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IRLML5203PbF
Parameter Min. Typ. Max. Units Conditions
ISContinuous Source Current MOSFET symbol
(Body Diode) showing the
ISM Pulsed Source Current integral reverse
(Body Diode) p-n junction diode.
VSD Diode Forward Voltage ––– ––– -1.2 V TJ = 25°C, IS = -1.3A, VGS = 0V
trr Reverse Recovery Time ––– 17 26 ns TJ = 25°C, IF = -1.3A
Qrr Reverse Recovery Charge ––– 12 18 nC di/dt = -100A/μs
Source-Drain Ratings and Characteristics
A
-24
-1.3
S
D
G
Repetitive rating; pulse width limited by
max. junction temperature.
Notes:
Pulse width ≤ 400μs; duty cycle ≤ 2%.
Surface mounted on FR-4 board, t ≤ 5sec.
Parameter Min. Typ. Max. Units Conditions
V(BR)DSS Drain-to-Source Breakdown Voltage -30 ––– ––– V VGS = 0V, ID = -250μA
ΔV(BR)DSS/ΔTJBreakdown Voltage Temp. Coefficient ––– 0.019 ––– V/°C Reference to 25°C, ID = -1mA
––– ––– 98 VGS = -10V, ID = -3.0A
––– ––– 165 VGS = -4.5V, ID = -2.6A
VGS(th) Gate Threshold Voltage -1.0 ––– -2.5 V VDS = VGS, ID = -250μA
gfs Forward Transconductance 3.1 ––– ––– S VDS = -10V, ID = -3.0A
––– ––– -1.0 VDS = -24V, VGS = 0V
––– ––– -5.0 VDS = -24V, VGS = 0V, TJ = 70°C
Gate-to-Source Forward Leakage ––– ––– -100 VGS = -20V
Gate-to-Source Reverse Leakage ––– ––– 100 VGS = 20V
QgTotal Gate Charge ––– 9.5 14 ID = -3.0A
Qgs Gate-to-Source Charge ––– 2.3 3.5 nC VDS = -24V
Qgd Gate-to-Drain ("Miller") Charge ––– 1.6 2.4 VGS = -10V
td(on) Turn-On Delay Time ––– 12 ––– VDD = -15V
trRise Time ––– 18 ––– ID = -1.0A
td(off) Turn-Off Delay Time ––– 88 ––– RG = 6.0Ω
tfFall Time ––– 52 ––– VGS = -10V
Ciss Input Capacitance ––– 510 ––– VGS = 0V
Coss Output Capacitance ––– 71 ––– pF VDS = -25V
Crss Reverse Transfer Capacitance ––– 43 ––– ƒ = 1.0MHz
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
IGSS
µA
mΩ
RDS(on) Static Drain-to-Source On-Resistance
IDSS Drain-to-Source Leakage Current
nA
ns