TB62757FUG TOSHIBA BiCD Digital Integrated Circuit Silicon Monolithic TB62757FUG Step Up Type DC-DC Converter for White LED The TB62757FUG is a high efficient Step-Up Type DC-DC Converter specially designed for constant current driving of White LED. This IC can drive 2 to 6 white LEDs connected series using a Li-ion battery. This IC contains N-ch MOSFET Transistor for Coil-Switching, and LED Current (IF) is set with an external resistor. This IC is especially for driving back light white LEDs in LCD of PDA, Cellular Phone, or Handy Terminal Equipment. Weight: 0.016 g (typ.) Features * Can drive 2 to 6 white LEDs connected series * Variable LED current IF is set with a external resistor: 20 mA (typ.) @RSENS = 16 * Output power: Available for 400 mW LED loading * High efficiency: 87% @Maximum * Output over voltage shutdown function: Switching operation is shut downed when OVD terminal voltage is over 22 V (typ.). * IC package: SOT23-6SSOP6-P-0.95B * Switching frequency: 1.1 MHz (typ.) 1 2010-06-306 TB62757FUG Block Diagram SW OVD 4 2 Over voltage detection VIN 3 Monostable multivibrator for reference Monostable multivibrator for off time control CTL AMP. Circuit on/off 6 FB Error AMP. SHDN 1 5 GND Pin Assignment (top view) OVD 2 VIN 3 6 FB 5 GND 4 SW SHDN 1 OVD 2 VIN 3 Week 1 to 26 S 1 S SHDN 6 FB 5 GND 4 SW Week 27 to 53 Note 1: This IC could be destroyed in some case if amounted in 180 inverse direction. Please be careful about IC direction in mounting. Pin Function Pin No. Symbol Function Description 1 SHDN 2 OVD 3 VIN Supply voltage input terminal. (2.8 V to 5.5 V) 4 SW Switch terminal for DC-DC 5 GND 6 FB Voltage-input terminal for IC-enable. SHDN = H Operation Mode, SHDN = L Shutdown Mode (IC shutdown) Please do not open this terminal. Over voltage detection terminal. IC switching operation is disabled with detection over voltage. If the voltage returns to detection level or less, operation is enabled again. converter. N-ch MOSFET built-in. Ground terminal. LED IF setting resister connecting terminal. 2 2010-06-306 TB62757FUG I/O Equivalent Pin Circuits 2. OVD Terminal 1. SHDN Terminal VIN OVD 2 SHDN 1 3. VIN Terminal to GND Terminal 4. SW Terminal VIN 3 SW 4 GND 5 5. FB Terminal VIN FB 6 3 2010-06-306 TB62757FUG Application Note 4.7 to 10 H 4 VIN 3 Over voltage detection Monostable multivibrator for reference 2.2 F SW 2 OVD Monostable multivibrator for off time control 1 F VIN Circuit on/off 6 Error AMP. SHDN 1 PWM 5 FB 16 @20 mA CTL AMP. GND Protection in LED Opened Condition (OVD Function) The operation with OVD terminal is available for the protection in case LED Circuit opened. If load of LED is detached, N-ch MOS switching operation is disabled with detection of boost circuit voltage. (* When the voltage value recovers below the detection voltage value, operation is restarted.) 4 2010-06-306 TB62757FUG Setting of External Capacitor In case not using PWM signal to SHDN terminal for brightness control, recommended values are C1 = Over 2.2 (F), C2 = Over 1.0 (F) In case with PWM signal to SHDN terminal for brightness control, recommended values are C1 = Over 4.7 (F), C2 = Under 0.1 (F). The recommended capacitor values depend on the Brightness Control Method. <Please refer the next page or later> The capacitor value must be considered for gain enough accuracy of brightness with reduction of noise from Input current changing. Setting of External Inductor Size Please select the inductor size with referring this table corresponding to each number of LEDs. LEDs 2 3 Indictor Size Note 4.7 H 4 6.8 H 5 8.1 H 6 10 H LED current IF = 20 mA LED Current IF Setting The resistance between the FB pin and GND, RSENS () is the resistance for the setting the output current. Depending on the resistance value, it is possible to set the average output current Io (mA). The average output current Io (mA) can be approximated with the following equation: IF = (325 [mV]/RSENS []) The current value error is 5%. 5 2010-06-306 TB62757FUG Brightness Control Method Recommended Brightness Control Circuits are 4 types. 1) Input PWM signal to SHDN terminal IF can be adjusted with PWM signal by inputting it to SHDN terminal. [Notice] <<Minimum ON-time of PWM signal input>> * Set the minimum ON-time or OFF-time 33 s or more in inputting the PWM signal. * Set the Duty ratio satisfying the condition above. Ex) In case PWM Frequency is 1 kHz, 1 kHz is 1 ms (PWM Width = 100%) and it takes 10 s per 1%. To set the pulse width 33 s or more, necessary ON-or-OFF-time is calculated below. 33 s / 10 s = 3.3% (Under the condition that 10 s equals 1%.) Finally, the Duty Ratio can be set in range of 3.3% to 96.7%. Set On-time 33 s or more = 3.3% Available Duty Ratio (3.3% to 96.7%) 1 ms (1 kHz) = 100% Set Off-time 33 s or more = 3.3% <<PWM signal frequency>> * The recommended PWM signal frequency is from 100 Hz to 10 kHz. There is a possibility to arise the audible frequency in mounting to the board because it is within the auditory area. <<Constant number of external capacitor>> * To reduce the fluctuation of input current and increase the accuracy of brightness, the values that C1 = 4.7 (F) or more, C2 = 0.1 (F) or less are recommended. * When the PWM signal is off, the time to drain C2 of charge depends on the constant number. And so, the actual value is little different from the theoretical value. <<PWM input signal>> * Set the amplitude of PWM signal within the range of SHDN terminal specification. <<Rush current in inputting>> * In case dimming by inputting the PWM signal to the SHDN terminal, this IC turns on and off repeatedly. And the rush current, which provides the charge to C2, arises in turning on. Take care in selecting the condenser. <<Current value in control with PWM: Ideal equation>> IF (mA ) = 325 [mV ] x ON Duty [%] RSENS [] 6 2010-06-306 TB62757FUG <Reference Data> Condition: VIN = 3.6 V, L = 6.8 H, 4LEDs, RSENS = 16 m@Io = 20 mA (1) C1 = 4.7 F, C2 = 0.1 F Wave Form TB62737FUG TB62757FUG ON Duty width[%] V.S. Error with Ideal Value SHDN Error with Ideal Value[%] 25 20 500kHz 1kHz 2kHz 4kHz 8kHz 12kHz 15 10 5 VOUT IIN 0 0 20 40 60 80 100 ON Duty width[%] (2) C1 = 4.7 F, C2 = 0.47 F Wave Form TB62737FUG TB62757FUG ON Duty width[%] V.S. Error with Ideal Value SHDN Error with Ideal Value[%] 25 20 500kHz 1kHz 2kHz 4kHz 8kHz 12kHz 15 10 5 VOUT IIN 0 0 20 40 60 80 100 ON Duty width[%] (3) C1 = 4.7 F, C2 = 1.0 F Wave Form TB62737FUG TB62757FUG ON Duty width[%] V.S. Error with Ideal Value SHDN Error with Ideal Value[%] 25 20 500kHz 1kHz 2kHz 4kHz 8kHz 12kHz 15 10 5 VOUT IIN 0 0 20 40 60 80 100 ON Duty width[%] (4) C1 = 2.2 F, C2 = 1.0 F Wave Form TB62737FUG TB62757FUG ON Duty width[%] V.S. Error with Ideal Value SHDN Error with Ideal Value[%] 25 20 500kHz 1kHz 2kHz 4kHz 8kHz 12kHz 15 10 5 VOUT IIN 0 0 20 40 60 80 100 ON Duty width[%] 7 2010-06-306 TB62757FUG <<Recommended circuit>> 6.8 H VCC SW OVD SHDN FB GND RSENS = 16 C1 = 4.7 F PWM signal S-Di C2 = 0.1 F VIN = 2.8 to 5.5 V 8 2010-06-306 TB62757FUG 2) Input analog voltage to FB terminal IF can be adjusted with analog voltage input to FB terminal. This method is without repeating IC ON/OFF, and no need to consider holding rash current. [Notice] * LED current value goes over 100% of the current set with RSENS, if the input analog voltage is between 0 V to 325 mV (typ.). for ref.) Analog voltage = 0 to 2.2 V About external parts value, please see recommended circuit. Supply Voltage [V] Ratio with Setting Current No connect (OFF) 100% 0 116.0% 0.2 106.5% 0.4 95.4% 0.6 84.5% 0.8 73.6% 1 59.9% 1.2 48.4% 1.4 37.4% 1.6 26.6% 1.8 15.9% 2 5.8% 2.2 0.0% TB62757FUG TB62737FUG Analog Voltage Input to FB Terminal Ratio with setting current(%) 140.0% 120.0% 100.0% 80.0% 60.0% 40.0% 20.0% 0.0% 0 0.5 1 1.5 2 2.5 Input Voltage <<Recommended circuit>> VCC S-Di SW OVD SHDN FB 16 k RSENS = 16 GND 82 k C1 = 2.2 F 6.8 H C2 = 1.0 F VIN = 2.8 to 5.5 V Analog voltage 9 2010-06-306 TB62757FUG 3) Input PWM signal with filtering to FB terminal IF can be adjusted with filtering PWM signal using RC filter indicated in recommended circuit, because the PWM signal can be regard as analog voltage after filtering. This method is without repeating IC ON/OFF, and no need to consider holding rash current. [Notice] * LED current value goes over 100% of the current set with RSENS, if the input voltage after filtering is between 0 V to 325 mV (typ.). for ref.) Voltage during PWM Signal-ON = 2 V About external parts value, please see recommended circuit. Supply Voltage [V] Ratio with Setting Current No connect (OFF) 100% 0 116.1% 10% 105.3% 20% 95.1% 30% 84.8% 40% 74.6% 50% 64.0% 60% 53.8% 70% 43.7% 80% 34.0% 90% 24.2% 100% 13.3% TB62757FUG TB62737FUG Input PWM signal filtered with R,C to the FB terminal 140.0% Setting current ratio(%) 120.0% 100.0% 80.0% 60.0% 40.0% 20.0% 0.0% 0% 20% 40% 60% 80% 100% PWM Duty(%) <<Recommended circuit>> SW SHDN C2 = 1.0 F VCC S-Di OVD RSENS = 16 GND 16 k 0.1 F FB 10 k C1 = 2.2 F 6.8 H 82 k VIN = 2.8 to 5.5 V PWM signal 10 2010-06-306 TB62757FUG 4) Input logic signal IF can be adjusted with Logic signal input as indicated in recommended circuit. The Resistor connected the ON-State N-ch MOS Drain and RSENS determines IF. Average of Setting Current Io (mA) is next, approximately. IF = (325 [mV]/Sum of Resistor Value []) <<Recommended circuit>> 6.8 H C1 = 2.2 F VCC S-Di SW C2 = 1.0 F VIN = 2.8 to 5.5 V OVD SHDN R1 M1 R2 M2 RSENS FB GND Logic signal M1 M2 LED Current OFF OFF ON OFF [] + R1 [] R 325 [mV ] x SENS RSENS [] x R1 [] OFF ON [] + R2 [] R 325 [mV] x SENS RSENS [] x R2 [] ON ON 325 [mV] RSENS [] 325 [mV] x RSENS [] x R1 [] + RSENS [] x R2 [] + R1 [] x R2 [] RSENS [] x R1 [] x R2 [] 11 2010-06-306 TB62757FUG Absolute Maximum Ratings (Ta = 25C if without notice) Characteristics Power supply voltage Symbol Rating Unit VIN -0.3 to +6.0 V Input voltage V SHDN Switching terminal voltage Vo (SW) Power dissipation -0.3 to + VIN + 0.3 (Note 1) -0.3 to 24 Thermal resistance V 0.41 (Device) PD 0.47 (on PCB) (Note 2) 300 (Device) Rth (j-a) V W C/W 260 (on PCB) Operation temperature range Topr -40 to +85 C Storage temperature range Tstg -55 to +150 C Tj 150 C Maximum junction temperature Note 1: However, do not exceed 6 V. Note 2: Power dissipation must be calculated with subtraction of 3.8 mW/C from Maximum Rating with every 1C if Topr is upper 25C. (on PCB) Recommended Operating Condition (Ta = -40C to 85C if without notice) Characteristics Symbol Test Condition Min Typ. Max Unit 2.8 5.5 V Power supply voltage VIN SHDN terminal input pulse width tpw "H", "L" duty width 33 s LED current (average value) IF1 VIN = 3.6 V, RSENS = 16 4 white LEDs, Ta = 25C 20 mA Typ. Max Unit Electrical Characteristics (Ta = 25C, VIN = 2.8 to 5.5 V, if without notice) Characteristics Symbol Test Condition Min 2.8 5.5 V Operating consumption current IIN (On) VIN = 3.6 V, RSENS = 16 0.9 1.5 mA Quiescent consumption current IIN (Off) VIN = 3.6 V, V SHDN = 0 V 0.5 1.0 A SHDN terminal "H" level input voltage V SHDN H 1.3 VIN V SHDN terminal "L" level input voltage V SHDN L 0 0.4 V -10 0 10 A 0.77 1.1 1.43 MHz Input voltage range SHDN terminal current Integrated MOS-Tr switching frequency VIN ISHDN VIN = 3.6 V, V SHDN = 3.6 V fOSC VIN = 3.6 V, V SHDN = 3.6 V or 0V Sw terminal protection voltage Vo (SW) 25 V Switching terminal current Ioz (SW) 400 mA Switching terminal leakage current Ioz (SW) 0.5 1 A FB terminal feedback voltage (VFB) VFB VIN = 3.6 V, RSENS = 16 , L = 6.8 H 308 325 342 mV VIN = 3.6 V center VIN = 3.0 to 5.0 V -5 5 % 19 22 23.5 V 0.5 1 A FB terminal line regulation VFB OVD terminal voltage VOVD OVD terminal leakage current IOVDZ VOVD = 16 V 12 2010-06-306 TB62757FUG 1. Application Circuit Example and Measurement Data (reference data) VIN = 2.8 to 5.5 V L1 S-Di * Evaluation conditions (Ta = 25C) WLEDs 2 to 6 OVD FB RSENS = 16 GND : CXLD120 series (NEO MAX CO.,Ltd.) (Size: 2.5 mm x 3.0 mm x 1.2 mm) : C2012JB1E225K (TDK Corp.) C1 : C2012JB1E105K (TDK Corp.) C2 S-Di : CUS02 1 A/30 V (TOSHIBA Corp.) WLEDs : NSCW215T (NICHIA Corp.) L1 100 35 100 30 90 30 90 25 80 25 80 70 20 IIOUT F Efficiency 15 10 2.8 3.1 3.4 3.7 4 4.3 4.6 4.9 5.2 IF (mA) IOUT(mA) 35 70 20 60 15 50 10 5.5 IIOUT F Efficiency 3.1 3.4 3.7 4 4.3 4.6 4.9 5.2 5.5 VIN(V) Input Voltage - Efficiency/Output Current 3LED Drive, L=6.8H Input Voltage - Efficiency/Output Current 6LED Drive, L=10H 100 35 100 30 90 30 90 25 80 70 20 IIOUT F Efficiency 15 10 3.1 3.4 3.7 4 4.3 4.6 4.9 5.2 IOUT(mA) IF (mA) 35 Efficiency(%) IF (mA) IOUT(mA) 60 50 2.8 VIN(V) 2.8 Efficiency(%) Input Voltage - Efficiency/Output Current 5LED Drive, L=10H Efficiency(%) IF (mA) IOUT(mA) Input Voltage - Efficiency/Output Current 2LED Drive, L=4.7H 80 25 70 20 60 15 50 10 IIOUT F Efficiency 60 50 2.8 5.5 Efficiency(%) SHDN SW C2 = 1.0 F C1 = 2.2 F VIN 3.1 3.4 3.7 4 VIN(V) 4.3 4.6 4.9 5.2 5.5 VIN(V) <Measurement Data> Efficiency in the range of VIN = 2.8 to 5.5 V 35 100 30 90 25 80 70 20 IIOUT F Efficiency 15 60 50 10 2.8 3.1 3.4 3.7 4 4.3 VIN(V) 4.6 4.9 5.2 2 LEDs 3 LEDs 4 LEDs 5 LEDs 6 LEDs Efficiency(%) IF (mA) IOUT(mA) Input Voltage - Efficiency/Output Current 4LED Drive, L=6.8H Efficiency (%) Average Efficiency (%) 82.60 to 88.46 82.69 to 87.78 80.73 to 86.22 80.73 to 87.28 79.78 to 85.55 86.29 85.95 83.05 83.45 81.15 Output current in the range of VIN = 3.0 to 5.0 V (VIN = 3.6 V typ.) 5.5 Output Current (mA) VIN = 3.6 V 2 LEDs 3 LEDs 4 LEDs 5 LEDs 6 LEDs * VOUT voltage in driving 5 or 6 LEDs must be lower than OVD detection level. (VOUT < 19 V) 21.13 20.60 20.87 20.06 19.90 Tolerance (%) Min Max -3.50 -1.95 -1.75 -1.81 -1.95 1.77 1.38 1.11 1.15 1.28 Note: These application examples are provided for reference only. Thorough evaluation and testing should be implemented when designing your application's mass production design. 13 2010-06-306 TB62757FUG 2. Application Circuit Example and Measurement Data (reference data) VIN = 2.8 to 5.5 V L1 S-Di * Evaluation conditions (Ta = 25C) WLEDs 2 to 6 OVD FB RSENS = 16 GND : 1001AS series (TOKO, INC) (Size: 3.6 mm x 3.6 mm x 1.2 mm) : C2012JB1E225K (TDK Corp.) C1 : C2012JB1E105K (TDK Corp.) C2 S-Di : CUS02 1 A/30 V (TOSHIBA Corp.) WLEDs : NSCW215T (NICHIA Corp.) L1 100 35 100 30 90 30 90 25 80 25 80 20 70 20 70 IIOUT F Efficiency 15 10 2.8 3.1 3.4 3.7 4 4.3 VIN(V) 4.6 4.9 5.2 IF (mA) IOUT(mA) 35 60 15 50 10 5.5 IIOUT F Efficiency 3.1 3.4 3.7 4 4.3 VIN(V) 4.6 4.9 5.2 5.5 Input Voltage - Efficiency/Output Current 6LED Drive, L=10H 100 35 100 30 90 30 90 25 80 25 80 20 70 20 70 IOUT IF Efficiency 10 2.8 3.1 3.4 3.7 4 4.3 4.6 4.9 5.2 IF (mA) IOUT(mA) 35 Efficiency(%) IF (mA) IOUT(mA) 60 50 2.8 Input Voltage - Efficiency/Output Current 3LED Drive, L=6.8H 15 Efficiency(%) Input Voltage - Efficiency/Output Current 5LED Drive, L=10H Efficiency(%) IOUT(mA) IF (mA) Input Voltage - Efficiency/Output Current 2LED Drive, L=4.7H 60 15 50 10 5.5 IOUT IF Efficiency Efficiency(%) SHDN SW C2 = 1.0 F C1 = 2.2 F VIN 60 50 2.8 3.1 3.4 3.7 4 4.3 VIN(V) VIN(V) 4.6 4.9 5.2 5.5 <Measurement Data> Efficiency in the range of VIN = 2.8 to 5.5 V 35 100 30 90 25 80 20 70 IIOUT F Efficiency 15 60 10 50 2.8 3.1 3.4 3.7 4 4.3 VIN(V) 4.6 4.9 5.2 2 LEDs 3 LEDs 4 LEDs 5 LEDs 6 LEDs Efficiency(%) IF (mA) IOUT(mA) Input Voltage - Efficiency/Output Current 4LED Drive, L=6.8H Efficiency (%) Average Efficiency (%) 83.10 to 88.60 81.32 to 86.47 79.15 to 84.63 79.72 to 86.39 78.91 to 85.10 86.55 84.54 81.30 82.87 80.47 Output current in the range of VIN = 3.0 to 5.0 V (VIN = 3.6 V typ.) 5.5 Output Current (mA) VIN = 3.6 V 2 LEDs 3 LEDs 4 LEDs 5 LEDs 6 LEDs * VOUT voltage in driving 5 or 6 LEDs must be lower than OVD detection level. (VOUT < 19 V) 21.17 20.85 20.56 20.10 19.95 Tolerance (%) Min Max -3.32 -1.95 -1.79 -1.82 -1.94 1.73 1.38 1.15 1.22 1.26 Note: These application examples are provided for reference only. Thorough evaluation and testing should be implemented when designing your application's mass production design. 14 2010-06-306 TB62757FUG 3. Application Circuit Example and Measurement Data (reference data) VIN = 2.8 to 5.5 V L1 S-Di * Evaluation conditions (Ta = 25C) WLEDs 2 to 6 OVD FB RSENS = 16 GND : LQH2M series (Murata Manufacturing Co.,Ltd.) (Size: 2.0 mm x 1.6 mm x 0.95 mm) : C2012JB1E225K (TDK Corp.) C1 : C2012JB1E105K (TDK Corp.) C2 S-Di : CUS02 1 A/30 V (TOSHIBA Corp.) WLEDs : NSCW215T (NICHIA Corp.) L1 100 35 100 30 90 30 90 25 80 25 80 20 70 20 70 IF IOUT Efficiency Efficiency 15 10 2.8 3.1 3.4 3.7 4 4.3 4.6 4.9 5.2 IF (mA) IOUT(mA) 35 60 15 50 10 5.5 IF IOUT Efficiency 3.1 3.4 3.7 4 4.3 VIN(V) 100 30 90 25 80 20 70 IIOUT F Efficiency 10 3.4 3.7 4 4.3 4.6 4.9 5.2 IF (mA) IOUT(mA) 35 3.1 4.6 4.9 5.2 5.5 Input Voltage - Efficiency/Output Current 6LED Drive, L=10H Efficiency(%) IF (mA) IOUT(mA) Input Voltage - Efficiency/Output Current 3LED Drive, L=6.8H 2.8 60 50 2.8 VIN(V) 15 Efficiency(%) Input Voltage - Efficiency/Output Current 5LED Drive, L=10H Efficiency(%) IF (mA) IOUT(mA) Input Voltage - Efficiency/Output Current 2LED Drive, L=4.7H 35 100 30 90 25 80 20 70 60 15 50 10 5.5 IOUT IF Efficiency Efficiency(%) SHDN SW C2 = 1.0 F C1 = 2.2 F VIN 60 50 2.8 3.1 3.4 3.7 4 4.3 VIN(V) VIN(V) 4.6 4.9 5.2 5.5 <Measurement Data> Efficiency in the range of VIN = 2.8 to 5.5 V 35 100 30 90 25 80 20 70 IOUT IF Efficiency 15 60 10 50 2.8 3.1 3.4 3.7 4 4.3 VIN(V) 4.6 4.9 5.2 2 LEDs 3 LEDs 4 LEDs 5 LEDs 6 LEDs Efficiency(%) IF (mA) IOUT(mA) Input Voltage - Efficiency/Output Current 4LED Drive, L=6.8H Efficiency (%) Average Efficiency (%) 82.37 to 88.70 80.19 to 86.55 78.11 to 84.54 74.79 to 84.94 74.14 to 83.47 86.38 84.12 80.16 79.94 77.17 Output current in the range of VIN = 3.0 to 5.0 V (VIN = 3.6 V typ.) 5.5 Output Current (mA) VIN = 3.6 V 2 LEDs 3 LEDs 4 LEDs 5 LEDs 6 LEDs * VOUT voltage in driving 5 or 6 LEDs must be lower than OVD detection level. (VOUT < 19 V) 21.19 20.90 20.63 20.09 19.93 Tolerance (%) Min Max -3.26 -1.87 -1.78 -1.88 -1.99 1.69 2.17 1.01 1.25 1.07 Note: These application examples are provided for reference only. Thorough evaluation and testing should be implemented when designing your application's mass production design. 15 2010-06-306 TB62757FUG 4. Application Circuit Example and Measurement Data (reference data) VIN = 2.8 to 5.5 V L1 S-Di * Evaluation conditions (Ta = 25C) WLEDs 2 to 6 OVD FB RSENS = 16 GND : VLF3010A series (TDK Corp.) (Size: 3.0 mm x 3.0 mm x 1.0 mm) : C2012JB1E225K (TDK Corp.) C1 : C2012JB1E105K (TDK Corp.) C2 S-Di : CUS02 1 A/30 V (TOSHIBA Corp.) WLEDs : NSCW215T (NICHIA Corp.) L1 100 30 90 25 80 70 20 IOUT IF Efficiency 15 10 2.8 3.1 3.4 3.7 4 4.3 4.6 4.9 5.2 35 100 30 90 25 80 70 20 60 15 50 10 5.5 IF IOUT Efficiency 3.1 3.4 3.7 4 4.3 4.6 4.9 5.2 5.5 VIN(V) Input Voltage - Efficiency/Output Current 3LED Drive, L=6.8H Input Voltage - Efficiency/Output Current 6LED Drive, L=10H 100 35 100 30 90 30 90 25 80 25 80 70 20 IOUT IF Efficiency 15 10 3.1 3.4 3.7 4 4.3 4.6 4.9 5.2 IF (mA) IOUT(mA) 35 Efficiency(%) IF (mA) IOUT(mA) 60 50 2.8 VIN(V) 2.8 Efficiency(%) 35 IF (mA) IOUT(mA) Input Voltage - Efficiency/Output Current 5LED Drive, L=10H Efficiency(%) IF (mA) IOUT(mA) Input Voltage - Efficiency/Output Current 2LED Drive, L=4.7H 70 20 60 15 50 10 5.5 IOUT IF Efficiency Efficiency(%) SHDN SW C2 = 1.0 F C1 = 2.2 F VIN 60 50 2.8 3.1 3.4 3.7 4 VIN(V) 4.3 4.6 4.9 5.2 5.5 VIN(V) <Measurement Data> Efficiency in the range of VIN = 2.8 to 5.5 V 35 100 30 90 25 80 70 20 IIOUT F Efficiency 15 60 50 10 2.8 3.1 3.4 3.7 4 4.3 4.6 4.9 5.2 2 LEDs 3 LEDs 4 LEDs 5 LEDs 6 LEDs Efficiency(%) IF (mA) IOUT(mA) Input Voltage - Efficiency/Output Current 4LED Drive, L=6.8H Efficiency (%) Average Efficiency (%) 79.85 to 86.97 80.19 to 85.32 78.77 to 83.60 79.72 to 86.39 78.91 to 85.10 84.02 83.39 80.69 82.87 80.49 Output current in the range of VIN = 3.0 to 5.0 V (VIN = 3.6 V typ.) 5.5 Output Current (mA) VIN = 3.6 V VIN(V) 2 LEDs 3 LEDs 4 LEDs 5 LEDs 6 LEDs * VOUT voltage in driving 5 or 6 LEDs must be lower than OVD detection level. (VOUT < 19 V) 21.19 20.89 20.64 20.10 19.95 Tolerance (%) Min Max -3.08 -1.86 -1.68 -1.82 -1.94 1.67 1.33 1.11 1.22 1.26 Note: These application examples are provided for reference only. Thorough evaluation and testing should be implemented when designing your application's mass production design. 16 2010-06-306 TB62757FUG 5. Application Circuit Example and Measurement Data (reference data) VIN = 2.8 to 5.5 V L1 S-Di * Evaluation conditions (Ta = 25C) WLEDs 2 to 4 OVD FB RSENS = 16 GND : 32R51 (KOA Corp.) (Size: 3.2 mm x 2.5 mm x 0.6 mm) : C2012JB1E225K (TDK Corp.) C1 : C2012JB1E105K (TDK Corp.) C2 S-Di : CUS02 1 A/30 V (TOSHIBA Corp.) WLEDs : NSCW215T (NICHIA Corp.) L1 100 30 90 25 80 20 70 IIout F Efficiency Efficiency 15 60 IF (mA) 35 Output Current (mA) Input Voltage - Efficiency/Output Current 3LED Drive, L=5.1H Efficiency(%) IF (mA) Output Current (mA) Input Voltage - Efficiency/Output Current 2LED Drive, L=5.1H 2.8 3.1 3.4 3.7 4 4.3 4.6 4.9 5.2 100 30 90 25 80 70 20 IIout F Efficiency Efficiency 15 60 50 10 50 10 35 2.8 5.5 Efficiency(%) SHDN SW C2 = 1.0 F C1 = 2.2 F VIN 3.1 3.4 3.7 4 VIN(V) 4.3 VIN(V) 4.6 4.9 5.2 5.5 <Measurement Data> Efficiency in the range of VIN = 2.8 to 5.5 V 35 100 30 90 25 80 70 20 IIout F Efficiency Efficiency 15 60 Efficiency(%) IF (mA) Output Current (mA) Input Voltage - Efficiency/Output Current 4LED Drive, L=5.1H 2 LEDs 3 LEDs 4 LEDs 2.8 3.1 3.4 3.7 4 4.3 VIN(V) 4.6 4.9 5.2 Average Efficiency (%) 83.08 to 89.23 79.02 to 86.30 75.75 to 83.83 86.73 83.52 80.78 Output current in the range of VIN = 3.0 to 5.0 V (VIN = 3.6 V typ.) Output Current (mA) VIN = 3.6 V 50 10 Efficiency (%) 5.5 2 LEDs 3 LEDs 4 LEDs 21.06 20.57 20.22 Tolerance (%) Min Max -2.46 -2.39 -2.28 4.02 2.94 2.65 Note: These application examples are provided for reference only. Thorough evaluation and testing should be implemented when designing your application's mass production design. 17 2010-06-306 TB62757FUG Package Dimensions Weight: 0.016 g (typ.) 18 2010-06-306 TB62757FUG Notes on Contents 1. Block Diagrams Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. 2. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 3. Timing Charts Timing charts may be simplified for explanatory purposes. 4. Application Circuits The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass production design stage. Toshiba does not grant any license to any industrial property rights by providing these examples of application circuits. 5. Test Circuits Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. IC Usage Considerations Notes on handling of ICs [1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. [2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. [3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. [4] Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. [5] Carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC that inputs output DC voltage to a speaker directly. 19 2010-06-306 TB62757FUG Points to remember on handling of ICs (1) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (TJ) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. (2) Back-EMF When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor's power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device's motor power supply and output pins might be exposed to conditions beyond maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design. 20 2010-06-306 TB62757FUG About solderability, following conditions were confirmed Solderability (1) (2) Use of Sn-37Pb solder Bath solder bath temperature: 230C dipping time: 5 seconds the number of times: once use of R-type flux Use of Sn-3.0Ag-0.5Cu solder Bath solder bath temperature: 245C dipping time: 5 seconds the number of times: once use of R-type flux 21 2010-06-306 TB62757FUG RESTRICTIONS ON PRODUCT USE * Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice. * This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. * Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. 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