LP2950CDT3.3RKG - ON SEMICONDUCTOR

June, 2015 − Rev. 4 1Publication Order Number:

HBL1015/D

HBL1015, HBL1025 Series

LED Shunt

The HBL1015/25 Series are electronic shunts which provide a

current bypass in t he c ase o f L EDs g oing i nto open c ircuit. L EDs a re by

nature quite fragile when subjected to transients and surge conditions.

There are also many cases where high reliability of the LED lighting

must be maintained such as in headlights, lighthouses, bridges, aircraft,

runways and so forth. In these cases the low cost addition of the HBL

device will provide full assurance that an entire string of LEDs will not

extinguish should one LED fail open. The HBL device is also

applicable to other loads where circuit continuity is required. The

devices can be used with LED string currents from 140 to 500 mA.

Features

•A Bidirectional Device

•Automatically Resets Itself if the LED Heals Itself or is Replaced

•ON−State Voltage Typically 1.8 V

•OFF−State Current less than 0.5 mA

•These are Pb−Free Devices

Typical Applications

•LEDs where Preventive Maintenance is Impractical

•LED Headlights

•LEDs with High Reliability Requirements

•Crowbar Protection for Open Circuit Conditions

•Overvoltage Protection for Sensitive Circuits

Figure 1. Pin Connections

1. Device is bidirectional. Either configuration shown is acceptable.

2. Pin 2 must be electrically floating

www.onsemi.com

Control

Circuit

Anode

Cathode

MARKING DIAGRAM

xxx = Specific Device Code

(015 or 025)

M = Date Code

G= Pb−Free Package

TSOP−5

CASE 483

(Note: Microdot may be in either location)

See detailed ordering and shipping information in the package

dimensions section on page 4 of this data sheet.

ORDERING INFORMATION

xxx MG

HBL1015, HBL1025 Series

www.onsemi.com

MAXIMUM RATINGS

Rating Symbol Value Unit

On−State Current, (TA = 25°C)

(Note 1)

(Note 2)

(Note 3)

IT(AVG) 500

425

250

Thermal Resistance, Junction−to−Air

(Note 1)

(Note 2)

(Note 3)

qJA 140

150

255

°C/W

Operating Temperature Range TJ−40 to 150 °C

Non−Operating Temperature Range TJ150 °C

Lead Temperature, Soldering (10 Sec) TL260 °C

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be af fected.

1. Mounted onto a 1500 mm2, Denka K1, 1.5 mm AI, 2 kV thermally conductive dielectric, 2 oz. Cu, or equivalent board. Heat sinking should

be spread equally among all pins (caution: pin 2 must be electrically isolated).

2. Mounted onto a 2−layer, 1000 mm2 per layer , 3 oz Cu, FR4 PCB. Heat sinking should be spread equally among all pins (caution: pin 2 must

be electrically isolated).

3. Mounted onto a 2−layer, 50 mm2 per layer, 1 oz Cu, FR4 PCB. Heat sinking should be spread equally among all pins (caution: pin 2 must

be electrically isolated).

NOTE: Normally this device would be mounted on the same copper heat sink and adjacent to the LED(s). If the LED(s) were to go open,

then the HBL shunt would now dissipate the power using the same copper heat sink. Since the HBL has a voltage that is lower

than that of the LED(s), then the power dissipation would be easily handled by the same heat sink as the LED.

ELECTRICAL CHARACTERISTICS (Unless otherwise noted: TA = 25°C)

Symbol Characteristics Min Min Typ Max Unit

V(BR) Breakdown Voltage: The minimum voltage across the device in or at

the breakdown region. Measured at IBR = 1 mA. HBL1015 8.0 V

HBL1025 11.5

IHHolding Current: The minimum current required to maintain the de-

vice in the on-state. HBL1015 125 mA

HBL1025 125

VBO Breakover Voltage: The voltage across the device in the breakover

region. Measured at IBO = 10 mA. HBL1015 14.0 V

HBL1025 16.0

IROff−State Current: The dc value of current that results from the ap-

plication of the off-state voltage. This is measured at 8.0 V for

HBL1015 and 11.5 V for HBL1025.

HBL1015 0.5 mA

HBL1025 0.5

VTOn−State Voltage HBL1015 1.2 1.8 2.4 V

HBL1025 1.2 1.8 2.4

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product

performance may not be indicated by the Electrical Characteristics if operated under different conditions.

HBL1015, HBL1025 Series

www.onsemi.com

TYPICAL PERFORMANCE CUR VES

(TA = 25°C unless otherwise noted)

TA, AMBIENT TEMPERATURE (°C)

IH, HOLDING CURRENT (mA)

Figure 2. Holding Current vs Temperature

012345

VOLTS (V)

Figure 3. Capacitance vs Voltage

Cd, CAPACITANCE (pF)

100

120

140

−50 −25 0 25 50 75 100 125 150

HBL1015

HBL1025

678

HBL1015

HBL1025

TA, AMBIENT TEMPERATURE (°C)

VBR, BREAKDOWN VOLTAGE (V)

Figure 4. Breakover Voltage vs Temperature

10.5

11.5

12.5

13.5

−50 −25 0 25 50 75 100 125 150

HBL1015

HBL1025

14.5

TA, AMBIENT TEMPERATURE (°C)

VT, ON−STATE VOLTAGE (V)

Figure 5. On−State Voltage vs Temperature

0.5

1.0

1.5

−50 −25 0 25 50 75 100 125 150

HBL1015/25 @ 350 mA

2.0

2.5

Figure 6. I−V Characteristics

Breakover

Voltage

Current

On−state

Current

Holding Current

Latching Current

Off−state

Current

Breakdown

Voltage

HBL1015, HBL1025 Series

www.onsemi.com

TYPICAL APPLICATION CIRCUIT

Figure 7. Typical Application Circuit

Current

Source

Control

Circuit

HBL1025

Control

Circuit

HBL1025

Control

Circuit

HBL1025

Control

Circuit

HBL1025

Typical Application Circuit for HBL1025

Current

Source

Control

Circuit

HBL1015

Control

Circuit

HBL1015

Control

Circuit

HBL1015

Control

Circuit

HBL1015

Typical Application Circuit for HBL1015

DEVICE ORDERING INFORMATION

Device Marking Package Shipping†

HBL1015T1G 015 TSOP−5

(Pb−Free) 3000 / Tape & Reel

HBL1025T1G 025 TSOP−5

(Pb−Free) 3000 / Tape & Reel

†For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting

Techniques Reference Manual, SOLDERRM/D.

HBL1015, HBL1025 Series

www.onsemi.com

PACKAGE DIMENSIONS

TSOP−5

CASE 483−02

ISSUE K NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH

THICKNESS. MINIMUM LEAD THICKNESS IS THE

MINIMUM THICKNESS OF BASE MATERIAL.

4. DIMENSIONS A AND B DO NOT INCLUDE MOLD

FLASH, PROTRUSIONS, OR GATE BURRS. MOLD

FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT

EXCEED 0.15 PER SIDE. DIMENSION A.

5. OPTIONAL CONSTRUCTION: AN ADDITIONAL

TRIMMED LEAD IS ALLOWED IN THIS LOCATION.

TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2

FROM BODY.

DIM MIN MAX

MILLIMETERS

A3.00 BSC

B1.50 BSC

C0.90 1.10

D0.25 0.50

G0.95 BSC

H0.01 0.10

J0.10 0.26

K0.20 0.60

M0 10

S2.50 3.00

123

54 S

0.7

0.028

1.0

0.039

ǒmm

inchesǓ

SCALE 10:1

0.95

0.037

2.4

0.094

1.9

0.074

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

0.20

CAB

T0.10

2X T0.20

NOTE 5

CSEATING

PLANE

0.05

DETAIL Z

TOP VIEW

SIDE VIEW

END VIEW

ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.

SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed

at www.onsemi.com/site/pdf/Patent− Marking.pdf. S CILLC r eserves the r ight to make changes without f urther n otice to any product s herein. S CILLC makes n o warranty, representation

or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and

specifically disclaims any and all l iabilit y, including without limitation special, consequential or i ncident al d amages. “Typical” parameters which may be provided in SCILLC d at a sheets

and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each

customer application b y c ust omer’s technical e xperts. SCILLC does n ot c onvey a ny license under its p atent rights n or the r ights o f o thers. SCILLC products are n ot d esigned, i ntended,

or authorized for use as c omponent s i n s yst ems i nt ended f or s urgic al i m plant i nt o the body, or other applications int ended t o support or sustain life, o r f or a ny o ther a pplicat ion in w hich

the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or

unauthorized application, Buyer shall indemnify and hold SCILLC an d it s officers, employees, subsidiaries, a ffiliates, and distributors harmless against all claims, costs, damages, and

expenses, and r easonable a ttorney f ees a rising o ut of, d irect ly o r i ndirectly, any claim o f p ersonal i njury o r d eath a ssociated w ith s uch u nint ended o r u nauthorized u se, e ven if s uch c laim

alleges that SCILLC was negligent regarding the d esign or manufacture of the p art. SCILLC is a n E qual O pport unity/Af firmative A ction E mployer . T his literature i s s ubject t o all applicable

UBLICATION ORDERING INFORMATION

N. American Technical Support: 800−282−9855 Toll Free

USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

Japan Customer Focus Center

Phone: 81−3−5817−1050

HBL1015/D

LITERATURE FULFILLMENT:

Literature Distribution Center for ON Semiconductor

P.O. Box 5163, Denver, Colorado 80217 USA

Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada

Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada

Email: orderlit@onsemi.com

ON Semiconductor Website: www.onsemi.com

Order Literature: http://www.onsemi.com/orderlit

For additional information, please contact your loc

Sales Representative