SFH 4059S
IR-Lumineszenzdiode (850 nm) mit hoher Ausgangsleistung
High Power Infrared Emitter (850 nm)
Lead (Pb) Free Product - RoHS Compliant
2010-11-09 1
Wesentliche Merkmale
• Sehr kleines Gehäuse:
(LxBxH) 3.2 mm x 1.6 mm x 1.85 mm
• Sehr hohe Gesamtleistung
Anwendungen
• Miniaturlichtschranken
• Industrieelektronik
• Mobile Geräte
• „Messen/Steuern/Regeln“
Sicherheitshinweise
Je nach Betriebsart emittieren diese Bauteile
hochkonzentrierte, nicht sichtbare Infrarot-
Strahlung, die gefährlich für das menschliche
Auge sein kann. Produkte, die diese Bauteile
enthalten, müssen gemäß den Sicherheits-
richtlinien der IEC-Normen 60825-1 und 62471
behandelt werden.
Typ
Type Bestellnummer
Ordering Code Strahlstärkegruppierung1) (IF = 70 mA, tp = 20 ms)
Radiant Intensity Grouping1)
Ie (mW/sr)
SFH 4059S Q65111A0278 ≥ 63 (typ. 130)
1) gemessen bei einem Raumwinkel Ω = 0.01 sr / measured at a solid angle of Ω = 0.01 sr
Features
• Very small package:
(LxWxH) 3.2 mm x 1.6 mm x 1.85 mm
• High optical total power
Applications
• Miniature photointerrupters
• Industrial electronics
• mobile devices
• For drive and control circuits
Safety Advices
Depending on the mode of operation, these
devices emit highly concentrated non visible
infrared light which can be hazardous to the
human eye. Products which incorporate these
devices have to follow the safety precautions
given in IEC 60825-1 and IEC 62471.
2010-11-09 2
SFH 4059S
Grenzwerte (TA = 25 °C)
Maximum Ratings
Bezeichnung
Parameter Symbol
Symbol Wert
Value Einheit
Unit
Betriebs- und Lagertemperatur
Operating and storage temperature range Top , Tstg – 40 … + 85 °C
Sperrspannung
Reverse voltage VR5 V
Vorwärtsgleichstrom
Forward current IF70 mA
Stoßstrom, tp = 300 μs, D = 0
Surge current IFSM 1 A
Verlustleistung
Power dissipation Ptot 245 mW
Wärmewiderstand Sperrschicht - Umgebung bei
Montage auf FR4 Platine, Padgröße je 16 mm2
Thermal resistance junction - ambient mounted
on PC-board (FR4), padsize 16 mm2 each
Wärmewiderstand Sperrschicht - Lötstelle bei
Montage auf Metallkernplatine
Thermal resistance junction - soldering point,
mounted on metal core board
RthJA
RthJS
420
260
K/W
K/W
Kennwerte (TA = 25 °C)
Characteristics
Bezeichnung
Parameter Symbol
Symbol Wert
Value Einheit
Unit
Wellenlänge der Strahlung
Wavelength at peak emission
IF = 70 mA, tp = 10 ms
λpeak 860 nm
Schwerpunkts-Wellenlänge der Strahlung
Centroid Wavelength
IF = 70 mA, tp = 10 ms
λcentroid 850 nm
Spektrale Bandbreite bei 50% von Imax
Spectral bandwidth at 50% of Imax
IF = 70 mA, tp = 10 ms
Δλ 42 nm
Abstrahlwinkel
Half angle ϕ± 15 Grad
deg.
Aktive Chipfläche
Active chip area A0.09 mm2
SFH 4059S
2010-11-09 3
Abmessungen der aktiven Chipfläche
Dimension of the active chip area L × B
L × W0.3 × 0.3 mm²
Schaltzeiten, Ie von 10% auf 90% und von 90%
auf 10%, bei IF = 70 mA, RL = 50 Ω
Switching times, Ιe from 10% to 90% and from
90% to 10%, IF = 70 mA, RL = 50 Ω
tr, tf20, 10 ns
Durchlassspannung
Forward voltage
IF = 70 mA, tp = 20 ms
VF3 (< 3.5) V
Sperrstrom
Reverse current IRnot designed for
reverse
operation
μA
Gesamtstrahlungsfluss
Total radiant flux
IF = 70 mA, tp = 20 ms
Φe70 mW
Temperaturkoeffizient von Ie bzw. Φe,
IF = 70 mA
Temperature coefficient of Ie or Φe,
IF = 70 mA
TCI– 0.5 %/K
Temperaturkoeffizient von VF, IF = 70 mA
Temperature coefficient of VF, IF = 70 mA TCV– 2 mV/K
Temperaturkoeffizient von λ, IF = 70 mA
Temperature coefficient of λ, IF = 70 mA TCλ+ 0.3 nm/K
Kennwerte (TA = 25 °C)
Characteristics (cont’d)
Bezeichnung
Parameter Symbol
Symbol Wert
Value Einheit
Unit
2010-11-09 4
SFH 4059S
Abstrahlcharakteristik
Radiation Characteristics Irel = f (ϕ)
Strahlstärke Ie in Achsrichtung1)
gemessen bei einem Raumwinkel Ω = 0.01 sr
Radiant Intensity Ie in Axial Direction
at a solid angle of Ω = 0.01 sr
Bezeichnung
Parameter Symbol Werte
Values Einheit
Unit
SFH 4059S
-V SFH 4059S
-AW SFH 4059S
-BW
Strahlstärke
Radiant intensity
IF = 70 mA, tp = 20 ms
Ie min
Ie max
63
125 100
200 160
320 mW/sr
mW/sr
Strahlstärke
Radiant intensity
IF = 1 A, tp = 25 µs
Ie typ 940 1500 2400 mW/sr
1) Nur eine Gruppe in einer Verpackungseinheit (Streu ung kleiner 2:1) /
Only one bin in one packing unit (variation lower 2:1)
OHF04536
0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚0.40.60.81.0
100˚
90˚
80˚
70˚
60˚
50˚
0˚10˚20˚30˚40˚
0
0.2
0.4
0.6
0.8
1.0
ϕ
SFH 4059S
2010-11-09 5
Relative Spectral Emission
Irel = f (λ)
Forward Current IF = f (VF)
Single pulse, tp = 100 μs
700
0nm
%
OHF04135
20
40
60
80
100
950750 800 850
I
rel
λ
OHF04546
F
I
V
mA
2
F
V
5
10
2
5
10
3
10
1
10
0
3 4 5
Radiant Intensity
Single pulse, tp = 25 μs
Permissible Pulse Handling
Capability IF = f (τ), TA = 25 °C,
duty cycle D = parameter
Ie
I
e 70 mA = f (IF)
OHF04547
I
F
mA
10 5 10 5 10 10
3
-3
10
e
(70 mA)
I
e
I
012
10
-2
10
-1
10
0
10
1
10
2
5
5
5
5
1010
0-2-3-4-5 1010 10
F
I
A
P
t
=
DT
210-1 10
t
p
10 s10
OHF04544
T
t
P
I
F
0.02
0.1
0.05
0.5
0.2
1
0.01
0.005
D
=
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
Max. Permissible Forward Current
IF = f (TA), RthJA = 420K/W
Permissible Pulse Handling
Capability IF = f (τ), TA = 85 °C,
duty cycl e D = parameter
0
0˚C
T
I
FmA
OHF04543
A
20 40 60 80 100
5
10
15
20
25
30
35
40
45
50
55
60
65
75
1010
0
-2-3-4-5
1010 10
F
I
AP
t
=
DT
210-1
10
t
p
10 s10
OHF04545
T
t
P
I
F
0.02
0.1
0.05
0.5
0.2
1
0.01
0.005
D
=
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
2010-11-09 6
SFH 4059S
Maßzeichnung
Package Outlines
Maße in mm/ Dimensions in mm.
Gehäuse / Package Epoxydharz / Epoxy
Farbe / Colour Schwarz / black
Gehäusemarkierung/
Package marking Pad 1: Kathode / cathode
Pad 2: Anode / anode
SFH 4059S
2010-11-09 7
Gurtung / Polarität und Lage Verpackungseinheit 2000/Rolle, ø180 mm
Method of Taping / Polarity and Orientation Packing unit 2000/reel, ø180 mm
Maße in mm (inch) / Dimensions in mm (inch).
Empfohlenes Lötpaddesign Reflow Löten
Recommended Solder Pad Reflow Soldering
Maße in mm / Dimensions in mm (inch).
2010-11-09 8
SFH 4059S
Lötbedingungen Vorbehandlung nach JEDEC Level 3
Soldering Conditions Preconditioning acc. to JEDEC Level 3
Reflow Lötprofil für bleifreies Löten (nach J-STD-020-D.01)
Reflow Soldering Profile for lead free soldering (acc. to J-STD-020-D.01)
Pb-Free (SnAgCu) Assembly
Profile Feature Recommendation Max. Ratings
Ramp-up Rate to Preheat*)
25°C to 150°C 2°C / sec 3°C / sec
Time ts from TSmin to TSmax
(150°C to 200°C 100s min. 60sec max. 120sec
Ramp-up Rate to Peak*)
TSmax to TP
2°C / sec 3°C / sec
Liquidus Temperture TL217°C
Time tL above TL80sec max. 100sec
Peak Temperature TP245°C max. 260°C
Time tP within 5°C of the specified peak
temperature TP - 5K 20sec min. 10sec max. 30sec
Ramp-down Rate*
TP to 100°C 3°C / sec 6°C / sec maximum
Time 25°C to Peak temperature max. 8 min.
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation ΔT/Δt: Δt max. 5 sec; fulfillment for the whole T-range
0
0s
OHA04525
50
100
150
200
250
300
50 100 150 200 250 300
t
T
˚C
S
t
t
P
t
T
p
240 ˚C
217 ˚C
245 ˚C
25 ˚C
L
SFH 4059S
2010-11-09 9
Published by
OSRAM Opto Semiconductors GmbH
Leibnizstrasse 4, D-93055 Regensburg
www.osram-os.com
© All Rights Reserved.
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components 1 , may only be used in life-support dev ices or systems 2 with the express written app roval of OSRAM OS.
1 A critical componen t is a component usedin a life-support device or syste m whose failure can reasonably be expected
to cause the failure of that life-support devic e or system, or to a ffect its safety or e ffectiveness of that device or system.
2 Life support devices or syste ms are intended (a) to be implanted in the human body, o r (b) to support and/or maintain
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
