1-101647-01 - SENSIRION - Datasheet.Live

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Datasheet SGPC3

Indoor Air Quality Sensor for TVOC Measurements

 Ultra-low power gas sensor for indoor air quality

applications

 Outstanding long-term stability

 Ultra-low power consumption: 0.065 mA at 1.8V

 I2C interface with TVOC output signal

 Very small 6-pin DFN package: 2.45 x 2.45 x 0.9 mm3

 Tape and reel packaged, reflow solderable

Block Diagram

Figure 1 Functional block diagram of the SGPC3.

Product Summary

The SGPC3 is a digital ultra-low power gas sensor

designed for mobile and battery-driven indoor air

quality applications. Sensirion’s CMOSens®

technology offers a complete sensor system on a

single chip featuring a digital I2C interface, a

temperature-controlled micro-hotplate and a

preprocessed indoor air quality signal. The sensing

element features an unmatched robustness against

contamination by siloxanes present in real-world

applications enabling a unique long-term stability and

low drift.

The very small 2.45 x 2.45 x 0.9 mm3 DFN package

and its ultra-low power consumption make the

SGPC3 perfectly suited for mobile and wearable

applications. Sensirion’s state-of-the-art production

process guarantees high reproducibility and reliability.

Tape and reel packaging, together with suitability for

standard SMD assembly processes make the SGPC3

predestined for high-volume applications.

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1 Sensor Performance

1.1 Gas Sensing Performance

Parameter

Signal

Values

Comments

Measurement

range1

Ethanol signal

0 ppm to 1000 ppm

Specified

range

Ethanol signal

0.3 ppm2 to 30 ppm

The specifications below are defined for this measurement

range. The specified measurement range covers the gas

concentrations expected in indoor air quality applications.

Relative

accuracy3

Ethanol signal

see Figure 2

typ.: 15% of meas. value

Accuracy is defined as

c-cset

cset

with c the measured concentration and cset the

concentration set point. The concentration c is determined

by c = cref ∙ exp 󰇡sref- sout

512 󰇢

with

sout: Ethanol signal output at concentration c

sref: Ethanol signal output at concentration

cref = 0.18 ppm

Long-term drift4

Ethanol signal

see Figure 3

typ.: 1.3% of meas. value

Change of accuracy over time: Siloxane accelerated

lifetime test5

Resolution

Ethanol signal

0.2 % of meas. value

Resolution of Ethanol signal output in relative change of the

measured concentration

Sampling time

Ethanol signal

Low power mode: 2s

The on-chip baseline algorithm has been optimized for

these sampling rates. The sensor shows best performance

when used with this sampling rate.

Ultralow power mode: 30s

Table 1 Gas sensing performance. Specifications are at 25°C, 50% RH and typical VDD. All parameters are determined for the low-power

operation mode with one measurement every 2s. The sensors have been operated for at least 24h before the first characterization.

Exposure to ethanol and H2 concentrations up to 1000 ppm have been tested. For applications requiring the measurement of higher gas

concentrations please contact Sensirion.

ppm: parts per million. 1 ppm = 1000 ppb (parts per billion)

90% of the sensors will be within the typical accuracy tolerance, >99% are within the maximum tolerance.

The long-term drift is stated as change of accuracy per year of operation.

Test conditions: operation in 250 ppm Decamethylcyclopentasiloxane (D5) for 200h simulating 10 years of operation in an indoor

environment.

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Accuracy Ethanol signal

Figure 2 Typical and maximum accuracy tolerance for the low-power operation mode in %

of measured value at 25°C, 50% RH and typical VDD. The sensors have been operated

for at least 24h before the characterization.

Long-term drift Ethanol signal

Figure 3 Typical and maximum long-term drift in % of measured value for the low-power

operation mode at 25°C, 50% RH and typical VDD. The sensors have been operated for

at least 24h before the first characterization.

1.2 Air Quality Signal

Air quality signal TVOC is calculated from Ethanol measurements using internal conversion and baseline compensation

algorithms (see Figure 4).

Figure 4 Simplified version of the functional block diagram (compare Figure 1) showing the

signal paths of the SGPC3.

Signal

Processing

Baseline

compensation

& Signal

conversion

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Specifications of air quality signals are shown in Table 2.

Parameter

Signal

Values

Comments

Output range

TVOC signal

0 ppb to 60000 ppb

Maximum possible output range. The gas

sensing performance is specified for the

measurement range as defined in Table 1

Range

Resolution

TVOC signal

0 ppb - 2008 ppb

1 ppb

2008 ppb – 11110 ppb

6 ppb

11110 ppb – 60000 ppb

32 ppb

Sampling

interval

TVOC signal

Low power mode: 2s

The on-chip baseline algorithm has been

optimized for these sampling rates. The

sensor shows best performance when used

with this sampling rate.

Ultra-low power mode: 30s

Table 2 Air quality signal specifications.

1.3 Recommended Operating and Storage Conditions

Gas Sensing Specifications as detailed in Table 1 are guaranteed only when the sensor is stored and operated under the

recommended conditions. Prolonged exposure to conditions outside these conditions may accelerate aging.

The recommended temperature and humidity range for operating the SGPC3 is 5–55 °C and 4–30 g m−3 absolute humidity,

respectively (see Figure 5 for the corresponding translation into relative humidity). It is recommended to store the sensor in a

temperature range of 5–30 °C and below 30 g m−3 absolute humidity (see Figure 6 for the corresponding translation into relative

humidity). The sensor must not be exposed towards condensing conditions (i.e., >90 % relative humidity) at any time. To ensure

a stable performance of the SGPC3, conditions described in the document SGP Handling Instructions have to be met. Please

also refer to the Design-in Guide for optimal integration of the SGPC3 into the final device.

Figure 5 Recommended relative humidity and temperature for

operating the SGPC3.

Figure 6 Recommended relative humidity and temperature for

storing the SGPC3.

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2 Electrical Specifications

Parameter

Min.

Typ.

Max.

Unit

Comments

Supply voltage VDD

1.62

1.8

1.98

Minimal voltage must be guaranteed also for the

maximum supply current specified in this table.

Hotplate supply voltage VDDH

1.62

1.8

1.98

Supply current in measurement mode6

48.8

The measurement mode is activated for 40 ms by

sending an “sgpc3_measure_tvoc”,

“sgpc3_measure_raw” or

“sgpc3_measure_tvoc_and_raw” command. After

40 ms, the sensor will be set into sleep mode.

Specified at 25°C and typical VDD.

Average supply current low power mode

0.98

Average supply current with one measurement

every 2s.

Average supply current ultra-low power

mode

0.065

Average supply current with one measurement

every 30s.

Sleep current

μA

LOW-level input voltage

-0.5

0.3*VDD

HIGH-level input voltage

0.7*VDD

VDD+0.5

Vhys hysteresis of Schmitt trigger inputs

0.05*VDD

LOW-level output voltage

0.2*VDD

(open-drain) at 2mA sink current

Communication

Digital 2-wire interface, I2C fast mode.

Table 3 Electrical specifications.

3 Interface Specifications

The SGPC3 comes in a 6-pin DFN package, see Table 4.

Name

Comments

VDD

Supply voltage

VSS

Ground

SDA

Serial data, bidirectional

Connect to ground (no electrical function)

VDDH

Supply voltage, hotplate

SCL

Serial clock, bidirectional

Table 4 Pin assignment (transparent top view). Dashed lines are only visible from the bottom.

A 20% higher current is drawn during 5ms on VDDH after entering the measurement mode.

A X8 9

SGP

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Figure 7 Typical application circuit (for better clarity in the image, the positioning of the pins does

not reflect the positions on the real sensor).

The electrical specifications of the SGPC3 are shown in Table 3. The power supply pins must be decoupled with a 100 nF

capacitor that shall be placed as close as possible to pin VDD – see Figure 7. The required decoupling depends on the power

supply network connected to the sensor. We also recommend VDD and VDDH pins to be shorted.

SCL is used to synchronize the communication between the microcontroller and the sensor. The SDA pin is used to transfer

data to and from the sensor. For safe communication, the timing specifications defined in the I2C manual

must be met. Both

SCL and SDA lines are open-drain I/Os with diodes to VDD and VSS. They should be connected to external pull-up resistors.

To avoid signal contention, the microcontroller must only drive SDA and SCL low. The external pull-up resistors (e.g. Rp = 10

kΩ) are required to pull the signal high. For dimensioning resistor sizes please take bus capacity and communication frequency

into account (see for example Section 7.1 of NXPs I2C Manual for more details7). It should be noted that pull-up resistors may

be included in I/O circuits of microcontrollers.

The die pad or center pad is electrically connected to GND. Hence, electrical considerations do not impose constraints on the

wiring of the die pad. However, for mechanical stability it is recommended to solder the center pad to the PCB.

4 Absolute Minimum and Maximum Ratings

Stress levels beyond those listed in Table 5 may cause permanent damage to the device. These are stress ratings for the

electrical components only and functional operation of the device at these conditions cannot be guaranteed. Exposure to the

absolute maximum rating conditions for extended periods may affect the reliability of the device.

Parameter

Rating

Supply voltage VDD

-0.3 V to +2.16 V

Supply voltage VDDH

-0.3 V to +2.16 V

Storage temperature range

-40 to +125°C

Operating temperature range

-40 to +85°C

Humidity Range

10% - 95% (non-condensing)

ESD HBM

2 kV

ESD CDM

500 V

Latch up, JESD78 Class II, 125°C

100 mA

Table 5 Absolute minimum and maximum ratings.

Please refer to Handling and Assembly Guideline for Sensirion Gas Sensors on Sensirion webpage for full documentation.

http://www.nxp.com/documents/user_manual/UM10204.pdf

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5 Timing Specifications

5.1 Sensor System Timings

Default conditions of 25°C and 1.8 V supply voltage apply to values in the table below, unless otherwise stated. The timings

refer to the power up and reset of the ASIC part and do not reflect the usefulness of the readings.

Parameter

Symbol

Condition

Min.

Typ.

Max.

Unit

Comments

Power-up time

tPU

After hard reset, VDD ≥VPOR

0.4

0.6

Soft reset time

tSR

After soft reset

0.4

0.6

Table 6 System timing specifications.

5.2 Communication Timings

Default conditions of 25 °C and 1.8 V supply voltage apply to values in the table below, unless otherwise stated.

Parameter

Symbol

Conditions

Min.

Typ.

Max.

Units

Comments

SCL clock frequency

fSCL

400

kHz

Hold time (repeated) START

condition

tHD;STA

After this period, the

first clock pulse is

generated

0.6

µs

LOW period of the SCL clock

tLOW

1.3

µs

HIGH period of the SCL clock

tHIGH

0.6

µs

Set-up time for a repeated START

condition

tSU;STA

0.6

µs

SDA hold time

tHD;DAT

SDA set-up time

tSU;DAT

100

SCL/SDA rise time

300

SCL/SDA fall time

300

SDA valid time

tVD;DAT

0.9

µs

Set-up time for STOP condition

tSU;STO

0.6

µs

Capacitive load on bus line

400

Table 7 Communication timing specifications.

Figure 8 Timing diagram for digital input/output pads. SDA directions are seen from the sensor.

Bold SDA lines are controlled by the sensor; plain SDA lines are controlled by the micro-controller.

Note that SDA valid read time is triggered by falling edge of preceding toggle.

SCL

SDA

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6 Operation and Communication

The SGPC3 supports I2C fast mode. For detailed information on the I2C protocol, refer to NXP I2C-bus specification7. All SGPC3

commands and data are mapped to a 16-bit address space. Additionally, data and commands are protected with a CRC

checksum to increase the communication reliability. The 16-bit commands that are sent to the sensor already include a 3-bit

CRC checksum. Data sent from and received by the sensor is always succeeded by an 8-bit CRC.

In write direction it is mandatory to transmit the checksum, since the SGPC3 only accepts data if it is followed by the correct

checksum. In read direction it is up to the master to decide if it wants to read and process the checksum.

SGPC3

Hex. Code

I2C address

0x58

Table 8 I2C device address.

The typical communication sequence between the I2C master (e.g., a microcontroller in a host device) and the sensor is

described as follows:

1. The sensor is powered up, communication is initialized

2. The I2C master periodically requests measurement and reads data, in the following sequence:

a. I2C master sends a measurement command

b. I2C master waits until the measurement is finished, either by waiting for the maximum execution time or by waiting

for the expected duration and then poll data until the read header is acknowledged by the sensor (expected

durations are listed in Table 10)

c. I2C master reads out the measurement result

6.1 Power-Up and Communication Start

The sensor starts powering-up after reaching the power-up threshold voltage VDD,Min specified in Table 3Table 6. After reaching

this threshold voltage, the sensor needs the time tPU to enter the idle state. Once the idle state is entered it is ready to receive

commands from the master.

Each transmission sequence begins with a START condition (S) and ends with a STOP condition (P) as described in the I2C-

bus specification.

6.2 Measurement Communication Sequence

A measurement communication sequence consists of a START condition, the I2C write header (7-bit I2C device address plus 0

as the write bit) and a 16-bit measurement command. The proper reception of each byte is indicated by the sensor. It pulls the

SDA pin low (ACK bit) after the falling edge of the 8th SCL clock to indicate the reception. With the acknowledgement of the

measurement command, the SGPC3 starts measuring.

When the measurement is in progress, no communication with the sensor is possible and the sensor aborts the communication

with a XCK condition.

After the sensor has completed the measurement, the master can read the measurement results by sending a START condition

followed by an I2C read header. The sensor will acknowledge the reception of the read header and responds with data. The

response data length is listed in Table 10 and is structured in data words, where one word consists of two bytes of data followed

by one byte CRC checksum. Each byte must be acknowledged by the microcontroller with an ACK condition for the sensor to

continue sending data. If the sensor does not receive an ACK from the master after any byte of data, it will not continue sending

data.

After receiving the checksum for the last word of data, an XCK and STOP condition have to be sent (see Figure 10).

The I2C master can abort the read transfer with a XCK followed by a STOP condition after any data byte if it is not interested in

subsequent data, e.g. the CRC byte or following data bytes, in order to save time. Note that the data cannot be read more than

once, and access to data beyond the specified amount will return a pattern of 1s.

6.3 Measurement Commands

The available measurement commands of the SGPC3 are listed in Table 10.

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Set Power Mode

The SGPC3 offers two operation modes with different power consumptions and sampling intervals. The low-power mode with

1mA average current and 2s sampling interval and the ultra-low power mode with 0.065mA average current and 30s sampling

interval. By default, the SGPC3 is using the low-power mode.

The sensor can be switched to the ultra-low power operation mode by sending the “sgpc3_set_power_mode” command followed

by 2 data bytes (MSB first) with a value of “0x0000” and the corresponding CRC byte. The “sgpc3_set_power_mode” command

has to be sent before the “sgpc3_tvoc_init_continuous” command (Figure 9). A restart of the sensor (power-up or soft reset) or

a “sgpc3_set_power_mode” command followed by a “0x0001” switches the sensor back to the default low-power operation

mode.

It is recommended to test the two modes on different SGPC3 sensors, as switching the power mode back and forth with the

same sensor will impact sensor accuracy.

Air Quality Signal

The SGPC3 uses a dynamic baseline compensation algorithm and on-chip calibration parameters to provide a preprocessed

total VOC signal (TVOC) air quality signal. Sending the “sgpc3_tvoc_init_continuous” commands initializes and starts the air

quality measurement. In addition, the “sgpc3_tvoc_init_continuous” command is used to accelerate the switch-on time of the

SGPC3. After sending the “sgpc3_tvoc_init_continuous” command, the SGPC3 is operated in a high power operation mode until

the first “sgpc3_measure_tvoc” command is sent. During this time interval the hotplate of the SGPC3 is operated continuously

with a supply current as indicated in Table 3 (supply current during measurements).

For air quality measurements the “sgpc3_measure_tvoc” command is used. The “sgpc3_measure_tvoc” command has to be

sent in regular intervals of 2s for the low-power operation mode or 30s for the ultra-low power operation mode to ensure proper

operation of the dynamic baseline compensation algorithms and the specified power consumption. The sensor responds with 2

data bytes (MSB first) and 1 CRC byte for the preprocessed air quality signal which corresponds to a TVOC concentration in

ppb. For the first 20s after the first “sgpc3_measure_tvoc” command the sensor is in an initialization phase during which a

“sgpc3_measure_tvoc” command returns a fixed value of 0 ppb.

After every power-up or soft reset, a new “sgpc3_tvoc_init_continuous” command has to be sent. The command sequence after

start-up for initializing and repeating measurements is illustrated in Figure 9.

Figure 9 Command sequence for starting the SGPC3 in the low-power and the ultra-low-power mode. An example

implementation of a generic driver including recommended time intervals for the accelerated switch-on phase can be found in

the document SGPC3_driver_integration_guide.

Set and Get Baseline

The SGPC3 provides the possibility to read and write the baseline value of the baseline compensation algorithm. This feature is

used to save the baseline in regular intervals on an external non-volatile memory and restore it after a new power-up or soft

reset of the sensor. The command “sgpc3_get_tvoc_baseline” returns the baseline value. The sensor responds with 2 data

bytes (MSB first) and 1 CRC byte. This value should be stored on the external memory. After a power-up or soft reset, the

baseline of the baseline compensation algorithm can be restored by sending first an “sgpc3_tvoc_init_continuous” command

followed by a “sgpc3_set_tvoc_baseline” command with the baseline value as a parameter. The baseline value is specific for

the operation mode. “sgpc3_get_tvoc_baseline” returns the baseline value for the operation mode set by the

“sgpc3_set_power_mode” command.

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Inceptive Baseline for TVOC measurements

The inceptive baseline offers an individually calibrated starting reference to the dynamic baseline compensation algorithm.

Thereby the feature yields a better TVOC concentration accuracy for the very first start-up under bad air condition. This results

in a better user experience especially when accuracy is required. Please note, that the application of this feature is solely limited

to the very first start-up period of an SGP sensor. Furthermore, it is limited to the TVOC signal output.

The command “sgpc3_get_tvoc_inceptive_baseline” reads the precalibrated reference point from the sensor HW and

“sgpc3_set_tvoc_baseline” activates the inceptive baseline.

Sensor Signals

The command “sgpc3_measure_raw” is intended for part verification and testing purposes. It returns the sensor raw signal for

ethanol (Sout_ETOH). The ethanol signal is used as input for the on-chip calibration and baseline correction algorithm as shown in

Figure 9. The command performs a measurement to which the sensor responds with 2 data bytes (MSB first) and 1 CRC byte

(see Figure 10). The Ethanol signal can be used to calculate gas concentrations c relative to a reference concentration cref by

c = cref ∙ exp 󰇡sref- sout

512 󰇢

with sout = sout_EtOH and sref the Ethanol signal output at the corresponding reference concentration cref_EtOh.

The command “sgpc3_measure_tvoc_and_raw” returns the sensor raw signal (Sout_ETOH) and the TVOC air quality signal. This

command can be used in place of the “sgpc3_measure_tvoc” or the “sgpc3_measure_raw” command. The command performs

a measurement to which the sensor responds with 2 data bytes (MSB first) and 1 CRC byte (see Figure 10) each for the Ethanol

signal and the TVOC air quality signal in the order Ethanol signal (Sout_ETOH) and TVOC air quality signal.

Humidity Compensation

The SGPC3 features an on-chip humidity compensation for the air quality signal and the sensor raw signal (Ethanol signal). To

use the on-chip humidity compensation an absolute humidity value from an external humidity sensor like the SHTxx is required.

Using the “sgpc3_set_absolute_humidity” command, a new humidity value can be written to the SGPC3 by sending 2 data bytes

(MSB first) and 1 CRC byte. The 2 data bytes represent humidity values as a fixed-point 8.8bit number with a minimum value of

0x0001 (=1/256 g/m3) and a maximum value of 0xFFFF (255 g/m3 + 255/256 g/m3). For instance, sending a value

of 0x0F80 corresponds to a humidity value of 15.50 g/m3 (15 g/m3 + 128/256 g/m3).

After setting a new humidity value, this value will be used by the on-chip humidity compensation algorithm until a new humidity

value is set using the “sgpc3_set_absolute_humidity” command. Restarting the sensor (power-on or soft reset) or sending a

value of 0x0000 (= 0 g/m3) disables the humidity compensation until a new humidity value is sent.

Absolute humidity values dV in unit g/m3 can be calculated by the following formula:

dv󰇛T, RH󰇜216.7 RH

100% 6.112exp 17.62T

243.12+T

273.15+T

with temperature T and relative humidity RH.

Example: Inserting T = 25°C and RH = 50% in above formula results in the absolute humidity dV = 11.8 g/m3.

The inceptive baseline feature is available for SGPC3 sensors with feature set 6 and later.

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Feature Set

The SGPC3 features a versioning system for the available set of measurement commands and on-chip algorithms. This so

called feature set version number can be read out by sending a “sgpc3_get_feature_set_version” command. The sensor

responds with 2 data bytes (MSB first) and 1 CRC byte (see Table 9). This feature set version number is used to refer to a

corresponding set of available measurement commands as listed in Table 10.

Most significant byte (MSB)

Least significant byte (LSB)

Bit

Product type

SGPC3: 1

Reserved for

future use

Product version

Table 9 Structure of the SGP feature set number. Please note that the last 5 bits of the product version (bits 12-16 of the LSB) are subject

to change. This is used to track new features added to the SGP multi-pixel platform.

Measure Test

The command “sgpc3_measure_test” which is included for integration and production line testing runs an on-chip self-test. In

case of a successful self-test the sensor returns the fixed data pattern 0xD400 (with correct CRC).

Feature Set

0x1006

Command

Hex. Code

Parameter

length,

including CRC

[bytes]

Response

length,

including CRC

[bytes]

Max. measurement

duration [ms]

sgpc3_tvoc_init_continuous

0x20ae

sgpc3_measure_tvoc

0x2008

sgpc3_set_power_mode

0x209f

sgpc3_get_tvoc_baseline

0x2015

sgpc3_set_tvoc_baseline

0x201e

sgpc3_set_absolute_humidity

0x2061

sgpc3_measure_test9

0x2032

220

sgpc3_get_feature_set_version

0x202f

sgpc3_measure_raw

0x204d

sgpc3_measure_tvoc_and_raw

0x2046

sgpc3_get_tvoc_inceptive_baseline

0x20b3

Table 10 Measurement commands.

The «sgpc3_measure_test» command is intended for production line testing and verification only. It should not be used after having

issued an “sgpc3_tvoc_init_continuous” command. For the duration of the « sgpc3_measure_test » command, the sensor is operated in

measurement mode with a supply current as specified in Table 3. After the command, the sensor is in sleep mode.

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6.4 Soft Reset

A sensor reset can be generated using the “General Call” mode according to I2C-bus specification. It is important to understand

that a reset generated in this way is not device specific. All devices on the same I2C bus that support the General Call mode will

perform a reset. The appropriate command consists of two bytes and is shown in Table 11.

Command

Hex. Code

Address byte

0x00

Second byte

0x06

Reset Command using the General Call address

0x0006

Table 11 Reset through the General Call address (Clear blocks are controlled by the microcontroller, grey blocks by the sensor.).

6.5 Get Serial ID

The readout of the serial ID register can be used to identify the chip and verify the presence of the sensor. The appropriate

command structure is shown in Table 12. After issuing the measurement command and sending the ACK Bit the sensor needs

the time tIDLE = 0.5ms to respond to the I2C read header with an ACK Bit. Hence, it is recommended to wait tIDLE =0.5ms before

issuing the read header.

The get serial ID command returns 3 words, and every word is followed by an 8-bit CRC checksum. Together the 3 words

constitute a unique serial ID with a length of 48 bits.

The ID returned with this command are represented in the big endian (or MSB first) format.

Command

Hex. Code

Get Serial ID

0x3682

Table 12 Get serial ID command.

ACK

General Call Address

1 2 3 4 5 6 7 8 9

ACK

Reset Command

1 2 3 4 5 6 7 8 9

General Call 1st byte General Call 2nd byte

ACK

I2C Address

1 2 3 4 5 6 7 8 9

ACK

Command MSB

123456789

ACK

Command LSB

10 11 12 13 14 15 16 17 18

16-bit command

I2C write header

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6.6 Checksum Calculation

The 8-bit CRC checksum transmitted after each data word is generated by a CRC algorithm. Its properties are displayed in

Table 13. The CRC covers the contents of the two previously transmitted data bytes. To calculate the checksum only these two

previously transmitted data bytes are used.

Property

Value

Name

CRC-8

Width

8 bit

Protected Data

read and/or write data

Polynomial

0x31 (x8 + x5 + x4 + 1)

Initialization

0xFF

Reflect input

False

Reflect output

False

Final XOR

0x00

Examples

CRC (0xBEEF) = 0x92

Table 13 I2C CRC properties.

6.7 Communication Data Sequences

Figure 10 Communication sequence for starting a measurement and reading measurement results.

7 Quality

7.1 Environmental Stability

The qualification of the SGPC3 was performed based on the JEDEC JESD47 qualification test method.

7.2 Material Contents

The device is fully RoHS and WEEE compliant, e.g., free of Pb, Cd, and Hg.

8 Device Package

SGPC3 sensors are provided in a DFN (dual flat no leads) package with an outline of 2.45 × 2.45 × 0.9 mm3 and a terminal pitch

of 0.8 mm. The circular sensor opening of maximally 1.6 mm diameter is centered on the top side of the package. The sensor

chip is assembled on a Ni/Pd/Au plated copper lead frame. Sensor chip and lead frame are over-molded by a black, epoxy-

based mold compound. Please note that the side walls of the package are diced and therefore the lead frame sidewall surfaces

are not plated. SGPC3

8.1 Moisture Sensitivity Level

The Moisture Sensitivity Level classification of the SGPC3 is MSL1, according to IPC/JEDEC J-STD-020.

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8.2 Traceability

All SGPC3 sensors are laser marked for simple identification and traceability. The marking on the sensor consists of the product

name and a 4-digit, alphanumeric tracking code. This code is used by Sensirion for batch-level tracking throughout production,

calibration, and testing. Detailed tracking data can be provided upon justified request. The pin-1 location is indicated by the

keyhole pattern in the light-colored central area. See Figure 11 for illustration.

Figure 11 Laser marking on SGPC3. The pin-1 location is indicated by the keyhole pattern in the

light-colored central area. The bottom line contains a 4-digit alphanumeric tracking code

8.3 Package Outline

Figure 12 Package outlines drawing of the SGPC3 with nominal values. Dimensions are given in

millimeters. * The die pad shows a small recess in the bottom left part. * These dimensions are not

well defined and given as a reference only.

8.4 Landing Pattern

Figure 13 shows the PCB landing pattern. The landing pattern is understood to be the metal layer on the PCB, onto which the

DFN pads are soldered. The solder mask is understood to be the insulating layer on top of the PCB covering the copper traces.

It is recommended to design the solder mask as a Non-Solder Mask Defined (NSMD) type. For solder paste printing it is

recommended to use a laser-cut, stainless steel stencil with electro-polished trapezoidal walls and with 0.125 to 0.150 mm

stencil thickness. The length of the stencil apertures for the I/O pads should be the same as the PCB pads. However, the position

of the stencil apertures should have an offset of 0.1 mm away from the package center, as indicated in Figure 13. The die pad

aperture should cover 70 – 90 % of the die pad area, resulting in a size of about 1.05 mm x 1.5 mm.

For information on the soldering process and further recommendation on the assembly process please contact Sensirion.

8 9

A X

SGP

2.45

0.9

1.7

0.8

1.25

0.4

0.350.3x45o

0.2*

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Figure 13 Recommended landing pattern.

8.5 Soldering Instructions

Standard reflow soldering ovens may be used for soldering. The sensors are designed to withstand a soldering profile

according to IPC/JEDEC J-STD-020. Peak temperatures of TP = 245 °C during up to tp = 30 seconds for Pb-free assembly in

IR/Convection reflow ovens (see Figure 14) are recommended. In addition, we also recommend a maximum ramp-down rate

of < 4 °C/s.

Figure 14 Soldering profile according to JEDEC standard. Recommended conditions are TP =245

°C and tP ≤ 30 sec for Pb-free assembly, TL < 220 °C and tL < 150 s. Ramp-up rate < 3 °C/s and

ramp-down rate < 4 °C/s.

It is recommended not to use vapor phase soldering to avoid potential contamination of the sensor. Please refer to Handling

and Assembly Guideline for Sensirion Gas Sensors on Sensirion webpage for full documentation.

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9 Tape & Reel Package

Figure 15 Technical drawing of the packaging tape with sensor orientation in tape. Header tape is

to the right and trailer tape to the left on this drawing. Dimensions are given in millimeters.

10 Ordering Information

Use the part names and product numbers shown in the following table when ordering the SGPC3 multi-pixel gas sensor. For

the latest product information and local distributors, visit www.sensirion.com.

Part Name

Tape & Reel Size

Product Number

SGPC3, TAPE ON REEL, 2500 PCS

2500

1-101647-01

Table 14 SGPC3 ordering options

TOLERANCES - UNLESS

NOTED 1PL ±.2 2PL ±.10

A = 2.75

B = 2.75

K = 1.20

NOTES:

1. 10 SPROCKET HOLE PITCH CUMULATIVE TOLERANCE ±0.2

2. POCKET POSITION RELATIVE TO SPROCKET HOLE MEASURED

AS TRUE POSITION OF POCKET, NOT POCKET HOLE

3. A0 AND B0 ARE CALCULATED ON A PLANE AT A DISTANCE "R"

ABOVE THE BOTTOM OF THE POCKET

R 0.25 TYP.

SECTION A - A

0.30 ±.05

R 0.2 MAX.

0.30 ±.05

2.00 ±.05 SEE Note 2 4.00

4.00 SEE Note 1

Ø1.5 +.1 /-0.0

Ø1.00 MIN 1.75 ±.1

12.0 +0.3/-0.1

5.50 ±.05

SEE NOTE 2

DETAIL B

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Revision History

Date

Version

Page(s)

Changes

May, 2020

1.0

–

www.sensirion.com Version 1.0 – May 2020 – D1 18/19

Important Notices

Warning, Personal Injury

Do not use this product as safety or emergency stop devices or in any other application where failure of the product could result in personal

injury. Do not use this product for applications other than its intended and authorized use. Before installing, handling, using or servicing this

product, please consult the data sheet and application notes. Failure to comply with these instructions could result in death or serious injury.

If the Buyer shall purchase or use SENSIRION products for any unintended or unauthorized application, Buyer shall defend, indemnify and hold harmless

SENSIRION and its officers, employees, subsidiaries, affiliates and distributors against all claims, costs, damages and expenses, and reasonable attorney

fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if SENSIRION

shall be allegedly negligent with respect to the design or the manufacture of the product.

ESD Precautions

The inherent design of this component causes it to be sensitive to electrostatic discharge (ESD). To prevent ESD-induced damage and/or degradation,

take customary and statutory ESD precautions when handling this product.

See application note “ESD, Latchup and EMC” for more information.

Warranty

SENSIRION warrants solely to the original purchaser of this product for a period of 12 months (one year) from the date of delivery that this product shall be

of the quality, material and workmanship defined in SENSIRION’s published specifications of the product. Within such period, if proven to be defective,

SENSIRION shall repair and/or replace this product, in SENSIRION’s discretion, free of charge to the Buyer, provided that:

 notice in writing describing the defects shall be given to SENSIRION within fourteen (14) days after their appearance;

 such defects shall be found, to SENSIRION’s reasonable satisfaction, to have arisen from SENSIRION’s faulty design, material, or workmanship;

 the defective product shall be returned to SENSIRION’s factory at the Buyer’s expense; and

 the warranty period for any repaired or replaced product shall be limited to the unexpired portion of the original period.

This warranty does not apply to any equipment which has not been installed and used within the specifications recommended by SENSIRION for the

intended and proper use of the equipment. EXCEPT FOR THE WARRANTIES EXPRESSLY SET FORTH HEREIN, SENSIRION MAKES NO

WARRANTIES, EITHER EXPRESS OR IMPLIED, WITH RESPECT TO THE PRODUCT. ANY AND ALL WARRANTIES, INCLUDING WITHOUT

LIMITATION, WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE, ARE EXPRESSLY EXCLUDED AND DECLINED.

SENSIRION is only liable for defects of this product arising under the conditions of operation provided for in the data sheet and proper use of the goods.

SENSIRION explicitly disclaims all warranties, express or implied, for any period during which the goods are operated or stored not in accordance with the

technical specifications.

SENSIRION does not assume any liability arising out of any application or use of any product or circuit and specifically disclaims any and all liability,

including without limitation consequential or incidental damages. All operating parameters, including without limitation recommended parameters, must be

validated for each customer’s applications by customer’s technical experts. Recommended parameters can and do vary in different applications.

SENSIRION reserves the right, without further notice, (i) to change the product specifications and/or the information in this document and (ii) to improve

reliability, functions and design of this product.

CMOSens® is a trademark of Sensirion.

www.sensirion.com Version 1.0 – May 2020 – D1 19/19

Headquarters and Subsidiaries

Sensirion AG

Laubisruetistr. 50

CH-8712 Staefa ZH

Switzerland

phone: +41 44 306 40 00

fax: +41 44 306 40 30

info@sensirion.com

www.sensirion.com

Sensirion Inc., USA

phone: +1 312 690 5858

info-us@sensirion.com

www.sensirion.com

Sensirion Korea Co. Ltd.

phone: +82 31 337 7700~3

info-kr@sensirion.com

www.sensirion.com/kr

Sensirion Japan Co. Ltd.

phone: +81 3 3444 4940

info-jp@sensirion.com

www.sensirion.com/jp

Sensirion China Co. Ltd.

phone: +86 755 8252 1501

info-cn@sensirion.com

www.sensirion.com/cn

Sensirion Taiwan Co. Ltd

phone: +886 3 5506701

info@sensirion.com

www.sensirion.com

To find your local representative, please visit www.sensirion.com/distributors