Semiconductor Components Industries, LLC, 2002
January, 2002 – Rev. 7 1Publication Order Number:
MC10103/D
MC10103
Quad 2-Input OR Gate
The MC10103 is a quad 2–input OR gate. The MC10103 provides
one gate with OR/NOR outputs.
•PD = 25 mW typ/gate (No Load)
•tpd = 2.0 ns typ
•tr, tf = 2.0 ns typ (20%–80%)
LOGIC DIAGRAM
VCC1 = PIN 1
VCC2 = PIN 16
VEE = PIN 8
14
13
12
11
10
3
7
6
2
5
4
15
9
DIP
PIN ASSIGNMENT
VCC1
AOUT
BOUT
AIN
AIN
BIN
BIN
VEE
VCC2
COUT
DOUT
CIN
CIN
DIN
DIN
COUT
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion Tables on page 18
of the ON Semiconductor MECL Data Book (DL122/D).
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Device Package Shipping
ORDERING INFORMATION
MC10103L CDIP–16 25 Units / Rail
MC10103P PDIP–16 25 Units / Rail
MC10103FN PLCC–20 46 Units / Rail
MARKING
DIAGRAMS
1
16
A = Assembly Location
WL = Wafer Lot
YY = Year
WW = Work Week
CDIP–16
L SUFFIX
CASE 620
MC10103L
AWLYYWW
PDIP–16
P SUFFIX
CASE 648
PLCC–20
FN SUFFIX
CASE 775
10103
AWLYYWW
1
1
16
MC10103P
AWLYYWW
MC10103
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2
ELECTRICAL CHARACTERISTICS
Test Limits
Pin
Under
–30°C +25°C +85°C
Characteristic Symbol
U
n
d
er
Test Min Max Min Typ Max Min Max Unit
Power Supply Drain Current IE8 29 21 26 29 mAdc
Input Current IinH 4* 390 245 245 µAdc
IinL 4* 0.5 0.5 0.3 µAdc
Output Voltage Logic 1 VOH 2
9–1.060
–1.060 –0.890
–0.890 –0.960
–0.960 –0.810
–0.810 –0.890
–0.890 –0.700
–0.700 Vdc
Output Voltage Logic 0 VOL 2
9–1.890
–1.890 –1.675
–1.675 –1.850
–1.850 –1.650
–1.650 –1.825
–1.825 –1.615
–1.615 Vdc
Threshold Voltage Logic 1 VOHA 2
9–1.080
–1.080 –0.980
–0.980 –0.910
–0.910 Vdc
Threshold Voltage Logic 0 VOLA 2
9–1.655
–1.655 –1.630
–1.630 –1.595
–1.595 Vdc
Switching Times (50Ω Load) ns
Propagation Delay t4+2+
t12+9– 2
91.0
1.0 3.1
3.1 1.0
1.0 2.0
2.0 2.9
2.9 1.0
1.0 3.3
3.3
Rise Time (20 to 80%) t2+ 2 1.1 3.6 1.1 2.0 3.3 1.1 3.7
Fall Time (20 to 80%) t2– 2 1.1 3.6 1.1 2.0 3.3 1.1 3.7
* Individually test each input applying VIH or VIL to input under test.
MC10103
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3
ELECTRICAL CHARACTERISTICS (continued)
TEST VOLTAGE VALUES (Volts)
@ Test Temperature VIHmax VILmin VIHAmin VILAmax VEE
–30°C–0.890 –1.890 –1.205 –1.500 –5.2
+25°C–0.810 –1.850 –1.105 –1.475 –5.2
+85°C–0.700 –1.825 –1.035 –1.440 –5.2
Pin
Under
TEST VOLTAGE APPLIED TO PINS LISTED BELOW
(V )
Characteristic Symbol Under
Test VIHmax VILmin VIHAmin VILAmax VEE (VCC)
Gnd
Power Supply Drain Current IE8 8 1, 16
Input Current IinH 4* 4* 8 1, 16
IinL 4* 4* 8 1, 16
Output Voltage Logic 1 VOH 2
94.5 8
81, 16
1, 16
Output Voltage Logic 0 VOL 2
912, 13 8
81, 16
1, 16
Threshold Voltage Logic 1 VOHA 2
94, 5 12, 13 8
81, 16
1, 16
Threshold Voltage Logic 0 VOLA 2
912, 13 4, 5 8
81, 16
1, 16
Switching Times (50Ω Load) Pulse In Pulse Out –3.2 V +2.0 V
Propagation Delay t4+2+
t12+9– 2
94
12 2
98
81, 16
1, 16
Rise Time (20 to 80%) t2+ 2 4 2 8 1, 16
Fall Time (20 to 80%) t2– 2 4 2 8 1, 16
* Individually test each input applying VIH or VIL to input under test.
Each MECL 10,000 series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is maintained.
Outputs are terminated through a 50-ohm resistor to –2.0 volts. Test procedures are shown for only one gate. The other gates are tested in the
same manner.
MC10103
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4
PACKAGE DIMENSIONS
PLCC–20
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
NOTES:
1. DATUMS -L-, -M-, AND -N- DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM -T-, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
–M–
–N–
–L–
Y BRK
W
V
D
D
S
L-M
M
0.007 (0.180) N S
T
S
L-M
M
0.007 (0.180) N S
T
S
L-M
S
0.010 (0.250) N S
T
XG1
B
U
Z
VIEW D–D
20 1
S
L-M
M
0.007 (0.180) N S
T
S
L-M
M
0.007 (0.180) N S
T
S
L-M
S
0.010 (0.250) N S
T
C
G
VIEW S
E
J
R
Z
A
0.004 (0.100)
–T– SEATING
PLANE
S
L-M
M
0.007 (0.180) N S
T
S
L-M
M
0.007 (0.180) N S
T
H
VIEW S
K
K1
F
G1 DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.385 0.395 9.78 10.03
B0.385 0.395 9.78 10.03
C0.165 0.180 4.20 4.57
E0.090 0.110 2.29 2.79
F0.013 0.019 0.33 0.48
G0.050 BSC 1.27 BSC
H0.026 0.032 0.66 0.81
J0.020 --- 0.51 ---
K0.025 --- 0.64 ---
R0.350 0.356 8.89 9.04
U0.350 0.356 8.89 9.04
V0.042 0.048 1.07 1.21
W0.042 0.048 1.07 1.21
X0.042 0.056 1.07 1.42
Y--- 0.020 --- 0.50
Z2 10 2 10
G1 0.310 0.330 7.88 8.38
K1 0.040 --- 1.02 ---
MC10103
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5
PACKAGE DIMENSIONS
CDIP–16
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE T
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
–A–
–B–
–T–
FE
G
NK
C
SEATING
PLANE
16 PL
D
S
A
M
0.25 (0.010) T
16 PLJ
S
B
M
0.25 (0.010) T
M
L
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.750 0.785 19.05 19.93
B0.240 0.295 6.10 7.49
C--- 0.200 --- 5.08
D0.015 0.020 0.39 0.50
E0.050 BSC 1.27 BSC
F0.055 0.065 1.40 1.65
G0.100 BSC 2.54 BSC
H0.008 0.015 0.21 0.38
K0.125 0.170 3.18 4.31
L0.300 BSC 7.62 BSC
M0 15 0 15
N0.020 0.040 0.51 1.01
16 9
18
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
B
FC
S
HGD
J
L
M
16 PL
SEATING
18
916
K
PLANE
–T–
M
A
M
0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.740 0.770 18.80 19.55
B0.250 0.270 6.35 6.85
C0.145 0.175 3.69 4.44
D0.015 0.021 0.39 0.53
F0.040 0.70 1.02 1.77
G0.100 BSC 2.54 BSC
H0.050 BSC 1.27 BSC
J0.008 0.015 0.21 0.38
K0.110 0.130 2.80 3.30
L0.295 0.305 7.50 7.74
M0 10 0 10
S0.020 0.040 0.51 1.01
PDIP–16
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
MC10103
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6
Notes
MC10103
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7
Notes
MC10103
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8
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MC10103/D
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