sigma modulator, and a lookup table.
The frequency divider consists of a divide-by-2 circuit (divides the 5 GHz signal from the VCO down to 2.5 GHz),
a divide-by-8-or-9 divider, and a digital modulus control. The delta-sigma modulator controls the division ratio and
also generates an input channel value to the lookup table.
Phase-Frequency Detector
The phase-frequency detector is a 5-state phase-detector. It responds only to transitions, hence phase-error is
independent of input waveform duty cycle or amplitude variations. Loop lockup occurs when all the negative
transitions on the inputs, F_REF and F_MOD, coincide. Both outputs (i.e., Up and Down) then remain high. This
is equal to the zero error mode. The phase-frequency detector input frequency range is between 10 and 20 MHz.
The phase-frequency detector has the option of being turned off such that the PLL can be opened. The
enabling/disabling of the phase detector operation is performed by the control signal PHD_ON. This mode is not
actively used in the LMX5252.
TRANSMITTER CIRCUITRY
The transmitter consists of ROM tables, two Digital to Analog (DA) converters, two low-pass filters, IQ mixers,
and a power amplifier (PA).
The ROM tables generate a digital IQ signal based on the transmit data. The output of the ROM tables is
inserted into IQ-DA converters and filtered through two low-pass filters. The two signal components are mixed up
to 2.5 GHz by the TX mixers and added together before being inserted into the transmit PA.
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IQ-DA Converters and TX Mixers
The ROM output signals drive an I- and a Q-DA converter. Two Butterworth low-pass filters filter the DA output
signals. The 6 MHz clock for the DA converters and the logic circuitry around the ROM tables are derived from
the autotuner.
The TX mixers mix the balanced I- and Q-signals up to 2.4- 2.5 GHz. The output signals of the I- and Q-mixers
are summed.
LOW FREQUENCY CIRCUITRY
The low frequency circuitry includes an adjustable crystal oscillator (XO), an adjustable low power oscillator
(LPO), a power-on reset (POR) block, and an off-chip reset input. For generation of the system clock, a 10-20
MHz crystal or up to a 40 MHz external reference clock input can be used.
For operation in low power modes, the low frequency circuitry generates a 3.2 kHz clock, synthesized from a
32.768 kHz or 32.0 kHz signal. The source can be either a reference clock or crystal signal input. Alternatively,
the main system clock can be used.
DIGITAL CIRCUITRY
The digital functions of the LMX5252 provide I- and Q-signal generation in the transmitter, baseband interface
control, filter tuning, fractional XO and PLL frequency division, and power-up control for all analog blocks. The
digital circuitry also allows for programming of the analog blocks in order to compensate for process variations.
By using an external voltage reference, the serial interface automatically adjusts the logic voltage levels to
different baseband controllers.
The logic is contained in the Control Logic and Serial Interface and the IQROM blocks. Scan testing is used for
all logic.
CRYSTAL OSCILLATOR
The oscillator should be as accurate as possible. If the LMX5252 is used in an application that already uses an
XTAL oscillator, the oscillator circuitry will act as buffer to an AC coupled via 10 pF to a small signal (100 to 400
mVp). Alternatively, via a 20 kΩresistor in series with 10 pF for an externally applied CMOS (square-wave)
signal into pin XO_P.
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APPLICATION INFORMATION
Figure 11. Base Band RF Interface
BDATA_1: Transmit/receive Bluetooth data and sync signal for transmit interface to RFDATA.
The RFDATA signal is the multiplexed Bluetooth data receive and transmit signal. The data is provided at a bit
rate of 1 Mbit/s with 12× oversampling, synchronized to the 12 MHz BBCLK. The RFDATA signal is a dedicated
RF interface pin. This signal is driven to a logic high after reset.
BPKTCTL: Access code indication from baseband controller. In transmit mode this controls the transmitter state,
high = TX ON. In receive mode this controls the filter bandwidth, high = narrow, low = wide interface to BTSEQ,
signals indicate internal states of the Bluetooth sequencer, which are used for interfacing to some external
devices.
BXTLEN: BRCLK enable. System clock enable signal (active high) interface to RFCE. The RFCE signal is the
chip enable to the radio chip. When RFCE is high, RF chip power is controlled by its power control registers.
When RFCE is low, the RF chip is powered-down. However, the serial interface is operational and the CP3000
device can access the RF chip internal registers. The RFCE signal is an alternate function of a general-purpose
I/O pin. At reset, this pin is in TRI-STATE mode. Software must enable the alternate function of the pin to give
control over this signal to the RF interface. During Bluetooth power-down phases, the CP3000 device provides a
mechanism to reduce the power consumption of an external RF chip by driving the RFCE signal of the RF
interface to a logic low level. This feature is available when the Power Management Module of the CP3000
device has enabled the Hardware Clock Control mechanism.
BPOR: Reset signal to baseband controller interface to RESET, Chip general reset with internal pull-down. NC
for normal operation.
RESET#: External reset (active low) to RF chip from baseband controller
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BRCLK: Buffered system clock output. Pin36 = high then same as crystal. Pin 36 = low then divide by 2 output,
interface to the X1CKI/BBCLK, is the input signal for the 12- MHz clock signal. The radio chip uses this signal
internally as the 12× oversampling clock and provides it externally to the CP3000 device for use as the Main
Clock. Some CP3000 devices have a separate CLKIN pin for receiving an external clock.
BDDATA; I/O DBUS data interface to SDAT. The SDAT signal is multiplexed serial receive and transmit data
between the radio chip and the CP3000 device. The SDAT signal is an alternate function of a general-purpose
I/O pin. At reset, this pin is in TRI-STATE mode. Software must enable the alternate function of the pin to give
control over this signal to the RF interface.
BDCLK: DBUS clock. Maximum 4 MHz interfaces to SCLK. The SCLK signal is the serial interface shift clock
output. The CP3000 device always acts as the master of the serial interface and therefore always provides the
shift clock. The SCLK signal is an alternate function of a general-purpose I/O pin. At reset, this pin is in TRI-
STATE mode. Software must enable the alternate function of the pin to give control over this signal to the RF
interface.
BDEN#: DBUS enable (active low). Latch enable, data latched from low to High, interface to SLE. The SLE pin is
the serial load enable output of the serial interface of the CP3000 device. During write operations (to the radio
chip registers), the data received by the shift register of the radio chip is copied into the address register on the
next rising edge of SCLK after the SLE signal goes high. During read operations (read from the registers), the
radio chip releases the SDAT line on the next rising edge of SCLK after the SLE signal goes high. At reset, this
pin is in TRI-STATE mode. Software must enable the alternate function of the pin to give control over this signal
to the RF interface.
PROGRAMMING DESCRIPTION
RADIO-BASEBAND INTERFACE
The radio-baseband (RF-BB) interface is comprised of eight signal pins according to the BlueRF specification.
However, in the LMX5252, two additional pins are present. These pins are BPOR and B3k2. BPOR is used for
power-on reset of the baseband. B3k2 is a clock output from the radio supplying a 3.2 kHz reference clock to the
baseband for low power mode operation.
SERIAL INTERFACE TIMING
Table 5. Serial Interface Timing
PARAMETER CONDITION MIN TYP MAX UNIT
tCS Data to clock setup time 10 ns
tCH Data to clock hold time 1 ns
tCWH Clock pulse width high 20 ns
tCWL Clock pulse width low 20 ns
See Figure 4
tES Clock to enable setup time 5 ns
tCES Enable to clock setup time 5 ns
tEWH Enable pulse width high 200 ns
tEWL Enable pulse width low 2500 ns
Figure 12. Serial Port Write Timing Diagram
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ACCESSING THE REGISTERS
The registers in the radio are accessed over the DBUS (see Table 2).
Table 6. Radio Registers
FIELD NO. OF BITS COMMENT
Device Address 3 Radio is allocated binary device address 101.
Read/Write 1 Driving this bit high indicates a read operation.
Register Address 5
Data 16
When accessing a 32-bit register the user must write to the same register twice. The highest bits ([31:16]) are
accessed first and on the second write, the lowest bits ([15:0]) are accessed. The time in-between these two
accesses must be at least two clock cycles. In the case of a 4 MHz clock, the minimum time would be 500 ns.
16-Bit Register
When reading a 16-bit register, the value of the register is read back. If a value of 0x0063 is written, 0x0063 is
read back.
32-Bit Register
The value read from a 32-bit register is not the actual register value, but a counter value. The value that the user
receives when reading a 32-bit register depends on read/ write order. If the highest bits are written first, 0x0000
is read back. If the lowest bits are written first, 0x0001 is read back. If the user writes two consecutive times to
the register, 0x0001 is always read back. The read back of a 32-bit WORD is independent of data written to the
register.
Example 1
Writing 0xFFFF DC04 to register 10.
BDDATA 101 0 01010 1111111111111111
BDDATA 101 0 01010 1101110000000100
Reading register 10.
BDDATA 101 1 01010 and following value is received: 0000000000000001
Example 2
Writing 0xFFFF DC04 to register 10 when doing read back between the writing.
BDDATA 101 0 01010 1111111111111111
BDDATA 101 1 01010 and following value is received: 0000000000000000
BDDATA 101 0 01010 1101110000000100
BDDATA 101 1 01010 and following value is received: 00000000000000011
The order for accessing the registers is from high to low: 17, 15, 14, 12, 11, 10, 9, 8, 7, 6, 5, 4, 2, and 1. These
registers need to be written to during the initialization of the radio. After initialization the radio is ready to transmit
or receive. The radio receives and transmits on the positive edge of the BDCLK. Figure 13 and Figure 14 show
the timing for register writing and reading.
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Figure 13. 32-Bit Register Write Timing
Figure 14. 32-Bit Register Read Timing
POWER-UP MODE, STATE MACHINE
When the LMX5252 is powered up, it enters a power-up mode and the power-up sequence is started. After that,
the LMX5252 performs a controlled reset of the baseband (see Figure 15 and Figure 16). The LMX5252 states
are described in the following paragraphs.
Off: When the LMX5252 enters Off mode, all configuration data is lost. In this state, the LMX5252 also drives
BPOR low.
Power-up: When the power supply is on and the RESET# is high, the LMX5252 starts up the crystal oscillator
and enters Power-up mode. After the crystal oscillator (XO) is settled, the LMX5252 sends four clock cycles on
the BRCLK before driving BPOR high.
RF init: The baseband now drives BXTLEN high and takes control of the XO. The baseband performs all the
needed initialization (i.e., writing the registers in the radio, such as XO trim).
Idle: The baseband drives BDATA_1 low when the initialization is ready. The LMX5252 is now ready to start
transmitting, receiving, or to enter Sleep mode.
Sleep: The LMX5252 can be forced into Sleep mode at any time by driving BXTLEN low. All configuration
settings are kept, only the Bluetooth low power clock is running (B3k2).
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Idle
Wait XTL
RF init
Power-up
Off
Sleep
XTL XO settled
BXTLEN = 1
From any state after RF init
Wait for XTL
BXTLEN = 1
Wait for XTL XO to settle
From any state
RESET# = 1
XTL XO settled
%'$7$B 'RQ¶WFDUH
Write registers
RESET# = 0 or
Power supply is switched on/off
Power supply on
XO to settle
BXTLEN = 0
LMX5252
SNOSCW4A –DECEMBER 2004–REVISED APRIL 2013
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Wait XTL: When BXTLEN goes high, the crystal oscillator becomes operational. When it is stable, the LMX5252
enters Idle mode and outputs the BRCLK for the baseband.
Figure 15. Power-Up Sequence
TRANSMIT MODE STATE MACHINE
LMX5252 Radio can only initiate a transmit sequence from the idle state mode, see Figure 16.
Idle: To initiate the transmit mode, the baseband needs to write a new channel number to the radio. This write
command enables the PLL counter. (The counter value is set in register 1 bit(7:0)
Wait data: The PLL counter starts to count down and when it reaches zero the PLL is enabled. LMX5252 then
waits for the TX clock synchronization on BDATA_1.
Data: Synchronization is done; LMX5252 is in this state until BPKTCTL goes high.
TX power up: When the BPKTCTL is high the complete transmit path is powered up. Now LMX5252 is
transmitting a carrier and is waiting for TX data on BDATA_1.
TX data: The transmit path is powered down by BPKTCTL going low. Note that the synthesizer is still active.
The synthesizer is active during the complete transmit sequence until LMX5252 is in idle state.
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Start up and initiation of the radio
RESET#
BDATA_1
BXTLEN
BRCLK
(13 MHz)
BPOR
B3k2
(3.2 kHz)
BDEN#
BDCLK
(4 MHz)
BDDATA
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SNOSCW4A –DECEMBER 2004–REVISED APRIL 2013
Figure 16. Power-up Timing Diagram
Table 7. Start Up Timing
PARAMETER TIME COMMENT
t1 20 ms Start up time for the crystal.
t2 350 ns for 13 MHz clock BPOR to the baseband will go high after 4.5 clock cycles.
t3 Depends of the baseband when it is ready to set BXTLEN high after receiving BPOR from the
radio.
t4 Depends of the baseband how long time after BXTLEN goes high it is ready to set BnDEN
low.
t5 Is set by the baseband; the radio is not dependent on it at all.
t6 6.25 µs 26 (4 MHz) clock cycles are needed to access/doing register writing.
t7 Minimum 500 ns At least 2 clock cycles are needed in between accessing two registers.
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PARAMETER TIME MEASURED COMMENT
TIME
t1 The radio is ready for transmit mode as soon as the frequency is written. After that
LMX5252 is just waiting for the synchronization pulse.
t2 1 µs 1 µs Synchronization pulse ≥0.3 µs.
t3 109 µs Is set by the baseband.
t4 Need to 86 µs Time between BPKTCTL goes high and data is available on BDATA1.
optimized TX is turned on when BPKTCTL goes high, the PA is turned on x µs after that. x is set
by register 17, (bit 15:8).
t5 Need to Time between no data on BDATA_1 and BPKTCTL goes low.
optimized The Pa is turned off when BPKTCTL goes low the rest of the TX path turns off x µs
after the PA. x is set by register 17, (bit 7:0).
RECEIVE MODE STATE MACHINE
LMX5252 Radio can only initiate a receive sequence from the idle state, see Figure 19.
Idle: To enter receive mode the baseband needs to write a new channel number to the radio. This write
command enables the PLL counter. This counter is set in register 1 and sets the settling time for the receive
path.
RX PLL: The PLL starts and the counter begins counting down (1ìs/bit) when BnDEN goes high.
RX Wide Filt: When the counter reaches the value 0 the receive path is powered up and begins detecting the
incoming data using the wide tracking filter.
RX Narrow Filt: Upon detection of the access code, the baseband drives the BPKTCTL high and the radio
switches to the narrow tracking filter.
After receiving the last data-bit, the baseband ends the receive sequence and puts the radio back to Idle state.
Both the RX path and the PLL are powered down. LMX5252 now releases BDATA_1 to be used by the
baseband.
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RESET#
BDEN#
BDATA_1
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Figure 20. Rx-Mode Timing Diagram
PARAMETER TIME MEASURED TIME COMMENT
t1 120 µs 120 µs Time between when BnDEN goes high and when the radio puts data on BDATA1.
Depends on when the baseband has detected the access code. The LMX5252
t2 requires that BPKTCTL goes high for at least 1 is after BDATA_1 is done to switch
off RX path.
Time between register writing for switching off RX path and set new node and
t3 11.2 µs channel. This register writing will be implemented and used for LMX5252.
REGISTER MAPPING
Table 8 specifies the different registers in the LMX5252 Read or Write status, the address and value at power-
up, and programmed value. Some of the trim registers have specific values and are indicated by a note in the
table. Values programmed after startup are 12MHz clock source.
Table 8. Register Setup(1)
Register Width Power-Up Value Program Value Program Value
Address Register Name R/Wb
(Bits) (Hex) (Hex) (Binary)
(Decimal)
0 RF Channel (2) 16 W, R 0005 N/A N/A
1 SyntRxOnCounter(3) 16 W, R FFFF 5A00 0101 1010 0000 0000
2 XO Trim 16 W, R 0000 0028 0000 0000 0010 1000
3 RSSI 16 R Undefined NA NA
(1) Two words needs to be written consecutive to the same address.
(2) Register 0 must be updated every frame.
(3) Register 1, 2, 4-12, 14, 15, and 17 must be updated after power-up.
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Table 8. Register Setup(1) (continued)
Register Width Power-Up Value Program Value Program Value
Address Register Name R/Wb
(Bits) (Hex) (Hex) (Binary)
(Decimal)
4 Trim (1)(3)(4) 32 W, Wc 0037 003C 0000 0000 0011 1100
0000 D400 1101 0100 0000 0000
5 Control (3) 16 W, R 0050 4844 0100 1000 0100 0100
6 BlockOn(1)(3) (5) 32 W, Wc 0000 0080 0000 0000 1000 0000
0040 0060 0000 0000 0110 000
7 Enable(3) 16 W, R 0007 001F 0000 0000 0001 1111
8 Power Control (3) 16 W, R 001F 0016 0000 0000 0001 0110
9 Frequency Reference(1)(3) 32 W, R, 0013 0012 0000 0000 0001 0010
(6) Wc D620 4F80 0100 1111 1000 0000
10 Clock Division(1) (3)(6) 32 W, Wc FFFF FFFF 1111 1111 1111 1111
DC04 F801 1111 1000 0000 0001
11 DSMIN(1) 32 W, Wc 0000 0000 0000 0000 0000 0000
0000 0000 0000 0000 0000 0000
12 DSMOUT 32 W, R 0000 0000 0000 0000 0000 0000
13 Test pins(4) 16 W, R FFFF FFFF 1111 1111 1111 1111
14 LPO Division(1) (3) 32 W, Wc 0092 00A0 0000 0000 1010 0000
8EC3 8EC3 1000 1110 1100 0011
15 Auxiliary(7)(8) (9) 32 W, Wc 004A 0150 0000 0001 0100 1010
0000 A100 1110 1101 0000 0000
16 MidTiming 16 W, R 0000 0000 0000 0000 0000 0000
17 PA Counter(8) 16 W, R FFFF 0108 0000 0001 0000 1000
18 WrOffMode 16 W xxxx xxxx xxxx
30 ManufacturerCode1 16 R E3C7 N/A N/A
31 ManufacturerCode2(10) 16 R 6000 N/A N/A
(4) Register 13 is only for test and does not need to be updated after power-up.
(5) In conjunction with CP3000 rev B0, B1
(6) Clock Division Ratio set for 12MHz
(7) Two words needs to be written consecutive to the same address.
(8) Register 1, 2, 4-12, 14, 15, and 17 must be updated after power-up.
(9) Register 13 is only for test and does not need to be updated after power-up.
(10) Clock Division Ratio set for 12MHz
Table 9. Selected Register Description
REGISTER REGISTER NAME BIT DESCRIPTION
2 XO TRIM 6:0 Trim value for the internal capacitor load of the crystal
3 RSSI 4:0 The RSSI is read when RSSI register is accessed
4 TRIM- VCO Cal 23 VCO calibration bit
TRIM- VCO trim 22:20 VCO frequency range trim value
TRIM- CS trim 19:16 Current source trim value for both PA and charge pump
TRIM- Tx bias 15:12 Current source trim value for both V to I and the mixer driver
TRIM- RGTRIMLO 11:8 The 4 bit signal controls the expectation value
TRIM- RGTRIMLO 7:0 Spare bits
8 Power Control 4 Gain Step
Power Control 3:0 Internal PA current timing
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Table 10. Component Bill of Material for 12 MHz
REFERENCE DESCRIPTION VALUE TOLERANCE SIZE
C1, C2, C3, C8. C9. C10 Ceramic Capacitor 4.7 pF 20% 402
C5 Ceramic Capacitor 39 pF 20% 402
C6 Ceramic Capacitor 220 pF 10% 402
C7 Ceramic Capacitor 2200 pF 10% 402
C11 Ceramic Capacitor 2.2 uF 20% 603
C12 Ceramic Capacitor 0.1 uF 20% 603
C13 Ceramic Capacitor 12 pF 10% 402
C14 Ceramic Capacitor 15 pF 10% 402
R1 Resistor 10 kΩ5% 402
Crystal 12MHz
R2 Resistor 3.3 kΩ5% 402
R3 Resistor NM 0Ω402
Table 11. Component Bill of Material for 13 MHz
REFERENCE DESCRIPTION VALUE TOLERANCE SIZE
C1, C2, C3, C8. C9. C10 Ceramic Capacitor 4.7 pF 20% 0402
C5 Ceramic Capacitor 39 pF 20% 0402
C6 Ceramic Capacitor 220 pF 10% 0402
C7 Ceramic Capacitor 3300 pF 10% 0402
C11 Ceramic Capacitor 2.2 uF 20% 0603
C12 Ceramic Capacitor 0.1 uF 20% 0603
C13 Ceramic Capacitor 12 pF 10% 0402
C14 Ceramic Capacitor 15 pF 10% 0402
R1 Resistor 10 kΩ5% 0402
Crystal 13MHz
R2 Resistor 3.3 kΩ5% 0402
R3 Resistor NM 0Ω0402
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REVISION HISTORY
Changes from Original (December 2004) to Revision A Page
• Added all the revision histories that were at the end of this data sheet. ............................................................................ 34
• Added 0.1 (April 2003) First draft of advance datasheet. ................................................................................................... 34
• Added 0.2 (June 2003) This update includes modifications to electrical specs, minor corrections, and the addition of
the Physical Dimensions section. ....................................................................................................................................... 34
• Added 0.3 (July 2003) Update of physical dimensions. Changed document status from Advance Information to
Preliminary. ......................................................................................................................................................................... 34
• Added 0.4 (August 2003) Updates in Tables 2, 4, 5, and 6. New subsections added to Functional Description.
Addition of Programming Description section. .................................................................................................................... 34
• Added 0.5 (March 2004) Updates to Application diagram, Register description, Pin description, Crystal
specifications and Operating conditions ............................................................................................................................. 34
• Added 0.7 (May 2004) Updates to Applications Diagram, BOM, Selected register description, Register values,
Electrical Specifications, and Pin descriptions .................................................................................................................... 34
• Added 0.8 (July - Sept 2004) Addition of reference schematics, Base band RF interface description, typical
performance characteristics and new information on crystal tuning Not released ............................................................. 34
• Added 1.0 (December 2004) See Table 21 on page 36 for edits to current revision. ........................................................ 34
• Changed to ordering information – Connections Diagram ................................................................................................. 34
• Changed B3K2 default to ground – Pin Description ........................................................................................................... 34
• Changed to Tx/Rx impedance, synthesizer lock time, output power, 2nd & 3rd Harmonics, lead soldering
temperature, humidity of operation, absolute maximum input power – Electrical Specifications ....................................... 34
• Added Tx/Rx impedance plots – Typical Performance Characteristics .............................................................................. 34
• Added to reg 15 – Register Map ......................................................................................................................................... 34
• Added Update to loop filter values and new schematic and layout added – Application Diagram Schematics ................. 34
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PACKAGE OPTION ADDENDUM
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Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LMX5252LQ/NOPB ACTIVE WQFN NJJ 36 250 Green (RoHS
& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 X5252LQ
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
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Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LMX5252LQ/NOPB WQFN NJJ 36 250 178.0 16.4 6.3 6.3 1.5 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 21-Nov-2016
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LMX5252LQ/NOPB WQFN NJJ 36 250 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 21-Nov-2016
Pack Materials-Page 2
MECHANICAL DATA
NJJ0036B
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LQA36B (Rev A)
IMPORTANT NOTICE
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