SFH 2302
Schnelle PIN-Fotodiode
High Speed PIN-Photodiode
Lead (Pb) Free Product - RoHS Compliant
2007-04-27 1
Wesentliche Merkmale
• Speziell geeignet für Anwendungen von 400nm
bis 1050nm
• Sehr kurze Schaltzeit im spezifizierten
Wellenlängenbereich
• Sehr kurze Schaltzeit bei geringer
Sperrspannung (<5V)
• Extrem kurze Abklingzeit („slow tail“)
• 3 mm-Plastikbauform im LED-Gehäuse
Anwendungen
• Optische Laufwerke (CD, DVD)
• Lichtschranken für Gleich- und Wechselbetrieb
• Industrieelektronik
• „Messen/Steuern/Regeln“
•LWL
• Abstandsmesser
Typ
Type
Bestellnummer
Ordering Code
SFH 2302 Q65110A6343
Features
• Especially suitable for applications from 400nm
to 1050nm
• Fast switching time within the specified
wavelength
• Fast switching time at low reverse voltage
(<5V)
• Ultra short decay time („slow tail“)
• 3 mm LED plastic package
Applications
• Optical Disc Drives (CD, DVD)
• Photointerrupters
• Industrial electronics
• For control and drive circuits
• Fibre optic transmission systems
• Range Finders
2007-04-27 2
SFH 2302
Grenzwerte
Maximum Ratings
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Betriebs- und Lagertemperatur
Operating and storage temperature range
Top; Tstg – 40 … + 100 °C
Sperrspannung
Reverse voltage
VR15 V
Sperrspannung, t <120 s
Reverse voltage
VR20 V
Verlustleistung
Total power dissipation
Ptot 150 mW
Elektrostatische Entladung
Electrostatic Discharge
Human Body Model according to EOS/ESD-5.1-1993
ESD 2 kV
Kennwerte (TA = 25 °C)
Characteristics
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
min typ max
Spektrale Fotoempfindlichkeit des Chips
Spectral sensitivity of the chip
λ = 650nm
λ = 780nm
λS max
0.45
0.5
A/W
Fotostrom, VR = 5 V, Ee = 0.5 mW/cm2
Photocurrent
λ = 650nm
λ = 780nm
IP
10
11
µA
Wellenlänge der max. Fotoempfindlichkeit
Wavelength of max. sensitivity
λS max 820 nm
Spektraler Bereich der Fotoempfindlichkeit
Spectral range of sensitivity
S = 10% of Smax
λ400..1050 nm
Abmessung der bestrahlungsempfindlichen Fläche
Dimensions of radiant sensitive area
L × B
L × W
0.6 × 0.6 mm × mm
Abstand Chipoberfläche zu Gehäuseoberfläche
Distance chip front to case surface
H2.4 … 2.8 mm
SFH 2302
2007-04-27 3
Halbwinkel
Half angle
ϕ ± 17 Grad
deg.
Dunkelstrom, VR = 5 V
Dark current
IR 0.05 5nA
Anstiegs- und Abfallzeit des Fotostromes
Rise and fall time of the photocurrent, 10% - 90%
VR = 5 V, RL = 50 Ω; λ = 650 nm; Ip = 1 mA
VR = 5 V, RL = 50 Ω; λ = 780 nm; Ip = 1 mA
tr, tf
tr, tf
1.8
2.0
ns
ns
Kapazität, f = 1 MHz, E = 0, VR = 0 V
Capacitance
C03 5 pF
Temperaturkoeffizient von IP
Temperature coefficient of IP
λ = 650 nm
λ = 780 nm
TCI
-0.03
-0.01
%/K
%/K
Rauschäquivalente Strahlungsleistung1)
Noise equivalent power, VR = 5 V, λ = 650 nm
8.9 × 10-15
1)
Kennwerte (TA = 25 °C)
Characteristics (cont’d)
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
min typ max
W
Hz
------------
NEP 17,9 15–
×10 IR
Sλ
---------
×=
SFH 2302
2007-04-27 4
Relative Spectral Sensitivity
Srel = f (λ)
Dark Current
IR = f (VR), E = 0
Directional Characteristics
Srel = f (ϕ)
OHF00815
0
λ
rel
S
%
400 500 600 700 800 900 nm 1100
10
20
30
40
50
60
70
80
90
100
OHF03904
V
R
R
I
nA
0V
0
0.02
0.04
0.06
0.08
0.12
5 10 15 20
Total Power Dissipation
Ptot = f(TA)
Dark Current
IR = f (TA), E = 0, VR = 5 V
0,01
0,1
1
10
100
25 35 45 55 65 75 85
TA
IR
°C
nA
Capacitance
C0 = f (VR), E = 0
Switching Time
tr, tf = f (VR)
OHF03901
0
V
-3
10
-2
10
-1
10
0
10
1
10
2
10V
pF
C
1
2
3
4
OHF03917
V
R
r
t
ns
0V
0
,
f
t
2 4 6 8 10 12 16
1
2
3
4
5
6
7
8
SFH 2302
2007-04-27 5
Maßzeichnung
Package Outlines
Maße in mm (inch) / Dimensions in mm (inch)
Empfohlenes Lötpaddesign Wellenlöten (TTW)
Recommended Solder Pad TTW Soldering
Maße in mm (inch) / Dimensions in mm (inch)
0.6 (0.024)
0.4 (0.016)
4.0 (0.157)
3.6 (0.142)
ø3.1 (0.122)
ø2.9 (0.114)
4.1 (0.161)
3.9 (0.154)
5.2 (0.205)
4.5 (0.177)
3.5 (0.138)
6.3 (0.248)
5.9 (0.232)
1.8 (0.071)
1.2 (0.047)
29 (1.142)
27 (1.063)
2.54 (0.100)
spacing
0.7 (0.028)
0.4 (0.016)
Chip position
Collector (Transistor)
Area not flat
GEOY6653
0.4 (0.016)
0.8 (0.031)
Cathode (Diode)
4 (0.157)
OHLPY985
4.8 (0.189)
2007-04-27 6
SFH 2302
Lötbedingungen
Soldering Conditions
Wellenlöten TTW (nach CECC 00802)
TTW Soldering (acc. to CECC 00802)
Published by
OSRAM Opto Semiconductors GmbH
Wernerwerkstrasse 2, D-93049 Regensburg
www.osram-os.com
© All Rights Reserved.
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.
1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected
to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.
2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
OHLY0598
0
0
50 100 150 200 250
50
100
150
200
250
300
T
t
C
s
235 C
10 s
C... 260
1. Welle
1. wave
2. Welle
2. wave
5 K/s 2 K/s
ca 200 K/s
CC... 130100
2 K/s Zwangskühlung
forced cooling
Normalkurve
standard curve
Grenzkurven
limit curves
