Board Level Heat Sinks P/N: 833302B02800 * No Hardware Device Attachment * Constant Spring Force Tension * Vertical Mounting via Solderable Tab * RoHS Compliant CUSTOMIZED HEATSINKS * Specialized Tabs, Plating * Specialized Body Configurations * Contact Applications Engineering 0 200 400 600 800 1000 100 20 80 16 60 12 40 8 20 4 0 0 0 1 2 3 Heat Dissipated - Watts COMAIR ROTRON, INC 8929 Terman Court, San Diego, CA 92121 Ph (858) 348-6200 Fax (858) 566-4577 E-mail: sales@comairrotron.com, Web: www.comairrotron.com 4 5 Thermal Resistance - oC / Watt (Mounting Surface to Ambient) FEATURES & BENEFITS Air Velocity - LFM Temp Rise Above Ambient -oC (Mounting Surface) * Devices: TO-220 & TO-262 * Size: 19.0 x 12.7 x 12.7 mm * Material: Aluminum, 0.8 mm thick * Type: Stamped * Finish: Black Anodized * PCB Mounting: Solderable Spring Tab * IC Mounting: Integrated Spring * Package: Bulk TO-220, TO-262 PRODUCT SPECIFICATIONS