ACCOUNT PRODUCTS SOLUTIONS SUPPORT ABOUT ALL Package : TSSOP16 TSSOP16, plastic, thin shrink small outline package 16 terminals 0.65 mm pitch 4.4 mm x 5 mm x 1.05 mm body 8-bit MCU, S08 core, 16KB Flash, 40MHz, -40/+125degC, Automotive Qualified, SOP 16 Data Sheet Product Summary Software & Tools Documentation Operating Characteristics CART Search... G9S08SG16E1MTG Buy Options ENGLISH Environmental Information Quality Information Shipping Information Operating Characteristics Parameter Value Parameter Value Flash (kB) 16 Supply voltage [min] (V) 2.7 RAM (kB) 1 Supply voltage [max] (V) 5.5 Operating Frequency [Max (MHz)] 20 GPIO 12 I2C 1 Ambient Operating Temperature (Min-Max) () -40 to 85 SPI 1 SCI 1 Environmental Information Material Declaration PbFree EU RoHS Halogen Free RHF Indicator 2nd Level Interconnect REACH SVHC Weight (mg) S9S08SG16E1MTG (935314753574) Yes Yes Yes D e3 REACH SVHC 62.2 S9S08SG16E1MTGR (935314753518) Yes Yes Yes D e3 REACH SVHC 62.2 Quality Information Material Declaration Safe Assure Functional Safety Moisture Sensitivity Level (MSL) Peak Package Body Temperature (PPT) (C) Maximum Time at Peak Temperatures (s) Lead Free Soldering Lead Free Soldering Lead Free Soldering S9S08SG16E1MTG (935314753574) No 3 260 40 S9S08SG16E1MTGR (935314753518) No 3 260 40 Shipping Information Part Number Harmonized Tariff (US) Disclaimer Export Control Classification Number (US) S9S08SG16E1MTG (935314753574) 854231 EAR99 S9S08SG16E1MTGR (935314753518) 854231 EAR99 ABOUT NXP RESOURCES Investors Mobile Apps Press, News, Blogs Contact Us Careers Privacy | Terms of Use | Terms of Sale | Feedback FOLLOW US News 26 Jul 2018 NXP Semiconductors Reports Second Quarter 2018 Results Read More (c)2006-2018 NXP Semiconductors. All rights reserved.