2N4401
Characteristics Kennwerte
Tj = 25°C Min. Typ. Max.
Collector-Emitter saturation voltage – Kollektor-Emitter-Sättigungsspg. 1)
IC = 150 mA, IB = 15 mA
IC = 500 mA, IB = 50 mA VCEsat
–
–
–
–
0.40 V
0.75 V
Base-Emitter saturation voltage – Basis-Emitter-Sättigungsspannung 1)
IC = 150 mA, IB = 15 mA
IC = 500 mA, IB = 50 mA VBEsat
0.75 V
–
–
–
0.95 V
1.2 V
Collector-Base cutoff current – Kollektor-Basis-Reststrom
VCE = 35 V, VEB = 0,4 V ICBV – – 100 nA
Emitter-Base cutoff current – Emitter-Basis-Reststrom
VCE = 35 V, VEB = 0,4 V IEBV – –- 100 nA
Gain-Bandwidth Product – Transitfrequenz
IC = 20 mA, VCE = 10 V, f = 100 MHz fT250 MHz – –
Collector-Base Capacitance – Kollektor-Basis-Kapazität
VCB = 5 V, IE = ie = 0, f = 1 MHz CCBO – – 6.5 pF
Emitter-Base Capacitance – Emitter-Basis-Kapazität
VEB = 0.5 V, IC = ic = 0, f = 1 MHz CEBO – – 30 pf
Switching times – Schaltzeiten (between 10% and 90% levels)
delay time
rise time
VCC = 30 V, VEB = 2 V
IC = 150 mA, IB1 = 15 mA
td– – 15 ns
tr– – 20 ns
storage time
fall time
VCC = 30 V, IC = 150 mA,
IB1 = IB2 = 15 mA
ts– – 225 ns
tf– – 30 ns
Thermal resistance junction to ambient
Wärmewiderstand Sperrschicht – Umgebung RthA < 200 K/W 2)
Disclaimer: See data book page 2 or website
Haftungssauschluss: Siehe Datenbuch Seite 2 oder Internet
1 Tested with pulses tp = 300 µs, duty cycle ≤ 2% – Gemessen mit Impulsen tp = 300 µs, Schaltverhältnis ≤ 2%
2 Mounted on P.C. board with 3 mm2 copper pad at each terminal
Montage auf Leiterplatte mit 3 mm2 Kupferbelag (Lötpad) an jedem Anschluss
2http://www.diotec.com/ © Diotec Semiconductor AG