µ/6240, µ6240
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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
On products compliant to MIL-PRF-38535, all parameters are
tested unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
SN54LS240
,
SN54LS241
,
SN54LS244
,
SN54S240
,
SN54S241
,
SN54S244
SN74LS240
,
SN74LS241
,
SN74LS244
,
SN74S240
,
SN74S241
,
SN74S244
SDLS144D –APRIL 1985–REVISED OCTOBER 2016
SNx4LS24x, SNx4S24x Octal Buffers and Line Drivers With 3-State Outputs
1
1 Features
1• Inputs Tolerant Down to 2 V, Compatible With
3.3-V or 2.5-V Logic Inputs
• Maximum tpd of 15 ns at 5 V
• 3-State Outputs Drive Bus Lines or Buffer Memory
Address Registers
• PNP Inputs Reduce DC Loading
• Hysteresis at Inputs Improves Noise Margins
2 Applications
• Servers
• LED Displays
• Network Switches
• Telecom Infrastructure
• Motor Drivers
• I/O Expanders
3 Description
The SNx4LS24x, SNx4S24x octal buffers and line
drivers are designed specifically to improve both the
performance and density of three-state memory
address drivers, clock drivers, and bus-oriented
receivers and transmitters. The designer has a choice
of selected combinations of inverting and non-
inverting outputs, symmetrical, active-low output-
control (G) inputs, and complementary output-control
(G and G) inputs. These devices feature high fan-out,
improved fan-in, and 400-mV noise margin. The
SN74LS24x and SN74S24x devices can be used to
drive terminated lines down to 133 Ω.
Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
SN54LS24x,
SN54S24x
CDIP (20) – J 24.20 mm × 6.92 mm
CFP (20) – W 7.02 mm × 13.72 mm
LCCC (20) – FK 8.89 mm × 8.89 mm
SN74LS240,
SN74LS244 SSOP (20) – DB 7.20 mm × 5.30 mm
SN74LS24x,
SN74S24x SOIC (20) – DW 12.80 mm × 7.50 mm
PDIP (20) – N 24.33 mm × 6.35 mm
SN74LS24x SOP (20) – NS 7.80 mm × 12.60 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Logic Diagram (Positive Logic)
2
SN54LS240
,
SN54LS241
,
SN54LS244
,
SN54S240
,
SN54S241
,
SN54S244
SN74LS240
,
SN74LS241
,
SN74LS244
,
SN74S240
,
SN74S241
,
SN74S244
SDLS144D –APRIL 1985–REVISED OCTOBER 2016
www.ti.com
Product Folder Links: SN54LS240 SN54LS241 SN54LS244 SN54S240 SN54S241 SN54S244 SN74LS240
SN74LS241 SN74LS244 SN74S240 SN74S241 SN74S244
Submit Documentation Feedback Copyright © 1985–2016, Texas Instruments Incorporated
Table of Contents
1 Features.................................................................. 1
2 Applications ........................................................... 1
3 Description............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information ................................................. 5
6.5 Electrical Characteristics – SNx4LS24x.................... 5
6.6 Electrical Characteristics – SNx4S24x...................... 5
6.7 Switching Characteristics – SNx4LS24x................... 6
6.8 Switching Characteristics – SNx4S24x..................... 6
6.9 Typical Characteristics.............................................. 7
7 Parameter Measurement Information .................. 7
7.1 SN54LS24x and SN74LS24x Devices...................... 7
7.2 SN54S24x and SN74S24x Devices.......................... 9
8 Detailed Description............................................ 11
8.1 Overview................................................................. 11
8.2 Functional Block Diagrams ..................................... 11
8.3 Feature Description................................................. 12
8.4 Device Functional Modes........................................ 12
9 Application and Implementation ........................ 14
9.1 Application Information............................................ 14
9.2 Typical Application.................................................. 14
9.3 System Examples ................................................... 15
10 Power Supply Recommendations ..................... 17
11 Layout................................................................... 17
11.1 Layout Guidelines ................................................. 17
11.2 Layout Example .................................................... 17
12 Device and Documentation Support................. 18
12.1 Related Links ........................................................ 18
12.2 Receiving Notification of Documentation Updates 18
12.3 Community Resource............................................ 18
12.4 Trademarks........................................................... 18
12.5 Electrostatic Discharge Caution............................ 18
12.6 Glossary................................................................ 18
13 Mechanical, Packaging, and Orderable
Information........................................................... 19
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision C (May 2010) to Revision D Page
• Added Applications section, ESD Ratings table, Feature Description section, Device Functional Modes,Application
and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation
Support section, and Mechanical, Packaging, and Orderable Information section................................................................ 1
• Deleted Ordering Information table; see POA at the end of the data sheet........................................................................... 1
• Changed RθJA values in the Thermal Information table from 70 to 94.3 (DB), from 58 to 90.3 (DW), from 69 to 50.6
(N), and from 60 to 76.6 (NS)................................................................................................................................................. 5
41A2
52Y3
61A3
72Y2
81A4
92Y1
10GND
112A1
121Y4
132A2
14 1Y3
15 2A3
16 1Y2
17 2A4
18 1Y1
19 2G/2G
20 VCC
1 1G
2 1A1
3 2Y4
Not to scale
11G 20 VCC
21A1 19 2G/2G
32Y4 18 1Y1
41A2 17 2A4
52Y3 16 1Y2
61A3 15 2A3
72Y2 14 1Y3
81A4 13 2A2
92Y1 12 1Y4
10GND 11 2A1
Not to scale
3
SN54LS240
,
SN54LS241
,
SN54LS244
,
SN54S240
,
SN54S241
,
SN54S244
SN74LS240
,
SN74LS241
,
SN74LS244
,
SN74S240
,
SN74S241
,
SN74S244
www.ti.com
SDLS144D –APRIL 1985–REVISED OCTOBER 2016
Product Folder Links: SN54LS240 SN54LS241 SN54LS244 SN54S240 SN54S241 SN54S244 SN74LS240
SN74LS241 SN74LS244 SN74S240 SN74S241 SN74S244
Submit Documentation FeedbackCopyright © 1985–2016, Texas Instruments Incorporated
5 Pin Configuration and Functions
DB, DW, J, N, NS, or W Package
20-Pin SSOP, SOIC, CDIP, PDIP, SOP, or CFP
Top View
FK Package
20-Pin LCCC
Top View
(1) 2G for SNx4LS241 and SNx4S241 or 2G for all other drivers.
Pin Functions
PIN I/O DESCRIPTION
NO. NAME
1 1G I Channel 1 output enable
2 1A1 I Channel 1, A side 1
3 2Y4 O Channel 2, Y side 4
4 1A2 I Channel 1, A side 2
5 2Y3 O Channel 2, Y side 3
6 1A3 I Channel 1, A side 3
7 2Y2 O Channel 2, Y side 2
8 1A4 I Channel 1, A side 4
9 2Y1 O Channel 2, Y side 1
10 GND — Ground
11 2A1 I Channel 2, A side 1
12 1Y4 O Channel 1, Y side 4
13 2A2 I Channel 2, A side 2
14 1Y3 O Channel 1, Y side 3
15 2A3 I Channel 2, A side 3
16 1Y2 O Channel 1, Y side 2
17 2A4 I Channel 2, A side 4
18 1Y1 O Channel 1, Y side 1
19 2G/2G(1) I Channel 2 output enable
20 VCC — Power supply
4
SN54LS240
,
SN54LS241
,
SN54LS244
,
SN54S240
,
SN54S241
,
SN54S244
SN74LS240
,
SN74LS241
,
SN74LS244
,
SN74S240
,
SN74S241
,
SN74S244
SDLS144D –APRIL 1985–REVISED OCTOBER 2016
www.ti.com
Product Folder Links: SN54LS240 SN54LS241 SN54LS244 SN54S240 SN54S241 SN54S244 SN74LS240
SN74LS241 SN74LS244 SN74S240 SN74S241 SN74S244
Submit Documentation Feedback Copyright © 1985–2016, Texas Instruments Incorporated
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Voltage values are with respect to network ground terminal.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Supply voltage, VCC(2) 7 V
Input voltage, VISNx4LS24x 7 V
SNx4S24x 5.5
Off-state output voltage 5.5 V
Storage temperature, Tstg –65 150 °C
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings VALUE UNIT
ALL PACKAGES
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) 500 V
N PACKAGE
V(ESD) Electrostatic discharge Charged device model (CDM), per JEDEC specification JESD22-C101(2) 500 V
(1) Voltage values are with respect to network ground terminal.
(2) An SN54S241J operating at free-air temperature above 116°C requires a heat sink that provides a thermal resistance from case to free
air, RθCA, of not more that 40°C/W.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT
VCC Supply voltage(1) SN54xS24x 4.5 5 5.5 V
SN74xS24x 4.75 5 5.25
VIH High-level input voltage 2 V
VIL Low-level input voltage SN54LS24x 0.7 V
SN54S24x, SN74xS24x 0.8
IOH High-level output current SN54xS24x –12 mA
SN74xS24x –15
IOL Low-level output current
SN54LS24x 12
mA
SN54S24x 48
SN74LS24x 24
SN74S24x 64
External resistance between any input and VCC or ground (SNx4S24x only) 40 kΩ
TAOperating free-air temperature(2) SN54xS24x –55 125 °C
SN74xS24x 0 70
5
SN54LS240
,
SN54LS241
,
SN54LS244
,
SN54S240
,
SN54S241
,
SN54S244
SN74LS240
,
SN74LS241
,
SN74LS244
,
SN74S240
,
SN74S241
,
SN74S244
www.ti.com
SDLS144D –APRIL 1985–REVISED OCTOBER 2016
Product Folder Links: SN54LS240 SN54LS241 SN54LS244 SN54S240 SN54S241 SN54S244 SN74LS240
SN74LS241 SN74LS244 SN74S240 SN74S241 SN74S244
Submit Documentation FeedbackCopyright © 1985–2016, Texas Instruments Incorporated
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
(2) Voltage values are with respect to network ground terminal.
(3) The package thermal impedance is calculated in accordance with JESD 51-7.
6.4 Thermal Information
THERMAL METRIC(1)
SN74LS240,
SN74LS244 SN74LS24x, SN74S24x SN74LS24x
UNIT
DB (SSOP) DW (SOIC) N (PDIP) NS (SOP)
20 PINS 20 PINS 20 PINS 20 PINS
RθJA Junction-to-ambient thermal resistance(2)(3) 94.3 90.3 50.6 76.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 55.9 45.5 37.4 42.9 °C/W
RθJB Junction-to-board thermal resistance 49.5 48.1 31.5 44.1 °C/W
ψJT Junction-to-top characterization parameter 21.3 19.4 24 19.2 °C/W
ψJB Junction-to-board characterization parameter 49.1 47.6 31.4 43.7 °C/W
(1) For conditions shown as minimum or maximum, use the appropriate value specified under recommended operating conditions.
(2) All typical values are at VCC = 5 V and TA= 25°C.
(3) Not more than one output must be shorted at a time, and duration of the short-circuit must not exceed one second.
6.5 Electrical Characteristics – SNx4LS24x
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS(1) MIN TYP(2) MAX UNIT
VIK VCC = MIN, II= –18 mA –1.5 V
Hysteresis
(VT+ −VT−)VCC = MIN 0.2 0.4 V
VOH VCC = MIN, IOH = –3 mA, VIH = 2 V, VIL = MAX 2.4 3.4 V
VCC = MIN, IOH = MAX, VIH = 2 V, VIL = 0.5 V 2
VOL VCC = MIN, VIL = MAX, VIH = 2 V IOL = 12 mA, SN54LS24x 0.4 V
IOL = 24 mA, SN74LS24x 0.5
IOZH VCC = MAX, VIL = MAX, VIH = 2 V, VO= 2.7 V 20 µA
IOZL VCC = MAX, VIL = MAX, VIH = 2 V, VO= 0.4 V –20 µA
IIVCC = MAX, VI= 7 V 0.1 mA
IIH VCC = MAX, VI= 2.7 V 20 µA
IIL VCC = MAX, VIL = 0.4 V –0.2 mA
IOS(3) VCC = MAX –40 –225 mA
ICC VCC = MAX, output open
Outputs high All 17 27
mA
Outputs low SNx4LS240 26 44
SNx4LS241, SNx4LS244 27 46
Outputs disabled SNx4LS240 29 50
SNx4LS241, SNx4LS244 32 54
(1) For conditions shown as minimum or maximum, use the appropriate value specified under recommended operating conditions.
(2) All typical values are at VCC = 5 V, TA= 25°C.
6.6 Electrical Characteristics – SNx4S24x
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS(1) MIN TYP(2) MAX UNIT
VIK VCC = MIN, II= –18 mA –1.2 V
Hysteresis
(VT+ −VT−)VCC = MIN 0.2 0.4 V
VOH
VCC = MIN, IOH = –1 mA, VIH = 2 V, VIL = 0.8 V, SN74S24x only 2.7 VVCC = MIN, IOH = –3 mA, VIH = 2 V, VIL = 0.8 V 2.4 3.4
VCC = MIN, IOH = MAX, VIH = 2 V, VIL = 0.5 V 2
VOL VCC = MIN, VIL = MAX, VIH = 2 V, IOL = 0.8 V 0.55 V
6
SN54LS240
,
SN54LS241
,
SN54LS244
,
SN54S240
,
SN54S241
,
SN54S244
SN74LS240
,
SN74LS241
,
SN74LS244
,
SN74S240
,
SN74S241
,
SN74S244
SDLS144D –APRIL 1985–REVISED OCTOBER 2016
www.ti.com
Product Folder Links: SN54LS240 SN54LS241 SN54LS244 SN54S240 SN54S241 SN54S244 SN74LS240
SN74LS241 SN74LS244 SN74S240 SN74S241 SN74S244
Submit Documentation Feedback Copyright © 1985–2016, Texas Instruments Incorporated
Electrical Characteristics – SNx4S24x (continued)
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS(1) MIN TYP(2) MAX UNIT
(3) Not more than one output must be shorted at a time, and duration of the short-circuit must not exceed one second.
IOZH VCC = MAX, VIL = 0.8 V, VIH = 2 V, VO= 2.4 V 50 µA
IOZL VCC = MAX, VIL = MAX, VIH = 2 V, VO= 0.5 V –50 µA
IIVCC = MAX, VI= 5.5 V 1 mA
IIH VCC = MAX, VI= 2.7 V 50 µA
IIL VCC = MAX, VIL = 0.5 V Any A –400 µA
Any G –2 mA
IOS(3) VCC = MAX –50 –225 mA
ICC VCC = MAX, output open
Outputs high
SN54S240 80 123
mA
SN74S240 80 135
SN54S241, SN54S244 95 147
SN74S241, SN74S244 95 160
Outputs low
SN54S240 100 145
SN74S240 100 150
SN54S241, SN54S244 120 170
SN74S241, SN74S244 120 180
Outputs disabled
SN54S240 100 145
SN74S240 100 150
SN54S241, SN54S244 120 170
SN74S241, SN74S244 120 180
6.7 Switching Characteristics – SNx4LS24x
VCC = 5 V, TA= 25°C (see SN54LS24x and SN74LS24x Devices)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tPLH RL= 667 Ω, CL= 45 pF SNx4LS240 9 14 ns
SNx4LS241, SNx4LS244 12 18
tPHL RL= 667 Ω, CL= 45 pF 12 18 ns
tPZL RL= 667 Ω, CL= 45 pF 20 30 ns
tPZH RL= 667 Ω, CL= 45 pF 15 23 ns
tPLZ RL= 667 Ω, CL= 5 pF 10 20 ns
tPHZ RL= 667 Ω, CL= 5 pF 15 25 ns
6.8 Switching Characteristics – SNx4S24x
VCC = 5 V and TA= 25°C (see SN54S24x and SN74S24x Devices)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tPLH RL= 90 Ω, CL= 50 pF SNx4S240 4.5 7 ns
SNx4S241, SNx4S244 6 9
tPHL RL= 90 Ω, CL= 50 pF SNx4S240 4.5 7 ns
SNx4S241, SNx4S244 6 9
tPZL RL= 90 Ω, CL= 50 pF 10 15 ns
tPZH RL= 90 Ω, CL= 50 pF SNx4S240 6.5 10 ns
SNx4S241, SNx4S244 8 12
tPLZ RL= 90 Ω, CL= 5 pF 10 15 ns
tPHZ RL= 90 Ω, CL= 5 pF 6 9 ns
VCC
RL
Test
Point
From Output
Under Test
CL
(see Note A)
(see Note B)
VCC
RL
From Output
Under Test
CL
(see Note A)
Test
Point
5 kΩ
S1
S2
(see Note B)
VCC
RL
From Output
Under Test
CL
(see Note A)
Test
Point
Time (ns)
Voltage (V)
0 5 10 15 20
-0.5
0.5
1.5
2.5
3.5
4.5
5.5
D001
Input
Output
7
SN54LS240
,
SN54LS241
,
SN54LS244
,
SN54S240
,
SN54S241
,
SN54S244
SN74LS240
,
SN74LS241
,
SN74LS244
,
SN74S240
,
SN74S241
,
SN74S244
www.ti.com
SDLS144D –APRIL 1985–REVISED OCTOBER 2016
Product Folder Links: SN54LS240 SN54LS241 SN54LS244 SN54S240 SN54S241 SN54S244 SN74LS240
SN74LS241 SN74LS244 SN74S240 SN74S241 SN74S244
Submit Documentation FeedbackCopyright © 1985–2016, Texas Instruments Incorporated
6.9 Typical Characteristics
VCC = 5 V, TA= 25°C, CL= 45 pF, and RL= 667 Ω(unless otherwise noted)
Figure 1. Simulated Propagation Delay From Input to Output
7 Parameter Measurement Information
7.1 SN54LS24x and SN74LS24x Devices
Figure 2. Load Circuit,
For 2-State Totem-Pole Outputs
Figure 3. Load Circuit,
For Open-Collector Outputs
Figure 4. Load Circuit,
For 3-State Outputs
Figure 5. Voltage Waveforms,
Pulse Durations
tPHZ
tPLZ
tPZL
tPZH
3 V
0 V
Output
Control
(low-level
enabling)
Waveform 1
(see Notes C
and D)
Waveform 2
(see Notes C
and D) ≈1.5 V
VOH 0.3 V–
VOL + 0.3 V
≈1.5 V
1.3 V 1.3 V
1.3 V
1.3 V
VOL
VOH
t
tPZH
≈1.5 V
V
VOL
tPHL tPLH
tPLH tPHL
Input
Out-of-Phase
Output
(see Note D)
3 V
0 V
VOL
VOH
VOH
VOL
In-Phase
Output
(see Note D)
1.3 V 1.3 V
1.3 V 1.3 V
1.3 V 1.3 V
3 V
3 V
0 V
0 V
t
th
su
Timing
Input
Data
Input
1.3 V
1.3 V 1.3 V
8
SN54LS240
,
SN54LS241
,
SN54LS244
,
SN54S240
,
SN54S241
,
SN54S244
SN74LS240
,
SN74LS241
,
SN74LS244
,
SN74S240
,
SN74S241
,
SN74S244
SDLS144D –APRIL 1985–REVISED OCTOBER 2016
www.ti.com
Product Folder Links: SN54LS240 SN54LS241 SN54LS244 SN54S240 SN54S241 SN54S244 SN74LS240
SN74LS241 SN74LS244 SN74S240 SN74S241 SN74S244
Submit Documentation Feedback Copyright © 1985–2016, Texas Instruments Incorporated
Figure 6. Voltage Waveforms,
Setup and Hold Times
Figure 7. Voltage Waveforms,
Propagation Delay Times
A. CLincludes probe and jig capacitance.
B. All diodes are 1N3064 or equivalent.
C. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output
control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the
output control.
D. S1 and S2 are closed for tPLH, tPHL, tPHZ, and tPLZ; S1 is open and S2 is closed for tPZH; S1 is closed and S2 is open
for tPZL.
E. Phase relationships between inputs and outputs have been chosen arbitrarily for these examples.
F. All input pulses are supplied by generators having the following characteristics: PRR ≤1 MHz, ZOis approximately
50 Ω, tr≤15 ns, tf≤6 ns.
G. The outputs are measured one at a time with one input transition per measurement.
Figure 8. Voltage Waveforms,
Enable and Disable Times, 3-State Outputs
(see Note B)
VCC
RL
From Output
Under Test
CL
(see Note A)
Test
Point
1 kΩ
S1
S2
tPHL tPLH
tPLH tPHL
Input
Out-of-Phase
Output
(see Note D)
3 V
0 V
VOL
VOH
VOH
VOL
In-Phase
Output
(see Note D)
1.5 V 1.5 V
1.5 V 1.5 V
1.5 V 1.5 V
VCC
RL
Test
Point
From Output
Under Test
CL
(see Note A)
3 V
3 V
0 V
0 V
t
th
su
Timing
Input
Data
Input
1.5 V
1.5 V 1.5 V
(see Note B)
VCC
RL
From Output
Under Test
CL
(see Note A)
Test
Point
9
SN54LS240
,
SN54LS241
,
SN54LS244
,
SN54S240
,
SN54S241
,
SN54S244
SN74LS240
,
SN74LS241
,
SN74LS244
,
SN74S240
,
SN74S241
,
SN74S244
www.ti.com
SDLS144D –APRIL 1985–REVISED OCTOBER 2016
Product Folder Links: SN54LS240 SN54LS241 SN54LS244 SN54S240 SN54S241 SN54S244 SN74LS240
SN74LS241 SN74LS244 SN74S240 SN74S241 SN74S244
Submit Documentation FeedbackCopyright © 1985–2016, Texas Instruments Incorporated
7.2 SN54S24x and SN74S24x Devices
Figure 9. Load Circuit,
For 2-State Totem-Pole Outputs
Figure 10. Load Circuit,
For Open-Collector Outputs
Figure 11. Load Circuit,
For 3-State Outputs
Figure 12. Voltage Waveforms,
Pulse Durations
Figure 13. Voltage Waveforms,
Setup and Hold Times
Figure 14. Voltage Waveforms,
Propagation Delay Times
tPHZ
tPLZ
tPZL
tPZH
3 V
0 V
Output
Control
(low-level
enabling)
Waveform 1
(see Notes C
and D)
Waveform 2
(see Notes C
and D)
≈1.5 V
VOH − 0.5 V
VOL + 0.5 V
≈1.5 V
1.5 V 1.5 V
1.5 V
1.5 V
VOH
VOL
10
SN54LS240
,
SN54LS241
,
SN54LS244
,
SN54S240
,
SN54S241
,
SN54S244
SN74LS240
,
SN74LS241
,
SN74LS244
,
SN74S240
,
SN74S241
,
SN74S244
SDLS144D –APRIL 1985–REVISED OCTOBER 2016
www.ti.com
Product Folder Links: SN54LS240 SN54LS241 SN54LS244 SN54S240 SN54S241 SN54S244 SN74LS240
SN74LS241 SN74LS244 SN74S240 SN74S241 SN74S244
Submit Documentation Feedback Copyright © 1985–2016, Texas Instruments Incorporated
A. CLincludes probe and jig capacitance.
B. All diodes are 1N3064 or equivalent.
C. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output
control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the
output control.
D. S1 and S2 are closed for tPLH, tPHL, tPHZ, and tPLZ; S1 is open and S2 is closed for tPZH; S1 is closed and S2 is open
for tPZL.
E. All input pulses are supplied by generators having the following characteristics: PRR ≤1 MHz, ZOis approximately
50 Ω; trand tf≤7 ns for SN54LS24x and SN74LS24x devices, and trand tf≤2.5 ns for SN54S24x and SN74S24x
devices.
F. The outputs are measured one at a time with one input transition per measurement.
Figure 15. Voltage Waveforms,
Enable and Disable Times, 3-State Outputs
1
2
4
6
8
19
11
13
15
17 3
5
7
9
12
14
16
18
1A1
1A2
1A3
1A4
1Y1
2A1
2A2
2A3
2A4
2Y1
1Y2
1Y3
1Y4
2Y2
2Y3
2Y4
2G
1G
Copyright © 2016, Texas Instruments Incorporated
1
2
4
6
8
19
11
13
15
17 3
5
7
9
12
14
16
18
1A1
1A2
1A3
1A4
1Y1
2A1
2A2
2A3
2A4
2Y1
1Y2
1Y3
1Y4
2Y2
2Y3
2Y4
2G
1G
Copyright © 2016, Texas Instruments Incorporated
11
SN54LS240
,
SN54LS241
,
SN54LS244
,
SN54S240
,
SN54S241
,
SN54S244
SN74LS240
,
SN74LS241
,
SN74LS244
,
SN74S240
,
SN74S241
,
SN74S244
www.ti.com
SDLS144D –APRIL 1985–REVISED OCTOBER 2016
Product Folder Links: SN54LS240 SN54LS241 SN54LS244 SN54S240 SN54S241 SN54S244 SN74LS240
SN74LS241 SN74LS244 SN74S240 SN74S241 SN74S244
Submit Documentation FeedbackCopyright © 1985–2016, Texas Instruments Incorporated
8 Detailed Description
8.1 Overview
This device is organized as two 4-bit buffers and drivers with separate output-enable (G) inputs. When G is low,
the device passes data from the A inputs to the Y outputs. When G is high, the outputs are in the high
impedance state. Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of this device
as a translator in a mixed 3.3-V and 5-V system environment. To ensure the high-impedance state during power
up or power down, G must be tied to VCC through a pullup resistor; the minimum value of the resistor is
determined by the current-sinking capability of the driver.
8.2 Functional Block Diagrams
Pin numbers shown are for DB, DW, J, N,
NS, and W packages
Figure 16. SNx4LS240 and SNx4S240
Logic Diagram
Pin numbers shown are for DB, DW, J, N,
NS, and W packages
Figure 17. SNx4LS241 and SNx4S241
Logic Diagram
1
2
4
6
8
19
11
13
15
17 3
5
7
9
12
14
16
18
1A1
1A2
1A3
1A4
1Y1
2A1
2A2
2A3
2A4
2Y1
1Y2
1Y3
1Y4
2Y2
2Y3
2Y4
2G
1G
Copyright © 2016, Texas Instruments Incorporated
12
SN54LS240
,
SN54LS241
,
SN54LS244
,
SN54S240
,
SN54S241
,
SN54S244
SN74LS240
,
SN74LS241
,
SN74LS244
,
SN74S240
,
SN74S241
,
SN74S244
SDLS144D –APRIL 1985–REVISED OCTOBER 2016
www.ti.com
Product Folder Links: SN54LS240 SN54LS241 SN54LS244 SN54S240 SN54S241 SN54S244 SN74LS240
SN74LS241 SN74LS244 SN74S240 SN74S241 SN74S244
Submit Documentation Feedback Copyright © 1985–2016, Texas Instruments Incorporated
Pin numbers shown are for DB, DW, J, N, NS, and W packages
Figure 18. SNx4LS244 and SNx4S244
Logic Diagram
8.3 Feature Description
8.3.1 3-State Outputs
The 3-state outputs can drive bus lines directly. All outputs can be put into high impedance mode through the G
pin.
8.3.2 PNP Inputs
This device has PNP inputs which reduce dc loading on bus lines.
8.3.3 Hysteresis on Bus Inputs
The bus inputs have built-in hysteresis that improves noise margins.
8.4 Device Functional Modes
The SNx4LS24x and SNx4S24x devices can be used as inverting and non-inverting bus buffers for data line
transmission and can isolate input to output by setting the G pin HIGH. Table 1,Table 2, and Table 3 list the
function tables for all devices.
Table 1. SNx4LS240 and SNx4S240
Function Table
INPUTS OUTPUTS
G A Y
L L H
L H L
H X Z
Req
VCC
Input
Copyright © 2016, Texas Instruments Incorporated
R
VCC
Output
GND
Copyright © 2016, Texas Instruments Incorporated
9 kΩ NOM
Input
VCC
Copyright © 2016, Texas Instruments Incorporated
13
SN54LS240
,
SN54LS241
,
SN54LS244
,
SN54S240
,
SN54S241
,
SN54S244
SN74LS240
,
SN74LS241
,
SN74LS244
,
SN74S240
,
SN74S241
,
SN74S244
www.ti.com
SDLS144D –APRIL 1985–REVISED OCTOBER 2016
Product Folder Links: SN54LS240 SN54LS241 SN54LS244 SN54S240 SN54S241 SN54S244 SN74LS240
SN74LS241 SN74LS244 SN74S240 SN74S241 SN74S244
Submit Documentation FeedbackCopyright © 1985–2016, Texas Instruments Incorporated
Table 2. SNx4LS241 and SNx4S241
Function Table
CHANNEL 1 CHANNEL 2
INPUTS OUTPUT INPUTS OUTPUT
1G 1A 1Y 2G 2A 2Y
L L L H L L
L H H H H H
H X Z L X Z
Table 3. SNx4LS244 and SNx4S244
Function Table
INPUTS OUTPUTS
G A Y
L L L
L H H
H X Z
Figure 19. SNx4LS240, SNx4LS241, SNx4LS244
Equivalent of Each Input
G and G inputs: Req = 2 kΩNOM
A inputs: Req = 2.8 kΩNOM
Figure 20. SNx4S240, SNx4S241, SNx4S244
Equivalent of Each Input
SNx4LS240, SNx4LS241, SNx4LS244:
R = 50 ΩNOM
SNx4S240, SNx4S241, SNx4S244:
R = 25 ΩNOM
Figure 21. Typical of All Outputs
Driver
1/8 'LS241/'S241 Repeater
1/8 'LS241/'S241
Input
2.9 V
CL
Long-Line
1.6 V
1.2 V
0.3 V Input Output Input Output Input Output Input Output Input Output
Repeater
1/8 'LS241/'S241
Repeater
1/8 'LS241/'S241
Receiver
1/8 'LS241/'S241
Output
Copyright © 2016, Texas Instruments Incorporated
14
SN54LS240
,
SN54LS241
,
SN54LS244
,
SN54S240
,
SN54S241
,
SN54S244
SN74LS240
,
SN74LS241
,
SN74LS244
,
SN74S240
,
SN74S241
,
SN74S244
SDLS144D –APRIL 1985–REVISED OCTOBER 2016
www.ti.com
Product Folder Links: SN54LS240 SN54LS241 SN54LS244 SN54S240 SN54S241 SN54S244 SN74LS240
SN74LS241 SN74LS244 SN74S240 SN74S241 SN74S244
Submit Documentation Feedback Copyright © 1985–2016, Texas Instruments Incorporated
9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The SNx4LS24x, SNx4S24x octal buffers and line drivers are designed to be used for a multitude of bus
interface type applications where output drive or PCB trace length is a concern.
9.2 Typical Application
Figure 22. SNx4LS241 and SNx4S241 Used as Repeater or Level Restorer
9.2.1 Design Requirements
This device uses Schottky transistor logic technology. Take care to avoid bus contention because it can drive
currents that would exceed maximum limits. The high drive creates fast edges into light loads, so routing and
load conditions must be considered to prevent ringing.
9.2.2 Detailed Design Procedure
• Power Supply
– Each device must maintain a supply voltage between 4.5 V and 5.5 V.
• Inputs
– Input signals must meet the VIH and VIL specifications in Electrical Characteristics – SNx4LS24x.
– Inputs leakage values (II, IIH, IIL) from Electrical Characteristics – SNx4LS24x must be considered.
• Outputs
– Output signals are specified to meet the VOH and VOL specifications in Electrical Characteristics –
SNx4LS24x as a minimum (the values could be closer to VCC for high signals or GND for low signals).
– TI recommends maintaining output currents as specified in Recommended Operating Conditions.
– The part can be damaged by sourcing or sinking too much current (see Electrical Characteristics –
SNx4LS24x for details).
Control or Microprogram ROM/PROM
or
Memory Address Register
'Ls240/
'S240
System and/or Memory-Address Bus
Output
Control
Copyright © 2016, Texas Instruments Incorporated
IOL (mA)
VOL
(max) V
03 6 9 12 15 18 21 24 27
0.1
0.2
0.3
0.4
0.5
VCC
@ 4.75 V
15
SN54LS240
,
SN54LS241
,
SN54LS244
,
SN54S240
,
SN54S241
,
SN54S244
SN74LS240
,
SN74LS241
,
SN74LS244
,
SN74S240
,
SN74S241
,
SN74S244
www.ti.com
SDLS144D –APRIL 1985–REVISED OCTOBER 2016
Product Folder Links: SN54LS240 SN54LS241 SN54LS244 SN54S240 SN54S241 SN54S244 SN74LS240
SN74LS241 SN74LS244 SN74S240 SN74S241 SN74S244
Submit Documentation FeedbackCopyright © 1985–2016, Texas Instruments Incorporated
Typical Application (continued)
9.2.3 Application Curve
Figure 23. VOL vs IOL
9.3 System Examples
The SNx4LS240 and SNx4S240 devices can be used to buffer signals along a memory bus. The increased
output drive helps data transmission reliability. Figure 24 shows a schematic of this example.
4-bit organization can be applied to handle binary or BCD
Figure 24. SNx4LS240 and SNx4S240 Used as System or Memory Bus Driver
The SNx4LS240 and SNx4S240 devices have two independently controlled 4-bit drivers, and can be used to
buffer signals in a bidirectional manner along a data bus. Figure 25 shows the SNx4LS240 or SNx4S240 used in
this manner.
Input A
To Other
Buffers
Output A
Bus
Control
H
H
L
L
H
H
L
L
H
L
Receivers
Input Output
Bus
Control
B
B
A
A
None
1/4 'LS241/'S241
Driver
Party-Line
Multiple-Input/Output Bus 1/4 'LS241/'S241
Driver
Input B
To Other
Buffers
Output B
A
B
B
A
None
L
H
H
L
L
L
L
H
H
H
Copyright © 2016, Texas Instruments Incorporated
'LS240/'S240
Output
Ports
Input
Ports
From
Data
Bus
From
Data
Bus
GOutput-Port
Control
Input-Port
Control
G
Copyright © 2016, Texas Instruments Incorporated
16
SN54LS240
,
SN54LS241
,
SN54LS244
,
SN54S240
,
SN54S241
,
SN54S244
SN74LS240
,
SN74LS241
,
SN74LS244
,
SN74S240
,
SN74S241
,
SN74S244
SDLS144D –APRIL 1985–REVISED OCTOBER 2016
www.ti.com
Product Folder Links: SN54LS240 SN54LS241 SN54LS244 SN54S240 SN54S241 SN54S244 SN74LS240
SN74LS241 SN74LS244 SN74S240 SN74S241 SN74S244
Submit Documentation Feedback Copyright © 1985–2016, Texas Instruments Incorporated
System Examples (continued)
Figure 25. Independent 4-Bit But Drivers/Receivers in a Single Package
The enable pins on the SNx4LS241 and SNx4S241 devices can be used to help direct signals along a shared
party-line bus. Figure 26 shows a general configuration of how to implement this structure. Take care to ensure
that bus contention does not occur.
Figure 26. Party-Line Bus System With Multiple Inputs, Outputs, and Receivers
VCC
Unused Input
Input
Output Output
Input
Unused Input
17
SN54LS240
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SN54LS241
,
SN54LS244
,
SN54S240
,
SN54S241
,
SN54S244
SN74LS240
,
SN74LS241
,
SN74LS244
,
SN74S240
,
SN74S241
,
SN74S244
www.ti.com
SDLS144D –APRIL 1985–REVISED OCTOBER 2016
Product Folder Links: SN54LS240 SN54LS241 SN54LS244 SN54S240 SN54S241 SN54S244 SN74LS240
SN74LS241 SN74LS244 SN74S240 SN74S241 SN74S244
Submit Documentation FeedbackCopyright © 1985–2016, Texas Instruments Incorporated
10 Power Supply Recommendations
The power supply can be any voltage between the minimum and maximum supply voltage rating located in
Recommended Operating Conditions. Each VCC pin must have a good bypass capacitor to prevent power
disturbance. For devices with a single supply, TI recommends a 0.1-µF bypass capacitor. If there are multiple
VCC pins, TI recommends a 0.01-µF or 0.022-µF bypass capacitors for each power pin. It is acceptable to parallel
multiple bypass capacitors to reject different frequencies of noise. Two bypass capacitors of value 0.1 µF and
1 µF are commonly used in parallel. For best results, install the bypass capacitor(s) as close to the power pin as
possible.
11 Layout
11.1 Layout Guidelines
When using multiple bit logic devices, inputs must not be left floating. In many applications, some channels of the
SNx4LS24x, SNx4S24x are unused, and thus must be terminated properly. Because each transceiver channel
pin can be either an input or an output, they must be treated as both when being terminated. Ground or VCC
(whichever is more convenient) can be used to terminate unused inputs; however, each unused channel should
be terminated to the same logic level on both the A and Y side. For example, in Figure 27 unused channels are
terminated correctly with both sides connected to the same voltage, while channel 8 is terminated incorrectly with
each side being tied to a different voltage. The G input is also unused in this example, and is terminated directly
to ground to permanently enable all outputs.
11.2 Layout Example
Figure 27. Example Demonstrating How to Terminate Unused Inputs and Channels of a Transceiver
18
SN54LS240
,
SN54LS241
,
SN54LS244
,
SN54S240
,
SN54S241
,
SN54S244
SN74LS240
,
SN74LS241
,
SN74LS244
,
SN74S240
,
SN74S241
,
SN74S244
SDLS144D –APRIL 1985–REVISED OCTOBER 2016
www.ti.com
Product Folder Links: SN54LS240 SN54LS241 SN54LS244 SN54S240 SN54S241 SN54S244 SN74LS240
SN74LS241 SN74LS244 SN74S240 SN74S241 SN74S244
Submit Documentation Feedback Copyright © 1985–2016, Texas Instruments Incorporated
12 Device and Documentation Support
12.1 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 4. Related Links
PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL
DOCUMENTS SUPPORT &
COMMUNITY
SN54LS240 Click here Click here Click here Click here
SN74LS241 Click here Click here Click here Click here
SN74LS244 Click here Click here Click here Click here
SN54S240 Click here Click here Click here Click here
SN54S241 Click here Click here Click here Click here
SN54S244 Click here Click here Click here Click here
SN74LS240 Click here Click here Click here Click here
SN74LS241 Click here Click here Click here Click here
SN74LS244 Click here Click here Click here Click here
SN74S240 Click here Click here Click here Click here
SN74S241 Click here Click here Click here Click here
SN74S241 Click here Click here Click here Click here
12.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
12.3 Community Resource
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.6 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
19
SN54LS240
,
SN54LS241
,
SN54LS244
,
SN54S240
,
SN54S241
,
SN54S244
SN74LS240
,
SN74LS241
,
SN74LS244
,
SN74S240
,
SN74S241
,
SN74S244
www.ti.com
SDLS144D –APRIL 1985–REVISED OCTOBER 2016
Product Folder Links: SN54LS240 SN54LS241 SN54LS244 SN54S240 SN54S241 SN54S244 SN74LS240
SN74LS241 SN74LS244 SN74S240 SN74S241 SN74S244
Submit Documentation FeedbackCopyright © 1985–2016, Texas Instruments Incorporated
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
PACKAGE OPTION ADDENDUM
www.ti.com 11-Mar-2021
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
5962-7801201VSA ACTIVE CFP W 20 25 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 5962-7801201VS
A
SNV54LS240W
7705701RA ACTIVE CDIP J 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 7705701RA
SNJ54LS244J
7705701SA ACTIVE CFP W 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 7705701SA
SNJ54LS244W
78012012A ACTIVE LCCC FK 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 78012012A
SNJ54LS
240FK
7801201RA ACTIVE CDIP J 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 7801201RA
SNJ54LS240J
7801201SA ACTIVE CFP W 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 7801201SA
SNJ54LS240W
JM38510/32401B2A ACTIVE LCCC FK 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 JM38510/
32401B2A
JM38510/32401BRA ACTIVE CDIP J 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 JM38510/
32401BRA
JM38510/32401BSA ACTIVE CFP W 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 JM38510/
32401BSA
JM38510/32402B2A ACTIVE LCCC FK 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 JM38510/
32402B2A
JM38510/32402BRA ACTIVE CDIP J 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 JM38510/
32402BRA
JM38510/32402BSA ACTIVE CFP W 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 JM38510/
32402BSA
JM38510/32403B2A ACTIVE LCCC FK 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 JM38510/
32403B2A
JM38510/32403BRA ACTIVE CDIP J 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 JM38510/
32403BRA
JM38510/32403BSA ACTIVE CFP W 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 JM38510/
32403BSA
JM38510/32403SRA ACTIVE CDIP J 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 JM38510/
32403SRA
PACKAGE OPTION ADDENDUM
www.ti.com 11-Mar-2021
Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
JM38510/32403SSA ACTIVE CFP W 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 JM38510/
32403SSA
M38510/32401B2A ACTIVE LCCC FK 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 JM38510/
32401B2A
M38510/32401BRA ACTIVE CDIP J 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 JM38510/
32401BRA
M38510/32401BSA ACTIVE CFP W 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 JM38510/
32401BSA
M38510/32402B2A ACTIVE LCCC FK 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 JM38510/
32402B2A
M38510/32402BRA ACTIVE CDIP J 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 JM38510/
32402BRA
M38510/32402BSA ACTIVE CFP W 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 JM38510/
32402BSA
M38510/32403B2A ACTIVE LCCC FK 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 JM38510/
32403B2A
M38510/32403BRA ACTIVE CDIP J 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 JM38510/
32403BRA
M38510/32403BSA ACTIVE CFP W 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 JM38510/
32403BSA
M38510/32403SRA ACTIVE CDIP J 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 JM38510/
32403SRA
M38510/32403SSA ACTIVE CFP W 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 JM38510/
32403SSA
SN54LS240J ACTIVE CDIP J 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 SN54LS240J
SN54LS241J ACTIVE CDIP J 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 SN54LS241J
SN54LS244J ACTIVE CDIP J 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 SN54LS244J
SN54S240J ACTIVE CDIP J 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 SN54S240J
SN54S241J ACTIVE CDIP J 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 SN54S241J
PACKAGE OPTION ADDENDUM
www.ti.com 11-Mar-2021
Addendum-Page 3
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
SN54S244J ACTIVE CDIP J 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 SN54S244J
SN74LS240DBR ACTIVE SSOP DB 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM LS240
SN74LS240DW ACTIVE SOIC DW 20 25 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LS240
SN74LS240DWG4 ACTIVE SOIC DW 20 25 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LS240
SN74LS240DWR ACTIVE SOIC DW 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LS240
SN74LS240N ACTIVE PDIP N 20 20 RoHS & Green NIPDAU N / A for Pkg Type 0 to 70 SN74LS240N
SN74LS240NE4 ACTIVE PDIP N 20 20 RoHS & Green NIPDAU N / A for Pkg Type 0 to 70 SN74LS240N
SN74LS240NSR ACTIVE SO NS 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 74LS240
SN74LS241DW ACTIVE SOIC DW 20 25 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LS241
SN74LS241DWR ACTIVE SOIC DW 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LS241
SN74LS241N ACTIVE PDIP N 20 20 RoHS &
Non-Green NIPDAU N / A for Pkg Type 0 to 70 SN74LS241N
SN74LS241NSR ACTIVE SO NS 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 74LS241
SN74LS244DBR ACTIVE SSOP DB 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LS244
SN74LS244DBRG4 ACTIVE SSOP DB 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LS244
SN74LS244DW ACTIVE SOIC DW 20 25 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LS244
SN74LS244DWE4 ACTIVE SOIC DW 20 25 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LS244
SN74LS244DWG4 ACTIVE SOIC DW 20 25 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LS244
SN74LS244DWR ACTIVE SOIC DW 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LS244
SN74LS244DWRE4 ACTIVE SOIC DW 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LS244
SN74LS244N ACTIVE PDIP N 20 20 RoHS & Green NIPDAU N / A for Pkg Type 0 to 70 SN74LS244N
SN74LS244NE4 ACTIVE PDIP N 20 20 RoHS & Green NIPDAU N / A for Pkg Type 0 to 70 SN74LS244N
PACKAGE OPTION ADDENDUM
www.ti.com 11-Mar-2021
Addendum-Page 4
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
SN74LS244NSR ACTIVE SO NS 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 74LS244
SN74LS244NSRG4 ACTIVE SO NS 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 74LS244
SN74S240DW ACTIVE SOIC DW 20 25 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 S240
SN74S240DWG4 ACTIVE SOIC DW 20 25 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 S240
SN74S240N ACTIVE PDIP N 20 20 RoHS & Green NIPDAU N / A for Pkg Type 0 to 70 SN74S240N
SN74S240NE4 ACTIVE PDIP N 20 20 RoHS & Green NIPDAU N / A for Pkg Type 0 to 70 SN74S240N
SN74S241DW ACTIVE SOIC DW 20 25 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 S241
SN74S241N ACTIVE PDIP N 20 20 RoHS &
Non-Green NIPDAU N / A for Pkg Type 0 to 70 SN74S241N
SN74S244DW ACTIVE SOIC DW 20 25 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 S244
SN74S244DWG4 ACTIVE SOIC DW 20 25 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 S244
SN74S244DWR ACTIVE SOIC DW 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 S244
SN74S244N ACTIVE PDIP N 20 20 RoHS &
Non-Green NIPDAU N / A for Pkg Type 0 to 70 SN74S244N
SNJ54LS240FK ACTIVE LCCC FK 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 78012012A
SNJ54LS
240FK
SNJ54LS240J ACTIVE CDIP J 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 7801201RA
SNJ54LS240J
SNJ54LS240W ACTIVE CFP W 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 7801201SA
SNJ54LS240W
SNJ54LS241FK ACTIVE LCCC FK 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 SNJ54LS
241FK
SNJ54LS241J ACTIVE CDIP J 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 SNJ54LS241J
SNJ54LS241W ACTIVE CFP W 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 SNJ54LS241W
SNJ54LS244FK ACTIVE LCCC FK 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 SNJ54LS
244FK
PACKAGE OPTION ADDENDUM
www.ti.com 11-Mar-2021
Addendum-Page 5
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
SNJ54LS244J ACTIVE CDIP J 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 7705701RA
SNJ54LS244J
SNJ54LS244W ACTIVE CFP W 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 7705701SA
SNJ54LS244W
SNJ54S240FK ACTIVE LCCC FK 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 SNJ54S
240FK
SNJ54S240J ACTIVE CDIP J 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 SNJ54S240J
SNJ54S240W ACTIVE CFP W 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 SNJ54S240W
SNJ54S241FK ACTIVE LCCC FK 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 SNJ54S
241FK
SNJ54S241J ACTIVE CDIP J 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 SNJ54S241J
SNJ54S244J ACTIVE CDIP J 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 SNJ54S244J
SNJ54S244W ACTIVE CFP W 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 SNJ54S244W
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
PACKAGE OPTION ADDENDUM
www.ti.com 11-Mar-2021
Addendum-Page 6
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54LS240, SN54LS240-SP, SN54LS241, SN54LS244, SN54LS244-SP, SN54S240, SN54S241, SN54S244, SN74LS240, SN74LS241,
SN74LS244, SN74S240, SN74S241, SN74S244 :
•Catalog: SN74LS240, SN54LS240, SN74LS241, SN74LS244, SN54LS244, SN74S240, SN74S241, SN74S244
•Military: SN54LS240, SN54LS241, SN54LS244, SN54S240, SN54S241, SN54S244
•Space: SN54LS240-SP, SN54LS244-SP
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
•Military - QML certified for Military and Defense Applications
•Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74LS240DBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1
SN74LS240DWR SOIC DW 20 2000 330.0 24.4 10.8 13.3 2.7 12.0 24.0 Q1
SN74LS240NSR SO NS 20 2000 330.0 24.4 8.4 13.0 2.5 12.0 24.0 Q1
SN74LS241DWR SOIC DW 20 2000 330.0 24.4 10.8 13.3 2.7 12.0 24.0 Q1
SN74LS241NSR SO NS 20 2000 330.0 24.4 8.4 13.0 2.5 12.0 24.0 Q1
SN74LS244DBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1
SN74LS244DWR SOIC DW 20 2000 330.0 24.4 10.8 13.3 2.7 12.0 24.0 Q1
SN74LS244NSR SO NS 20 2000 330.0 24.4 8.4 13.0 2.5 12.0 24.0 Q1
SN74S244DWR SOIC DW 20 2000 330.0 24.4 10.8 13.3 2.7 12.0 24.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 30-Dec-2020
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74LS240DBR SSOP DB 20 2000 853.0 449.0 35.0
SN74LS240DWR SOIC DW 20 2000 367.0 367.0 45.0
SN74LS240NSR SO NS 20 2000 367.0 367.0 45.0
SN74LS241DWR SOIC DW 20 2000 367.0 367.0 45.0
SN74LS241NSR SO NS 20 2000 367.0 367.0 45.0
SN74LS244DBR SSOP DB 20 2000 853.0 449.0 35.0
SN74LS244DWR SOIC DW 20 2000 367.0 367.0 45.0
SN74LS244NSR SO NS 20 2000 367.0 367.0 45.0
SN74S244DWR SOIC DW 20 2000 367.0 367.0 45.0
PACKAGE MATERIALS INFORMATION
www.ti.com 30-Dec-2020
Pack Materials-Page 2
www.ti.com
PACKAGE OUTLINE
C
18X 0.65
2X
5.85
20X 0.38
0.22
8.2
7.4 TYP
SEATING
PLANE
0.05 MIN
0.25
GAGE PLANE
0 -8
2 MAX
B5.6
5.0
NOTE 4
A
7.5
6.9
NOTE 3
0.95
0.55
(0.15) TYP
SSOP - 2 mm max heightDB0020A
SMALL OUTLINE PACKAGE
4214851/B 08/2019
1
10 11
20
0.1 C A B
PIN 1 INDEX AREA
SEE DETAIL A
0.1 C
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-150.
A 15
DETAIL A
TYPICAL
SCALE 2.000
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MAX
ALL AROUND 0.07 MIN
ALL AROUND
20X (1.85)
20X (0.45)
18X (0.65)
(7)
(R0.05) TYP
SSOP - 2 mm max heightDB0020A
SMALL OUTLINE PACKAGE
4214851/B 08/2019
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 10X
SYMM
SYMM
1
10 11
20
15.000
METAL
SOLDER MASK
OPENING METAL UNDER
SOLDER MASK SOLDER MASK
OPENING
EXPOSED METAL
EXPOSED METAL
SOLDER MASK DETAILS
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
www.ti.com
EXAMPLE STENCIL DESIGN
20X (1.85)
20X (0.45)
18X (0.65)
(7)
(R0.05) TYP
SSOP - 2 mm max heightDB0020A
SMALL OUTLINE PACKAGE
4214851/B 08/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 10X
SYMM
SYMM
1
10 11
20
www.ti.com
PACKAGE OUTLINE
C
TYP
10.63
9.97
2.65 MAX
18X 1.27
20X 0.51
0.31
2X
11.43
TYP
0.33
0.10
0 - 8
0.3
0.1
0.25
GAGE PLANE
1.27
0.40
A
NOTE 3
13.0
12.6
B7.6
7.4
4220724/A 05/2016
SOIC - 2.65 mm max heightDW0020A
SOIC
NOTES:
1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm per side.
5. Reference JEDEC registration MS-013.
120
0.25 C A B
11
10
PIN 1 ID
AREA
NOTE 4
SEATING PLANE
0.1 C
SEE DETAIL A
DETAIL A
TYPICAL
SCALE 1.200
www.ti.com
EXAMPLE BOARD LAYOUT
(9.3)
0.07 MAX
ALL AROUND
0.07 MIN
ALL AROUND
20X (2)
20X (0.6)
18X (1.27)
(R )
TYP
0.05
4220724/A 05/2016
SOIC - 2.65 mm max heightDW0020A
SOIC
SYMM
SYMM
LAND PATTERN EXAMPLE
SCALE:6X
1
10 11
20
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
www.ti.com
EXAMPLE STENCIL DESIGN
(9.3)
18X (1.27)
20X (0.6)
20X (2)
4220724/A 05/2016
SOIC - 2.65 mm max heightDW0020A
SOIC
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SYMM
SYMM
1
10 11
20
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:6X
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