Product Data Sheet Industrial MICRO SD Memory Card S-300u Series SPI, SD and SDHC compliant Swissbit AG Industriestrasse 4 CH-9552 Bronschhofen Switzerland Swissbit reserves the right to change products or specifications without notice. www.swissbit.com industrial@swissbit.com Revision: 1.01 S-300u_data_sheet_SD-NxBW_Rev101.doc Page 22 of 23 S-300u Series MICRO SD Memory Card 1 Feature summary Highly-integrated memory controller o Fully compliant with SD Memory Card specification SD1.01, SD1.1, SD2.0 and SD3.01 and MICRO SD Memory Card Addendum 4.00 Standard MICRO SD Memory Card form factor o 15.0mm x 11.0mm x 0.7mm Operating voltage 2.7...3.6V Low-power CMOS technology High reliability o MTBF: > 3,000,000 hours o Number of insertions: > 10,000 o Extended Temperature range -25 up to 85C o Industrial Temperature range -40 up to 85C Hot swappable High performance o Speed class 2GB Card class 6 4GB to 8GB class 10 o SD burst up to 25MB/s o SD Low speed 0...25MHz clock rate o SD High speed 25...50MHz clock rate o Flash burst up to 40MB/s o Flash Bus interleave Operating bus modes: SD 1 & 4bit and SPI Error Correction up to 24bit/1KB BCH ECC Wear Leveling: equal wear leveling of static and dynamic data The wear leveling assures that dynamic data as well as static data is balanced evenly across the memory. With that the maximum write endurance of the device is guaranteed. Write Endurance: Due to advanced wear leveling an even use of the entire flash is guaranteed, regardless how much "static" (OS) data is stored. Example: If the average file size is 10MByte and the total capacity is 8GByte, 48Mio write cycles can be performed. Available densities o 2, 4 and 8GBytes (SLC NAND Flash) Controlled BOM Life Cycle Management 2 Order Information 2.1 Standard product list Table 1: Standard Product List Density Part Number 2GB SFSD2048NgBW1MT-t-ME-1x1-STD 4GB SFSD4096NgBW1MT-t-DF-1x1-STD 8GB SFSD8192NgBW1MT-t-QG-1x1-STD g defines the product generation x defines the FW t defines the temperature range (E=-25C to +85C, I=-40C to +85C) Swissbit AG Industriestrasse 4 CH-9552 Bronschhofen Switzerland Swissbit reserves the right to change products or specifications without notice. www.swissbit.com industrial@swissbit.com Revision: 1.01 S-300u_data_sheet_SD-NxBW_Rev101.doc Page 22 of 23 2.2 Current product generation Table 2: Standard Product List Density Part Number 2GB SFSD2048N1BW1MT-E-ME-111-STD 4GB SFSD4096N1BW1MT-E-DF-111-STD 8GB SFSD8192N1BW1MT-E-QG-111-STD 2GB SFSD2048N1BW1MT-I-ME-111-STD 4GB SFSD4096N1BW1MT-I-DF-111-STD 8GB SFSD8192N1BW1MT-I-QG-111-STD Swissbit AG Industriestrasse 4 CH-9552 Bronschhofen Switzerland Swissbit reserves the right to change products or specifications without notice. www.swissbit.com industrial@swissbit.com Revision: 1.01 S-300u_data_sheet_SD-NxBW_Rev101.doc Page 22 of 23 3 Contents 1 FEATURE SUMMARY ..................................................................................................................................................................... 2 2 ORDER INFORMATION .................................................................................................................................................................. 2 2.1 STANDARD PRODUCT LIST .......................................................................................................................................................... 2 2.2 CURRENT PRODUCT GENERATION ................................................................................................................................................ 3 3 CONTENTS .................................................................................................................................................................................... 4 4 PRODUCT SPECIFICATION ............................................................................................................................................................. 5 4.1 SYSTEM PERFORMANCE ............................................................................................................................................................ 5 4.2 ENVIRONMENTAL SPECIFICATIONS .............................................................................................................................................. 6 4.2.1 Recommended Operating Conditions ............................................................................................................... 6 4.2.2 Recommended Storage Conditions ................................................................................................................... 6 4.2.3 Humidity & ESD .................................................................................................................................................... 6 4.2.4 Environmental Conditions ................................................................................................................................. 6 4.3 PHYSICAL DIMENSIONS............................................................................................................................................................ 6 4.4 RELIABILITY .......................................................................................................................................................................... 6 5 CAPACITY SPECIFICATION ............................................................................................................................................................. 6 6 CARD PHYSICAL ........................................................................................................................................................................... 7 6.1 PHYSICAL DESCRIPTION ............................................................................................................................................................ 7 7 ELECTRICAL INTERFACE ................................................................................................................................................................ 8 7.1 ELECTRICAL DESCRIPTION........................................................................................................................................................... 8 7.2 DC CHARACTERISTICS ............................................................................................................................................................... 9 7.3 SIGNAL LOADING.................................................................................................................................................................... 9 7.4 AC CHARACTERISTICS ..............................................................................................................................................................10 8 HOST ACCESS SPECIFICATION ......................................................................................................................................................12 8.1 SD AND SPI BUS MODES .......................................................................................................................................................12 8.1.1 SD Bus Mode Protocol .........................................................................................................................................12 8.1.2 SPI Bus Mode Protocol ........................................................................................................................................13 8.1.3 Mode Selection ....................................................................................................................................................13 8.2 CARD REGISTERS...................................................................................................................................................................14 9 DECLARATION OF CONFORMITY ..................................................................................................................................................17 10 ROHS AND WEEE UPDATE FROM SWISSBIT...............................................................................................................................18 11 PART NUMBER DECODER ...........................................................................................................................................................20 11.1 MANUFACTURER ...................................................................................................................................................................20 11.2 MEMORY TYPE .....................................................................................................................................................................20 11.3 PRODUCT TYPE .....................................................................................................................................................................20 11.4 CAPACITY ............................................................................................................................................................................20 11.5 PLATFORM ..........................................................................................................................................................................20 11.6 GENERATION .......................................................................................................................................................................20 11.7 MEMORY ORGANIZATION ........................................................................................................................................................20 11.8 TECHNOLOGY .......................................................................................................................................................................20 11.9 CHANNELS ..........................................................................................................................................................................20 11.10 FLASH CODE ......................................................................................................................................................................20 11.11 TEMP. OPTION ....................................................................................................................................................................21 11.12 DIE CLASSIFICATION ............................................................................................................................................................21 11.13 PIN MODE ........................................................................................................................................................................21 11.14 CONFIGURATION XYZ ...........................................................................................................................................................21 11.15 OPTION .............................................................................................................................................................................21 Swissbit AG Industriestrasse 4 CH-9552 Bronschhofen Switzerland Swissbit reserves the right to change products or specifications without notice. www.swissbit.com industrial@swissbit.com Revision: 1.01 S-300u_data_sheet_SD-NxBW_Rev101.doc Page 22 of 23 12 SWISSBIT LABEL SPECIFICATION ................................................................................................................................................22 12.1 FRONT SIDE MARKING............................................................................................................................................................22 12.2 BACK SIDE MARKING.............................................................................................................................................................22 13 REVISION HISTORY.....................................................................................................................................................................23 4 Product Specification The MICRO SD Memory Card is a small form factor non-volatile memory card which provides high capacity data storage. Its aim is to capture, retain and transport data, audio and images, facilitating the transfer of all types of digital information between a large variety of digital systems. The card operates in two basic modes: SD/SDHC card mode SPI mode The MICRO SD Memory Card also supports SD High Speed mode with up to 50MHz clock frequency. The cards are compliant with SD Memory card Specification Part 1, Physical layer Specification V3.01 SD Memory card Specification Part 2, File System Specification V3.00 SD Memory card Specification Part 3, Security Specification V3.00 MICRO SD Memory Card Addendum V4.00 Simplified specifications are available at https://www.sdcard.org/downloads/pls/simplified_specs/ The Card has an internal intelligent controller which manages interface protocols, data storage and retrieval as well as hardware BCH Error Correction Code (ECC), defect handling, diagnostics and clock control. The advanced wear leveling mechanism assures an equal usage of the Flash memory cells to extend the life time. The hardware BCH-code ECC allows to detect and correct up to 24 defect bits per 1kByte. The card has a power-loss management feature to prevent data corruption after power-down. The power consumption is very low. The cards are RoHS compliant and lead-free. 4.1 System Performance Table 3: Performance System Performance Burst Data transfer Rate (max SD clock 50MHz) Sustained Sequential Read Sustained Sequential Write typ 2GB 4...8GB 2GB 4...8GB (1)(2) 19 (1)(2) 19 (1)(2) 11 (1)(2) 17 max 25 (1)(3) 24 (1)(3) 24 (1)(3) 12 (1)(3) 22 Unit MB/s 1. All values refer to Micron Flash 8Gb MICRO SD Memory Card in SD mode 50MHz, cycle time 20ns, 2. Sustained Speed measured with USB-SD Memory Card reader. It depends on burst speed, flash number, and file size. 3. Maximum values were measured with Testmetrix tester. Swissbit AG Industriestrasse 4 CH-9552 Bronschhofen Switzerland Swissbit reserves the right to change products or specifications without notice. www.swissbit.com industrial@swissbit.com Revision: 1.01 S-300u_data_sheet_SD-NxBW_Rev101.doc Page 22 of 23 4.2 Environmental Specifications 4.2.1 Recommended Operating Conditions Table 4: MICRO SD Memory Card Recommended Operating Conditions Parameter min typ max unit Extended Operating Temperature Industrial Operating Temperature -25 -40 25 25 85 85 C C typ max unit 25 25 85 100 C C 4.2.2 Recommended Storage Conditions Table 5: MICRO SD Memory Card Recommended Storage Conditions Parameter min Extended Storage Temperature Industrial Operating Temperature -25 -40 4.2.3 Humidity & ESD Table 6: Humidity & ESD Parameter Humidity (non-condensing) Operating Non Operating operation: 95% RH @25C storage: 93% RH @40C, 500h Non Contact Pads area: Contact Pads: 8 kV (air discharge) 4 kV, Human body model Human body model according according to IEC61000-4-2 to IEC61000-4-2 EMC / EMI 4.2.4 Environmental Conditions Table 7: Environmental Conditions Parameter UV light exposure Durability Drop test Bending / Torque Mechanical Schock Operating Non Operating 2 UV: 254nm, 15Ws/cm according to ISO7816-1 10,000 mating cycles 1.5m free fall 10N / 0.10Nm 2.5 max 1500G, 0,5ms, half sine wave xyz-axis, five pulses each Non operating, JESD22B110 Condition B 50G, 1.5mm p-p, 20..2000Hz, sweep xyz-axis, five pulses each, Non operating Vibration MIL-STD-883 M2007.3 Condition B 4.3 Physical Dimensions Table 8: Physical Dimensions Outer Physical Dimensions Length Width Thickness Weight (typ.) Unit Value 15.00.1 11.00.1 0.7 (1.0)0.1 0.4 mm g 4.4 Reliability Table 9: Reliability Parameter Data Retention @ 25C Value 10 years (JEDEC47G) 5 Capacity specification Table 10: MICRO SD Memory Card capacity specification Capacity 2GB 4GB 8GB Swissbit AG Industriestrasse 4 CH-9552 Bronschhofen Switzerland Sectors 4'016'128 8'042'496 16'136'192 Total addressable capacity (Byte) 2'056'257'536 4'117'757'952 8'261'730'304 Swissbit reserves the right to change products or specifications without notice. www.swissbit.com industrial@swissbit.com Revision: 1.01 S-300u_data_sheet_SD-NxBW_Rev101.doc Page 22 of 23 6 Card physical 6.1 Physical description The MICRO SD Memory Card contains a single chip controller and Flash memory module(s). The controller interfaces with a host system allowing data to be written to and read from the Flash memory module(s). Figure 1 and Figure 2 show card dimensions. Figure 1: Mechanical Dimensions MICRO SD Memory Card (side and top, simplified) Figure 2: Mechanical Dimensions MICRO SD Memory Card (bottom side with connector) Gold pads thickness: 0.8m / 30inch Swissbit AG Industriestrasse 4 CH-9552 Bronschhofen Switzerland Swissbit reserves the right to change products or specifications without notice. www.swissbit.com industrial@swissbit.com Revision: 1.01 S-300u_data_sheet_SD-NxBW_Rev101.doc Page 22 of 23 7 Electrical interface 7.1 Electrical description Figure 3: MICRO SD Memory Card Block Diagram Figure 4: MICRO SD Memory Card Shape and Interface (Bottom View) Table 11: MICRO SD Memory Card Pad Assignment Pin # SD Mode SPI Mode Name Type1 Description Name Type1 Description 1 DAT25 I/O/PP Data Line [Bit 2] RSV 2 CD/DAT32 I/O/PP3 Card Detect/ Data Line [Bit 3] CS I3 Chip Select (negative true) 3 CMD PP Command/Response DI I Data In 4 VDD S Supply voltage VDD S Supply voltage 5 CLK I Clock SCLK I Clock 6 VSS S Supply voltage ground VSS S Supply voltage ground 7 DAT0 I/O/PP Data Line [Bit 0] DO O/PP Data Out 8 DAT14 I/O/PP Data Line [Bit 1] RSV Notes: 1) S: power supply; I: input; O: output using push-pull drivers; PP: I/O using push-pull drivers; 2) The extended DAT lines (DAT1-DAT3) are input on power up. They start to operate as DAT lines after SET_BUS_WIDTH command. The Host shall keep its own DAT1-DAT3 lines in input mode, as well, while they are not used. 3) At power up this line has a 50kOhm pull up enabled in the card. This resistor serves two functions Card detection and Mode Selection. For Mode Selection, the host can drive the line high or let it be pulled high to select SD mode. If the host wants to select SPI mode it should drive the line low. For Card detection, the host detects that the line is pulled high. This pull-up should be disconnected by the user, during regular data transfer, with SET_CLR_CARD_DETECT (ACMD42) command 4) DAT1 line may be used as Interrupt Output (from the Card) in SDIO mode during all the times that it is not in use for data transfer operations (refer to "SDIO Card Specification" for further details). 5) DAT2 line may be used as Read Wait signal in SDIO mode (refer to "SDIO Card Specification" for further details). Swissbit AG Industriestrasse 4 CH-9552 Bronschhofen Switzerland Swissbit reserves the right to change products or specifications without notice. www.swissbit.com industrial@swissbit.com Revision: 1.01 S-300u_data_sheet_SD-NxBW_Rev101.doc Page 8 of 23 7.2 DC characteristics Measurements are at Recommended Operating Conditions unless otherwise specified. Table 12: DC Characteristics Symbol Parameter min typ max Peak Voltage on all Lines -0.3 VDD+0.3 VIL Input LOW Voltage -0.3 0.25*VDD VIH Input HIGH Voltage 0.625*VDD VDD+0.3 VOL Output LOW Voltage 0.125*VDD VOH Output HIGH Voltage 0.75*VDD Operating Current Read 50 60 Operating Current Write 60 70 IDD Pre-initialization Standby Current 150 200 130 150 Post-initialization Standby Current 400 600 ILI Input Leakage Current -10 10 ILO Output Leakage Current -10 10 Table 13: MICRO SD Memory Card Recommended Operating Conditions Symbol Parameter min Normal Operating Status 2.7 VDD Supply Voltage Basic Communication 2.0 (CMD0, CMD15, CMD55, ACMD41) Power Up Time (from 0V to VDD min) unit V V V V V mA mA A A A A A notes @ 100A @ 100A @ 25C @ 25C @ 25C @ 25C @ 85C without pull up R typ max 3.6 unit V 3.3 3.6 V 250 ms 7.3 Signal Loading The total capacitance CL is the sum of the bus master capacitance CHOST, the bus capacitance CBUS, and the capacitance CCARD of the card connected to the line: CL = CHOST + CBUS + CCARD To allow the sum of the host and bus capacitances to be up to 20pF for the card, the following conditions in the table below are met by the card. Table 14: Signal loading Parameter Pull up resistance Pull up resistance Bus signal line capacitance Signal card capacitance Signal line inductance Swissbit AG Industriestrasse 4 CH-9552 Bronschhofen Switzerland Symbol RCMD RDAT CL Ccard Min 10 10 Max 100 100 40 10 16 Unit kOhm kOhm pF pF nH Notes To prevent bus floating To prevent bus floating Single card Single card f20MHz Swissbit reserves the right to change products or specifications without notice. www.swissbit.com industrial@swissbit.com Revision: 1.01 S-300u_data_sheet_SD-NxBW_Rev101.doc Page 9 of 23 Figure 5: Signal Loading (MICRO SD Memory Card has no WP slider) 7.4 AC characteristics Table 15: AC Characteristics Low Speed Mode Parameter Symbol Min Max Unit Notes CL100pF Clock frequency in data transfer mode fPP 0 25 MHz CL250pF Clock frequency in card id mode fOD 0 400 KHz Clock low time tWL 10/50 ns Clock high time tWH 10/50 ns CL100/250pF Clock rise time tTLH 10/50 ns Clock fall time tTHL 10/50 ns CMD, DAT input setup time tISU 5 ns CL25pF CMD, DAT input hold time tIH 5 ns CL25pF, data transfer CMD, DAT output delay time tODLY 0 14 ns CL25pF, identification CMD, DAT output delay time tODLY 0 50 ns Notes 1. Rise and fall times are measured from 10% to 90% of voltage level. 2. CLK referenced to VIH min and VIL max. 3. CMD and DAT inputs and outputs referenced to CLK. 4. 0Hz means to stop the clock. The given minimum frequency range is for cases where a continuous clock is required 5. Specified for one card Swissbit AG Industriestrasse 4 CH-9552 Bronschhofen Switzerland Swissbit reserves the right to change products or specifications without notice. www.swissbit.com industrial@swissbit.com Revision: 1.01 S-300u_data_sheet_SD-NxBW_Rev101.doc Page 10 of 23 Figure 6: AC Characteristics Low Speed Mode Table 16: AC Characteristics High Speed Mode Parameter Symbol Min Max Unit Notes Clock frequency in data transfer mode fPP 0 50 MHz Clock low time tWL 7.0 ns Clock high time tWH 7.0 ns Clock rise time tTLH 3 ns Clock fall time tTHL 3 ns CL10pF CMD, DAT input setup time tISU 6 ns CMD, DAT input hold time tIH 2 ns CMD, DAT output delay time during data tODLY 14 ns transfer mode CMD, DAT output hold time tOH 2.5 ns Notes 1. Rise and fall times are measured from 10% to 90% of voltage level. 2. CLK referenced to VIH min and VIL max. 3. CMD and DAT inputs and outputs referenced to CLK. 4. In order to satisfy severe timing, the host shall drive only one card with max 40pF total at each line. Figure 7: AC Characteristics High Speed Mode Swissbit AG Industriestrasse 4 CH-9552 Bronschhofen Switzerland Swissbit reserves the right to change products or specifications without notice. www.swissbit.com industrial@swissbit.com Revision: 1.01 S-300u_data_sheet_SD-NxBW_Rev101.doc Page 11 of 23 8 Host access Specification The following chapters summarize how the host accesses the card: Chapter 8.1 summarizes the SD and SPI buses. Chapter 8.2 summarizes the registers. 8.1 SD and SPI Bus Modes The card supports SD and the SPI Bus modes. Application can chose either one of the modes. Mode selection is transparent to the host. The card automatically detects the mode of the reset command and will expect all further communication to be in the same communication mode. The SD mode uses a 4-bit high performance data transfer, and the SPI mode provides compatible interface to MMC host systems with little redesign, but with a lower performance. 8.1.1 SD Bus Mode Protocol The SD Bus mode has a single master (host) and multiple slaves (cards) synchronous topology. Clock, power, and ground signals are common to all cards. After power up, the SD Bus mode uses DAT0 only; after initialization, the host can change the cards' bus width from 1 bit (DAT0) to 4 bits (DAT0-DAT3). In high speed mode, only one card can be connected to the bus. Communication over the SD bus is based on command and data bit streams which are initiated by a start bit and terminated by a stop bit. Command: a command is a token which starts an operation. A command is sent from the host either to a single card (addressed command) or to all connected cards (broadcast command). A command is transferred serially on the CMD line. Response: a response is a token which is sent from an addressed card, or (synchronously) from all connected cards, to the host as an answer to a previously received command. A response is transferred serially on the CMD line. Data: data can be transferred from the card to the host or vice versa. Data is transferred via the data lines. The SD bus signals are listed in Table 17, and the SD bus topology is illustrated in Figure 8: SD Bus Topology. Table 17: SD Bus Signals Signal CLK CMD DAT0-DAT3 Vdd, Vss Description Host to card clock signal Bidirectional Command/Response signal 4 Bidirectional data signals Power and Ground Figure 8: SD Bus Topology Swissbit AG Industriestrasse 4 CH-9552 Bronschhofen Switzerland Swissbit reserves the right to change products or specifications without notice. www.swissbit.com industrial@swissbit.com Revision: 1.01 S-300u_data_sheet_SD-NxBW_Rev101.doc Page 12 of 23 8.1.2 SPI Bus Mode Protocol The Serial Parallel Interface (SPI) Bus is a general purpose synchronous serial interface. The SPI mode consists of a secondary communication protocol. The interface is selected during the first reset command after power up (CMD0) and it cannot be changed once the card is powered on. While the SD channel is based on command and data bit streams which are initiated by a start bit and terminated by a stop bit, the SPI channel is byte oriented. Every command or data block is built of 8-bit bytes and is byte aligned to the CS signal. The card identification and addressing methods are replaced by a hardware Chip Select (CS) signal. There are no broadcast commands. For every command, a card (slave) is selected by asserting (active low) the CS signal. The CS signal must be continuously active for the duration of the SPI transaction (command, response and data). The only exception occurs during card programming, when the host can de-assert the CS signal without affecting the programming process. The bidirectional CMD and DAT lines are replaced by unidirectional dataIn and dataOut signals. The SPI bus signals are listed Table 18 and the SPI bus topology is illustrated in Figure 9. Table 18: SPI Bus Signals Signal Description /CS Host to card chip select CLK Host to card clock signal Data In Host to card data signal Data Out Card to host data signal Vdd, Vss Power and ground Figure 9: SPI bus topology 8.1.3 Mode Selection The SD Memory Card wakes up in the SD mode. It will enter SPI mode if the CS signal is asserted (negative) during the reception of the reset command (CMD0) and the card is in idle_state. If the card recognizes that the SD mode is required it will not respond to the command and remain in the SD mode. If SPI mode is required the card will switch to SPI and respond with the SPI mode R1 response. The only way to return to the SD mode is by entering the power cycle. In SPI mode the SD Memory Card protocol state machine is not observed. All the SD Memory Card commands supported in SPI mode are always available. During the initialization sequence, if the host gets Illegal Command indication for ACMD41 sent to the card, it may assume that the card is Multimedia Card. In that case it should re-start the card as Multimedia Card using CMD0 and CMD1. Swissbit AG Industriestrasse 4 CH-9552 Bronschhofen Switzerland Swissbit reserves the right to change products or specifications without notice. www.swissbit.com industrial@swissbit.com Revision: 1.01 S-300u_data_sheet_SD-NxBW_Rev101.doc Page 13 of 23 8.2 Card Registers The MICRO SD Memory Card has five registers. Refer to Table 19 to Table 24 for detail. Table 19: MICRO SD Memory Card registers Register Bit Description Function Name Width Card Identification This register contains the card identification information used during the CID 128 information Card Identification phase. Operation This register describes the operating voltage range and contains the status OCR 32 Conditions Registers bit in the power supply. Card specific This register provides information on how to access the card content. Some CSD 128 information fields of this register are writeable by PROGRAM_CSD (CMD27). SD Memory Card's SCR 64 This register provides information on special features. Special features Relative Card RCA 16 This register carries the card address is SD Card mode. Address Table 20: CID register Register Name MID OID PNM Bit Width 8 16 40 typ. value TBD (0x5d) TBD (0x5342) TBD ("NgBWc") g=generation c=number of channels 0xgg PRV 8 Product Revision PSN -- MDT CRC -- 32 4 12 7 1 Product Serial Number Reserved Manufacture Date Check sum of CID contents Not used; always=1 Table 21: OCR register OCR bit position VDD voltage window 0-3 Reserved 4 1.6-1.7 5 1.7-1.8 6 1.8-1.9 7 1.9-2.0 8 2.0-2.1 9 2.1-2.2 10 2.2-2.3 11 2.3-2.4 12 2.4-2.5 13 2.5-2.6 14 Notes 1. 2. Description Manufacture ID OEM/Application ID Product Name 2.6-2.7 typ. value OCR bit position 0 0 0 0 0 0 0 0 0 0 0 15 16 17 18 19 20 21 22 23 24-30 30 0 31 xxxxxxxx 0x0 0xyym chksum 1 VDD voltage window 2.7-2.8 2.8-2.9 2.9-3.0 3.0-3.1 3.1-3.2 3.2-3.3 3.3-3.4 3.4-3.5 3.5-3.6 Reserved Card Capacity Status (CCS) 0=busy; 1=ready typ. value 1 1 1 1 1 1 1 1 1 *1) *2) This bit is valid only when the card power up status bit is set. This bit is set to LOW if the card has not finished the power up routine. Swissbit AG Industriestrasse 4 CH-9552 Bronschhofen Switzerland Swissbit reserves the right to change products or specifications without notice. www.swissbit.com industrial@swissbit.com Revision: 1.01 S-300u_data_sheet_SD-NxBW_Rev101.doc Page 14 of 23 Table 22: CSD register Register Name Bits Bit Width Description CSD_STRUCTURE 127:126 2 CSD structure -- 125:120 6 Reserved TAAC 119:112 8 Data read access time 1 NSAC 111:104 8 Data read access time 2 (CLK cycle) TRAN_SPEED 103:96 8 Data transfer rate CCC 95:84 12 Card command classes READ_BL_LEN 83:80 4 Read data block length READ_BL_PARTIAL 79 1 Partial blocks for read allowed WRITE_BLK_MISALIGN 78 1 Write block misalignment READ_BLK_MISALIGN 77 1 Read block misalignment DSR_IMP 76 1 DSR implemented -- 75:74 2 Reserved C_SIZE 73:62 12 Device size VDD_R_CURR_MIN 61:59 3 VDD min read current VDD_R_CURR_MAX 58:56 3 VDD max read current VDD_W_CURR_MIN 55:53 3 VDD min write current VDD_W_CURR_MAX 52:50 3 VDD max write current C_SIZE_MULT 49:47 3 Device size multiplier -- 75:70 6 Reserved C_SIZE 69:48 22 Device size -- 47 1 Reserved ERASE_BLK_EN 46 1 Erase single block enable SECTOR_SIZE 45:39 7 Erase sector size WP_GRP_SIZE 38:32 7 Write protect group size WP_GRP_ENABLE 31 1 Write protect group enable -- 30:29 2 Reserved R2W_FACTOR 28:26 3 Write speed factor WRITE_BL_LEN 25:22 4 Write data block length WRITE_BL_PARTIAL 21 1 Partial blocks for write allowed -- 20:16 5 Reserved FILE_FORMAT_GRP 15 1 File format group COPY 14 1 Copy flag PERM_WRITE_PROTECT 13 1 Permanent write protection TMP_WRITE_PROTECT 12 1 Temporary write protection FILE_FORMAT 11:10 2 File format -- 9:8 2 Reserved CRC 7:1 7 Checksum of CSD contents -- 0 1 Always=1 *) Drive Size and block sizes vary with card capacity 2Gb memory capacity = BLOCKNR * BLOCK_LEN Where BLOCKNR = (C_SIZE+1) * MULT MULT = 2C_SIZE_MULT+2 (C_SIZE_MULT < 8) BLOCK_LEN = 2READ_BL_LEN, (READ_BL_LEN < 12) typ. Value 2GB 00 000000 01011110 00000000 00110010 010110110101 1010 1 0 0 0 00 xxx*) 101 101 101 101 111*) 1 1111111 0111111*) 0 00 101 1010*) 0 00000 0 W(1) 0 W(1) 0 W(1) 0W 00 W(1) 00 W xxxxxxx W 1 typ. Value 4GB, 8GB 01 00000 00001110 00000000 00110010 010110110101 1001 0 0 0 0 000000 xxx*) 0 1 1111111 0000000 0 00 010 1001*) 0 00000 0 W(1) 0 W(1) 0 W(1) 0W 00 W(1) 00 W xxxxxxx W 1 >2Gb memory capacity = (C_SIZE+1) * 512kByte W W(1) value can be changed with CMD27 (PROGRAM_CSD) value can be changed ONCE with CMD27 (PROGRAM_CSD) Swissbit AG Industriestrasse 4 CH-9552 Bronschhofen Switzerland Swissbit reserves the right to change products or specifications without notice. www.swissbit.com industrial@swissbit.com Revision: 1.01 S-300u_data_sheet_SD-NxBW_Rev101.doc Page 15 of 23 Table 23: SCR register Field SCR_STRUCTURE SD_SPEC DATA_STAT_AFTER_ERASE SD_SECURITY SD_BUS_WIDTHS Reserved Reserved Bit Width 4 4 1 3 4 16 32 Table 24: RCA register Field Bit Width RCA 16 *) After Initialization the card can change the RCA register. Swissbit AG Industriestrasse 4 CH-9552 Bronschhofen Switzerland typ Value 0000 0010 0 010 or 011 0101 0 0 remark SCR 1.01...2.00 SD 2.0 or 3.0 0 Version 1.01 (SD) or 2.00 (SDHC) 1 or 4 bit 0 0 typ Value 0x0000*) Swissbit reserves the right to change products or specifications without notice. www.swissbit.com industrial@swissbit.com Revision: 1.01 S-300u_data_sheet_SD-NxBW_Rev101.doc Page 16 of 23 9 Declaration of Conformity We Manufacturer: Swissbit AG Industriestrasse 4 CH-9552 Bronschhofen Switzerland declare under our sole responsibility that the product Product Type: Brand Name: Product Series: Part Number: MICRO SD Memory Card SWISSMEMORYTM MICRO SD Memory Card S-300u SFSDxxxxNxBWxxx-x-xx-xxx-xxx to which this declaration relates is in conformity with the following directives: EN55022:2006 +A1:r B FCC47 Part 15 Subpart B 15.111 EN 61000-4-2:1995 +A1:1998 + A2:2001 EN 61000-4-3:2006+A1:2008 2002/96/EC Category 3 (WEEE) following the provisions of Directive Electromagnetic compatibility 2004/108/EC Restriction of the use of certain hazardous substances 2011/65/EU Swissbit AG, February 2013 Manuela Kogel Head of Quality Management Swissbit AG Industriestrasse 4 CH-9552 Bronschhofen Switzerland Swissbit reserves the right to change products or specifications without notice. www.swissbit.com industrial@swissbit.com Revision: 1.01 S-300u_data_sheet_SD-NxBW_Rev101.doc Page 17 of 23 10 RoHS and WEEE update from Swissbit Dear Valued Customer, We at Swissbit place great value on the environment and thus pay close attention to the diverse aspects of manufacturing environmentally and health friendly products. The European Parliament and the Council of the European Union have published two Directives defining a European standard for environmental protection. This states that CompactFlash Cards must comply with both Directives in order for them to be sold on the European market: RoHS - Restriction of Hazardous Substances WEEE - Waste Electrical and Electronic Equipment Swissbit would like to take this opportunity to inform our customers about the measures we have implemented to adapt all our products to the European norms. What is the WEEE Directive (2002/96/EC)? The Directive covers the following points: Prevention of WEEE Recovery, recycling and other measures leading to a minimization of wastage of electronic and electrical equipment Improvement in the quality of environmental performance of all operators involved in the EEE life cycle, as well as measures to incorporate those involved at the EEE waste disposal points What are the key elements? The WEEE Directive covers the following responsibilities on the part of producers: Producers must draft a disposal or recovery scheme to dispose of EEE correctly. Producers must be registered as producers in the country in which they distribute the goods. They must also supply and publish information about the EEE categories. Producers are obliged to finance the collection, treatment and disposal of WEEE. Inclusion of WEEE logos on devices In reference to the Directive, the WEEE logo must be printed directly on all devices that have sufficient space. In exceptional cases where this is necessary because of the size of the product, the symbol of the WEEE Directive shall be printed on the packaging, on the instructions of use and on the warranty (WEEE Directive 2002/96/EC) When does the WEEE Directive take effect? The Directive came into effect internationally on 13 August, 2005. What is RoHS (2002/95/EC)? The goals of the Directive are to: Place less of a burden on human health and to protect the environment by restricting the use of hazardous substances in new electrical and electronic devices To support the WEEE Directive (see above) RoHS enforces the restriction of the following 6 hazardous substances in electronic and electrical devices: Lead (Pb) - no more than 0.1% by weight in homogeneous materials Mercury (Hg) - no more than 0.1% by weight in homogeneous materials Cadmium (Cd) - no more than 0.01% by weight in homogeneous materials Chromium (Cr6+) - no more than 0.1% by weight in homogeneous materials PBB, PBDE - no more than 0.1% by weight in homogeneous materials Swissbit AG Industriestrasse 4 CH-9552 Bronschhofen Switzerland Swissbit reserves the right to change products or specifications without notice. www.swissbit.com industrial@swissbit.com Revision: 1.01 S-300u_data_sheet_SD-NxBW_Rev101.doc Page 18 of 23 Swissbit is obliged to minimize the hazardous substances in the products. According to part of the Directive, manufacturers are obliged to make a self-declaration for all devices with RoHS. Swissbit carried out intensive tests to comply with the self-declaration. We have also already taken steps to have the analyses of the individual components guaranteed by third-party companies. Swissbit carried out the following steps during the year with the goal of offering our customers products that are fully compliant with the RoHS Directive. Preparing all far-reaching directives, logistical enhancements and alternatives regarding the full understanding and introduction of the RoHS Directive's standards Checking the components and raw materials: o o Replacing non-RoHS-compliant components and raw materials in the supply chain Cooperating closely with suppliers regarding the certification of all components and raw materials used by Swissbit Modifying the manufacturing processes and procedures o Successfully adapting and optimizing the new management-free integration process in the supply chain o Updating existing production procedures and introducing the new procedures to support the integration process and the sorting of materials Carrying out the quality process o Performing detailed function and safety tests to ensure the continuous high quality of the Swissbit product line When does the RoHS Directive take effect? As of 1 July, 2006, only new electrical and electronic devices with approved quantities of RoHS will be put on the market. When will Swissbit be offering RoHS-approved products? Swissbit's RoHS-approved products are available now. Please contact your Swissbit contact person to find out more about exchanging your existing products for RoHS-compliant devices. For your attention We understand that packaging and accessories are not EEE material and are therefore not subject to the WEEE or RoHS Directives. Contact details: Swissbit AG Industriestrasse 4 CH 9552 Bronschhofen Tel: +41 71 913 03 03 - Fax: +41 71 913 03 15 E-mail: info@swissbit.com - Website: www.swissbit.com Swissbit AG Industriestrasse 4 CH-9552 Bronschhofen Switzerland Swissbit reserves the right to change products or specifications without notice. www.swissbit.com industrial@swissbit.com Revision: 1.01 S-300u_data_sheet_SD-NxBW_Rev101.doc Page 19 of 23 11 Part Number Decoder S F SD 1 2 3 2048 N 4 5 1 B W 1 6 7 9 8 Manuf. Memory Type. Product Type Capacity Platform Generation Memory Organization MT - E - M 10 11 12 E - 111 - STD 13 14 15 Option Configuration Manuf. Code: Flash Mode Manuf. Code: Flash Package Temp. Option Flash vendor Code Number of flash chips/channels Technology 11.1 Manufacturer Swissbit code S Flash F 11.2 Memory Type 11.3 Product Type SD Memory Card SD 11.4 Capacity 2 GByte 4 GByte 8 GByte 2048 4096 8192 11.5 Platform MICRO SD Memory Card N Generation 1 x8 B 11.6 Generation 11.7 Memory Organization 11.8 Technology SD Memory Card controller S-3x0 series W 11.9 Channels 1 Flash Channel 1 11.10 Flash Code Micron Swissbit AG Industriestrasse 4 CH-9552 Bronschhofen Switzerland MT Swissbit reserves the right to change products or specifications without notice. www.swissbit.com industrial@swissbit.com Revision: 1.01 S-300u_data_sheet_SD-NxBW_Rev101.doc Page 20 of 23 11.11 Temp. Option Extended Temp. Range -25C to 85C Industrial Temp. Range -40C to 85C E I 11.12 DIE Classification SLC MONO (single die package) SLC DDP (dual die package) SLC QDP (dual die package) MLC MONO (single die package) MLC DDP (dual die package) M Single nCE & R/nB Dual nCE & Dual R/nB Quad nCE & Quad R/nB E F G D Q G L 11.13 PIN Mode 11.14 Configuration XYZ X Configuration Configuration default X 1 Y FW Revision FW Revision Version 1 Y 1 Z optional Optional optional Z 1 11.15 Option Swissbit / Standard Swissbit AG Industriestrasse 4 CH-9552 Bronschhofen Switzerland STD Swissbit reserves the right to change products or specifications without notice. www.swissbit.com industrial@swissbit.com Revision: 1.01 S-300u_data_sheet_SD-NxBW_Rev101.doc Page 21 of 23 12 Swissbit Label specification 12.1 Front side marking Swissbit Density SD Memory Card logo 12.2 Back side marking Part Number Calendar week and year Lot code Swissbit AG Industriestrasse 4 CH-9552 Bronschhofen Switzerland Swissbit reserves the right to change products or specifications without notice. www.swissbit.com industrial@swissbit.com Revision: 1.01 S-300u_data_sheet_SD-NxBW_Rev101.doc Page 22 of 23 13 Revision History Table 25: Document Revision History Date April 19, 2012 February 01, 2013 Revision Revision Details 1.00 Initial release 1.01 Electrical characteristic update, added I-grade material, added CE Declaration and gold pads thickness Disclaimer: No part of this document may be copied or reproduced in any form or by any means, or transferred to any third party, without the prior written consent of an authorized representative of Swissbit AG ("SWISSBIT"). The information in this document is subject to change without notice. SWISSBIT assumes no responsibility for any errors or omissions that may appear in this document, and disclaims responsibility for any consequences resulting from the use of the information set forth herein. SWISSBIT makes no commitments to update or to keep current information contained in this document. The products listed in this document are not suitable for use in applications such as, but not limited to, aircraft control systems, aerospace equipment, submarine cables, nuclear reactor control systems and life support systems. Moreover, SWISSBIT does not recommend or approve the use of any of its products in life support devices or systems or in any application where failure could result in injury or death. If a customer wishes to use SWISSBIT products in applications not intended by SWISSBIT, said customer must contact an authorized SWISSBIT representative to determine SWISSBIT willingness to support a given application. The information set forth in this document does not convey any license under the copyrights, patent rights, trademarks or other intellectual property rights claimed and owned by SWISSBIT. The information set forth in this document is considered to be "Proprietary" and "Confidential" property owned by SWISSBIT. ALL PRODUCTS SOLD BY SWISSBIT ARE COVERED BY THE PROVISIONS APPEARING IN SWISSBIT'S TERMS AND CONDITIONS OF SALE ONLY, INCLUDING THE LIMITATIONS OF LIABILITY, WARRANTY AND INFRINGEMENT PROVISIONS. SWISSBIT MAKES NO WARRANTIES OF ANY KIND, EXPRESS, STATUTORY, IMPLIED OR OTHERWISE, REGARDING INFORMATION SET FORTH HEREIN OR REGARDING THE FREEDOM OF THE DESCRIBED PRODUCTS FROM INTELLECTUAL PROPERTY INFRINGEMENT, AND EXPRESSLY DISCLAIMS ANY SUCH WARRANTIES INCLUDING WITHOUT LIMITATION ANY EXPRESS, STATUTORY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. (c)2012 SWISSBIT AG All rights reserved. Swissbit AG Industriestrasse 4 CH-9552 Bronschhofen Switzerland Swissbit reserves the right to change products or specifications without notice. www.swissbit.com industrial@swissbit.com Revision: 1.01 S-300u_data_sheet_SD-NxBW_Rev101.doc Page 23 of 23