1. General description
The PCF8545 is a periph eral device which interfaces to almost any Liq uid Crystal Disp lay
(LCD)1 with low multiplex rates. It generates the drive signals for any multiplexed LCD
containing up to eight backp lan e s, an d up to 32 0 ele m en ts. The PCF85 45 is compatible
with most microcontrollers and communicates via the two-line bidirectional I2C-bus
(PCF8545A) or a three line unidirectional SPI-bus (PCF8545B). Communication
overheads are minimized using a display RAM with auto-incremented addressing.
For a selection of NXP LCD segment drivers, see Table 40 on page 61.
2. Features and benefits
Single-chip 320 elements LCD controller and driver
Wide range for digital power supply: from 1.8 V to 5.5 V
LCD supply range from 2.5 V up to 5.5 V
LCD and logic supplies may be separated
Low power consum ption
Selectable backplane drive configuration: 4, 6, or 8 backplane multiplexing
Selectable display bias configuration
320-bit RAM for display data storage
400 kHz I2C-bus inter fac e (PCF8545A)
5 MHz SPI-bus interface (PCF8545B)
Programmable frame frequency in the range of 60 Hz to 300 Hz in step s of 10 Hz;
factory calibrated
320 segments driven allowing:
up to 40 7-segment alphanumeric characte rs
up to 20 14-segment alphanumeric characters
any graphics of up to 32 0 elements
Manufactured in silicon gate CMOS process
3. Applications
Industrial and consumer products
PCF8545
Universal LCD driver for multiplex rates up to 1:8
Rev. 1 — 13 November 2013 Product data sheet
1. The definition of the abbreviations and acronyms used in this data sheet can be found in Section 21.
PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 2 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
4. Ordering information
4.1 Ordering options
5. Marking
Tabl e 1. Ordering information
Type number Interface
type Package
Name Description Version
PCF8545ATT I2C-bus TSSOP56 plastic thin shrink small outline
package; 56 leads; body width 6.1 mm SOT364-1
PCF8545BTT SPI-bus TSSOP56 plastic thin shrink small outline
package; 56 leads; body width 6.1 mm SOT364-1
Tabl e 2. Ordering options
Product type number Sales item (12NC) Orderable part
number IC
revision Delivery form
PCF8545ATT/A 935302987118 PCF8545ATT/AJ 1 tape and reel, 13 inch
PCF8545BTT/A 935302988118 PCF8545BTT/AJ 1 tape and reel, 13 inch
Table 3. Marking codes
Type number Marking code
PCF8545ATT/A PCF8545ATT
PCF8545BTT/A PCF8545BTT
PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 3 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
6. Block diagram
Fig 1. Block diagram of PCF8545A
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PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 4 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
Fig 2. Block diagram of PCF8545B
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PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 5 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
7. Pinning information
7.1 Pinning
Top view. For mechanical details, see Figure 45. Top view. For mechanical details, see Figure 45.
Fig 3. Pin configuration for TSSOP56 (PCF8545ATT) Fig 4. Pin configuration for TSSOP56 (PCF8545BTT)
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PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 6 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
7.2 Pin description
[1] VLCD must be equal to or greater than VDD.
[2] Effect of backplane swapping is illustrated in Figure 5 on page 9.
[3] Bit BPS is explained in Section 8.1.3 on page 8.
Table 4. Pin description of PCF8545ATT and PCF8545BTT
Input or input/output pins must always be at a defined level (VSS or VDD) unless otherwise specified.
Pin Symbol Type Description
1 to 11 S9 to S19 output LCD segment
20 to 31 S20 to S31 output LCD segment
43 RESET input active LOW reset input
44 VSS supply ground supply voltage
45 VDD supply supply voltage
46 OSCCLK input/output external clock input/internal oscillator
output
47 VLCD[1] supply LCD supply voltage
48 to 56 S0 to S8 output LCD segment
Pin layout depending on backplane swap configuration[2]
BPS = 0[3] BPS = 1
12 BP0 S32 output LCD backplane/LCD segment
13 BP1 S33
14 BP2 S34
15 BP3 S35
16 BP4/S43 S36
17 BP5/S42 S37
18 BP6/S41 S38
19 BP7/S40 S39
32 S32 BP7/S40
33 S33 BP6/S41
34 S34 BP5/S42
35 S35 BP4/S43
36 S36 BP3
37 S37 BP2
38 S38 BP1
39 S39 BP0
Pin layout depen ding on product and bus type
PCF8545ATT PCF8545BTT
40 A0 input I2C-bus slave address selection
CE input SPI-bus chip enable - active LOW
41 SCL input I2C-bus serial clock
SCL input SPI-bus serial clock
42 SDA input/output I2C-bus serial data
SDI input SPI-bus data input
PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 7 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
8. Functional description
The PCF8545 is a versatile per iph eral de vi ce designed to inter fac e any micr ocon troller to
a wide variety of LCDs. It ca n dir ec tly dr ive an y mu ltip lex ed LCD containing up to eig h t
backplanes and up to 44 segments.
8.1 Commands of PCF8545
The PCF8545 is controlled by 9 commands, which are defined in Table 5. Any other
combinations of operation code bits that are not mentioned in th is document may lead to
undesired op er a tion mo de s of PCF8 54 5.
[1] Information about control byte and register selection see Section 9.1 on page 36.
8.1.1 Command: initialize
This command generates a chip-wide reset. It has the same function as the RESET pin.
Reset takes 1 ms to complete.
8.1.2 Command: OTP-refresh
During production of the device, e ach IC is calibrated to achieve the spe cified accuracy of
the frame freque n c y. This calibration is perf or me d on EPROM ce lls calle d On e Time
Programmable (OTP) cells. The device reads these cells every time the OTP-refresh
command is sent. The OTP-refresh comma nd has to be sent after a reset has bee n made
and before the display is enabled.
This command will be completed after a maximum of 30 ms and requires either the
internal or external clock to run. If the internal oscillator is not used, then a clock must be
supplied to the OSCCLK pin. If the OTP-re fresh instruction is sent and no clock is p resent,
then the request is stored until a clock is available.
Remark: It is recommended not to en te r power -down mo de dur ing th e OTP re fr esh cycle.
Table 5. Commands of PCF 8 545
Command name Register
selection
RS[1:0][1]
Bits Reference
76543210
initialize 0000010110Section 8.1.1
OTP-refresh 0011110000Section 8.1.2
mode-settings 000101BPSINVPDESection 8.1.3
oscillator-control 0 0 00011EFRCOEOSCSection 8.1.4
set-MUX-mode 00000000M[1:0] Section 8.1.5
set-bias-mode 00000001B[1:0] Section 8.1.6
frame-frequency 00001FD[4:0] Section 8.1.7
load-data-pointer 0 0 1 0 DP[5:0] Section 8.1.8
write-RAM-data 0 1 D[7:0] Section 8.1.9
Table 6. Initialize - initialize command bit description
Bit Symbol Value Description
7 to 0 - 00010110 fixed value
PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 8 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
8.1.3 Command: mode-settings
[1] Default value.
[2] See Section 8.1.3.2.
8.1.3.1 Backplane swapping
Backplane swapping can be configured with the BPS bit (see Table 8). It moves the
location of the backplane and the associated segment outputs from one side of the
PCF8545 to the other. Backplane swapping is sometimes desirable to aid with the routing
of PCBs that do not use multiple layers.
The BPS bit has to be set to the required value before enabling the display. Failure to do
so does not damage the PCF8545 or the display, however unexpected display content
may appear.
Table 7. OTP-refresh - OTP-refresh command bit description
Bit Symbol Value Description
7 to 0 - 11110000 fixed value
Table 8. Mode-settings - mode settings command bit description
Bit Symbol Value Description
7 to 4 - 0101 fixed value
3 BPS backplane swappin g
0[1] backplane configurati on 0
1 backplane configuration 1
2INV set inversi on mode
0[1][2] Driving scheme A: LCD line inversion mode
1 Driving scheme B: LCD frame inversion mode
1PD set power mod e
1 power-down mode; backplane and segment
outputs are connected to VSS and the internal
oscillator is switched off
0[1] power-up mode
0E display switch
0[1] display disabled; backplane and segment
outputs are connected to VSS
1 display enabled
PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 9 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
8.1.3.2 Line inversion (driving scheme A) and frame inversion (driving scheme B)
The DC offset of the voltage across the LCD is compensated over a certain period:
line-wise in line inversion mode (driving scheme A) or frame-wise in frame inversion mode
(driving scheme B). With the INV bit (see Table 8), the compensation mode can be
switched.
In frame inversion mode, the DC value is compensated across two frames an d not within
one frame. Changing the inversion mode to frame inversion reduces the power
consumption; therefore it is useful when power consumption is a key point in the
application.
Frame inversion may not be suitable for all applications. The RMS voltage across a
segment is better defined; however, since the switching frequency is reduced, there is
possibility for flicker to occur.
The waveforms of Figure 14 on page 24 to Figure 17 on page 27 are showing line
inversion mode. Figure 18 on page 28 shows an example of frame inversion.
8.1.3.3 Power-down mode
The power-down bit (PD) allows the PCF8545 to be put in a minimum power
configuration. To avoid display artifacts, enter power-down only after the display has been
switched off by setting bit E to logic 0. During power-down, the internal oscillator is
switched off.
Fig 5. Effect of backplane swapping
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PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 10 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
With the following sequence, the PCF8545 can be set to a state of minimum power
consumption, called power-down mode.
Remarks:
It is necessary to run the power-down sequence before removing the supplies.
Depending on the application, care must be taken that no other signals are present at
the chip input or output pins when removing the supplies (see Section 10). Otherwise
it may cause unwanted display artifacts. If an uncontrolled removal of the supply
happens, the PCF8545 does not get damaged.
Static voltages across the liquid crystal display can build up when the external LCD
supply voltage (VLCD) is on while the IC supp ly volt age is off, or the other way around.
This may cause unwanted display artifacts. To avoid such artifacts, VLCD and VDD
must be applied or removed together.
Table 9. Effect of the power-down bit (PD)
Effect on function Mode settings Effect of setting PD
0 1
backplane output E = 1 normal function VSS
segment output E = 1 normal function VSS
internal oscillator OSC = 0, COE = 1 on off
OSCCLK pin OSC = 0, COE = 1 output of internal
oscillator frequency VDD
OSCCLK pin OSC = 1 input clock clock input, can be
logic 0, logic 1, or left
floating
Fig 6. Recommended power-down sequence
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PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 11 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
A clock signal must always be supplied to the device when the display is active.
Removing the clock may freeze the LCD in a DC state, which is not suitable for the
liquid crystal. First disable th e disp la y and afterwar ds rem ov e th e cloc k s ign al.
8.1.3.4 Display enable
The display enable bit (E) is used to enable and disable the display. When the display is
disabled, all LCD outputs go to VSS. This function is implemented to ensure that no
voltage can be induced on the LCD outputs as it may lead to unwanted displays of
segments.
Recommended start-up sequences are found in Section 8.2.3
Remark: Display enable is not synchronized to an LCD frame boundary. Therefore using
this function to flash a display for prolonged periods is not recommended due to the
possible build-up of DC voltages on the display.
8.1.4 Command: oscillator-control
The oscillator-control command switches between internal and external oscillator and
enables or disables the pin OSCCLK. It is also defines the external frequency.
[1] Default value.
The bits OSC, COE, and EFR control the source and frequency of the clock used to
generate the LCD signals (see Figure 7). Valid combinations are shown in Table 11.
Table 10. Oscillator-contro l - osc illator control command bit desc ription
Bit Symbol Value Description
7 to 3 - 00011 fixed value
2EFR external cl oc k freq ue ncy applied on pin
OSCCLK
0[1] 9.6 kHz
1 230 kHz
1COE clock output enable for pin OSCCLK
0[1] clock signal not available on pin OSCCLK;
pin OSCCLK is in 3-state
1 clock signal available on pin OSCCLK
0OSC oscillator source
0[1] internal oscillator running
1 external oscillator used;
pin OSCCLK becomes an input;
used in combination with EFR to determine
input frequency
PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 12 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
8.1.4.1 Oscillator
The system is designed to operate from a 9.6 kHz or a 230 kHz clock. This clock can be
sourced internally or externally. The internal logic and LCD drive signals of the PCF8545
are timed either by the internal oscillator or from the clock externally supplied.
Internal clock: When the internal oscillator is used, all LCD signals are generated from it.
The oscillator runs at nominal 230 kHz. The relationship between this frequency and the
LCD frame frequency is detailed in Section 8.1.7. Control over the internal oscillator is
made with the OSC bit (see Section 8.1.4).
It is possible to make the internal oscillator signal available on pin OSCCLK by using the
oscillator-control command (see Table 10) and configuring the clock output en ab le (COE)
bit. If not requir ed, the pin OSCCLK should be left open or connected to VSS. At power- on
the signal at pin OSCCLK is disabled and pin OSCCLK is in 3-state.
Clock output is only valid when using the internal oscillator. The signal appears on the
OSCCLK pin.
An intermediate clock frequency is available at the OSCCLK pin. The duty cycle of this
clock varies with the chosen divide ratio.
(1) Can only be used with the internal oscillator (OSC = 0).
(2) Can only be used with an external oscillator (OSC = 1).
(3) Nominal value for divide factor q is 24; source clock is 230 kHz (see Section 8.1.7).
Fig 7. Oscillator selection
Table 11. Valid combinations of bits OSC, EFR, and COE
OSC COE EFR OSCCLK pin Clock source
0 0 not used inactive;
may be left floating internal oscillator used
0 1 not used output of internal oscillator
frequency (prescaler) internal oscillator used
1 not used 0 9.6 kHz input OSCCLK pin
1 not used 1 230 kHz input OSCCLK pin
Table 12. Typical use of bits OSC, EFR, and COE
Usage OSC COE EFR
LCD with internal oscillator 0 0 not used
LCD with external oscillator (230 kHz) 1 not used 1
LCD with external oscillator (9.6 kHz) 1 not used 0
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PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 13 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
[1] When RESET is active, the pin OSCCLK is in 3-state.
[2] In this state, an external clock may be applied, but it is not a requirement.
[3] 9.6 kHz is the nominal frequency with q = 24, see Table 14.
External clock: In applications wh ere an externa l clock must be applied to the PCF8545,
bit OSC (see Table 10) has to be set logic 1. In this case pin OSCCLK becomes an input.
The OSCCLK signal must switch between the VSS and the VDD voltage supplied to the
chip.
The EFR bit determines the external clock frequency (230 kHz or 9.6 kHz). The clock
frequency (fclk(ext)) in turn determines the LCD frame frequency, see Table 14.
Remark: If an external clock is used, then this clock signal must always be supplied to the
device when the display is on. Removing the clock may freeze the LCD in a DC state
which damages the LCD material.
8.1.4.2 Timing an d fram e fre qu e nc y
The timing of the PCF8545 organizes the internal data flow of the device. This includes
the transfer of display data from the display RAM to the display segment outputs. The
timing also generates the LCD frame frequency which it derives as an integer division of
the clock frequency (see Table 14). The frame frequency is a fixed division of the internal
clock or of the frequency applied to pin OSCCLK when an external clock is used.
[1] Other values of the frame frequency prescaler see Table 18.
When the internal clock is used, or an external clock with EFR = 1, the LCD frame
frequency can be prog rammed by software in steps of approximatel y 10 Hz in the range o f
60 Hz to 300 Hz (see Table 18). Furthermore the internal oscillator is factory calibrated,
see Table 34 on page 50.
Table 13. OSCCLK pin state depending on config uration
PD OSC COE EFR OSCCLK pin[1]
power-down n.a. off n.a. 3-state[2]
power-downn.a.on n.a.V
DD
power-up internal oscillator off n.a. 3-state
on n.a. 9.6 kHz output[3]
external oscillator n.a. 9.6 kHz 9.6 kHz input
230 kHz 230 kHz input
Table 14. LCD frame freq uencies
Frame frequenc y Typical external
frequency (Hz) Nominal frame
frequency (Hz) EFR bit Value of q[1]
9600 200 0 -
230000 200 1 24
ffr LCD
fclk ext
48
-----------------
=
ffr LCD
fclk ext
48 q
-----------------
=
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Product data sheet Rev. 1 — 13 November 2013 14 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
8.1.5 Command: set-MUX-mode
The multiplex drive mode is configured with the bits described in Table 15.
[1] Default value.
8.1.6 Command: set-bias-mode
The set-bias-mode command allows setting the bias level.
[1] Default value.
8.1.7 Command: frame-frequency
With the frame-frequency command, the frame frequency for the display can be
configured. The clock frequency determines the frame frequency.
When using an external clock it can be either a 230 kHz or a 9.6 kHz clock signal. The
EFR bit (see Table 10) has to be set according to the external clock frequency.
When EFR is set to 9.6 kHz, then the LCD frame frequency is calculated with Equation 1:
(1)
When EFR is set to 230 kHz, then th e LCD frame freque ncy is calcul ated with Equation 2:
(2)
where q is the frequency divide factor (see Table 18).
Remark: fclk(ext) is the external input clock frequency to pin OSCCLK.
Table 15. Set-MUX-mode - set multiplex drive mode command bit description
Bit Symbol Value Description
7 to 2 - 000000 fixed value
1 to 0 M[1:0] 00[1], 01 1:8 multiplex drive mode; eight backplanes
10 1:6 multiplex drive mode; 6 backplane s
11 1:4 multiplex drive mode; 4 backplane s
Table 16. Set-bias-mode - set bias mode command bit description
Bit Symbol Value Description
7 to 2 - 000001 fixed value
1 to 0 B[1:0] 00[1]. 01 14 bias
11 13 bias
10 12 bias
Table 17. Frame-frequency - frame frequency and output clock frequency command bit
description
Bit Symbol Value Description
7 to 5 - 001 fixed value
4 to 0 FD[4:0] see Table 18 frequency prescaler
ffr LCD
fclk ext
48
-----------------
=
ffr LCD
fclk ext
48 q
-----------------
=
PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 15 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
When the internal oscillator is used, the intermediate frequency may be output on the
OSCCLK pin. Its frequency is given in Table 18.
[1] Nominal frame frequency calculated for the default clock frequency of 230 kHz.
[2] Default value.
8.1.8 Command: load-data-pointer
The load-data-pointer command defines the start address of the display RAM. The data
pointer is auto incremented after each RAM write. The size of the display RAM is
dependent on the current multiplex drive mode setting, see Table 19.
Table 18. Frame frequency prescaler values for 230 kHz clock operation
FD[4:0] Nominal LCD frame
frequency (Hz) [1] Divide factor, q Intermediate clo ck
frequency (Hz)
00000 59.9 80 2875
00001 70.5 68 3382
00010 79.9 60 3833
00011 90.4 53 4340
00100 99.8 48 4792
00101 108.9 44 5227
00110 119.8 40 5750
00111 129.5 37 6216
01000 140.9 34 6765
01001 149.7 32 7188
01010 159.7 30 7667
01011 171.1 28 8214
01100 177.5 27 8519
01101 191.7 25 9200
01110[2] 199.7 24 9583
01111 208.3 23 10000
10000 217.8 22 10455
10001 228.3 21 10952
10010 239.6 20 11500
10011 252.2 19 12105
10100 266.2 18 12778
10101 281.9 17 13529
10110 299.5 16 14375
10111 to 11111 not used
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NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
[1] Default value.
Remark: Data pointer values outside of the valid range are ignored and no RAM content
is transferred until a valid data pointer value is set.
Filling of the display RAM is described in Section 8.9.
8.1.9 Command: write-RAM-data
This command initiates the transfer of data to the display RAM. Data is written into the
address defined by the load-data-pointer command. RAM filling is described in
Section 8.9.
[1] For this command to be effective bit RS[1:0] of the control byte has to be set logic 01, see Table 25 on
page 36.
8.2 Start-up and shut-down
8.2.1 Reset and Power-On Reset (POR)
After a reset and at power-on the PCF8545 resets to starting conditions as follows:
1. The display is disabled.
2. All backplane outputs are set to VSS.
3. All segment outputs are set to VSS.
4. Selected drive mode is: 1:8 with 14 bias.
5. The data pointers are cleared (set logic 0).
6. RAM data is not initialized. Its content can be considered to be random.
7. The internal oscillator is running; no clock signal is available on pin OSCCLK; pin
OSCCLK is in 3-state.
The reset state is as shown in Table 21.
Table 19. Load -data-pointer - load data pointer command bit description
Bit Symbol Value Description
7 to 6 - 10 fixed value
Multiplex drive mode 1:8
5 to 0 DP[5:0] 000000[1] to
100111 6-bit binary value of 0 to 39
Multiplex drive mode 1:6
5 to 0 DP[5:0] 000000[1] to
101001 6-bit binary value of 0 to 41
Multiplex drive mode 1:4
5 to 0 DP[5:0] 000000[1] to
101011 6-bit binary value of 0 to 43
Table 20. Write-RAM-data - write RAM data command bit description[1]
Bit Symbol Value Description
7 to 0 D[7:0] 00000000 to
11111111 writing data byte-wise to RAM
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Product data sheet Rev. 1 — 13 November 2013 17 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
The first command sent to the device after the power-on event must be the initialize
command (see Section 8.1.1).
After Power-On Reset (POR) and before enabling the display, the RAM content should be
brought to a defined state by writing meaningful content (for example, a graphic)
otherwise unwanted display artifacts may appear on the display.
8.2.2 RESET pin function
The RESET pin of the PCF8545 sets all the registers to their default state. The reset state
is given in Table 21. The RAM contents remains unchanged. After the reset signal is
removed, the PCF8545 will behave in the same manner as after Power-On Reset (POR).
See Section 8.2.1 for details.
8.2.3 Recommended start-up sequences
This chapter describes how to proceed with the initia liza tio n of the ch ip in different
application modes.
In general, the sequence should always be:
1. Power-on the device,
2. set the display and functional modes,
3. fill the display memory and then
4. turn on the displa y.
Table 21. Reset state
Reset state of configurable bits shown in the command table format for clarity.
Associated command Bits
7 6 5 4 3 2 1 0
mode-settings - - - - BPS = 0 INV = 0 PD = 0 E = 0
oscillator-control - - - - - EFR = 0 COE = 0 OSC = 0
set-MUX-mode - - - - - - M[1:0] = 00
set-bias-mode - - - - - - B[1:0] = 00
frame-frequency - - - FD[4:0] = 01110
load-data-pointe r - - DP[5:0] = 000000
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Product data sheet Rev. 1 — 13 November 2013 18 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
(1) Alternatively, it is possible to send the initialize command.
Fig 8. Recommended start-up sequence when using the internal oscillator
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PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 19 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
(1) Alternatively, it is possible to send the initialize command.
Fig 9. Recommended start-up sequence when using an external clock signal
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PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 20 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
8.3 Possible display configurations
The PCF8545 is a versatile peripheral device designed to interface between any
microcontroller to a wide variety of LCD se gment or dot m atrix displays (see Figure 10). It
can drive multiplexed LCD with 4, 6, or 8 backplanes and up to 44 segments.
The display configurations possible with the PCF8545 depend on the required number of
active backplane outputs. A selection of possible display configurations is given in
Table 22.
[1] 7 segment display has 8 elements including the decimal point.
[2] 14 segment display has 16 elements including decimal point and accent dot.
All of the display configurations in Table 22 can be implemented in the typical systems
shown in Figure 11 and Figure 12.
Fig 10. Example of displays suitable for PCF8545
Table 22. Selection of display configurations
Number of Digit s /Cha ra cte r s Dot matrix/
Elements
Backplanes Segments Icons 7 segment[1] 14 segment[2]
8 40 320 40 20 320
6 42 252 31 15 252
4 44 176 22 11 176
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PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 21 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
The host microcontroller maintains the two line I2C-bus or a three line SPI-bus
communication channel with the PCF8545. The appropriate biasing volt ages for the
multiplexed LCD waveforms a re generated internally. The only other connections required
to complete the system are the power supplies (VDD, VSS, VLCD) and the LCD panel
selected for the application.
The minimum recommended values for external capacitors on VDD and VLCD are 100 nF
respectively. Decoupling of VLCD helps to reduce display artifacts. The decoupling
capacitors should be placed close to the IC with short connections to the respective
supply pin and VSS.
8.4 LCD voltage selector
The LCD voltage selector coord ina te s th e mu ltiplexing of the LCD in accordance with the
selected LCD drive configuration. The operation of the voltage selector is controlled by the
set-bias-mode command (see Table 16) and the set-MUX-mode command (see
Table 15).
Fractional LCD biasing volt ages a re obt ained fr om an inte rnal volt age divider. The biasing
configurations that apply to the preferred modes of ope ration, together with the biasing
characteristics as functions of VLCD and the resu lting discriminatio n ratios (D), are given in
Table 23.
Fig 11. Typical system configuration for the I2C-bus
Fig 12. Typical system configuration for the SPI-bus
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PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 22 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
Discrimination is a term which is defined as the ratio of the on a nd off RMS volt age across
a segment. It can be thought of as a measurement of contrast.
[1] Determined from Equation 5.
[2] Determined from Equation 4.
[3] In these examples, the discrimination factor and hence the contrast ratios are smaller. The advantage of
these LCD drive modes is a reduction of the LCD voltage VLCD.
A practical value for VLCD is determined by equating Voff(RMS) with a defined LCD
threshold voltage (Vth(off)), typically when the LCD exhibits approximately 10 % contrast.
Bias is calculated by , where the values for a are
a = 1 for 12 bias
a = 2 for 13 bias
a = 3 for 14 bias
The RMS on-state voltage (Von(RMS)) for the LCD is calculated with Equation 3
(3)
where VLCD is the resultant voltage at the LCD segment and where the values for n are
n = 4 for 1:4 multiplex drive
n = 6 for 1:6 multiplex drive
n = 8 for 1:8 multiplex drive
The RMS off-state voltage (Voff(RMS)) for the LCD is calculated with Equation 4:
(4)
Discrimination is the ratio of Von(RMS) to Voff(RMS) and is determined from Equation 5:
Tabl e 23. Preferred LCD drive modes : summary of characteristics
LCD multiplex
drive mode Number of: LCD bias
configuration [1] VLCD[2]
Backplanes Levels
1:4 [3] 43
120.433 0.661 1.527 2.309Voff(RMS)
1:4 4 4 130.333 0.577 1.732 3.0Voff(RMS)
1:4 [3] 45
140.331 0.545 1.646 3.024Voff(RMS)
1:6 [3] 63
120.456 0.612 1.341 2.191Voff(RMS)
1:6 6 4 130.333 0.509 1.527 3.0Voff(RMS)
1:6 6 5 140.306 0.467 1.527 3.266Voff(RMS)
1:8 [3] 83
120.467 0.586 1.254 2.138Voff(RMS)
1:8 [3] 84
130.333 0.471 1.414 3.0Voff(RMS)
1:8 8 5 140.293 0.424 1.447 3.411Voff(RMS)
Voff RMS
VLCD
-----------------------
Von RMS
VLCD
----------------------
DVon RMS
Voff RMS
-----------------------
=
1
1a+
-------------
Von RMS a22a n++
n1a+
2
------------------------------
VLCD
=
Voff RMS a22an+
n1a+
2
------------------------------
VLCD
=
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Product data sheet Rev. 1 — 13 November 2013 23 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
(5)
VLCD is sometimes referred to as the LCD operating vo ltage.
8.4.1 Electro-optical performance
Suitable values for Von(RMS) and Voff(RMS) are dependent on the LCD liquid used. The
RMS voltage, at which a pixel gets switched on or off, determine the transmissibility of the
pixel.
For any given liquid, there are two threshold values defined. One point is at 10 % relative
transmission (at Vth(off)) an d th e oth e r at 90 % relative transm ission (at Vth(on)), see
Figure 13. For a good contrast performance, the following rules should be followed:
(6)
(7)
Von(RMS) and Voff(RMS) are properties of the display driver and are af fected by the selection
of a, n (see Equation 3 to Equation 5) and the VLCD voltage.
Vth(off) and Vth(on) are properties of the LCD liquid and can be provided by the module
manufacturer. Vth(off) is sometimes named Vth. Vth(on) is sometimes named saturation
voltage Vsat.
It is important to match the module properties to those of the driver in order to achie ve
optimum performance.
DVon RMS
Voff RMS
-----------------------a22a n++
a22an+
---------------------------==
Fig 13. Electro-optical characteristic: relative transmission curve of the liquid
Von RMS
Vth on
Voff RMS
Vth off
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PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 24 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
8.5 LCD drive mode waveforms
8.5.1 1:4 Multiplex drive mode
When four backplanes are provided in the LCD, the 1:4 multiplex drive mode applies, as
shown in Figure 14. This drawing is also showing the case of line inversion (see
Section 8.1.3.2).
Vstate1(t) = VSn(t) VBP0(t). Vstate2(t) = VSn(t) VBP1(t).
Von(RMS)(t) = 0.577VLCD. Voff(RMS)(t) = 0.333VLCD.
Fig 14. W aveforms for the 1:4 multiplex drive mode with 13 bias and line inversion
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PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 25 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
8.5.2 1:6 Multiplex drive mode
When six backplanes are provided in the LCD, the 1:6 multiplex drive mode applies. The
PCF8545 allows use of 13 bias or 14 bias in this mode as shown in Figure 15 and
Figure 16. These waveforms are drawn for the case of line inversion (see
Section 8.1.3.2).
Vstate1(t) = VSn(t) VBP0(t). Vstate2(t) = VSn +1 (t) VBP0(t). Von(RMS)(t) = 0.509VLCD. Voff(RMS)(t) = 0.333VLCD.
Fig 15. Wav eforms for 1:6 multiplex drive mode with bias 13 and line inversion
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PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 26 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
Vstate1(t) = VSn(t) VBP0(t). Vstate2(t) = VSn + 1(t) VBP0(t).
Von(RMS)(t) = 0.467VLCD. Voff(RMS)(t) = 0.306VLCD.
Fig 16. Wav eforms for 1:6 multiplex drive mode with bias 14 and line inversion
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PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 27 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
8.5.3 1:8 Multiplex drive mode
Vstate1(t) = VSn(t) VBP0(t). Vstate2(t) = VSn + 1(t) VBP0(t). Von(RMS)(t) = 0.424VLCD. Voff(RMS)(t) = 0.293VLCD.
Fig 17. Wav eforms for 1:8 multiplex drive mode with bias 14 and line inversion
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PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 28 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
Vstate1(t) = VSn(t) VBP0(t). Vstate2(t) = VSn + 1(t) VBP0(t). Von(RMS)(t) = 0.424VLCD. Voff(RMS)(t) = 0.293VLCD.
Fig 18. Wav eforms for 1:8 multiplex drive mode with bias 14 and frame inversion
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PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 29 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
8.6 Display register
The display register holds the display data while the corresponding multiplex signals are
generated.
8.7 Backplane outputs
The LCD drive section includes eight backplane outputs: BP0 to BP7. The backplane
output signals are generated based on the selected LCD multiplex drive mode.
In 1:8 multiplex drive mode: BP0 to BP7 must be connecte d directly to the LCD.
In 1:6 multiplex drive mode: BP0 to BP5 must be connecte d directly to the LCD.
In 1:4 multiplex drive mode: BP0 to BP3 must be connecte d directly to the LCD.
8.8 Segment outputs
The LCD drive section includes up to 44 segment outputs (S0 to S43) which must be
connected dir ec tly to the LC D. Th e segm e nt output signals are generated based on th e
multiplexed backplane signals and with data resident in the display register. When less
segment outputs are required, the unused segm ent outpu ts must be left open-cir cu it. T he
number of available segments depends on the multiplex drive mode selected.
8.9 Display RAM
The display RAM stores the LCD data. Depending on the multiplex drive mode, the
arrangemen t of th e RAM is chan ge d .
multiplex drive 1:8: RAM is 40 8 bit
multiplex drive 1:6: RAM is 42 6 bit
multiplex drive 1:4: RAM is 44 4 bit
Table 24. Backplan e and active segment combinations
Multiplex
drive mode Active BPs Active segments
1:8 BP0 to BP7 S0 to S39
1:6 BP0 to BP5 S0 to S41
1:4 BP0 to BP3 S0 to S43
PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 30 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
Logic 1 in the RAM bit map indicates the on-state (Von(RMS)) of the corresponding LCD
element; similarly, logic 0 indicates the off-state (Voff(RMS)). For more information on
Von(RMS) and Voff(RMS), see Section 8.4.
There is a one-to-one correspondence between
the bits in the RAM bitmap and the LCD elements,
the RAM columns and the se gm e nt outp u ts,
the RAM rows and the backplane outputs.
The display RAM bit map, Figure 19, sh ows row 0 to row 7 and column 0 to column 43 .
Row 0 to row 7 correspond with the backplane output s BP0 to BP7. Column 0 to column
43 correspond with the segment outputs S0 to S43. In multiplexed LCD applications, the
data of each row of the display RAM is time-multiplexed with the corresponding backplane
(row 0 with BP0, row 1 with BP1, and so on).
The display RAM bitmap shows the direct relationship between the display RAM column and the
segment outputs and between the bits in a RAM row and the backplane outputs.
Fig 19. Display RAM bitmap
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PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 31 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
When display dat a is transmitted to the PCF8545, the displa y bytes received are stored in
the display RAM in acco rd an ce with th e sele cted LCD multiplex drive mode. The data is
stored as it arrives and depending on the current multiplex drive mode, data is stored in
quadruples, sextuples or bytes.
8.9.1 Data pointer
The addressing mechanism for the display RAM is realized using the data poin ter. This
allows the loading of an individual display da t a byte, or a series of display dat a bytes, into
any location of the display RAM. The sequence commences with the initialization of the
data pointer by the load-data-pointer command (see Table 19).
Following this command, an arriving data byte is stored starting at the display RAM
address indica te d by the da ta pointer.
The data pointer is automatically incremented in ac cordance with the chosen LCD
multiplex drive mode configuration. That is, after each byte is stored, the contents of the
data pointer are incremen ted
by two (1:4 multiplex drive mode),
by one or two (1:6 multiplex drive mode),
by one (1:8 multiplex drive mode).
Multiplex drive 1:6 is a special case and is described later on.
When the address coun ter reaches the end of th e RAM, it stops incrementing af ter the last
byte is transmitted. Redundant bits of the last byte and subsequent bytes transmitted are
discarded until the pointer is r eset. To send new RAM data, the d ata poin ter must be reset.
If an I2C-bus or SPI-bus da t a access is term inated ea rly, then the st a te of the data pointer
is unknown. The data pointer must then be rewritten before further RAM accesses.
8.9.2 RAM filling in 1:4 multiplex drive mode
In the 1:4 multiplex drive mode the RAM is organized in four rows and 44 columns. The
eight transmitted dat a bits ar e placed in two successive display RAM columns of four rows
(see Figure 20). In order to fill the whole four RAM rows, 22 bytes need to be sent to the
PCF8545. After the last byte sent, the data pointer must be reset before the next RAM
content update. Additional data bytes sent and any data bits that spill over the RAM are
discarded.
PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 32 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
Depending on the start address of the data pointer, there is the possibility for a boundary
condition. This occurs when more data bits are sent than fit into the remaining RAM. The
additional data bits are discarded. See Figure 21.
8.9.3 RAM filling in 1:6 multiplex drive mode
In the 1:6 multiplex drive mode the RAM is organized in six rows and 42 columns. The
eight transmitted data bits are placed in such a way, that a column is filled up (see
Figure 22).
Fig 20. Disp lay RAM filling order in 1:4 multiplex drive mode
Fig 21. Boundary condition in 1:4 multiplex drive mode
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PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 33 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
The remaining bits are wrapped over into the next column. In order to fill the whole RAM,
31 and a half bytes need to be sent to the PCF8545. After the last byte sent, the data
pointer must be reset before the next RAM content update. Additional dat a bytes sent and
any data bit s that spill over the RAM are discarded. Depending on the st art address of the
data pointer, there are th re e possib l e bound a ry co nd itio ns . See Figure 23.
Fig 22. Disp lay RAM filling order in 1:6 multiplex drive mode
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PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 34 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
8.9.4 RAM filling in 1:8 multiplex drive mode
In the 1:8 multiplex drive mode the RAM is organized in eight rows and 40 columns. The
eight transmitted data bits are placed into eight rows of one display RAM column (see
Figure 24). In order to fill the whole RAM, 40 bytes need to be sent to the PCF8545. After
the last byte sent, the data pointer must be reset before the next RAM content update.
Additional data bytes sent are discarded.
Fig 23. Boundary condition in 1:6 multiplex drive mode
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PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 35 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
There are no boundary conditions in 1:8 multiplex drive mode.
Fig 24. Disp lay RAM filling order in 1:8 multiplex drive mode
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PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 36 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
9. Bus interfaces
9.1 Control byte and register selection
After initiating the communication over the bus and sending the slave address (I2C-bus,
see Section 9.2) or subaddress (SPI-bus, see Section 9.3), a control byte follows. The
purpose of this byte is to indicate both, the content for the following data bytes (RAM, or
command) and to indicate that more control bytes will follow.
Typical sequences could be:
Slave address/subaddr ess - control byte - command byte - command b yte - command
byte - end
Slave address/subaddress - control byte - RAM byte - RAM byte - RAM byte - end
Slave address/subaddress - control byte - command byte - control byte - RAM byte -
end
In this way, it is possible to send a mixture of RAM and command data in one access or
alternatively, to send just one type of data in one access.
Tabl e 25. Control byte description
Bit Symbol Value Description
7CO continue bi t
0 l ast control byte
1 control bytes continue
6 to 5 RS[1:0] register selection
00 command re gister
01 RAM data
10, 11 unused
4 to 0 - - unused
Fig 25. Control byte format
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PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 37 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
9.2 I2C-bus interface
The I2C-bus is for bidire ctional, two-line communication between dif ferent ICs or modules.
The two lines are a Serial DAt a line (SDA) and a Serial CLock line (SCL). Both lines must
be connected to a positive supply via a pull-up resistor when connected to the output
stages of a device. Data transfer may be initiated only when the bus is not busy.
9.2.1 Bit transfer
One data bi t is transferred durin g each clock pulse . The data o n the SDA line must remain
stable du ring the HIGH period of the clock pu lse as ch anges in the data line at this time is
interpreted as a control signal (see Figure 26).
9.2.2 START and STOP conditions
Both data and clock lines remain HIGH when the bus is not busy.
A HIGH-to-LOW change of the data line, while the clock is HIGH, is defined as the START
condition (S).
A LOW-to-HIGH change of the data line, while the clock is HIGH, is defined as the STOP
condition (P).
The START and STOP conditions are shown in Figure 27.
9.2.3 System configuration
A device generating a message is a transmitter, a device receiving a message is the
receiver. The device that controls the message is the master and th e devices which are
controlled by the master are the slaves. The system configuration is shown in Figure 28.
Fig 26. Bit transfer
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Fig 27. Definition of START and STOP condition s
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PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 38 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
9.2.4 Acknowledge
The number of data bytes tran sf er re d be tween the START and STOP conditions from
transmitter to receiver is unlimited. Each byte of 8 bits is followed by an acknowledge
cycle.
A slave receiver which is addressed must generate an ackn owledge after the
reception of each byte.
Also a master receiver must generate an acknowledge after the reception of each
byte that has been clocked out of the slave transmitter.
The device that acknowledges must pull-down the SDA line during the acknowledge
clock pulse, so that the SDA line is stable LOW during the HIGH period of the
acknowledge related clock pulse (set-up and hold times must be considered).
A master receiver must signal an end of data to the transmitter by not generating an
acknowledge on the last byte that has been clocked out of the slave. In this event, the
transmitter mus t leave the data line HIGH to enable the master to generate a STOP
condition.
Acknowledgement on the I2C-bus is shown in Figure 29.
9.2.5 I2C-bus controller
The PCF8545 acts as an I2C-bus slave receiver. It does not initiate I2C-bus transfers or
transmit data to an I2C-bus master receiver. Device selection depends on the I2C-bus
slave address.
Fig 28. System configuration
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PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 39 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
9.2.6 Input filters
To enhance noise immunity in electrically adverse environments, RC low-pass filters are
provided on the SDA and SCL lines.
9.2.7 I2C-bus slave address
Device selection depends on the I2C-bus slave address. Two different I2C-bus slave
addresses can be used to address the PCF8545 (see Table 26).
The least significant bit of the slave address byte is bit R/W (see Table 27).
Bit 1 of the slave address is defined by connecting the input A0 to either VSS (logic 0) or
VDD (logic 1). Therefore, two instances of PCF8545 can be distinguished on the same
I2C-bus.
9.2.8 I2C-bus protocol
The I2C-bus protocol is shown in Figure 30. The sequence is initiated with a START
condition (S) from the I2C-bus master which is followed by one of the two PCF8545 slave
addresses available. All PCF8545 with the corresponding A0 level acknowledge in
parallel to the slave address. But any PCF8545 with the alterna tive A0 level ignore the
whole I2C-bus transfer.
After acknowledgement, a control byte follows (see Section 9.1 on page 36).
The display bytes are stored in the display RA M at the address specified b y the RAM dat a
pointer.
The acknowledgement af ter each byte is ma de only by the addressed PCF854 5. After the
last data byte, the I2C-bus master issues a STOP condition (P). Alternatively a START
may be issued to RESTART an I2C-bus ac ces s.
Table 26. I2C slave address byte
Slave address
Bit 7 6 5 4 3 2 1 0
MSB LSB
011100A0R/W
Table 27. R/W-bit description
R/W Description
0 write data
1 read data
PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 40 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
9.2.8.1 Statu s rea d out
Status read out for I2C-bus operation only. This command initiates the read- out of a fixed
value plus the slave address bit A0 from the PCF8545. The read-out function allows the
I2C master to confirm the existence of the device on the I2C-bus.
If a readout is made, the R/W bit must be logic 1 and then the next data byte following is
provided by the PCF8545 as shown in Figure 31.
In the unlikely case that the chip has entered the internal test mode, detection of this state
is possible by using the modified status read-out detailed in Table 29. The read out value
is modified to indicate that the chip has en te re d an inte rn a l test mo d e.
Fig 30. I2C-bu s protocol write mode
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Table 28. Status read out value
Bit Symbol Value Description
7 to 1 - 0101010 fixed value
0 A0 0 read back value is 01010100
1 read back value is 01010101
(1) From PCF8545.
Fig 31. I2C-bus protocol read mode
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PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 41 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
EMC detection: The PCF8545 is ruggedized against EMC susceptibility; however it is not
possible to cover all cases. To detect if a severe EMC event has occurred, it is possible to
check the responsiveness of the devic e by re ad in g its register.
Table 29. Modified status read out value
Bit Symbol Value Description
7 to 1 - 1111000 fixed value
0 A0 0 read back value is 1111 0000
1 read back value is 1111 0001
PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 42 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
9.3 SPI-bus interface
Data tr ansfer to the de vice is made via a 3 line SPI-b us (see Table 30). There is no output
data line. The SPI-bus is initialized whenever the chip enable line pin CE is inactive.
[1] The chip enable must not be wired permanently LOW.
9.3.1 Data transmission
The chip enable signal is used to identify the transmitted dat a. Each data transfer is a byte
with the Most Significant Bit (MSB) sent first.
The transmission is controlled by the active LOW chip enable signal CE. The first byte
transmitted is the subaddress byte.
The subaddress byte opens the communication with a read/write bit and a subaddress.
The subaddress is used to identify multiple devices on one SPI-bus.
After the subaddress byte, a control byte follows (see Section 9.1 on page 36).
Table 30. Serial interface
Symbol Function Description
CE chip enable input[1]; active LOW when HIGH, the interface is reset
SCL serial clock input input may be higher than VDD
SDI serial data input i nput may be high er than VDD; input data is
sampled on the rising edge of SCL
Fig 32. Data transfer overview
Tabl e 31. Subaddress byte definition
Bit Symbol Value Description
7R/W data read or write selection
0 write data
1 read data
6 to 5 SA[1:0] 01 subaddress; other codes cause the device to
ignore data transfer
4 to 0 - unused
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PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 43 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
Data transfers are terminated by de-asserting CE (set CE to logic 1).
Fig 33. SPI-bus write example
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In this example, the bias system is set to 13. The transfer is terminated by CE returning to logic 1. After the last bit is
transmitted, the state of the SDI line is not important.
Fig 34. SPI-bus example
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PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 44 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
10. Internal circuitry
11. Safety notes
Fig 35. Device protection diagram for PCF8545A
Fig 36. Device protection diagram for PCF8545B
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CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling
electrostatic sensitive devices.
Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or
equivalent standards.
CAUTION
Static voltages across the liquid crystal display can build up when the LCD supply voltage
(VLCD) is on while the IC supply voltage (VDD) is off, or vice versa. This may cause unwanted
display artifacts. To avoid such artifacts, VLCD and VDD must be applied or removed together.
PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 45 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
12. Limiting values
[1] Pass level; Human Body Model (HBM), according to Ref. 6 “ JESD22-A114.
[2] Pass level; Charge Device Model (CDM), according to Ref. 7 “JESD22-C101.
[3] Pass level; latch-up testing according to Ref. 8 “JESD78 at maximum ambient temperature (Tamb(max)).
[4] According to the store and transport requirements (see Ref. 12 “UM10569) the devices have to be stored at a temperature of +8 C to
+45 C and a humidity of 25 % to 75 %.
Table 32. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VDD supply voltage 0.5 +6.5 V
IDD supply current 50 +50 mA
VLCD LCD supply voltage 0.5 +6.5 V
IDD(LCD) LCD supply current 50 +50 mA
VIinput voltage PCF8545ATT
on pins SDA,
OSCCLK, SCL, A0,
RESET
0.5 +6.5 V
PCF8545BTT
on pins CE,
OSCCLK, SCL,
SDI, RESET
0.5 +6.5 V
IIinput current 10 +10 mA
VOoutput voltage on pins S0 to S39,
BP0 to BP7 0.5 +6.5 V
on pin SDA 0.5 +6.5 V
IOoutput current 10 +10 mA
ISS ground supply current 50 +50 mA
Ptot total power dissipation - 400 mW
P/out power dissipation per output - 100 mW
VESD electrostatic discharge voltage HBM [1] -3500 V
CDM [2] -1250 V
Ilu latch-up current [3] -200mA
Tstg storage temperature [4] 65 +150 C
Tamb ambient temperature operatin g device 40 +85 C
PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 46 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
13. Static characteristics
Table 33. Static characteristics
VDD = 1.8 V to 5.5 V; VSS = 0 V; VLCD = 2.5 V to 5.5 V; Tamb =
40
C to +85
C; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Supplies
VDD supply voltage 1.8 - 5.5 V
VLCD LCD supply voltage VLCD VDD 2.5- 5.5V
IDD(pd) power-down mode su pply current [1] -0.52A
IDD supply current see Figure 37
external 9.6 kHz clock [2] -1025A
internal oscillator [2] -3060A
IDD(LCD) LCD supply current power-down , see
Figure 38 [1][3] -715A
display active, see
Figure 39 [4] -55140A
Logic
VIinput voltage VSS 0.5 - VDD + 0.5 V
VIL LOW-level input voltage on pins OSCCLK,
A0 and RESET - - 0.3VDD V
VIH HIGH-level input voltage on pins OSCCLK,
A0 and RESET 0.7VDD --V
VOoutput voltage 0.5 - VDD + 0.5 V
VOH HIGH-level output voltage driving load of 50 A
on pins OSCCLK 0.8VDD --V
VOL LOW-level output voltage d riving load of 50 A
on pins OSCCLK - - 0.2VDD V
IOH HIGH-level output current output source current;
VOH =V
DD 0.4 V
on pin OSCC LK
VDD = 1.8 V 0.7 1.6 - mA
VDD 3.3 V 1.5 4.0 - mA
IOL LOW-level output current output sink current;
VOL =0.4V
on pin OSCC LK
VDD =1.8V 3 4 - mA
VDD 3.3 V 5 10 - mA
ILleakage current Vi=V
DD or VSS; on
pin OSCCLK 1- +1A
PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 47 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
[1] Power-down mode is enabled; I2C-bus or SPI-bus inactive.
[2] 1:8 multiplex drive mode; 14 bias; display enabled; LCD outputs are open circuit; RAM is all written with logic 1; inputs at VSS or VDD;
default display prescale factor; I2C-bus or SPI-bus inactive.
[3] Strongly linked to VLCD voltage. See Figure 38.
[4] 1:8 multiplex drive mode; 14 bias; display enabled; LCD outputs are open circuit; RAM is all written with logic 1; default display prescale
factor.
[5] The I2C-bus interface of PCF8545 is 5 V tolerant.
[6] Variation between any two backplanes on a given voltage level; static measured.
[7] Variation between any two segments on a given voltage level; static measured.
[8] Outputs measured one at a time.
I2C-bus[5]
On pins SCL and SDA
VIinput voltage VSS 0.5 - 5.5 V
VIL LOW-level input voltage - - 0.3VDD V
VIH HIGH-level input voltage 0.7VDD --V
VOoutput voltage 0.5 - +5.5 V
ILleakage current VI=V
DD or VSS 1- +1A
On pin SDA
IOL LOW-level output current o utput sink current
VDD =1.8V 3 5.5 - mA
VDD =3.3V 5 9 - mA
SPI-bus
VIinput voltage on pin SCL VSS 0.5 - 5.5 V
on pins CE and SDI VSS 0.5 - VDD + 0.5 V
On pins SCL, CE and SDI
VIL LOW-level input voltage - - 0.3VDD V
VIH HIGH-level input voltage 0.7VDD --V
ILleakage current VI=V
DD or VSS 1- +1A
LCD outputs
VOoutput voltage variation on pins BP0 to BP7 [6] -2.5+10mV
on pins S0 to S43 [7] -2.5+10mV
ROoutput resistance VLCD = 5.5 V;
on pins BP0 to BP7 [8] -0.95.0k
VLCD = 5.5 V;
on pins S0 to S43 [8] -1.56.0k
Table 33. Static characteristics …continued
VDD = 1.8 V to 5.5 V; VSS = 0 V; VLCD = 2.5 V to 5.5 V; Tamb =
40
C to +85
C; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 48 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
1:8 multiplex drive mode; 14 bias; internal oscillator; display enabled; LCD outputs are open circuit;
RAM is all written with logic 1; inputs at VSS or VDD; default display prescale factor; I2C-bus or
SPI-bus inactive. Typical is defined at VDD = 3.3 V, 25 C.
Fig 37. Typical IDD with respect to temperature
Power-down mode is enabled; I2C-bus or SPI-bus inactive. Typical is defined at 25 C.
Fig 38. Typical IDD(LCD) in power-down mode with respect to temperature
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PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 49 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
1:8 multiplex drive mode; 14 bias; display enabled; LCD outputs are open circuit; RAM is all written
with logic 1; default display prescale factor. Typical is defined at 25 C.
Fig 39. Typical IDD(LCD) when display is active with respect to temper ature
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PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 50 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
14. Dynamic characteristics
[1] Frequency present on OSCCLK with default display frequency division factor.
Table 34. Dynamic characteristics
VDD = 1.8 V to 5.5 V; VSS = 0 V; VLCD = 2.5 V to 5.5 V; Tamb =
40
C to +85
C; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
fclk clock frequency output on pin
OSCCLK; VDD =3.3V [1] 7800 9600 11040 Hz
fclk(ext) external clock frequency EFR = 0 - - 250000 Hz
t(RESET_N) RESET_N pulse width LOW time 400 - - ns
External clock so urce used on pin OSCCLK
tclk(H) clock HIGH time 33 - - s
tclk(L) clock LOW time 33 - - s
(1) 40 C.
(2) 25 C.
(3) 85 C.
Fig 40. Typical clock frequency with respect to VDD and tempera tur e
External clock source used on pin OSCCLK.
Fig 41. Driver timing waveforms
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PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 51 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
[1] The minimum SCL clock frequency is limited by the bus time-out feature, which resets the serial bus interface if either the SDA or SCL
is held LOW for a minimum of 25 ms. The bus time-out feature must be disabled for DC operation.
[2] tVD;ACK = time for acknowledgement signal from SCL LOW to SDA output LOW.
[3] tVD;DAT = minimum time for valid SDA output following SCL LOW.
[4] Input filters on the SDA and SCL inputs suppress noise spikes of less than 50 ns.
Fig 42. RESET timing
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Table 35. Timing characteristics: I2C-bus
VDD = 1.8 V to 5.5 V; VSS = 0 V; Tamb =
40
C to +85
C; unless otherwise specified. All timing values are valid within the
operating supply voltage and temperature range and referenced to VIL and VIH with an input voltage swing of VSS to VDD.
Timing waveforms see Figure 43.
Symbol Parameter Conditions Min Typ Max Unit
Pin SCL
fSCL SCL clock frequency [1] --400kHz
tLOW LOW period of the SCL clock 1.3 - - s
tHIGH HIGH period of the SCL clock 0.6 - - s
Pin SDA
tSU;DAT data set-up time 100 - - ns
tHD;DAT data hold time 0 - - ns
Pins SCL and SDA
tBUF bus free time between a STOP
and START condition 1.3 - - s
tSU;STO set-up time for STOP condition 0.6 - - s
tHD;STA hold time (repeated) START
condition 0.6 - - s
tSU;STA set-up time for a repeated START
condition 0.6 - - s
trrise time of both SDA and SCL
signals fSCL = 400 kHz - - 0.3 s
fSCL = 100 kHz - - 1.0 s
tffall time of both SDA and SCL
signals --0.3s
tVD;ACK data valid acknowledge time [2] 0.6 - - s
tVD;DAT data valid time [3] 0.6 - - s
Cbcapacitive load for each bus line - - 400 pF
tSP pulse width of spikes that must be
suppressed by the input filter [4] --50ns
PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 52 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
Fig 43. I2C-bus timing waveforms
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Table 36. Timing characteristics: SPI-bus
VDD = 1.8 V to 5.5 V; VSS =0V; T
amb =
40
C to +85
C. All timing values are valid within the operating supply voltage and
temperature range and referenced to VIL and VIH with an input voltage swing of VSS to VDD. Timing waveforms see Figure 44.
Symbol Parameter Conditions VDD < 2.7 V VDD 2.7 V Unit
Min Max Min Max
fclk(SCL) SCL clock frequency - 2 - 5 MHz
tSCL SCL time 500 - 200 - ns
tclk(H) clock HIGH time 200 - 80 - ns
tclk(L) clock LOW time 200 - 80 - ns
trrise time for SCL signal - 100 - 100 ns
tffall time for SCL signal - 100 - 100 ns
tsu(CE_N) CE_N set-up time 150 - 80 - ns
th(CE_N) CE_N hold time 0 - 0 - ns
trec(CE_N) CE_N recovery time 100 - 100 - ns
tsu set-up time set-up time for
SDI data 10-5-ns
thhold time hold time for SDI
data 25 - 10 - ns
PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 53 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
Fig 44. SPI-bus timin g
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PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 54 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
15. Package outline
Fig 45. Package outline SOT364-1 (TSSOP56)
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PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 55 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
16. Handling information
All input and output pins are protected against ElectroStatic Discharge (ESD) under
normal handling. When handling Metal-Oxide Semiconductor (MOS) devices ensure that
all normal precautions are taken as described in JESD625-A, IEC61340-5 or equivalent
standards.
PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 56 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
17. Packing information
17.1 Tape and reel information
Fig 46. Tape and reel details for PCF8545ATT and PCF8545BTT
Table 37. Carrier tape dimensions of PCF8545ATT and PCF8545 BTT
Symbol Description Value Unit
Compartments
A0 pocket width in x direction 8.65 to 8.9 mm
B0 pocket width in y direction 14.4 to 15.8 mm
K0 pocket depth 1.5 to 1.8 mm
P1 pocket hole pitch 12 mm
D1 pocket hole diameter 1.5 to 2.05 mm
Overall dimensions
W tape width 24 mm
D0 sprocket hole diameter 1.5 to 1.55 mm
P0 sprocket hole pitch 4 mm
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PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 57 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
18. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
18.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
18.2 Wave and reflow soldering
W ave soldering is a joinin g technology in which the joint s are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for th e following:
Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
18.3 Wave soldering
Key characteristics in wave soldering are:
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave pa rameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 58 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
18.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free ve rsus SnPb soldering; note th at a lead-free reflow process usua lly leads to
higher minimum peak temperatures (see Figure 47) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enoug h for the solder to make reliable solder joint s (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in acco rdance with
Table 38 and 39
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 47.
Table 38. SnPb eutectic p rocess (from J-STD-020D)
Package thickness (mm) Package reflow temperature (C)
Volume (mm3)
< 350 350
< 2.5 235 220
2.5 220 220
Table 39. Lead -free process (from J-STD-020D)
Package thickness (mm) Package reflow temperature (C)
Volume (mm3)
< 350 350 to 2000 > 2000
< 1.6 260 260 260
1.6 to 2.5 260 250 245
> 2.5 250 245 245
PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 59 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
MSL: Moisture Sensitivity Level
Fig 47. Temperature profiles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 60 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
19. Footprint information for reflow soldering
Fig 48. Footprint information for reflow soldering of SOT364-1 (TSSOP56) package
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PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 61 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
20. Appendix
20.1 LCD segment driver selection
Table 40 . Selection of LCD segment drivers
Type name Number of el em ents at MUX VDD (V) VLCD (V) ffr (Hz) VLCD (V)
charge
pump
VLCD (V)
temperature
compensat.
Tamb (C) Interface Package AEC-
Q100
1:1 1:2 1:3 1:4 1:6 1:8 1:9
PCA8561AHN[5] 18365472---1.8to5.51.8to5.532 to 256
[1] NN 40 to 105 I2CHVQFN32Y
PCA8561BHN[5] 18365472---1.8to5.51.8to5.532 to 256
[1] NN 40 to 105 SPI HVQFN32 Y
PCF8566TS 24487296---2.5to62.5to669 N N 40 to 85 I2C VSO40 N
PCF85162T 32 64 96 128 ---1.8to5.52.5to6.582 N N 40 to 85 I2CTSSOP48N
PCA85162T 326496128---1.8to5.52.5to8110 N N 40 to 95 I2CTSSOP48Y
PCA85262ATT326496128---1.8to5.52.5to8200 N N 40 to 105 I2CTSSOP48Y
PCF8551ATT[5] 3672108144---1.8to5.51.8to5.532 to 128
[1] NN 40 to 85 I2CTSSOP48N
PCF8551BTT[5] 3672108144---1.8to5.51.8to5.532 to 128
[1] NN 40 to 85 SPI TSSOP48 N
PCA8551ATT[5] 3672108144---1.8to5.51.8to5.532 to 256
[1] NN 40 to 105 I2CTSSOP48Y
PCA8551BTT[5] 3672108144---1.8to5.51.8to5.532 to 256
[1] NN 40 to 105 SPI TSSOP48 Y
PCF85176T 40 80 120 160 ---1.8to5.52.5to6.582 N N 40 to 85 I2CTSSOP56N
PCA85176T 4080120160---1.8to5.52.5to8110 N N 40 to 95 I2CTSSOP56Y
PCA85276ATT4080120160---1.8to5.52.5to8200 N N 40 to 105 I2CTSSOP56Y
PCF85176H 40 80 120 160 ---1.8to5.52.5to6.582 N N 40 to 85 I2CTQFP64N
PCA85176H 4080120160---1.8to5.52.5to882 N N 40 to 95 I2CTQFP64Y
PCF8553ATT[5] 4080120160---1.8to5.51.8to5.532 to 128
[1] NN 40 to 85 I2CTSSOP56N
PCF8553BTT[5] 4080120160---1.8to5.51.8to5.532 to 128
[1] NN 40 to 85 SPI TSSOP56 N
PCA8553ATT[5] 4080120160---1.8to5.51.8to5.532 to 256
[1] NN 40 to 105 I2CTSSOP56Y
PCA8553BTT[5] 4080120160---1.8to5.51.8to5.532 to 256
[1] NN 40 to 105 SPI TSSOP56 Y
PCA8546ATT[5] ---176---1.8to5.52.5to960to300
[1] NN 40 to 95 I2CTSSOP56Y
PCA8546BTT[5] ---176---1.8to5.52.5to960to300
[1] NN 40 to 95 SPI TSSOP56 Y
PCA8547AHT[5] 4488-176---1.8to5.52.5to960to300
[1] YY
[3] 40 to 95 I2CTQFP64Y
PCA8547BHT[5] 4488-176---1.8to5.52.5to960to300
[1] YY
[3] 40 to 95 SPI TQFP64 Y
PCF85134HL 60 120 180 240 ---1.8to5.52.5to6.582 N N 40 to 85 I2CLQFP80N
PCA85134H 60120180240---1.8to5.52.5to882 N N 40 to 95 I2CLQFP80Y
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PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 62 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
[1] Can be selected by command.
[2] Can be selected by pin configuration.
PCA8543AHL 60120-240---2.5to5.52.5to960to300
[1] YY 40 to 105 I2CLQFP80Y
PCF8545ATT[5] - - - 176 252 320 - 1.8to5.5 2.5to5.5 60to300
[1] NN 40 to 85 I2CTSSOP56N
PCF8545BTT[5] - - - 176 252 320 - 1.8to5.5 2.5to5.5 60to300
[1] NN 40 to 85 SPI TSSOP56 N
PCF8536AT[4] - - - 176 252 320 - 1.8to5.5 2.5to9 60to300
[1] NN 40 to 85 I2CTSSOP56N
PCF8536BT[4] - - - 176 252 320 - 1.8to5.5 2.5to9 60to300
[1] NN 40 to 85 SPI TSSOP56 N
PCA8536AT[4] - - - 176 252 320 - 1.8to5.5 2.5to9 60to300
[1] NN 40 to 95 I2CTSSOP56Y
PCA8536BT[4] - - - 176 252 320 - 1.8to5.5 2.5to9 60to300
[1] NN 40 to 95 SPI TSSOP56 Y
PCF8537AH 44 88 - 176 276 352 - 1.8 to 5.5 2.5 to 9 60 to 300[1] YY
[3] 40 to 85 I2CTQFP64N
PCF8537BH 44 88 - 176 276 352 - 1.8 to 5.5 2.5 to 9 60 to 300[1] YY
[3] 40 to 85 SPI TQFP64 N
PCA8537AH 44 88 - 176 276 352 - 1.8 to 5.5 2.5 to 9 60 to 300[1] YY
[3] 40 to 95 I2CTQFP64Y
PCA8537BH 44 88 - 176 276 352 - 1.8 to 5.5 2.5 to 9 60 to 300[1] YY
[3] 40 to 95 SPI TQFP64 Y
PCA9620H 60 120 - 240 320 480 - 2.5 to 5.5 2.5 to 9 60 to 300[1] YY
[3] 40 to 105 I2CLQFP80Y
PCA9620U 60 120 - 240 320 480 - 2.5 to 5.5 2.5 to 9 60 to 300[1] YY
[3] 40 to 105 I2C bare die Y
PCF8552DUG[5] 3672108144---1.8to5.51.8to5.532 to 128
[1] NN 40 to 85 I2C, SPI bare die N
PCA8552DUG[5] 3672108144---1.8to5.51.8to5.532 to 256
[1] NN 40 to 105 I2C, SPI bare die Y
PCF8576DU 4080120160---1.8to5.52.5to6.577 N N 40 to 85 I2C bare die N
PCF8576EUG 4080120160---1.8to5.52.5to6.577 N N 40 to 85 I2C bare die N
PCA8576FUG[5] 4080120160---1.8to5.52.5to8200 N N 40 to 105 I2C bare die Y
PCF85133U 80 160 240 320 ---1.8to5.52.5to6.582, 110
[2] NN 40 to 85 I2C bare die N
PCA85133U 80160240320---1.8to5.52.5to882, 110
[2] NN 40 to 95 I2C bare die Y
PCA85233U 80160240320---1.8to5.52.5to8150, 220[2] NN 40 to 105 I2C bare die Y
PCA8530DUG[5] 102204-408---2.5to5.54to1245to300
[1] YY
[3] 40 to 105 I2C, SPI bare die Y
PCF85132U 160 320 480 640 ---1.8to5.51.8to860to90
[1] NN 40 to 85 I2C bare die N
PCA85132U 160320480640---1.8to5.51.8to860to90
[1] NN 40 to 95 I2C bare die Y
PCA85232U 160320480640---1.8to5.51.8to8117to176
[1] NN 40 to 95 I2C bar e die Y
PCF8538UG[5] 102 204 - 408 612 816 918 2.5 to 5.5 4 to 12 45 to 300[1] YY
[3] 40 to 85 I2C, SPI[2] bare die N
PCA8538UG 102 204 - 408 612 816 918 2.5 to 5.5 4 to 12 45 to 300[1] YY
[3] 40 to 105 I2C, SPI[2] bare die Y
Table 40 . Selection of LCD segment drivers …co ntinue d
Type name Number of el em ents at MUX VDD (V) VLCD (V) ffr (Hz) VLCD (V)
charge
pump
VLCD (V)
temperature
compensat.
Tamb (C) Interface Package AEC-
Q100
1:1 1:2 1:3 1:4 1:6 1:8 1:9
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PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 63 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
[3] Extra feature: Temperature sensor.
[4] Extra feature: 6 PWM channels.
[5] In development.
PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 64 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
21. Abbreviations
Table 41. Abbre viations
Acronym Description
CDM Charged-Device Model
CMOS Complementary Metal-Oxide Semiconductor
DC Direct Current
EMC ElectroMagnetic Compatibility
EPROM Erasable Programmable Read-Only Memory
ESD ElectroStatic Discharge
HBM Human Body Model
I2C Inter-Integrated Circuit bus
IC Integrated Circuit
LCD Liquid Crystal Display
LSB Least Significant Bit
MSB Most Significant Bit
MSL Moisture Sensitivity Level
MUX Multiplexer
OTP One Time Programmable
PCB Printed-Circuit Board
POR Power-On Reset
RC Resistance-Capacitance
RAM Random Access Memory
RGB Re d Green Blue
RMS Root Mean Squ a r e
SCL Serial CLock line
SDA Serial DAta line
SPI Serial Peripheral Interface
PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 65 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
22. References
[1] AN10365 — Surface mount reflow soldering description
[2] AN1 1267 — EMC and system level ESD design guidelines for LCD drivers
[3] IEC 60 13 4 Rating syst ems for electronic tubes and valves and analogous
semiconductor devices
[4] IEC 61340-5 — Protection of electronic devices from electrostatic phenomena
[5] IPC/JEDEC J-STD-020D — Moisture/R eflow Sensitivity Classific ation for
Nonhermetic Solid State Surface-Mount Devices
[6] JESD 22 -A114 — Electrostatic Discharge (ESD) Sensitivity Testing Human Body
Model (HBM)
[7] JESD 22 -C101 — Field-Induced Charged-Device Model Test Method for
Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components
[8] JESD78IC Latch-Up Test
[9] JESD625-A — Requirements for Handling Electrostatic-Discharge-Sensitive
(ESDS) Devices
[10] SNV-FA-01-02 — Marking Formats Integrated Circuits
[11] UM10204 — I2C-bus specification and user manual
[12] UM10569 — Store and transport requirements
PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 66 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
23. Revision history
Table 42. Revision history
Document ID Release date Data sheet status Change notice Supersedes
PCF8545 v.1 20131113 Product data sheet - -
PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 67 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
24. Legal information
24.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
24.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liab ility for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall pre vail.
Product specificatio n — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to off er functions and qualities beyond those described in the
Product data sheet.
24.3 Disclaimers
Limited warr a nty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Se miconductors takes no
responsibility for the content in this document if provided by an inf ormation
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect , incidental,
punitive, special or consequ ential damages (including - wit hout limitatio n - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
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contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconduct ors’ aggregate and cumulati ve liability toward s
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semicondu ctors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descripti ons, at any time and without
notice. This document supersedes and replaces all informa tion supplied prior
to the publication hereof .
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support , life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in perso nal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconducto rs products in such equipment or
applications and ther efore such inclu sion and/or use is at the cu stomer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty tha t such application s will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and ope ration of their applications
and products using NXP Semiconductors product s, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suit able and fit for the custome r’s applications and
products planned, as well as fo r the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associate d with their
applications and products.
NXP Semiconductors does not accept any liabil i ty related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for th e customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by cu stomer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress rating s only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanent ly and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individua l agreement. In case an individual
agreement is concluded only the ter ms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing i n this document may be interpreted or
construed as an of fer t o sell product s that is open for accept ance or t he grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specificati on for product development.
Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specificat ion.
Product [short] dat a sheet Production This document contains the product specification.
PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 68 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors prod uct is automotive qualified,
the product is not suitable for automotive use. It i s neit her qua lified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automot ive specifications and standard s, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive ap plications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconduct ors for an y
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
24.4 Trademarks
Notice: All referenced b rands, produc t names, service names and trademarks
are the property of their respect i ve ow ners.
I2C-bus — logo is a trademark of NXP B.V.
25. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 69 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
26. Tables
Table 1. Ordering information . . . . . . . . . . . . . . . . . . . . .2
Table 2. Ordering options. . . . . . . . . . . . . . . . . . . . . . . . .2
Table 3. Marking codes . . . . . . . . . . . . . . . . . . . . . . . . . .2
Table 4. Pin description of PCF8545ATT and
PCF8545BTT . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Table 5. Commands of PCF8545 . . . . . . . . . . . . . . . . . .7
Table 6. Initialize - initialize command bi t description . . .7
Table 7. OTP-refresh - OTP-refresh command bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Table 8. Mode-settings - mode settings command
bit description . . . . . . . . . . . . . . . . . . . . . . . . . .8
Table 9. Effect of the power-down bit (PD). . . . . . . . . . .10
Table 10. Oscilla tor-control - oscillator control
command bit description . . . . . . . . . . . . . . . . .11
Table 11. Valid combin ations of bits OSC, EFR,
and COE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Table 12. Typical use of bits OSC, EFR, and COE . . . . .12
Table 13. OSCCLK pin state depending on configuration13
Table 14. LCD frame frequencies. . . . . . . . . . . . . . . . . . .13
Table 15. Set-MUX-mo de - set multipl ex drive mode
command bit description . . . . . . . . . . . . . . . . .14
Table 16. Set-bias-mode - set bias mode command
bit description . . . . . . . . . . . . . . . . . . . . . . . . .14
Table 17. Fr ame-frequency - frame frequency and output
clock frequency command bit description . . . .14
Table 18. F r ame frequency prescaler values for 230 kHz
clock operation . . . . . . . . . . . . . . . . . . . . . . . .15
Table 19. Load-data-pointer - load data pointer
command bit description. . . . . . . . . . . . . . . . . .16
Table 20. Write-RAM-data - write RAM data
command bit description[1] . . . . . . . . . . . . . . . .16
Table 21. Reset state . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
Table 22. Selection of display configurations . . . . . . . . . .20
Table 23. Preferred LCD drive modes: summary of
characteristics. . . . . . . . . . . . . . . . . . . . . . . . . .22
Table 24. Backpl ane and active segment combinations. .29
Table 25. Control byte description . . . . . . . . . . . . . . . . . .36
Table 26. I 2C slave address byte . . . . . . . . . . . . . . . . . . .39
Table 27. R/W-bit description . . . . . . . . . . . . . . . . . . . . . .39
Table 28. Status read out value . . . . . . . . . . . . . . . . . . . .40
Table 29. Modified status read out value . . . . . . . . . . . . .41
Table 30. Serial interface . . . . . . . . . . . . . . . . . . . . . . . . .42
Table 31. Subaddress byte definition . . . . . . . . . . . . . . . .42
Table 32. Limiting values . . . . . . . . . . . . . . . . . . . . . . . . .45
Table 33. Static characteristics . . . . . . . . . . . . . . . . . . . .46
Table 34. Dynamic characteristics . . . . . . . . . . . . . . . . . .50
Table 35. Timing characteristics: I2C-bus . . . . . . . . . . . .51
Table 36. Timing characteristics: SPI-bus . . . . . . . . . . . .52
Table 37. Carrier tape dimensions of PCF8545ATT
and PCF8545BTT . . . . . . . . . . . . . . . . . . . . . .56
Table 38. SnPb eutectic process (from J-STD-020D) . . .58
Table 39. Lead-free process (from J-STD-020D) . . . . . .58
Table 40. Sel ection of LCD segment drivers . . . . . . . . . .61
Table 41. Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . .64
Table 42. Revision history . . . . . . . . . . . . . . . . . . . . . . . .66
PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 70 of 72
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
27. Figures
Fig 1. Block diagram of PCF8545A . . . . . . . . . . . . . . . . .3
Fig 2. Block diagram of PCF8545B . . . . . . . . . . . . . . . . .4
Fig 3. Pin configuration for TSSOP56 (PCF8545ATT). . .5
Fig 4. Pin configuration for TSSOP56 (PCF8545BTT) . .5
Fig 5. Effect of backplane swapping . . . . . . . . . . . . . . . .9
Fig 6. Recommended power-down sequence . . . . . . . .10
Fig 7. Oscillator selection. . . . . . . . . . . . . . . . . . . . . . . .12
Fig 8. Recommended start-up sequence when
using the internal oscillator . . . . . . . . . . . . . . . . .18
Fig 9. Recommended start-up sequence when
using an external clock signal . . . . . . . . . . . . . . .1 9
Fig 10. Example of displays suitable for PCF8545 . . . . .20
Fig 11. Typical system configuration for the I2C-bus . . . .21
Fig 12. Typical system configurati on for the SPI-bus. . . .21
Fig 13. Electro-optical characteristic: relative
transmission curve of the liquid . . . . . . . . . . . . . .23
Fig 14. Waveforms for the 1:4 multi plex drive mode
with 13 bias and line inversion. . . . . . . . . . . . . . .24
Fig 15. Waveforms for 1:6 multiplex drive mode with
bias 13 and line inversion. . . . . . . . . . . . . . . . . . .25
Fig 16. Waveforms for 1:6 multiplex drive mode with
bias 14 and line inversion. . . . . . . . . . . . . . . . . . .26
Fig 17. Waveforms for 1:8 multiplex drive mode with
bias 14 and line inversion. . . . . . . . . . . . . . . . . . .27
Fig 18. Waveforms for 1:8 multiplex drive mode with
bias 14 and frame inversion. . . . . . . . . . . . . . . . .28
Fig 19. Display RAM bitmap . . . . . . . . . . . . . . . . . . . . . .30
Fig 20. Display RAM filling order in 1:4 multiplex
drive mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32
Fig 21. Boundary condition in 1:4 multiplex drive mode .32
Fig 22. Display RAM filling order in 1:6 multiplex
drive mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
Fig 23. Boundary condition in 1:6 multiplex drive mode .34
Fig 24. Display RAM filling order in 1:8 multiplex
drive mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35
Fig 25. Control byte format . . . . . . . . . . . . . . . . . . . . . . .36
Fig 26. Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37
Fig 27. Definition of START and STOP conditions. . . . . .3 7
Fig 28. System configuration. . . . . . . . . . . . . . . . . . . . . .38
Fig 29. Acknowledgement on the I2C-bus . . . . . . . . . . . .38
Fig 30. I2C-bus protocol write mode . . . . . . . . . . . . . . . .40
Fig 31. I2C-bus protocol read mode. . . . . . . . . . . . . . . . .40
Fig 32. Data transfer overview. . . . . . . . . . . . . . . . . . . . .42
Fig 33. SPI-bus write example. . . . . . . . . . . . . . . . . . . . .43
Fig 34. SPI-bus example . . . . . . . . . . . . . . . . . . . . . . . . .43
Fig 35. Device protection diagram for PCF8545A . . . . . .44
Fig 36. Device protection diagram for PCF8545B . . . . . .44
Fig 37. Typical IDD with respect to temperature . . . . . . . .48
Fig 38. Typical IDD(LCD) in power-down mode with
respect to temperature. . . . . . . . . . . . . . . . . . . . .4 8
Fig 39. Typical IDD(LCD) when display is active with
respect to temperature. . . . . . . . . . . . . . . . . . . . .4 9
Fig 40. Typical clock frequency with respect to VDD
and temperature . . . . . . . . . . . . . . . . . . . . . . . . .50
Fig 41. Driver timing waveforms . . . . . . . . . . . . . . . . . . .50
Fig 42. RESET timing . . . . . . . . . . . . . . . . . . . . . . . . . . .51
Fig 43. I2C-bus timing waveforms. . . . . . . . . . . . . . . . . . 52
Fig 44. SPI-bus timing. . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Fig 45. Package outline SOT364-1 (TSSOP56) . . . . . . . 54
Fig 46. Tape and reel details for PCF8545ATT and
PCF8545BTT . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Fig 47. Temperature profiles for large and small
components. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Fig 48. Footprint information for reflow soldering of
SOT364-1 (TSSOP56) package . . . . . . . . . . . . . 60
PCF8545 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 13 November 2013 71 of 72
continued >>
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
28. Contents
1 General description. . . . . . . . . . . . . . . . . . . . . . 1
2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1
3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
4 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4.1 Ordering options. . . . . . . . . . . . . . . . . . . . . . . . 2
5 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
7 Pinning information. . . . . . . . . . . . . . . . . . . . . . 5
7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6
8 Functional description . . . . . . . . . . . . . . . . . . . 7
8.1 Commands of PCF8545. . . . . . . . . . . . . . . . . . 7
8.1.1 Command: initialize . . . . . . . . . . . . . . . . . . . . . 7
8.1.2 Command: OTP-refresh . . . . . . . . . . . . . . . . . . 7
8.1.3 Command: mode-settings . . . . . . . . . . . . . . . . 8
8.1.3.1 Backplane swapping. . . . . . . . . . . . . . . . . . . . . 8
8.1.3.2 Line inversion
(driving scheme A)
and frame inversion
(driving scheme B) . . . . . . . . . . . . . . . . . . . . . . 9
8.1.3.3 Power-down mode . . . . . . . . . . . . . . . . . . . . . . 9
8.1.3.4 Display enable . . . . . . . . . . . . . . . . . . . . . . . . 11
8.1.4 Command: oscillator-control . . . . . . . . . . . . . 11
8.1.4.1 Oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
8.1.4.2 Timing and frame frequency. . . . . . . . . . . . . . 13
8.1.5 Command: set-MUX-mode. . . . . . . . . . . . . . . 14
8.1.6 Command: set-bias-mode . . . . . . . . . . . . . . . 14
8.1.7 Command: frame-frequency. . . . . . . . . . . . . . 14
8.1.8 Command: load-data-pointer . . . . . . . . . . . . . 15
8.1.9 Command: write-RAM-data . . . . . . . . . . . . . . 16
8.2 Start-up and shut-down. . . . . . . . . . . . . . . . . . 16
8.2.1 Reset and Power-On Reset
(POR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
8.2.2 RESET pin function . . . . . . . . . . . . . . . . . . . . 17
8.2.3 Recommended start-up sequences . . . . . . . . 17
8.3 Possible display configurations . . . . . . . . . . . 20
8.4 LCD voltage selector . . . . . . . . . . . . . . . . . . . 21
8.4.1 Electro-optical performance . . . . . . . . . . . . . . 23
8.5 LCD drive mode waveforms. . . . . . . . . . . . . . 24
8.5.1 1:4 Multiplex drive mode. . . . . . . . . . . . . . . . . 24
8.5.2 1:6 Multiplex drive mode. . . . . . . . . . . . . . . . . 25
8.5.3 1:8 Multiplex drive mode. . . . . . . . . . . . . . . . . 27
8.6 Display register. . . . . . . . . . . . . . . . . . . . . . . . 29
8.7 Backplane outputs . . . . . . . . . . . . . . . . . . . . . 29
8.8 Segment outputs. . . . . . . . . . . . . . . . . . . . . . . 29
8.9 Display RAM. . . . . . . . . . . . . . . . . . . . . . . . . . 29
8.9.1 Data pointer . . . . . . . . . . . . . . . . . . . . . . . . . . 31
8.9.2 RAM filling in 1:4 multiplex
drive mode. . . . . . . . . . . . . . . . . . . . . . . . . . . 31
8.9.3 RAM filling in 1:6 multiplex
drive mode. . . . . . . . . . . . . . . . . . . . . . . . . . . 32
8.9.4 RAM filling in 1:8 multiplex
drive mode. . . . . . . . . . . . . . . . . . . . . . . . . . . 34
9 Bus interfaces . . . . . . . . . . . . . . . . . . . . . . . . . 36
9.1 Control byte and register selection . . . . . . . . 36
9.2 I2C-bus interface . . . . . . . . . . . . . . . . . . . . . . 37
9.2.1 Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
9.2.2 START and STOP conditions. . . . . . . . . . . . . 37
9.2.3 System configuration . . . . . . . . . . . . . . . . . . . 37
9.2.4 Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . 38
9.2.5 I2C-bus controller. . . . . . . . . . . . . . . . . . . . . . 38
9.2.6 Input filters . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
9.2.7 I2C-bus slave address . . . . . . . . . . . . . . . . . . 39
9.2.8 I2C-bus protocol. . . . . . . . . . . . . . . . . . . . . . . 39
9.2.8.1 Status read out. . . . . . . . . . . . . . . . . . . . . . . . 40
9.3 SPI-bus interface . . . . . . . . . . . . . . . . . . . . . . 42
9.3.1 Data transmission . . . . . . . . . . . . . . . . . . . . . 42
10 Internal circuitry . . . . . . . . . . . . . . . . . . . . . . . 44
11 Safety notes. . . . . . . . . . . . . . . . . . . . . . . . . . . 44
12 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 45
13 Static characteristics . . . . . . . . . . . . . . . . . . . 46
14 Dynamic characteristics. . . . . . . . . . . . . . . . . 50
15 Package outline. . . . . . . . . . . . . . . . . . . . . . . . 54
16 Handling information . . . . . . . . . . . . . . . . . . . 55
17 Packing information . . . . . . . . . . . . . . . . . . . . 56
17.1 Tape and reel information . . . . . . . . . . . . . . . 56
18 Soldering of SMD packages. . . . . . . . . . . . . . 57
18.1 Introduction to soldering. . . . . . . . . . . . . . . . . 57
18.2 Wave and reflow soldering. . . . . . . . . . . . . . . 57
18.3 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . 57
18.4 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . 58
19 Footprint information
for reflow soldering. . . . . . . . . . . . . . . . . . . . . 60
20 Appendix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
20.1 LCD segment driver selection . . . . . . . . . . . . 61
21 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 64
22 References. . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
23 Revision history . . . . . . . . . . . . . . . . . . . . . . . 66
24 Legal information . . . . . . . . . . . . . . . . . . . . . . 67
24.1 Data sheet status. . . . . . . . . . . . . . . . . . . . . . 67
24.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
NXP Semiconductors PCF8545
Universal LCD driver for multiplex rates up to 1:8
© NXP B.V. 2013. All rights rese rved.
For more information, please visit: http://www.nxp.co m
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 13 November 2013
Document identifier: PCF8545
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
24.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 67
24.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
25 Contact information. . . . . . . . . . . . . . . . . . . . . 68
26 Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
27 Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
28 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
Mouser Electronics
Authorized Distributor
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