Schnelle PIN-Fotodiode High Speed PIN-Photodiode Lead (Pb) Free Product - RoHS Compliant SFH 2302 Wesentliche Merkmale Features * Speziell geeignet fur Anwendungen von 400nm bis 1050nm * Sehr kurze Schaltzeit im spezifizierten Wellenlangenbereich * Sehr kurze Schaltzeit bei geringer Sperrspannung (<5V) * Extrem kurze Abklingzeit (slow tail") * 3 mm-Plastikbauform im LED-Gehause * Especially suitable for applications from 400nm to 1050nm * Fast switching time within the specified wavelength * Fast switching time at low reverse voltage (<5V) * Ultra short decay time (slow tail") * 3 mm LED plastic package Anwendungen Applications * * * * * * * * * * * * Optische Laufwerke (CD, DVD) Lichtschranken fur Gleich- und Wechselbetrieb Industrieelektronik Messen/Steuern/Regeln" LWL Abstandsmesser Typ Type Bestellnummer Ordering Code SFH 2302 Q65110A6343 2007-04-27 1 Optical Disc Drives (CD, DVD) Photointerrupters Industrial electronics For control and drive circuits Fibre optic transmission systems Range Finders SFH 2302 Grenzwerte Maximum Ratings Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Betriebs- und Lagertemperatur Operating and storage temperature range Top; Tstg - 40 ... + 100 C Sperrspannung Reverse voltage VR 15 V Sperrspannung, t <120 s Reverse voltage VR 20 V Verlustleistung Total power dissipation Ptot 150 mW 2 kV Elektrostatische Entladung ESD Electrostatic Discharge Human Body Model according to EOS/ESD-5.1-1993 Kennwerte (TA = 25 C) Characteristics Bezeichnung Parameter Symbol Symbol Wert Value min typ Einheit Unit max Spektrale Fotoempfindlichkeit des Chips Spectral sensitivity of the chip = 650nm = 780nm S max Fotostrom, VR = 5 V, Ee = 0.5 mW/cm2 Photocurrent = 650nm = 780nm IP Wellenlange der max. Fotoempfindlichkeit Wavelength of max. sensitivity S max 820 nm Spektraler Bereich der Fotoempfindlichkeit Spectral range of sensitivity S = 10% of Smax 400..1050 nm Abmessung der bestrahlungsempfindlichen Flache L x B Dimensions of radiant sensitive area LxW 0.6 x 0.6 mm x mm Abstand Chipoberflache zu Gehauseoberflache Distance chip front to case surface 2.4 ... 2.8 mm 2007-04-27 A/W 0.45 0.5 A 10 11 H 2 SFH 2302 Kennwerte (TA = 25 C) Characteristics (cont'd) Bezeichnung Parameter Symbol Symbol Wert Value min typ Halbwinkel Half angle 17 Dunkelstrom, VR = 5 V Dark current IR 0.05 t r , tf t r , tf 1.8 2.0 C0 3 TCI -0.03 -0.01 Anstiegs- und Abfallzeit des Fotostromes Rise and fall time of the photocurrent, 10% - 90% VR = 5 V, RL = 50 ; = 650 nm; Ip = 1 mA VR = 5 V, RL = 50 ; = 780 nm; Ip = 1 mA Kapazitat, f = 1 MHz, E = 0, VR = 0 V Capacitance Temperaturkoeffizient von IP Temperature coefficient of IP = 650 nm = 780 nm 8.9 x 10-15 Rauschaquivalente Strahlungsleistung1) Noise equivalent power, VR = 5 V, = 650 nm 1) - 15 NEP = 17,9 x10 2007-04-27 IR x --------S 3 Einheit Unit max Grad deg. 5 nA ns ns 5 pF %/K %/K W -----------Hz SFH 2302 Relative Spectral Sensitivity Srel = f () Total Power Dissipation Capacitance C0 = f (VR), E = 0 Ptot = f(TA) OHF00815 100 % Srel 90 C OHF03901 4 pF 80 3 70 60 50 2 40 30 1 20 10 0 400 500 600 700 800 900 nm 1100 0 -3 10 Dark Current IR = f (VR), E = 0 Dark Current IR = f (TA), E = 0, VR = 5 V 10 -2 10 -1 10 0 10 1 V 10 2 V Switching Time tr, tf = f (VR) OHF03904 0.12 nA 100 IR nA tr , tf IR 10 OHF03917 8 ns 7 6 0.08 5 1 0.06 4 3 0.04 0,1 2 0.02 1 0,01 0 25 0 5 10 15 35 45 55 V 20 75 C 85 TA VR 0 0 2 4 6 8 10 12 V 16 VR Directional Characteristics Srel = f () 2007-04-27 65 4 SFH 2302 Mazeichnung Package Outlines o3.1 (0.122) o2.9 (0.114) 0.7 (0.028) 0.4 (0.016) 0.8 (0.031) 0.4 (0.016) 2.54 (0.100) spacing Area not flat 5.2 (0.205) 4.5 (0.177) 4.1 (0.161) 3.9 (0.154) Collector (Transistor) Cathode (Diode) 4.0 (0.157) 3.6 (0.142) 3.5 (0.138) 1.8 (0.071) 1.2 (0.047) 29 (1.142) 27 (1.063) 0.6 (0.024) 0.4 (0.016) Chip position 6.3 (0.248) 5.9 (0.232) GEOY6653 Mae in mm (inch) / Dimensions in mm (inch) 4.8 (0.189) Empfohlenes Lotpaddesign Wellenloten (TTW) Recommended Solder Pad TTW Soldering 4 (0.157) OHLPY985 Mae in mm (inch) / Dimensions in mm (inch) 2007-04-27 5 SFH 2302 Lotbedingungen Soldering Conditions Wellenloten TTW (nach CECC 00802) TTW Soldering (acc. to CECC 00802) OHLY0598 300 C T 10 s 250 Normalkurve standard curve 235 C ... 260 C Grenzkurven limit curves 2. Welle 2. wave 200 1. Welle 1. wave 150 ca 200 K/s 2 K/s 5 K/s 100 C ... 130 C 100 2 K/s 50 Zwangskuhlung forced cooling 0 0 50 100 150 200 s 250 t Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg www.osram-os.com (c) All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2007-04-27 6