Product
Folder
Sample &
Buy
Technical
Documents
Tools &
Software
Support &
Community
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM119
,
LM219
,
LM319
SNOSBJ2B –AUGUST 2000–REVISED JANUARY 2016
LMx19 High Speed Dual Comparator
1
1 Features
1• Two Independent Comparators
• Operates from a Single 5-V Supply
• Typically 80-ns Response Time at ±15 V
• Minimum Fan-out of 2 Each Side
• Maximum Input Current of 1 μA Over
Temperature
• Inputs and Outputs can be Isolated from System
Ground
• High Common-Mode Slew Rate
Connection Diagram
Typical Application - Relay Driver
2 Description
The LM119 series are precision high-speed dual
comparators fabricated on a single monolithic chip.
They are designed to operate over a wide range of
supply voltages down to a single 5-V logic supply and
ground. They have higher gain and lower input
currents than devices such as the LM710. The
uncommitted collector of the output stage makes the
LM119 compatible with RTL, DTL, and TTL, as well
as capable of driving lamps and relays at currents of
up to 25 mA.
The LM319A offers improved precision over the
standard LM319, with tighter tolerances on offset
voltage, offset current, and voltage gain.
Although designed primarily for applications requiring
operation from digital logic supplies, the LM119 series
are fully specified for power supplies up to ±15 V.
The series features faster response than the LM111,
at the expense of higher power dissipation. However,
the high-speed, wide operating voltage range and low
package count make the LM119 more versatile than
older devices such as the LM711.
The LM119 is specified from −55°C to +125°C, the
LM219 is specified from −25°C to +85°C, and the
LM319A and LM319 are specified from 0°C to +70°C.
Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
LM119, LM219,
LM319
TO-100 (10) 8.96 mm × 8.96 mm
CDIP (14) 6.67 mm × 19.56
mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
2
LM119
,
LM219
,
LM319
SNOSBJ2B –AUGUST 2000–REVISED JANUARY 2016
www.ti.com
Product Folder Links: LM119 LM219 LM319
Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated
Table of Contents
1 Features.................................................................. 1
2 Description............................................................. 1
3 Revision History..................................................... 2
4 Pin Configuration and Functions......................... 3
5 Specifications......................................................... 4
5.1 Absolute Maximum Ratings ...................................... 4
5.2 ESD Ratings.............................................................. 4
5.3 Thermal Information.................................................. 4
5.4 Electrical Characteristics LM119, LM219.................. 5
5.5 Electrical Characteristics LM319, LM319A............... 6
5.6 Typical Characteristics.............................................. 7
6 Detailed Description............................................ 10
6.1 Functional Block Diagram....................................... 10
7 Application and Implementation ........................ 11
7.1 Typical Applications ................................................ 11
8 Device and Documentation Support.................. 12
8.1 Related Links .......................................................... 12
8.2 Community Resources............................................ 12
8.3 Trademarks............................................................. 12
8.4 Electrostatic Discharge Caution.............................. 12
8.5 Glossary.................................................................. 12
9 Mechanical, Packaging, and Orderable
Information........................................................... 12
3 Revision History
Changes from Revision A (May 2004) to Revision B Page
• Changed datasheet to new TI format from National. ............................................................................................................. 1
• Added Pin Functions and Thermal Information tables, the Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section.................................................................................................. 1
3
LM119
,
LM219
,
LM319
www.ti.com
SNOSBJ2B –AUGUST 2000–REVISED JANUARY 2016
Product Folder Links: LM119 LM219 LM319
Submit Documentation FeedbackCopyright © 2000–2016, Texas Instruments Incorporated
4 Pin Configuration and Functions
D, J, or NFF Package
14-Pins CDIP and PDIP
Top View LME Package
10-Pins TO-100 (Metal Can Package)
Top View
NAD Package
10-Pins CFP
Top View
Pin Functions
PIN I/O DESCRIPTION
NAME NO.
(D, J, NFF 14) NO.
(LME 10) NO.
(NAD 10)
OUTPUT 1 1 12 1 O Comparator 1 output
GND 1 2 3 2 G Comparator 1 ground connection
INPUT 1+ 3 4 3 I Comparator 1 input
INPUT 1- 4 5 4 I Comparator 1 input
V- 5 6 5 P Negative supply voltage
OUTPUT 2 6 7 6 O Comparator 2 output
GND 2 7 8 7 G Comparator 2 ground connection
INPUT 2+ 8 9 8 I Comparator 2 input
INPUT 2- 9 10 9 I Comparator 2 input
V+ 10 11 10 P Positive supply voltage
NC 1,2,13,14 No connect. Do not connect to ground.
4
LM119
,
LM219
,
LM319
SNOSBJ2B –AUGUST 2000–REVISED JANUARY 2016
www.ti.com
Product Folder Links: LM119 LM219 LM319
Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) Refer to RETS119X for LM119H/883 and LM119J/883 specifications.
(4) For supply voltages less than ±15 V the absolute maximum input voltage is equal to the supply voltage.
(5) The maximum junction temperature of the LM119 is 150°C, while that of the LM219 is 110°C. For operating at elevated temperatures,
devices in the H10 package must be derated based on a thermal resistance of 160°C/W, junction to ambient, or 19°C/W, junction to
case. The thermal resistance of the J14 and N14 packages is 100°C/W, junction to ambient.
(6) See AN-450 “Surface Mounting Methods and Their Effect on Product Reliability” for other methods of soldering surface mount devices.
5 Specifications
5.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)(2)(3)
MIN MAX UNIT
Total supply voltage 36 V
Output to negative supply voltage 36 V
Ground to negative supply voltage 25 V
Ground to positive supply voltage 18 V
Differential input voltage –5 +5 V
Input voltage(4) –15 +15 V
Power dissipation(5) 500 mW
Output short circuit duration 10 sec
Lead temperature (soldering, 10 sec.) 260 °C
Soldering information(6)
Dual-In-Line Package Soldering (10 seconds) 260
°C
Small Outline Package Vapor Phase (60
seconds) 215
Small Outline Package Infrared (15 seconds) 220
Operating temperature LM119 –55 125 °CLM219 –25 85
LM319A, LM319 0 70
Storage temperature, Tstg –65 150 °C
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
5.2 ESD Ratings VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±800 V
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
5.3 Thermal Information
THERMAL METRIC(1)
LM119, LM219, LM319
UNIT
TO-100
(LME) PDIP
(NFF) CDIP
(J)
10 PINS 14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 160 100 100 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 19 NA NA °C/W
5
LM119
,
LM219
,
LM319
www.ti.com
SNOSBJ2B –AUGUST 2000–REVISED JANUARY 2016
Product Folder Links: LM119 LM219 LM319
Submit Documentation FeedbackCopyright © 2000–2016, Texas Instruments Incorporated
(1) The offset voltages and offset currents given are the maximum values required to drive the output within a volt of either supply with a 1-
mA load. Thus, these parameters define an error band and take into account the worst case effects of voltage gain and input
impedance.
(2) Output is pulled up to 15 V through a 1.4-kW resistor.
(3) The response time specified is for a 100-mV input step with 5-mV overdrive.
5.4 Electrical Characteristics LM119, LM219
These specifications apply for VS= ±15 V, and the Ground pin at ground, and −55°C ≤TA ≤+125°C, unless otherwise stated.
With the LM219, all temperature specifications are limited to −25°C ≤TA ≤+85°C. The offset voltage, offset current and bias
current specifications apply for any supply voltage from a single 5-V supply up to ±15-V supplies. Do not operate the device
with more than 16 V from ground to VS.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Input Offset Voltage(1) TA= 25°C, RS ≤5k 0.7 4 mV
Input Offset Current(1) TA= 25°C 30 75 nA
Input Bias Current TA= 25°C 150 500 nA
Voltage Gain TA= 25°C(2) 10 40 V/mV
Response Time(3) TA= 25°C, VS= ±15 V 80 ns
Saturation Voltage VIN ≤ −5 mV, IOUT = 25 mA
TA= 25°C 0.75 1.5 V
Output Leakage Current VIN ≥5 mV, VOUT = 35 V
TA= 25°C 0.2 2 µA
Input Offset Voltage(1) RS≤5k 7 mV
Input Offset Current(1) 100 nA
Input Bias Current 1000 nA
Input Voltage Range VS= ±15 V –12 ±13 +12 V
V+= 5 V, V-= 0 1 3
Saturation Voltage
V+≥4.5 V, V−= 0
VIN ≤ −6 mV, ISINK ≤3.2 mA V
TA≥0°C 0.23 0.4
TA≤0°C 0.6
Output Leakage Current VIN ≥5 mV, VOUT = 35 V, V−= VGND
= 0 V 1 10 µA
Differential Input Voltage ±5 V
Positive Supply Current TA= 25°C, V+= 5 V, V−= 0 4.3 mA
Positive Supply Current TA= 25°C, VS= ±15 V 8 11.5 mA
Negative Supply Current TA= 25°C, VS= ±15 V 3 4.5 mA
6
LM119
,
LM219
,
LM319
SNOSBJ2B –AUGUST 2000–REVISED JANUARY 2016
www.ti.com
Product Folder Links: LM119 LM219 LM319
Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated
(1) The offset voltages and offset currents given are the maximum values required to drive the output within a volt of either supply with a 1-
mA load. Thus, these parameters define an error band and take into account the worst case effects of voltage gain and input
impedance.
(2) Output is pulled up to 15 V through a 1.4-kW resistor.
(3) The response time specified is for a 100-mV input step with 5-mV overdrive.
5.5 Electrical Characteristics LM319, LM319A
These specifications apply for VS= ±15 V, and 0°C ≤TA≤70°C, unless otherwise stated. The offset voltage, offset current,
and bias current specifications apply for any supply voltage from a single 5-V supply up to ±15-V supplies. Do not operate the
device with more than 16 V from ground to VS.
PARAMETER TEST CONDITIONS LM319A LM319 UNIT
MIN TYP MAX MIN TYP MAX
Input Offset Voltage(1) TA= 25°C, RS ≤5k 0.5 1 2 8 mV
Input Offset Current(1) TA= 25°C 20 40 80 200 nA
Input Bias Current TA= 25°C 150 500 250 1000 nA
Voltage Gain TA= 25°C(2) 20 40 8 40 V/mV
Response Time(3) TA= 25°C, VS= ±15 V 80 80 ns
Saturation Voltage VIN ≤ −10 mV, IOUT = 25 mA
TA= 25°C 0.75 1.5 0.75 1.5 V
Output Leakage Current VIN ≥10 mV, VOUT = 35 V
V−= VGND = 0 V, TA= 25°C 0.2 10 0.2 10 µA
Input Offset Voltage(1) RS≤5k 10 10 mV
Input Offset Current(1) 300 300 nA
Input Bias Current 1000 1200 nA
Input Voltage Range VS= ±15 V ±13 ±13 V
V+= 5 V, V-= 0 1 3 1 3
Saturation Voltage V+≥4.5 V, V−= 0
VIN ≤ −10 mV, ISINK ≤3.2 mA 0.3 0.4 0.3 0.4 V
Differential Input Voltage ±5 ±5 V
Positive Supply Current TA= 25°C, V+= 5 V, V−= 0 4.3 4.3 mA
Positive Supply Current TA= 25°C, VS= ±15 V 8 12.5 8 12.5 mA
Negative Supply Current TA= 25°C, VS= ±15 V 3 5 3 5 mA
7
LM119
,
LM219
,
LM319
www.ti.com
SNOSBJ2B –AUGUST 2000–REVISED JANUARY 2016
Product Folder Links: LM119 LM219 LM319
Submit Documentation FeedbackCopyright © 2000–2016, Texas Instruments Incorporated
5.6 Typical Characteristics
5.6.1 Typical Characteristics – LM119, LM119A, LM219
Figure 1. Input Currents Figure 2. Common-Mode Limits
Figure 3. Transfer Function Figure 4. Response Time for Various Input Overdrives
Figure 5. Response Time for Various Input Overdrives Figure 6. Input Characteristics
Figure 7. Response Time for Various Input Overdrives Figure 8. Response Time for Various Input Overdrives
8
LM119
,
LM219
,
LM319
SNOSBJ2B –AUGUST 2000–REVISED JANUARY 2016
www.ti.com
Product Folder Links: LM119 LM219 LM319
Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated
Typical Characteristics – LM119, LM119A, LM219 (continued)
Figure 9. Output Saturation Voltage Figure 10. Supply Current
Figure 11. Supply Current Figure 12. Output Limiting Characteristics
5.6.2 Typical Characteristics – LM319, LM319A
Figure 13. Input Currents Figure 14. Supply Currents
Figure 15. Transfer Function Figure 16. Response Time for Various Input Overdrives
9
LM119
,
LM219
,
LM319
www.ti.com
SNOSBJ2B –AUGUST 2000–REVISED JANUARY 2016
Product Folder Links: LM119 LM219 LM319
Submit Documentation FeedbackCopyright © 2000–2016, Texas Instruments Incorporated
Typical Characteristics – LM319, LM319A (continued)
Figure 17. Response Time for Various Input Overdrives Figure 18. Input Characteristics
Figure 19. Response Time for Various Input Overdrives Figure 20. Response Time for Various Input Overdrives
Figure 21. Output Saturation Voltage Figure 22. Supply Current
Figure 23. Common-Mode Limits Figure 24. Output Limiting Characteristics
DS005705-1
∗Do not operate the LM119 with more than 16V between GND and V
+
10
LM119
,
LM219
,
LM319
SNOSBJ2B –AUGUST 2000–REVISED JANUARY 2016
www.ti.com
Product Folder Links: LM119 LM219 LM319
Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated
6 Detailed Description
6.1 Functional Block Diagram
11
LM119
,
LM219
,
LM319
www.ti.com
SNOSBJ2B –AUGUST 2000–REVISED JANUARY 2016
Product Folder Links: LM119 LM219 LM319
Submit Documentation FeedbackCopyright © 2000–2016, Texas Instruments Incorporated
7 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
7.1 Typical Applications
7.1.1 Relay Driver
Figure 25. Relay Driver
7.1.2 Window Detector
Figure 26. Window Detector
12
LM119
,
LM219
,
LM319
SNOSBJ2B –AUGUST 2000–REVISED JANUARY 2016
www.ti.com
Product Folder Links: LM119 LM219 LM319
Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated
8 Device and Documentation Support
8.1 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 1. Related Links
PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL
DOCUMENTS TOOLS &
SOFTWARE SUPPORT &
COMMUNITY
LM119 Click here Click here Click here Click here Click here
LM219 Click here Click here Click here Click here Click here
LM319 Click here Click here Click here Click here Click here
8.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
8.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
8.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
8.5 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
9 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
PACKAGE OPTION ADDENDUM
www.ti.com 4-Feb-2021
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM119H ACTIVE TO-100 LME 10 500 Non-RoHS &
Non-Green Call TI Call TI -55 to 125 ( LM119H, LM119H)
LM119H/NOPB ACTIVE TO-100 LME 10 500 RoHS & Green Call TI Level-1-NA-UNLIM -55 to 125 ( LM119H, LM119H)
LM119J ACTIVE CDIP J 14 25 Non-RoHS
& Green Call TI Call TI -55 to 125 LM119J
LM319AM ACTIVE SOIC D 14 55 Non-RoHS
& Green Call TI Call TI 0 to 70 LM319AM
LM319AM/NOPB ACTIVE SOIC D 14 55 RoHS & Green SN Level-1-260C-UNLIM 0 to 70 LM319AM
LM319AMX/NOPB ACTIVE SOIC D 14 2500 RoHS & Green SN Level-1-260C-UNLIM 0 to 70 LM319AM
LM319M ACTIVE SOIC D 14 55 Non-RoHS
& Green Call TI Call TI 0 to 70 LM319M
LM319M/NOPB ACTIVE SOIC D 14 55 RoHS & Green SN Level-1-260C-UNLIM 0 to 70 LM319M
LM319MX/NOPB ACTIVE SOIC D 14 2500 RoHS & Green SN Level-1-260C-UNLIM 0 to 70 LM319M
LM319N/NOPB ACTIVE PDIP NFF 14 25 RoHS & Green SN Level-1-NA-UNLIM 0 to 70 LM319N
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
PACKAGE OPTION ADDENDUM
www.ti.com 4-Feb-2021
Addendum-Page 2
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM319AMX/NOPB SOIC D 14 2500 330.0 16.4 6.5 9.35 2.3 8.0 16.0 Q1
LM319MX/NOPB SOIC D 14 2500 330.0 16.4 6.5 9.35 2.3 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 25-Sep-2019
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM319AMX/NOPB SOIC D 14 2500 367.0 367.0 35.0
LM319MX/NOPB SOIC D 14 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 25-Sep-2019
Pack Materials-Page 2
www.ti.com
PACKAGE OUTLINE
C
A
9.40
8.51
( 3.56)
STAND-OFF
0.86
0.71
5.84
2.92
8.51
7.75
5.72 MAX
4.70
4.19
1.02 MAX
10X 12.7 MIN
10X 0.53
0.41
STAND-OFF
1.02
0.25
1.14
0.74
36 TYP
TO-CAN - 5.72 mm max heightLME0010A
METAL CYLINDRICAL PACKAGE
4220604/A 05/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration MO-006/TO-100.
0.25 C A
SEATING PLANE
1
2
3
456
7
10
8
9
SCALE 0.800
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MAX
ALL AROUND
9X 0.07 MAX
ALL AROUND
( 5.84)
( 1.4)
9X ( 1.4)
METAL
10X ( 0.8)
VIA
(R0.05)
TYP
(36 ) TYP
TO-CAN - 5.72 mm max heightLME0010A
METAL CYLINDRICAL PACKAGE
4220604/A 05/2017
LAND PATTERN EXAMPLE
NON-SOLDER MASK DEFINED
SCALE: 12X
9X SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL
1
2
3
4
5
6
7
10
8
9
MECHANICAL DATA
N0014A
www.ti.com
N14A (Rev G)
NFF0014A
www.ti.com
PACKAGE OUTLINE
C
14X .008-.014
[0.2-0.36]
TYP
-15
0
AT GAGE PLANE
-.314.308 -7.977.83[ ]
14X -.026.014 -0.660.36[ ]
14X -.065.045 -1.651.15[ ]
.2 MAX TYP
[5.08] .13 MIN TYP
[3.3]
TYP-.060.015 -1.520.38[ ]
4X .005 MIN
[0.13]
12X .100
[2.54]
.015 GAGE PLANE
[0.38]
A
-.785.754 -19.9419.15[ ]
B -.283.245 -7.196.22[ ]
CDIP - 5.08 mm max heightJ0014A
CERAMIC DUAL IN LINE PACKAGE
4214771/A 05/2017
NOTES:
1. All controlling linear dimensions are in inches. Dimensions in brackets are in millimeters. Any dimension in brackets or parenthesis are for
reference only. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This package is hermitically sealed with a ceramic lid using glass frit.
4. Index point is provided on cap for terminal identification only and on press ceramic glass frit seal only.
5. Falls within MIL-STD-1835 and GDIP1-T14.
78
14
1
PIN 1 ID
(OPTIONAL)
SCALE 0.900
SEATING PLANE
.010 [0.25] C A B
www.ti.com
EXAMPLE BOARD LAYOUT
ALL AROUND
[0.05] MAX.002
.002 MAX
[0.05]
ALL AROUND
SOLDER MASK
OPENING
METAL
(.063)
[1.6]
(R.002 ) TYP
[0.05]
14X ( .039)
[1]
( .063)
[1.6]
12X (.100 )
[2.54]
(.300 ) TYP
[7.62]
CDIP - 5.08 mm max heightJ0014A
CERAMIC DUAL IN LINE PACKAGE
4214771/A 05/2017
LAND PATTERN EXAMPLE
NON-SOLDER MASK DEFINED
SCALE: 5X
SEE DETAIL A SEE DETAIL B
SYMM
SYMM
1
78
14
DETAIL A
SCALE: 15X
SOLDER MASK
OPENING
METAL
DETAIL B
13X, SCALE: 15X
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
permission to use these resources only for development of an application that uses the TI products described in the resource. Other
reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party
intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages,
costs, losses, and liabilities arising out of your use of these resources.
TI’s products are provided subject to TI’s Terms of Sale (https:www.ti.com/legal/termsofsale.html) or other applicable terms available either
on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s
applicable warranties or warranty disclaimers for TI products.IMPORTANT NOTICE
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2021, Texas Instruments Incorporated
